Laser and laser processing device

Abstract

The utility model discloses a laser device and a laser processing device, the laser device comprises a box body, a heat dissipation module, a light path assembly, a circuit board assembly and a pump source assembly, and the box body is internally provided with an accommodating cavity; the heat dissipation module is arranged in the containing cavity so that the containing cavity can be divided into a first installation cavity and a second installation cavity in the first direction. The light path assembly is arranged in the first mounting cavity and is attached to the heat dissipation module; the circuit board assembly and the pump source assembly are arranged in the second installation cavity and attached to the heat dissipation module, and the heat dissipation module comprises a heat dissipation body and a heat dissipation pipe assembly, so that the heat dissipation effect on the laser can be improved by adopting a combined structure of heat dissipation fins of the heat dissipation body and the heat dissipation pipe assembly; at least part of the radiating pipe assembly is inserted into the radiating fins of the radiating body, so that the fitting tightness between the radiating pipe assembly and the radiating fins is improved, the heat conduction efficiency of the radiating fins and the radiating pipe assembly can be improved, and the radiating and cooling efficiency of the laser is improved.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to a laser and a laser processing device. Background Technology

[0002] Laser cleaning and laser marking are applications of laser ablation, methods that use laser energy to selectively remove layers of material from a surface. Laser cleaning uses photon energy to strip, vaporize, sublimate, or burn away unwanted waste without damaging the underlying large material. It is primarily a localized application with lower precision requirements. Laser marking, on the other hand, uses a high-energy-density laser to locally irradiate the workpiece, causing the surface material to vaporize or change color, thus leaving a permanent mark. It can mark various texts, symbols, and patterns as needed, with character sizes ranging from millimeters to micrometers, and requires higher precision.

[0003] With the increasing demand for miniaturized laser applications, the lasers used in existing laser cleaning and laser marking fields are still relatively large. Reducing the size of the laser can easily lead to an increase in the internal heat capacity and insufficient heat dissipation efficiency. Utility Model Content

[0004] The purpose of this invention is to propose a laser and a laser processing device, which aims to solve the problems that existing lasers are still relatively large in size, and that reducing the size of the laser can easily lead to an increase in the internal heat capacity and insufficient heat dissipation efficiency.

[0005] In a first aspect, this utility model provides a laser, the laser comprising:

[0006] The housing has a receiving cavity inside;

[0007] A heat dissipation module is disposed within the accommodating cavity to divide the accommodating cavity along a first direction to form a first mounting cavity and a second mounting cavity;

[0008] An optical path assembly is disposed within the first mounting cavity and attached to the heat dissipation module;

[0009] The circuit board assembly and the pump source assembly are both disposed in the second mounting cavity and are both attached to the heat dissipation module;

[0010] The heat dissipation module includes a heat sink and a heat pipe assembly, with at least a portion of the heat pipe assembly inserted into the heat sink fins of the heat sink.

[0011] In one embodiment, the heat sink includes a substrate and a plurality of heat sinks connected to the substrate, the plurality of heat sinks being arranged parallel to each other to form a plurality of ventilation channels extending along a second direction, the first direction being at an angle to the second direction.

[0012] The heat dissipation pipe assembly includes a heat dissipation pipe body inserted inside a plurality of heat dissipation fins, and a heat conduction pipe body connected to the heat dissipation pipe body, wherein the heat conduction pipe body is completely embedded in the plurality of heat dissipation fins, or at least a portion of the heat conduction pipe body is disposed outside the heat dissipation fins.

[0013] In one embodiment, the heat dissipation module further includes a heat dissipation frame, the heat sink is installed in the heat dissipation frame, the heat dissipation frame includes a plurality of heat-conducting plates, the plurality of heat-conducting plates surround to form a heat dissipation space for accommodating the heat sink, and the heat dissipation pipe assembly includes a first heat dissipation pipe and a second heat dissipation pipe, the first heat dissipation pipe including the heat dissipation pipe body and the heat-conducting pipe body;

[0014] The distribution area of ​​the first heat dissipation pipe corresponds to the pump source assembly, and the heat pipe body is completely embedded in the plurality of heat sinks; the distribution area of ​​the second heat dissipation pipe corresponds to the circuit board assembly, and the second heat dissipation pipe is completely embedded in the heat-conducting plate.

