Tantalum polymer capacitor laminated electrode packaging structure

Abstract

The utility model discloses a laminated electrode packaging structure of a tantalum polymer capacitor, which relates to the technical field of capacitor packaging and comprises an inner electrode, an outer electrode and an outer electrode, the end electrodes are arranged at the two ends of the inner electrode, each end electrode comprises tantalum metal layers arranged on the two sides of the inner electrode and used for improving the conductivity of the end electrode, the inner electrode comprises chips which are horizontally stacked in a staggered mode, a second ceramic dielectric layer is arranged outside each chip, and the tantalum metal layers are arranged on the tantalum metal layers. According to the utility model, the chip is arranged in the second ceramic dielectric layer in an inclined manner at 5 degrees, so that the electric field distribution is further optimized, the response capability of the capacitor to the change of the electric field is improved, the effective working length of the inner electrode is increased, the area of the inner electrode is increased in a phase-changing manner, and the capacitance is improved.

Description

Technical Field

[0001] This utility model relates to the field of capacitor packaging technology, and in particular to a tantalum polymer capacitor stacked electrode packaging structure. Background Technology

[0002] In today's era of rapid development in electronic technology, electronic devices are constantly moving towards miniaturization, lightweighting, high performance, and high integration. This trend places extremely stringent requirements on the performance and packaging structure of electronic components, especially capacitors. Tantalum polymer capacitors, with their advantages of high capacitance, low equivalent series resistance (ESR), good frequency characteristics, and stable operating performance, are widely used in many electronic devices, such as smartphones, tablets, laptops, wearable devices, and various high-end electronic instruments.

[0003] However, existing electrode packaging structures for tantalum polymer capacitors have revealed numerous problems in practical applications. Current tantalum polymer capacitors typically employ a parallel stacking arrangement for their internal electrodes. This method limits the effective contact area between the electrodes, resulting in insufficient capacity expansion and making it difficult to meet the high-capacity requirements of electronic devices. Furthermore, the parallel stacking arrangement easily leads to uneven electric field distribution, with severe electric field concentration at the electrode edges. This makes the capacitor highly susceptible to breakdown under high-voltage conditions, reducing its reliability and lifespan. Therefore, a multi-layered electrode packaging structure for tantalum polymer capacitors is urgently needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a tantalum polymer capacitor stacked electrode packaging structure. Its advantages lie in: by tilting the chip at a 5° angle within the second ceramic dielectric layer, the electric field distribution is further optimized, enhancing the capacitor's response to changes in the electric field; simultaneously, the effective working length of the internal electrodes is increased, effectively increasing the internal electrode area and thus improving the capacitance.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A tantalum polymer capacitor stacked electrode package structure, comprising:

[0007] Internal electrodes used for storing charge;

[0008] The end electrodes are disposed at both ends of the inner electrode, and the end electrodes include tantalum metal layers disposed on both sides of the inner electrode to improve the conductivity of the end electrodes.

[0009] Through the above technical solution, the tantalum metal layers on both sides of the terminal electrode, with their good conductivity, can quickly introduce the charge of the external circuit into the internal electrode, and at the same time, can efficiently conduct the charge stored in the internal electrode to the external circuit.

[0010] The present invention is further configured such that the inner electrode includes chips stacked in a horizontally staggered manner, and a second ceramic dielectric layer is disposed on the outside of the chips. The second ceramic dielectric layer is fixedly connected to the chips by high-temperature sintering.

[0011] The above technical solutions increase the effective contact area between electrodes, creating favorable conditions for improving capacitance. At the same time, they change the electric field distribution path, making the electric field more uniformly distributed in the second ceramic dielectric layer 303, thus reducing the risk of capacitor breakdown under high voltage.

[0012] The present invention is further configured such that the second ceramic dielectric layer is wrapped with the first ceramic dielectric layer, and the strength of the first ceramic dielectric layer is greater than that of the second ceramic dielectric layer.

[0013] Through the above technical solution, the strength of the first ceramic dielectric layer is greater than that of the second ceramic dielectric layer, thus providing good protection for the internal structure.

[0014] The present invention is further provided that a coating layer is provided on the outside of the first ceramic medium layer.

[0015] The above technical solutions enhance the capacitor's protective performance through the coating layer, effectively preventing external factors from eroding the inner structure.

[0016] The present invention is further configured such that the end electrode includes a first nickel layer and a second nickel layer, and the outer wall of the first nickel layer is provided with a tin layer.

[0017] The above technical solution achieves the following: the second nickel layer assists the tantalum metal layer to ensure smooth charge transfer between the inner electrode and the end electrode, and the tin layer improves the solderability of the end electrode, facilitating soldering and connection with external circuits.

