Package and system

Abstract

The utility model relates to a package and a system. There is provided a package comprising: a first rigid segment defining a first vent hole; a second rigid segment defining a second vent hole; a first speaker die attached to the first rigid segment and covering the first vent hole; a second speaker die attached to the second rigid segment and covering the second vent hole; a first flexible segment attached between the first rigid segment and the second rigid segment and providing electrical continuity between the first rigid segment and the second rigid segment; and a spacer defining an acoustic port with a first rigid segment attached to a first side of the spacer and a second rigid segment attached to a second side of the spacer with the first loudspeaker die facing the second loudspeaker die.

Description

Technical Field

[0001] The exemplary embodiments of this disclosure generally relate to the packaging of multiple loudspeakers, and more particularly to an apparatus, system, and method for packaging multiple MEMS-based loudspeakers in a compact form factor, which improves manufacturability and enhances the audio quality of the loudspeakers. Background Technology

[0002] Using speakers to generate audio has broad applicability to a variety of use cases. While relatively large speakers can provide enough sound to fill an environment, challenges arise for speakers used in smaller applications. For example, speakers used in earphones or mobile devices such as cellular phones require a large amount of audio output from a very small form factor. Microelectromechanical systems (MEMS) speakers are very small speaker packages that are useful in a variety of applications that require speakers with small form factors. These speakers operate in a manner consistent with conventional speakers, moving air according to the frequency of the noise the speaker wants to generate that can be heard by an ear or electronic receiver (e.g., a microphone). The amount of air moved / displaced directly affects the volume and power that the speaker can generate. Because these speakers are relatively very small in size, the amount of air moved is relatively small. Therefore, some embodiments require multiple MEMS speakers to achieve the amount of air moved and audio volume desired by a particular device.

[0003] MEMS speaker packaging presents challenges due to the size limitations of many applications, taking into account space constraints, the physical properties of the materials used in the speaker, and the acoustic functionality required for a given device. Summary of the Invention

[0004] The various embodiments described herein generally relate to the packaging of multiple loudspeakers, and more particularly to multiple MEMS-based loudspeaker devices, systems, and methods for packaging multiple loudspeaker devices, systems, and methods in a compact form factor, which improves manufacturability and enhances the audio quality of the loudspeakers.

[0005] The embodiments provided herein include an encapsulation comprising: a first rigid segment defining a first vent; a second rigid segment defining a second vent; a first speaker die attached to the first rigid segment and covering the first vent; a second speaker die attached to the second rigid segment and covering the second vent; a first flexible segment attached between the first and second rigid segments and providing electrical continuity between the first and second rigid segments; and a spacer defining an acoustic port, wherein the first rigid segment is attached to a first side of the spacer, the second rigid segment is attached to a second side of the spacer, and the first speaker die faces the second speaker die.

[0006] According to some embodiments, a first rigid segment, a second rigid segment, and a spacer define an acoustic chamber, wherein sound from the acoustic chamber is guided through an acoustic port defined in the spacer. The package in some embodiments further includes: a first cover attached to the first rigid segment, wherein a first speaker die is attached to a first side of the first rigid segment, wherein the first cover is attached to a second side of the first rigid segment opposite to the first side; and a second cover attached to the second rigid segment, wherein a second speaker die is attached to a first side of the second rigid segment, wherein the second cover is attached to a second side of the second rigid segment opposite to the first side. According to some embodiments, the first cover defines a first cavity between the first cover and a second side of the first rigid segment, and the second cover defines a second cavity between the second cover and a second side of the second rigid segment. According to some embodiments, the first cavity is isolated from the acoustic chamber, and the second cavity is isolated from the acoustic chamber.

[0007] According to some embodiments of the package, a first rigid segment is defined in a first trench around a first vent, and a second rigid segment is defined in a second trench around a second vent. A first speaker die is attached to the first rigid segment using an adhesive deposited in the first trench, and a second speaker die is attached to the second rigid segment using an adhesive deposited in the second trench. Some embodiments of the package also include a third rigid segment and a second flexible segment, the second flexible segment being attached between the first and third rigid segments and providing electrical continuity between the first and third rigid segments.

[0008] Some embodiments of the package also include a connector attached to a third rigid segment, wherein the connector is electrically connected to the first speaker die and the second speaker die. In some embodiments, the third rigid segment includes electrical leads, wherein the electrical leads are electrically connected to the first speaker die and the second speaker die. According to some embodiments, a first electrical lead is connected to the first speaker die via a second flexible segment, and a second electrical lead is connected to the second speaker die via both the second and first flexible segments. According to some embodiments, the first and second speaker dies each include a microelectromechanical system (MEMS) speaker die.

[0009] The embodiments provided herein include a method of forming an encapsulation, comprising: attaching a first speaker die to a first rigid segment over a first vent hole passing through a first rigid segment; attaching a second speaker die to a second rigid segment over a second vent hole passing through a second rigid segment, wherein the first rigid segment is attached to the second rigid segment via a first flexible segment; attaching the first rigid segment to a first side of a spacer; and attaching the second rigid segment to a second side of the spacer by bending the first flexible segment to form an acoustic chamber located between the first and second rigid segments and defined by the spacer.