[0015] In one embodiment, the heat dissipation module further includes a heat dissipation frame, the heat sink is installed in the heat dissipation frame, the heat dissipation frame includes a plurality of heat-conducting plates, the plurality of heat-conducting plates surround to form a heat dissipation space for accommodating the heat sink, and the heat dissipation pipe assembly includes a first heat dissipation pipe and a second heat dissipation pipe, the first heat dissipation pipe including the heat dissipation pipe body and the heat-conducting pipe body;

[0016] The distribution area of ​​the first heat dissipation pipe corresponds to the pump source component, and a part of the heat pipe body is embedded in a plurality of heat dissipation fins, while another part is embedded in the heat conduction plate.

[0017] The distribution area of ​​the second heat pipe corresponds to the circuit board assembly, and a portion of the second heat pipe is embedded in a plurality of heat sinks, while another portion is embedded in the heat-conducting plate.

[0018] In one embodiment, the first heat sink further includes a bent tube connecting the heat sink body and the heat conduction tube body. The heat sink body has a clearance groove for avoiding the bent tube. The exterior of the heat sink body is provided with a first heat conduction groove for fitting and conforming to the heat conduction tube body. A plurality of heat conduction plates include a first heat conduction plate and a second heat conduction plate disposed opposite to each other. The second heat conduction plate is attached to the heat sink body and has a first heat transfer groove for fitting the heat conduction tube body and a second heat transfer groove for fitting the second heat sink. A portion of the heat conduction tube body is embedded... The first heat-conducting groove is partially disposed within the first heat-transfer groove, and another portion is disposed within the first heat-conducting groove. At least a portion of the second heat-dissipating pipe is embedded within the second heat-transfer groove. The wall of the clearance groove is provided with a second heat-conducting groove for adapting and fitting with the bent pipe body. At least a portion of the bent pipe body is disposed within the second heat-conducting groove. A plurality of heat-dissipating fins are provided with heat-conducting holes for adapting and fitting with the heat-dissipating pipe body, and the heat-dissipating pipe body passes through the heat-conducting holes. The clearance grooves are arranged in multiple sets at intervals along the second direction, and each set of clearance grooves corresponds to a plurality of the first heat-dissipating pipes; and / or,

[0019] Several of the heat sinks are welded and fixed to the substrate.

[0020] In one embodiment, the heat dissipation module further includes a fan assembly and a fan shroud. The heat sink and the fan assembly are spaced apart along a second direction so that the fan assembly can draw or blow air into the ventilation duct. The fan shroud is installed on the heat dissipation frame and surrounds the heat dissipation frame to form an air intake space for accommodating the fan assembly.

[0021] Wherein, the exhaust cross-sectional area of ​​the fan assembly in the air intake space is not less than the ventilation cross-sectional area of ​​a plurality of the ventilation ducts, and the first direction and the second direction are arranged at an angle.

[0022] In one embodiment, the first heat-conducting plate is provided with an optical fiber groove for winding optical fiber on one side of the first mounting cavity.

[0023] The heat sink is a structural component made of copper or aluminum alloy, the heat pipe assembly is a pipe structure made of copper or aluminum alloy, and the heat sink frame is a frame structure made of copper or aluminum alloy.

[0024] In one embodiment, the optical path assembly includes an isolator, a beam combiner, and a mode stripper, wherein the isolator, the beam combiner, and the mode stripper are spaced apart within the first mounting cavity and are all attached to the heat dissipation module; the pump source assembly includes a first-stage pump source, a second-stage pump source, and a third-stage pump source, wherein the first-stage pump source, the second-stage pump source, and the third-stage pump source are spaced apart within the second mounting cavity and are all attached to the heat dissipation module; the laser further includes a signal light source, wherein the signal light source is disposed within the second mounting cavity; and / or,

[0025] The circuit board assembly includes a control board and a drive board electrically connected to the control board. The control board includes a control body and a drive unit and a seed source unit disposed on the control body.

[0026] In one embodiment, the housing includes a first plate and a second plate spaced apart along a first direction, and a third plate and a fourth plate spaced apart along a second direction. Each of the third and fourth plates has a ventilation slot for ventilation. The first, second, third, and fourth plates enclose the accommodating cavity, and a sealing structure is provided at the joints between adjacent plates.

[0027] The height dimension of the box along the first direction is H, where 80mm≤H≤120mm; the length dimension of the box along the second direction is L, where 250mm≤L≤340mm; the width dimension of the box along the third direction is D, where 205mm≤D≤265mm, wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0028] Secondly, this utility model also provides a laser processing apparatus, which includes the laser of any of the above embodiments.