[0018] The present invention is further configured such that the second nickel layer is disposed on one side of the tantalum metal layer, and the thickness of the first nickel layer is greater than the thickness of the second nickel layer.

[0019] The above technical solution enhances the stability and conductivity of the connection between the terminal electrode and the external circuit due to the larger thickness of the first nickel layer.

[0020] The present invention is further configured such that the chip is inclined in the second ceramic dielectric layer, and the angle between the chip and the horizontal direction is 5°.

[0021] The above technical solutions can further optimize the electric field distribution, improve the capacitor's response to changes in the electric field, increase the effective working length of the internal electrode, indirectly increase the area of ​​the internal electrode, and improve the capacitance.

[0022] The present invention is further configured such that the chip includes a horizontal portion and a storage enhancement component, the number of horizontal portions being two, and the storage enhancement component being disposed in the middle of the two horizontal portions.

[0023] The above technical solution provides a structural basis for increasing capacitor capacity by placing the storage enhancement component in the middle of the two horizontal sections.

[0024] The present invention is further configured such that the storage enhancement component includes an arc-shaped part and a vertical part, the arc-shaped part, the vertical part and the horizontal part are all fixedly connected, and the arc-shaped part and the vertical part are distributed at equal distances in the middle of the two horizontal parts.

[0025] Through the above technical solutions: the arc-shaped and vertical parts set in the storage component effectively increase the overall area of ​​the chip, and based on the principle that the capacitance is proportional to the electrode area, the capacitance is significantly improved.

[0026] The beneficial effects of this utility model are as follows:

[0027] 1. In this utility model, the inner electrodes adopt a horizontally staggered stacked chip design, which increases the effective contact area between the electrodes, expands the capacity improvement space, changes the electric field distribution path, makes the electric field more uniformly distributed in the second ceramic dielectric layer, reduces the electric field concentration phenomenon, and reduces the risk of capacitor breakdown under high voltage. By setting the chip at a 5° angle in the second ceramic dielectric layer, the electric field distribution is further optimized, the capacitor's response capability to electric field changes is improved, and the effective working length of the inner electrodes is increased, which indirectly increases the area of ​​the inner electrodes and improves the capacity.

[0028] 2. In this utility model, by setting tantalum metal layers on both sides of the end electrode, the conductivity of the end electrode is significantly improved, which can quickly introduce external circuit charge into the inner electrode and efficiently discharge the charge stored in the inner electrode. At the same time, the first nickel layer, the second nickel layer and the tin layer in the end electrode work together. The first nickel layer is thicker, which enhances the stability and conductivity of the connection between the end electrode and the external circuit. The second nickel layer assists the tantalum metal layer to ensure smooth charge transmission between the inner electrode and the end electrode. The tin layer improves the solderability of the end electrode and facilitates soldering connection with the external circuit.

[0029] 3. In this utility model, by placing the energy storage component in the middle of the two horizontal parts of the chip, its arc-shaped and vertical parts effectively increase the overall area of ​​the chip. Based on the principle that the capacitance is proportional to the electrode area, the capacitance is significantly improved. Furthermore, since the energy storage component is located in the middle of the chip, it can effectively disperse the electric field during operation, avoid excessively strong electric fields at the ends, reduce the risk of capacitor breakdown, and improve the capacitor's stable operation under high voltage conditions. In addition, the second ceramic dielectric layer is wrapped with a stronger first ceramic dielectric layer, which plays a good role in protecting the internal structure. The coating layer outside the first ceramic dielectric layer further enhances the capacitor's protective performance, prevents external factors from eroding the inner structure, and ensures the capacitor's long-term stable operation in complex environments. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of a tantalum polymer capacitor stacked electrode packaging structure proposed in this utility model.

[0031] Figure 2 This is a cross-sectional planar structural schematic diagram of a tantalum polymer capacitor stacked electrode packaging structure proposed in this utility model;

[0032] Figure 3 This is a schematic diagram of Embodiment 2 of the tantalum polymer capacitor stacked electrode packaging structure proposed in this utility model;

[0033] Figure 4 This is a schematic diagram of Embodiment 3 of the tantalum polymer capacitor stacked electrode packaging structure proposed in this utility model.

