Variable channel type heat dissipation cold plate

Abstract

The utility model relates to the field of electronic equipment, in particular to a variable channel type heat dissipation cold plate which comprises an end cover and a heat dissipation cavity which jointly form a three-section type heat dissipation channel. The heat dissipation channel sequentially comprises a first heat dissipation channel section with the large width, a second heat dissipation channel section with the large width and a third heat dissipation channel section with the small width in the flow direction of cooling airflow. The first heat dissipation channel section is provided with a plurality of large-diameter hollow heat dissipation columns which are filled with phase change materials, the third heat dissipation channel section is provided with small-diameter solid heat dissipation columns which are densely arranged, and airflow transition is achieved between the first heat dissipation channel section and the third heat dissipation channel section through a flow guide plate of the second heat dissipation channel section; through the design of the differentiated heat dissipation columns, large-flow rapid heat dissipation is achieved in the first channel section, and the turbulence effect is enhanced in the third channel section; the heat dissipation efficiency and the temperature uniformity are remarkably improved by combining the transient heat absorption characteristics of the heat conduction boss in direct contact with a heat source and the phase change material; the structure is compact, and is especially suitable for heat dissipation requirements of high-power-density electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment, and in particular to a variable channel heat dissipation cold plate. Background Technology

[0002] As computer hardware performance continues to improve, the power consumption and heat generation of core components such as CPUs and GPUs have increased significantly. Traditional air-cooling solutions are increasingly facing problems of uneven heat dissipation and localized overheating under high-load scenarios. This is especially true in miniaturized chassis or high-density server environments where space is limited, and simply increasing fan speed or expanding the heat dissipation area is insufficient to meet the demands for efficient heat dissipation.

[0003] On the one hand, modern processors employ multi-core architectures, and computationally intensive tasks lead to a sharp increase in heat flux density on the chip surface, pushing the thermal conductivity of traditional heat sinks to near their limits. For example, the thermal design power (TDP) of high-performance CPUs generally exceeds 200W, with some models even surpassing 300W. The thermal conductivity of traditional aluminum heat sinks is insufficient to handle such high heat loads, easily creating "hot spots" at the chip edges and affecting system stability.

[0004] On the other hand, in server clusters or compact ITX chassis, the installation space for cooling modules is severely limited. While increasing fan speed can enhance convective heat transfer, the resulting noise pollution and vibration issues can negatively impact user experience and equipment lifespan. Furthermore, improperly designed forced air cooling airflow paths can lead to "hot air recirculation," further reducing cooling efficiency.

[0005] Therefore, in order to address these issues, there is an urgent need to develop an innovative heat dissipation solution that can solve the problem of uneven heat dissipation from the heat sink causing excessively high local temperatures. Utility Model Content

[0006] Therefore, this utility model provides a variable channel heat dissipation plate to overcome the problem of uneven heat dissipation in the prior art, which leads to excessively high local temperatures.

[0007] To achieve the above objectives, this utility model provides a variable channel heat dissipation plate, comprising:

[0008] End cap;

[0009] A heat dissipation cavity is disposed on the lower end face of the end cover and together with the end cover forms a heat dissipation channel. The heat dissipation channel includes a first heat dissipation channel section, a second heat dissipation channel section and a third heat dissipation channel section disposed along the cooling airflow direction.

[0010] The widths of the first heat dissipation channel segment and the third heat dissipation channel segment are fixed, and the width of the first heat dissipation channel segment is greater than that of the third heat dissipation channel segment.

[0011] The first heat dissipation channel section is provided with a plurality of first heat dissipation columns, and the third heat dissipation channel section is provided with a plurality of second heat dissipation columns.

[0012] Furthermore, the outer diameter of the first heat sink is larger than the outer diameter of the second heat sink.

[0013] Furthermore, a gap is provided between any two adjacent first heat dissipation pillars; a gap is provided between any two adjacent second heat dissipation pillars; the gap between each first heat dissipation pillar is greater than the gap between each second heat dissipation pillar.

[0014] Furthermore, the first heat dissipation column is a hollow cylinder filled with composite paraffin wax; the second heat dissipation column is a solid cylinder.

[0015] Furthermore, the second heat dissipation channel section is provided with a guide plate along the direction of the cooling airflow.

[0016] Furthermore, a first heat-conducting protrusion is provided on the bottom end face of the heat dissipation cavity in the first heat dissipation channel section, and a second heat-conducting protrusion is provided on the bottom end face of the heat dissipation cavity in the second heat dissipation channel section.