[0029] The present invention has the following beneficial effects:

[0030] The laser and laser processing device of this invention, since the heat dissipation module includes a heat sink and a heat pipe assembly, can use a combination structure of heat sink and heat pipe assembly to increase the heat dissipation effect of the laser. Furthermore, since at least part of the heat pipe assembly is inserted into the heat sink of the heat sink, the tightness of the fit between the heat pipe assembly and the heat sink is improved, thus improving the thermal conductivity of the heat sink and heat pipe assembly, thereby increasing the heat dissipation and cooling efficiency of the laser. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] in:

[0033] Figure 1 An explosion of a laser in one embodiment Figure 1 .

[0034] Figure 2 for Figure 1 The explosion of the laser shown Figure 2 .

[0035] Figure 3 for Figure 1 Partial schematic diagram of the laser shown Figure 1 .

[0036] Figure 4 for Figure 1 Partial schematic diagram of the laser shown Figure 2 .

[0037] Figure 5 for Figure 1 An exploded view of part of the heat dissipation module in the laser shown.

[0038] Figure 6 for Figure 5 Enlarged view of section A.

[0039] Figure 7 for Figure 1 A schematic diagram of the heat sink in the laser shown.

[0040] Figure 8 for Figure 1 A schematic diagram of the heat dissipation tube assembly in the laser shown.

[0041] Figure 9 for Figure 1 A schematic diagram of the heat dissipation module in the laser shown.

[0042] Reference numerals: 100, Housing; 110, First Plate; 120, Second Plate; 130, Third Plate; 140, Fourth Plate; 101, Ventilation Slot; 200, Heat Dissipation Module; 210, Heat Sink; 211, Base Plate; 212, Heat Sink; 213, Ventilation Channel; 214, Clearance Slot; 215, First Heat Conducting Slot; 216, Second Heat Conducting Slot; 220, Heat Pipe Assembly; 221, First Heat Pipe; 2211, Heat Conducting Pipe Body; 2212, Heat Pipe Body; 2213, Bent Pipe Body; 222, Second Heat Pipe; 23 0. Fan shroud; 240. Heat sink frame; 241. First heat conduction plate; 242. Second heat conduction plate; 250. Air intake space; 300. Optical path assembly; 310. Isolator; 320. Bundle combiner; 330. Demold stripper; 400. Circuit board assembly; 410. Control board; 411. Control unit; 412. Drive unit; 413. Seed source unit; 420. Drive board; 500. Pump source assembly; 510. First-stage pump source; 520. Second-stage pump source; 530. Third-stage pump source; 600. Fan assembly; 700. Signal light source. Detailed Implementation

[0043] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0044] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0045] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include at least one of the stated features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0046] This utility model discloses a laser processing device, which is mainly used for laser cleaning or laser marking. Please refer to... Figures 1 to 9 One embodiment of the laser processing apparatus includes a laser for emitting a laser beam. In this embodiment, the laser includes a housing 100, a heat dissipation module 200, an optical path assembly 300, a circuit board assembly 400, and a pump source assembly 500. The housing 100 has a receiving cavity. The heat dissipation module 200 is disposed in the receiving cavity to divide the receiving cavity along a first direction to form a first mounting cavity and a second mounting cavity. The optical path assembly 300 is disposed in the first mounting cavity and attached to the heat dissipation module 200, thereby facilitating heat dissipation of the optical path assembly 300. The circuit board assembly 400 and the pump source assembly 500 are both disposed in the second mounting cavity and attached to the heat dissipation module 200, thereby facilitating heat dissipation of the circuit board assembly 400 and the pump source assembly 500.

[0047] This configuration allows for the separation of the heat-generating pump source component 500 from the less heat-generating optical path component 300, thus improving the heat dissipation efficiency of the pump source component 500.

[0048] Figure 1 and Figure 2 The direction pointed to by the middle arrow Z is the first direction.

[0049] In this embodiment, the heat dissipation module 200 includes a heat sink 210 and a heat pipe assembly 220. At least a portion of the heat pipe assembly 220 is inserted into the heat sink 212 of the heat sink 210. Since the heat dissipation module 200 includes a heat sink 210 and a heat pipe assembly 220, the combined structure of the heat sink 212 of the heat sink 210 and the heat pipe assembly 220 can be used to increase the heat dissipation effect on the laser. Furthermore, since at least a portion of the heat pipe assembly 220 is inserted into the heat sink 212 of the heat sink 210, the tightness of the fit between the heat pipe assembly 220 and the heat sink 212 is improved. Therefore, the thermal conductivity of the heat sink 212 and the heat pipe assembly 220 can be improved, thereby increasing the heat dissipation and cooling efficiency of the laser.