[0034] In the figure: 1. Coating layer; 2. Terminal electrode; 201. Tin layer; 202. First nickel layer; 203. Second nickel layer; 204. Tantalum metal layer; 3. Inner electrode; 301. First ceramic dielectric layer; 302. Chip; 303. Second ceramic dielectric layer; 30201. Horizontal part; 30202. Arc-shaped part; 30203. Vertical part. Detailed Implementation

[0035] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0036] Reference Figures 1-2 A tantalum polymer capacitor stacked electrode packaging structure, comprising:

[0037] Internal electrode 3 for storing charge;

[0038] The end electrodes 2 are disposed at both ends of the inner electrode 3. The end electrodes 2 include tantalum metal layers 204 disposed on both sides of the inner electrode 3 to improve the conductivity of the end electrodes 2. With their good conductivity, the tantalum metal layers 204 on both sides of the end electrodes 2 can quickly introduce the charge of the external circuit into the inner electrode 3, and at the same time can efficiently conduct the charge stored in the inner electrode 3 to the external circuit.

[0039] To improve capacitor capacitance, refer to Figures 1-2 The inner electrode 3 includes chips 302 stacked in a horizontally staggered manner. A second ceramic dielectric layer 303 is disposed on the outside of the chip 302. The second ceramic dielectric layer 303 is fixedly connected to the chip 302 by high-temperature sintering. The horizontally staggered stacked chips 302 increase the effective contact area between the electrodes, creating favorable conditions for increasing the capacitance. At the same time, it changes the electric field distribution path, making the electric field more uniformly distributed in the second ceramic dielectric layer 303, reducing the risk of capacitor breakdown under high voltage.

[0040] To enhance the stability and reliability of the overall capacitor structure, refer to Figure 2 The second ceramic dielectric layer 303 is wrapped with the first ceramic dielectric layer 301. The strength of the first ceramic dielectric layer 301 is greater than that of the second ceramic dielectric layer 303, thus providing good protection for the internal structure.

[0041] To ensure the long-term stable operation of the capacitor in complex environments, refer to Figures 1-2 The first ceramic dielectric layer 301 is provided with a coating layer 1 on its exterior, which further enhances the protection performance of the capacitor and can effectively prevent external factors from eroding the inner structure.

[0042] To enhance the overall performance of the capacitor, refer to Figure 2 The terminal electrode 2 also includes a first nickel layer 202 and a second nickel layer 203. The outer wall of the first nickel layer 202 is provided with a tin layer 201. The second nickel layer 203 assists the tantalum metal layer 204 to ensure smooth charge transfer between the inner electrode 3 and the terminal electrode 2. The tin layer 201 improves the solderability of the terminal electrode 2 and facilitates soldering connection with external circuits.

[0043] To enhance the stability and conductivity of the connection between terminal electrode 2 and the external circuit, refer to Figure 2 The second nickel layer 203 is disposed on one side of the tantalum metal layer 204. The thickness of the first nickel layer 202 is greater than the thickness of the second nickel layer 203. The larger thickness of the first nickel layer 202 enhances the stability and conductivity of the connection between the terminal electrode 2 and the external circuit.

[0044] Example 2

[0045] Reference Figure 3A tantalum polymer capacitor stacked electrode packaging structure is disclosed. Compared with Embodiment 1, in this embodiment, the chip 302 is inclined in the second ceramic dielectric layer 303, and the angle between the chip 302 and the horizontal direction is 5°. This can further optimize the electric field distribution, improve the capacitor's response to changes in the electric field, and increase the effective working length of the inner electrode 3, thereby indirectly increasing the area of ​​the inner electrode 3 and improving the capacitance.

[0046] Example 3

[0047] Reference Figure 4 A tantalum polymer capacitor stacked electrode packaging structure, compared with embodiments 1-2, this embodiment also includes a chip 302 including a horizontal portion 30201 and a storage enhancement component. The number of horizontal portions 30201 is two, and the storage enhancement component is disposed in the middle of the two horizontal portions 30201. The storage enhancement component is disposed in the middle of the two horizontal portions 30201, which provides a structural basis for increasing the capacitance.

[0048] To further increase the overall capacitance, refer to Figure 4 The storage enhancement component includes an arc-shaped portion 30202 and a vertical portion 30203. The arc-shaped portion 30202, the vertical portion 30203, and the horizontal portion 30201 are all fixedly connected. The arc-shaped portion 30202 and the vertical portion 30203 are distributed at equal distances in the middle of the two horizontal portions 30201. Since the arc-shaped portion 30202 and the vertical portion 30203 provided in the storage enhancement component effectively increase the overall area of ​​the chip 302, based on the principle that the capacitance is proportional to the electrode area, the capacitance is significantly improved.