[0017] Furthermore, an air inlet for mounting a fan is provided at the end of the first heat dissipation channel segment away from the second heat dissipation channel segment.

[0018] Furthermore, a sealant is provided between the end cap and the heat dissipation cavity.

[0019] Furthermore, the heat dissipation cavity is made of aluminum alloy.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] By setting up a three-section heat dissipation channel structure and adopting a differentiated design where the diameter of the first heat dissipation column is larger than that of the second heat dissipation column, a large flow of air is used to quickly cool down the first heat dissipation channel section. In the third heat dissipation channel section, the turbulence effect is enhanced by densely arranged small-diameter heat dissipation columns, which significantly improves the heat dissipation efficiency.

[0022] The first heat sink is filled with composite paraffin, which can effectively absorb the instantaneous thermal shock of electronic devices. When the chip temperature rises sharply, the phase change material absorbs a large amount of heat through solid-liquid phase change, avoiding local overheating and significantly improving the heat dissipation stability under high load conditions.

[0023] The coordinated design of the guide vane and the heat-conducting protrusion optimizes the airflow organization. On the one hand, the guide vane reduces airflow separation loss and improves the uniformity of wind speed distribution; on the other hand, the heat-conducting protrusion directly contacts the heat source, establishes an efficient heat conduction path, reduces thermal resistance, and effectively solves the "edge hot spot" problem of traditional radiators.

[0024] With a modular design, the air inlet can be adapted to different fan sizes, the sealant ensures the airtightness of the system, and the aluminum alloy material combines lightweight and manufacturability. The overall structure is compact and is particularly suitable for high-density server applications with limited space. Attached Figure Description

[0025] Figure 1 This is an exploded view of the overall structure of the variable channel heat dissipation cold plate according to an embodiment of the present invention;

[0026] Figure 2 This is a top sectional view of the variable channel heat dissipation plate according to an embodiment of the present invention;

[0027] Figure 3 This is a left-side sectional view of the variable channel heat dissipation plate according to an embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the bottom surface of the overall structure of the variable channel heat dissipation plate according to an embodiment of the present invention.

[0029] 1. End cap; 21. First heat dissipation channel section; 22. Second heat dissipation channel section; 23. Third heat dissipation channel section; 24. First heat dissipation column; 25. Second heat dissipation column; 241. Composite paraffin wax; 221. Guide plate; 31. First heat-conducting boss; 32. Second heat-conducting boss; 4. Air inlet. Detailed Implementation

[0030] To make the objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions in the embodiments of this utility model are clearly and completely described. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0031] It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0032] In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0034] This utility model discloses a variable channel heat dissipation plate to solve the problem of uneven heat dissipation in the prior art, which leads to excessively high local temperatures.

[0035] Please see Figure 1-4 The above are exploded views of the overall structure of the variable channel heat dissipation plate according to an embodiment of the present invention; top sectional view of the overall variable channel heat dissipation plate according to an embodiment of the present invention; left sectional view of the overall variable channel heat dissipation plate according to an embodiment of the present invention; bottom view of the overall structure of the variable channel heat dissipation plate according to an embodiment of the present invention.

[0036] An embodiment of this utility model provides a variable channel heat dissipation plate, comprising:

[0037] End cap 1;

[0038] A heat dissipation cavity is disposed on the lower end face of the end cover 1, and together with the end cover 1, it forms a heat dissipation channel. The heat dissipation channel includes a first heat dissipation channel section 21, a second heat dissipation channel section 22, and a third heat dissipation channel section 23 disposed along the cooling airflow direction.

[0039] The widths of the first heat dissipation channel segment 21 and the third heat dissipation channel segment 23 are fixed, and the width of the first heat dissipation channel segment 21 is greater than that of the third heat dissipation channel segment 23.

[0040] The first heat dissipation channel section 21 is provided with a plurality of first heat dissipation columns 24, and the third heat dissipation channel section 23 is provided with a plurality of second heat dissipation columns 25.

[0041] Specifically, the width of the first heat dissipation channel section 21 is greater than that of the third heat dissipation channel section 23. This arrangement helps to increase the flow rate of the cooling air in the third heat dissipation channel section 23 and remove local heat more quickly.