[0050] The heat dissipation method using the heat sink 212 and heat pipe assembly 220 in this embodiment can optimize the heat dissipation layout. Even when the ambient temperature reaches 45°C, the temperature rise of the laser can be kept within a safe range of 15°C when operating at full power.

[0051] In one embodiment, please refer to Figures 5 to 7The heat sink 210 includes a substrate 211 and a plurality of heat sinks 212 connected to the substrate 211. The plurality of heat sinks 212 are arranged parallel to each other to form a plurality of ventilation channels 213 extending along a second direction. The first direction and the second direction are arranged at an angle. The heat pipe assembly 220 includes a heat pipe body 2212 inserted inside the plurality of heat sinks 212 and a heat conduction pipe body 2211 connected to the heat sink body 2212. The heat conduction pipe body 2211 is completely embedded in the plurality of heat sinks 212. By such arrangement, the heat conduction pipe body 2211 and the heat sinks 212 can be tightly attached to each other, increasing the heat conduction efficiency between them.

[0052] Figure 1 and Figure 2 In the diagram, the direction pointed to by arrow Y is the second direction.

[0053] Of course, in some embodiments, at least a portion of the heat pipe 2211 may also be disposed outside the heat sink 212. This arrangement facilitates increased heat conduction efficiency between the heat pipe 2211 and external components, allowing the heat pipe 2211 to efficiently transfer heat to the heat sink 2212. Since the heat sink 2212 is inserted inside several heat sinks 212, the heat transfer efficiency between the heat sink 2212 and the heat sink 212 is improved, thereby increasing the heat dissipation efficiency of the heat dissipation module 200. The arrangement of the heat sink 212 further reduces weight while ensuring overall heat dissipation.

[0054] In one embodiment, please refer to Figures 5 to 8 The heat dissipation module 200 also includes a heat dissipation frame 240, and a heat sink 210 is installed inside the heat dissipation frame 240. The heat dissipation frame 240 includes a plurality of heat-conducting plates, which enclose a heat dissipation space for accommodating the heat sink. The heat dissipation pipe assembly 220 includes a first heat dissipation pipe 221 and a second heat dissipation pipe 222. The first heat dissipation pipe 221 includes a heat dissipation pipe body 2212 and a heat-conducting pipe body 2211.

[0055] In this embodiment, the configuration of the plurality of heat-conducting plates and heat pipe assemblies 220 can have a variety of options.

[0056] In one embodiment, the distribution area of ​​the first heat dissipation pipe 221 corresponds to that of the pump source assembly 500, and the heat pipe body 2211 is completely embedded within a plurality of heat sinks 212, thereby enhancing the heat dissipation efficiency of the pump source assembly 500 through the first heat dissipation pipe 221. The distribution area of ​​the second heat dissipation pipe 222 corresponds to that of the circuit board assembly 400, and the second heat dissipation pipe 222 is completely embedded within the heat-conducting plate, thereby enhancing the heat dissipation efficiency of the circuit board assembly 400 through the second heat dissipation pipe 222. This arrangement ensures that the heat from the main heat source area, i.e., the pump source assembly 500, is quickly transferred to the low-heat area and dissipated through air cooling. In this embodiment, embedding the heat pipe body 2211 completely within the heat sinks 212 allows for better contact with the heat-conducting plate.

[0057] In another embodiment, the distribution area of ​​the first heat dissipation pipe 221 corresponds to that of the pump source assembly 500, and a portion of the heat pipe body 2211 is embedded within a plurality of heat sinks 212, while the other portion is embedded in a heat-conducting plate. This enhances the heat dissipation efficiency of the pump source assembly 500 through the first heat dissipation pipe 221. Similarly, the distribution area of ​​the second heat dissipation pipe 222 corresponds to that of the circuit board assembly 400, with a portion of the second heat dissipation pipe 222 embedded within a plurality of heat sinks 212 and the other portion embedded in a heat-conducting plate. This also enhances the heat dissipation efficiency of the circuit board assembly 400 through the second heat dissipation pipe 222. In this embodiment, using the heat pipe body 2211 and the second heat dissipation pipe 222 to connect the plurality of heat sinks 212 and the heat-conducting plate improves heat conduction efficiency.