[0049] Working principle: When an external circuit applies voltage, charge begins to be stored and transferred in the tantalum polymer capacitor stacked electrode package structure. The chip 302 in the inner electrode 3 serves as the core charge storage component and undertakes the main charge storage task. Since the chips 302 are horizontally staggered, on the one hand, the effective contact area between the electrodes is increased, and on the other hand, the distribution path of the electric field is changed, making the electric field more uniformly distributed in the second ceramic dielectric layer 303 and reducing the electric field concentration phenomenon.

[0050] In Embodiment 2, by tilting the chip 302 at 5° in the second ceramic dielectric layer 303, the electric field distribution is further optimized, the capacitor's response to changes in the electric field is improved, and the capacitor's performance is more stable during charging and discharging. Furthermore, the tilted stacked chip 302 increases the effective working length of the inner electrode 3, thereby indirectly increasing the area of ​​the inner electrode 3 and thus improving the capacitance.

[0051] Meanwhile, the tantalum metal layer 204 on both sides of the terminal electrode 2, with its good conductivity, quickly introduces the charge of the external circuit into the inner electrode 3, and can also efficiently conduct the charge stored in the inner electrode 3 to the external circuit. The first nickel layer 202, the second nickel layer 203 and the tin layer 201 in the terminal electrode 2 work together. The first nickel layer 202 is thicker and is mainly responsible for enhancing the stability and conductivity of the connection between the terminal electrode 2 and the external circuit. The second nickel layer 203 assists the tantalum metal layer 204 to ensure smooth charge transfer between the inner electrode 3 and the terminal electrode 2. The tin layer 201 improves the solderability of the terminal electrode 2 and facilitates soldering connection with the external circuit.

[0052] In Embodiment 3, by placing the arc-shaped portion 30202 and the vertical portion 30203 in the storage enhancement component in the middle of the two horizontal portions 30201, the overall area of ​​the chip 302 is effectively increased. According to the basic principle of capacitors, the capacitance is proportional to the electrode area. Therefore, the design of the storage enhancement component significantly improves the capacitance. At the same time, since the storage enhancement component is located in the middle of the chip 302, it can effectively disperse the electric field when the capacitor is working, avoid the situation of excessively strong electric field at the end, reduce the risk of capacitor breakdown, improve the voltage withstand performance of the capacitor, and enable the capacitor to work stably in a high-voltage environment.

[0053] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A tantalum polymer capacitor laminated electrode package structure, characterized by, include: Internal electrode (3) used for storing charge; The end electrodes (2) are disposed at both ends of the inner electrode (3). The end electrodes (2) include tantalum metal layers (204) disposed on both sides of the inner electrode (3) to improve the conductivity of the end electrodes (2).

2. The tantalum polymer capacitor stack electrode package structure of claim 1, wherein The inner electrode (3) includes chips (302) stacked horizontally in a staggered manner. A second ceramic dielectric layer (303) is disposed on the outside of the chip (302). The second ceramic dielectric layer (303) is fixedly connected to the chip (302) by high-temperature sintering.

3. The tantalum polymer capacitor laminate electrode package structure of claim 2, wherein The second ceramic dielectric layer (303) is wrapped with a first ceramic dielectric layer (301), and the strength of the first ceramic dielectric layer (301) is greater than that of the second ceramic dielectric layer (303).

4. The tantalum polymer capacitor laminate electrode package structure of claim 3, wherein The first ceramic dielectric layer (301) is provided with a coating layer (1) on its exterior.

5. The tantalum polymer capacitor laminate electrode package structure of claim 4, wherein The terminal electrode (2) further includes a first nickel layer (202) and a second nickel layer (203), and a tin layer (201) is disposed on the outer wall of the first nickel layer (202).

6. The tantalum polymer capacitor laminate electrode package structure of claim 5, wherein The second nickel layer (203) is disposed on one side of the tantalum metal layer (204), and the thickness of the first nickel layer (202) is greater than the thickness of the second nickel layer (203).

7. The tantalum polymer capacitor laminate electrode package structure of claim 6, wherein The chip (302) is inclined in the second ceramic dielectric layer (303), and the angle between the chip (302) and the horizontal direction is 5°.

8. The tantalum polymer capacitor laminate electrode package structure of claim 7, wherein, The chip (302) includes a horizontal section (30201) and a storage enhancement component. There are two horizontal sections (30201), and the storage enhancement component is disposed in the middle of the two horizontal sections (30201).

9. The tantalum polymer capacitor laminate electrode package structure of claim 8, wherein, The storage enhancement component includes an arc-shaped portion (30202) and a vertical portion (30203). The arc-shaped portion (30202), the vertical portion (30203), and the horizontal portion (30201) are all fixedly connected. The arc-shaped portion (30202) and the vertical portion (30203) are distributed at equal distances in the middle of the two horizontal portions (30201).

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