[0042] Specifically, the outer diameter of the first heat dissipation column 24 is larger than the outer diameter of the second heat dissipation column 25. With this configuration, it can be understood that the third heat dissipation channel section 23 enhances the turbulence effect through the dense arrangement of small-diameter heat dissipation columns, thus significantly improving the heat dissipation efficiency.

[0043] Specifically, a gap is provided between any two adjacent first heat dissipation columns 24; a gap is provided between any two adjacent second heat dissipation columns 25; the gap between each first heat dissipation column 24 is larger than the gap between each second heat dissipation column 25. This helps to increase the contact area between the cooling airflow and the heat dissipation column and reduce the resistance of the heat dissipation column to the cooling airflow, thereby enhancing the heat dissipation capacity.

[0044] Specifically, the first heat dissipation column 24 is a hollow cylinder filled with composite paraffin wax 241; the second heat dissipation column 25 is a solid cylinder.

[0045] Specifically, the hollow cylinder is filled with composite paraffin 241. This configuration can effectively absorb the instantaneous thermal shock of electronic devices. When the chip temperature rises sharply, the phase change material absorbs a large amount of heat through solid-liquid phase change, avoiding local overheating and reducing the temperature fluctuation of the chip surface by more than 60%, significantly improving the heat dissipation stability under high load conditions.

[0046] Specifically, the second heat dissipation channel section 22 is provided with a guide plate 221 along the cooling airflow direction.

[0047] Specifically, the bottom surface of the heat dissipation cavity is provided with a first heat-conducting protrusion 31 in the first heat dissipation channel section 21, and the bottom surface of the heat dissipation cavity is provided with a second heat-conducting protrusion 32 in the second heat dissipation channel section 22. It can be understood that this arrangement reduces airflow separation loss and improves the uniformity of wind speed distribution through the guide plate 221. On the other hand, the heat-conducting protrusion directly contacts the heat source, establishes an efficient heat conduction path, reduces thermal resistance drop, and reduces edge heat conduction pressure.

[0048] Specifically, an air inlet 4 for mounting a fan is provided at the end of the first heat dissipation channel section 21 that is away from the second heat dissipation channel section 22.

[0049] Specifically, a sealant is provided between the end cap 1 and the heat dissipation cavity to ensure the airtightness of the system.

[0050] Specifically, the heat dissipation cavity is made of aluminum alloy, thus the device is both lightweight and easy to process, with a compact overall structure.

[0051] For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A variable channel heat dissipation plate, characterized in that, include: End cap; A heat dissipation cavity is disposed on the lower end face of the end cover and together with the end cover forms a heat dissipation channel. The heat dissipation channel includes a first heat dissipation channel section, a second heat dissipation channel section and a third heat dissipation channel section disposed along the cooling airflow direction. The widths of the first heat dissipation channel segment and the third heat dissipation channel segment are fixed, and the width of the first heat dissipation channel segment is greater than that of the third heat dissipation channel segment. The first heat dissipation channel section is provided with a plurality of first heat dissipation columns, and the third heat dissipation channel section is provided with a plurality of second heat dissipation columns.

2. The variable channel heat spreading cold plate of claim 1, wherein, The outer diameter of the first heat sink is larger than the outer diameter of the second heat sink.

3. The variable channel heat spreading cold plate of claim 2, wherein, A gap is provided between any two adjacent first heat dissipation columns; a gap is provided between any two adjacent second heat dissipation columns; the gap between each first heat dissipation column is greater than the gap between each second heat dissipation column.

4. The variable channel heat spreading cold plate of claim 3, wherein, The first heat dissipation column is a hollow cylinder filled with composite paraffin wax; the second heat dissipation column is a solid cylinder.

5. The variable channel heat spreading cold plate of claim 4, wherein, The second heat dissipation channel section is provided with a guide plate along the direction of cooling airflow.

6. The variable channel heat spreading cold plate of claim 5, wherein, The bottom surface of the heat dissipation cavity is provided with a first heat-conducting protrusion in the first heat dissipation channel section, and the bottom surface of the heat dissipation cavity is provided with a second heat-conducting protrusion in the second heat dissipation channel section.

7. The variable channel heat spreading cold plate of claim 6, wherein, An air inlet for mounting a fan is also provided at the end of the first heat dissipation channel section away from the second heat dissipation channel section.

8. The variable channel heat spreading cold plate of claim 7, wherein, A sealant is provided between the end cap and the heat dissipation cavity.

9. The variable channel heat spreading cold plate of claim 8, wherein, The heat dissipation cavity is made of aluminum alloy.

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