[0058] Furthermore, in this embodiment, the first heat dissipation pipe 221 further includes a bent pipe body 2213 connecting the heat dissipation pipe body 2212 and the heat conduction pipe body 2211. The heat dissipation body 210 has an avoidance groove 214 for avoiding the bent pipe body 2213. The exterior of the heat dissipation body 210 is provided with a first heat conduction groove 215 for fitting and conforming to the heat conduction pipe body 2211. A plurality of heat conduction plates include a first heat conduction plate 241 and a second heat conduction plate 242 disposed opposite to each other. The second heat conduction plate 242 is attached to the heat dissipation body 210 and is provided with a first heat transfer groove for fitting the heat conduction pipe body 2211 and a second heat transfer groove for fitting the second heat dissipation pipe 222. A portion of the heat conduction pipe body 2211 is embedded in the first heat conduction groove 215, and another portion is disposed in the first heat transfer groove. At least a portion of the second heat conduction pipe body 2211 is also disposed in the first heat transfer groove. The heat dissipation pipe 222 is embedded in the second heat transfer groove. The groove wall of the clearance groove 214 is provided with a second heat conduction groove 216 for fitting and conforming to the bent pipe body 2213. At least part of the bent pipe body 2213 is disposed in the second heat conduction groove 216. Several heat sinks 212 are provided with heat conduction holes for fitting and conforming to the heat dissipation pipe body 2212. The heat dissipation pipe body 2212 passes through the heat conduction holes. Thus, the first heat dissipation pipe 221 is assembled and set up through the first heat conduction groove 215, the second heat conduction groove 216, and the heat conduction holes. By setting the heat conduction holes and several grooves, not only can the installation position of each pipe body in the heat dissipation pipe assembly 220 be limited, but the tightness of the fit between the pipe body and the heat sink 212 and the heat conduction plate can also be increased, thereby increasing the heat conduction efficiency. Furthermore, the several grooves can be selected as arc grooves. Of course, in some embodiments, the several grooves can also be adapted to square grooves or other structural forms. Their purpose is to limit the position and to fit and conduct heat.

[0059] Specifically, multiple sets of clearance slots 214 are spaced apart along the second direction, and each set of clearance slots 214 is provided with multiple first heat dissipation pipes 221, thereby improving the heat dissipation efficiency of the distribution area by using the clustered arrangement of the first heat dissipation pipes 221. Furthermore, each set of clearance slots 214 includes two clearance slots 214, and the two clearance slots 214 in each set are symmetrically arranged on both sides of the heat sink 210.

[0060] Of course, in other embodiments, the heat pipe body 2211 can also be completely embedded in the heat-conducting plate, and the second heat dissipation pipe 222 can also be completely embedded in a number of heat dissipation fins 212. The specific arrangement of the heat pipe body 2211 and the second heat dissipation pipe 222 can be selected according to the specific design requirements of the heat dissipation module 200.

[0061] In one embodiment, a plurality of heat sinks 212 are welded and fixed to the substrate 211, thereby ensuring that the plurality of heat sinks 212 are arranged according to a preset trajectory. At the same time, this welding process provides a heat dissipation area of ​​more than 30% compared with the toothed or aluminum extrusion process for the same volume, and the corresponding heat dissipation capacity is improved by more than 20%, but the weight increases by less than 5%.

[0062] Specifically, the components within the heat dissipation module 200 can be integrated tightly into one piece using welding and screw-in methods, which can effectively reduce thermal resistance.

[0063] In one embodiment, please refer to Figure 1 and Figure 2 The heat dissipation module 200 also includes a fan assembly 600. The heat sink 210 and the fan assembly 600 are spaced apart along a second direction so that the fan assembly 600 can draw air or blow air into the ventilation duct 213, thereby increasing the airflow velocity in the ventilation duct 213 and exchanging heat with the heat dissipation module 200, removing temperatures higher than the ambient temperature from the heat dissipation module 200, and improving the heat dissipation efficiency of the heat sink 210. In this embodiment, the first direction and the second direction are arranged at an angle.

[0064] In this embodiment, the fan assembly 600 can draw air from the ventilation duct 213 to prevent the air from blowing directly into the front during operation.

[0065] Please refer to the following for details. Figure 5 The heat dissipation module 200 also includes a fan shroud 230. The heat sink 210 is installed inside the heat dissipation frame 240. The fan shroud 230 is installed in the heat dissipation frame 240 and together with the heat dissipation frame 240, they form an air intake space 250 for accommodating the fan assembly 600. The exhaust cross-sectional area of ​​the fan assembly 600 in the air intake space 250 is not less than the ventilation cross-sectional area of ​​a number of ventilation channels 213, thereby ensuring that the fan assembly 600 can provide sufficient exhaust air force to improve the heat dissipation efficiency of the heat sink 210.

[0066] Understandably, by setting up the fan shroud 230, the height of the air intake space 250 can be widened, thereby increasing the exhaust cross-sectional area of ​​the fan assembly 600, so as to ensure that several fans in the fan assembly 600 can completely cover the cross-sectional area of ​​the ventilation duct 213, so as to ensure sufficient exhaust air force.

[0067] By setting the fan height higher than the heat sink 210, a larger airflow can be achieved, and the ineffective area of ​​the fan can be reduced. If the fan height is the same as the heat sink 210, the airflow will not be able to fill the ventilation channel 213 in the ineffective area of ​​the fan. Furthermore, the fan assembly 600 includes multiple fans, which are spaced apart along a third direction.

[0068] In one embodiment, please refer to Figure 5 A thermally conductive agent is also filled between the heat-conducting plate and the first heat dissipation pipe 221 and the second heat dissipation pipe 222, which further improves the thermal conductivity between the heat-conducting plate and the first heat dissipation pipe 221 and the second heat dissipation pipe 222.

[0069] In this embodiment, the first heat-conducting plate 241 is provided with an optical fiber groove for winding optical fiber on one side of the first mounting cavity, and the optical fiber is wound in the optical fiber groove.

[0070] Specifically, the heat sink 210 is a structural component made of copper or aluminum alloy, the heat pipe assembly 220 is a pipe structure made of copper or aluminum alloy, and the heat sink frame 240 is a frame structure made of copper or aluminum alloy. This configuration improves the heat dissipation efficiency of the heat dissipation module 200.

[0071] Furthermore, the heat sink 210 is a structural component made of aluminum alloy, the heat pipe assembly 220 is a pipe structure made of copper, and the heat sink frame 240 is a frame structure made of aluminum alloy. This configuration reduces the production cost of the heat sink 210 and the heat sink frame 240. Since copper has a higher thermal conductivity than aluminum alloy, using copper pipes for the heat pipe assembly 220 enhances its heat dissipation efficiency.

[0072] The copper pipes can be made of 8mm diameter purple copper that is resistant to gravity, with a thermal conductivity of Qmax = 80W(mk). The pipe layout is combined with the actual power limit and heat dissipation requirements to ensure that the heat from the main heat source area is transferred to the low heat area and can be dissipated through air cooling.

[0073] In one embodiment, please refer to Figures 1 to 3 The optical path assembly 300 includes an isolator 310, a combiner 320, and a stripper 330. The isolator 310, the combiner 320, and the stripper 330 are spaced apart in the first mounting cavity and are all attached to the heat dissipation module 200, thereby realizing the distribution of the optical path assembly 300, solving the problem of flexible placement of optical devices in the small space optical path assembly 300, and ensuring that the optical fiber has a sufficient bending radius.

[0074] In this embodiment, please refer to Figure 4 The pump source assembly 500 includes a first-stage pump source 510, a second-stage pump source 520, and a third-stage pump source 530. The first-stage pump source 510, the second-stage pump source 520, and the third-stage pump source 530 are spaced apart in the second mounting cavity and are all attached to the heat dissipation module 200. This arrangement can optimize the circuit path and reduce interference with the optical path.

[0075] In this embodiment, the laser also includes a signal light source 700, which is disposed within the second mounting cavity. Its function is to output a visible red laser beam.

[0076] Specifically, the circuit board assembly 400 includes a control board 410 and a drive board 420 electrically connected to the control board 410. The control board 410 includes a control body 411 and a drive unit 412 and a seed source unit 413 disposed on the control body 411.

[0077] This configuration not only meets the requirements for miniaturization and small size of the laser, but also integrates control, drive and seed source functions on the control board 410, and provides an additional drive board 420 with an extra stage of drive to meet the power output requirements.

[0078] Understandably, by arranging the components within the laser in this way, the overall structure becomes compact and lightweight, reducing the laser's size to as low as 0.0068m. 3 It weighs as little as 5kg.

[0079] In one embodiment, please refer to Figure 1 and Figure 2 The housing 100 includes a first plate 110 and a second plate 120 spaced apart along a first direction, and a third plate 130 and a fourth plate 140 spaced apart along a second direction. Both the third plate 130 and the fourth plate 140 are provided with ventilation slots 101 for ventilation. The first plate 110, second plate 120, third plate 130, and fourth plate 140 enclose a receiving cavity, and the joints between adjacent plates of the first plate 110, second plate 120, third plate 130, and fourth plate 140 are sealed with a sealing structure. Further, the sealing structure can be selected from sealing cotton, sealant, or other sealing materials.

[0080] Specifically, the sealing cotton can be selected as sealing cotton with a compression of 70% EVA. Furthermore, in this embodiment, both the first plate 110 and the second plate 120 are U-shaped plates. The ventilation slot 101 has a high-pass design; a high ventilation rate allows for smoother airflow, thereby improving heat dissipation efficiency.

[0081] Specifically, the height dimension of the box body 100 along the first direction is H, where 80mm ≤ H ≤ 120mm. Further, the height dimension H of the box body 100 along the first direction can be selected as 80mm, 85mm, 90mm, 95mm, 100mm, 105mm, 110mm, 115mm, or 120mm. The length dimension of the box body 100 along the second direction is L, where 250mm ≤ L ≤ 340mm. Further, the length dimension L of the box body 100 along the second direction can be selected as 250mm, 260mm, 270mm, 280mm, 290mm, 300mm, 310mm, 320mm, 330mm, or 340mm. The width dimension of the housing 100 along the third direction is D, where 205mm ≤ D ≤ 265mm. Further, the width dimension D of the housing 100 along the third direction can be selected as 205mm, 215mm, 225mm, 235mm, 245mm, 255mm, or 265mm. In this embodiment, the first direction, the second direction, and the third direction are arranged perpendicular to each other. This dimensional arrangement allows for miniaturization of the laser.

[0082] Figure 1 and Figure 2 In the diagram, the direction pointed to by arrow X is the second direction.

[0083] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A laser, characterized by, The laser includes: The housing has a receiving cavity inside; A heat dissipation module is disposed within the accommodating cavity to divide the accommodating cavity along a first direction to form a first mounting cavity and a second mounting cavity; An optical path assembly is disposed within the first mounting cavity and attached to the heat dissipation module; The circuit board assembly and the pump source assembly are both disposed in the second mounting cavity and are both attached to the heat dissipation module; The heat dissipation module includes a heat sink and a heat pipe assembly, with at least a portion of the heat pipe assembly inserted into the heat sink fins of the heat sink.

2. The laser of claim 1, wherein, The heat sink includes a substrate and a plurality of heat sinks connected to the substrate. The plurality of heat sinks are arranged parallel to each other to form a plurality of ventilation channels extending along a second direction. The first direction and the second direction are arranged at an angle. The heat dissipation pipe assembly includes a heat dissipation pipe body inserted inside a plurality of heat dissipation fins, and a heat conduction pipe body connected to the heat dissipation pipe body, wherein the heat conduction pipe body is completely embedded in the plurality of heat dissipation fins, or at least a portion of the heat conduction pipe body is disposed outside the heat dissipation fins.

3. The laser of claim 2, wherein, The heat dissipation module further includes a heat dissipation frame, the heat sink is installed in the heat dissipation frame, the heat dissipation frame includes a plurality of heat-conducting plates, the plurality of heat-conducting plates surround to form a heat dissipation space for accommodating the heat sink, and the heat dissipation pipe assembly includes a first heat dissipation pipe and a second heat dissipation pipe, the first heat dissipation pipe including the heat dissipation pipe body and the heat-conducting pipe body; The distribution area of ​​the first heat dissipation pipe corresponds to the pump source assembly, and the heat pipe body is completely embedded in the plurality of heat sinks; the distribution area of ​​the second heat dissipation pipe corresponds to the circuit board assembly, and the second heat dissipation pipe is completely embedded in the heat-conducting plate.

4. The laser of claim 2, wherein, The heat dissipation module further includes a heat dissipation frame, the heat sink is installed in the heat dissipation frame, the heat dissipation frame includes a plurality of heat-conducting plates, the plurality of heat-conducting plates surround to form a heat dissipation space for accommodating the heat sink, and the heat dissipation pipe assembly includes a first heat dissipation pipe and a second heat dissipation pipe, the first heat dissipation pipe including the heat dissipation pipe body and the heat-conducting pipe body; The distribution area of ​​the first heat dissipation pipe corresponds to the pump source component, and a part of the heat pipe body is embedded in a plurality of heat dissipation fins, while another part is embedded in the heat conduction plate. The distribution area of ​​the second heat pipe corresponds to the circuit board assembly, and a portion of the second heat pipe is embedded in a plurality of heat sinks, while another portion is embedded in the heat-conducting plate.

5. The laser of claim 4, wherein, The first heat dissipation pipe further includes a bent pipe body connecting the heat dissipation pipe body and the heat conduction pipe body. The heat dissipation body has a clearance groove for avoiding the bent pipe body. The exterior of the heat dissipation body is provided with a first heat conduction groove for fitting and conforming to the heat conduction pipe body. A plurality of heat conduction plates include a first heat conduction plate and a second heat conduction plate arranged opposite to each other. The second heat conduction plate is attached to the heat dissipation body and is provided with a first heat transfer groove for fitting the heat conduction pipe body and a second heat transfer groove for fitting the second heat dissipation pipe. A portion of the heat conduction pipe body is embedded in the first... In one heat-conducting groove, another part is disposed in the first heat-transfer groove, at least a portion of the second heat dissipation pipe is embedded in the second heat-transfer groove, the groove wall of the clearance groove is provided with a second heat-conducting groove for adapting and fitting with the bent pipe body, at least a portion of the bent pipe body is disposed in the second heat-conducting groove, a plurality of heat sinks are provided with heat-conducting holes for adapting and fitting with the heat dissipation pipe body, and the heat dissipation pipe body passes through the heat-conducting holes; wherein, the clearance groove is provided in multiple sets at intervals along the second direction, and each set of clearance grooves is provided with a plurality of the first heat dissipation pipes; and / or, Several of the heat sinks are welded and fixed to the substrate.

6. The laser of claim 3 or 4, wherein, The heat dissipation module further includes a fan assembly and a fan shroud. The heat sink and the fan assembly are spaced apart along a second direction so that the fan assembly can draw or blow air into the ventilation duct. The fan shroud is installed on the heat dissipation frame and surrounds the heat dissipation frame to form an air intake space for accommodating the fan assembly. Wherein, the exhaust cross-sectional area of ​​the fan assembly in the air intake space is not less than the ventilation cross-sectional area of ​​a plurality of the ventilation ducts, and the first direction and the second direction are arranged at an angle.

7. The laser of claim 5, wherein, The first heat-conducting plate is provided with an optical fiber groove for winding optical fiber on one side of the first mounting cavity. The heat sink is a structural component made of copper or aluminum alloy, the heat pipe assembly is a pipe structure made of copper or aluminum alloy, and the heat sink frame is a frame structure made of copper or aluminum alloy.

8. The laser of claim 1, wherein, The optical path assembly includes an isolator, a beam combiner, and a mode stripper. The isolator, beam combiner, and mode stripper are spaced apart within the first mounting cavity and are all attached to the heat dissipation module. The pump source assembly includes a first-stage pump source, a second-stage pump source, and a third-stage pump source. The first-stage pump source, the second-stage pump source, and the third-stage pump source are spaced apart within the second mounting cavity and are all attached to the heat dissipation module. The laser also includes a signal light source, which is disposed within the second mounting cavity. And / or, The circuit board assembly includes a control board and a drive board electrically connected to the control board. The control board includes a control body and a drive unit and a seed source unit disposed on the control body.

9. The laser of claim 1, wherein, The housing includes a first plate and a second plate spaced apart along a first direction, and a third plate and a fourth plate spaced apart along a second direction. Each of the third and fourth plates has ventilation slots for ventilation. The first, second, third, and fourth plates enclose the accommodating cavity, and the joints between adjacent plates are sealed with a sealing structure; and / or, The height dimension of the box along the first direction is H, where 80mm≤H≤120mm; the length dimension of the box along the second direction is L, where 250mm≤L≤340mm; the width dimension of the box along the third direction is D, where 205mm≤D≤265mm, wherein the first direction, the second direction and the third direction are perpendicular to each other.

10. A laser processing apparatus characterized by comprising: The laser processing apparatus includes the laser as described in any one of claims 1 to 9.

Images