[0010] Some embodiments of the method further include: attaching a first cap to a first rigid segment, wherein a first speaker die is attached to a first side of the first rigid segment, wherein the first cap is attached to a second side of the first rigid segment opposite to the first side; and attaching a second cap to a second rigid segment, wherein a second speaker die is attached to a first side of the second rigid segment, wherein the second cap is attached to a second side of the second rigid segment opposite to the first side. According to some embodiments, the first cap defines a first cavity between the first cap and a second side of the first rigid segment, and the second cap defines a second cavity between the second cap and a second side of the second rigid segment. According to some embodiments, the first cavity is isolated from an acoustic chamber, and the second cavity is isolated from the acoustic chamber. In some embodiments, attaching the first speaker die to the first rigid segment over a first vent hole includes depositing an adhesive in a trench surrounding the first vent hole and attaching a frame of the first speaker die to the adhesive.

[0011] The embodiments provided herein include a microelectromechanical (MEMS) loudspeaker system comprising: a first rigid segment defining a first vent; a second rigid segment defining a second vent; a third rigid segment; a first loudspeaker die attached to the first rigid segment and covering the first vent; a second loudspeaker die attached to the second rigid segment and covering the second vent; a first flexible segment attached between the first and second rigid segments and providing electrical continuity between the first and second rigid segments; a second flexible segment attached between the first and third rigid segments and providing electrical continuity between the first and third rigid segments, wherein an electrical connection on the third rigid segment is electrically connected to the first loudspeaker die via the second flexible segment, and is electrically connected to the second loudspeaker die via the first and second flexible segments; and a spacer defining an acoustic port, wherein the first rigid segment is attached to a first side of the spacer, and the second rigid segment is attached to a second side of the spacer, wherein the first loudspeaker die faces the second loudspeaker die.

[0012] According to some embodiments, a first rigid segment, a second rigid segment, a third rigid segment, a first flexible segment, and a second flexible segment are formed as coplanar to attach a first speaker die, a second speaker die, and a spacer. According to some embodiments, the first speaker die wires are bonded to solder pads of the first rigid segment, and the second speaker die wires are bonded to solder pads of the second rigid segment. In some embodiments, the first rigid segment, the second rigid segment, and the spacer define a circular profile.

[0013] The above description of the invention is provided merely to outline some exemplary embodiments to provide a basic understanding of some aspects of this disclosure. Accordingly, it will be appreciated that the above embodiments are merely examples and should not be construed as limiting the scope or spirit of this disclosure in any way. It will also be appreciated that the scope of this disclosure covers many potential embodiments in addition to those outlined herein, some of which will be further described below. Attached Figure Description

[0014] Therefore, some exemplary embodiments of this disclosure have been outlined, and reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and in which:

[0015] Figure 1 The illustration shows a portion of the package of a speaker according to an exemplary embodiment of the present disclosure;

[0016] Figure 2 The illustration shows attaching a connector to an example embodiment according to the present disclosure. Figure 1 The encapsulated part;

[0017] Figure 3 The illustration shows the deposition of an adhesive pattern around an exhaust port according to an exemplary embodiment of the present disclosure;

[0018] Figure 4 The illustration shows a groove in a rigid segment for receiving an adhesive pattern according to an example embodiment of the present disclosure;

[0019] Figure 5 The illustration shows the attachment of a MEMS speaker die to a rigid segment of a package according to an exemplary embodiment of the present disclosure;

[0020] Figure 6 The illustration shows the deposition of a spacer adhesive pattern according to an exemplary embodiment of the present disclosure;

[0021] Figure 7 The illustration shows a pattern of attaching a spacer to a spacer adhesive according to an exemplary embodiment of the present disclosure;

[0022] Figure 8 The illustration shows a second rigid segment folded over a first rigid segment along a first flexible segment according to an exemplary embodiment of the present disclosure;

[0023] Figure 9 The illustration shows a first rigid segment and a second rigid segment attached to the opposite side of the spacer according to an exemplary embodiment of the present disclosure;

[0024] Figure 10 The illustration shows a view of a package according to an exemplary embodiment of the present disclosure, illustrating an acoustic aperture in a spacer;

[0025] Figure 11The illustration shows the rear sides of the first rigid segment, the second rigid segment, and the third rigid segment prior to encapsulation assembly according to an exemplary embodiment of the present disclosure;

[0026] Figure 12 The illustration shows a second rigid segment folded over a first rigid segment along a first flexible segment according to an exemplary embodiment of the present disclosure;

[0027] Figure 13 The illustration shows a first rigid segment and a second rigid segment according to an exemplary embodiment of the present disclosure, which are attached to the opposite side of the spacer and have a cover that creates a rear cavity for the speaker;

[0028] Figure 14 The illustration shows a view of a package according to an exemplary embodiment of the present disclosure, illustrating an acoustic aperture in a spacer;

[0029] Figure 15 The illustration shows an encapsulation having a wire connection directly above a first rigid segment according to an exemplary embodiment of the present disclosure;

[0030] Figure 16 The illustration shows a package pair arranged in a stacked configuration according to an example embodiment of the present disclosure;

[0031] Figure 17 The illustration shows a circular embodiment of the package according to an exemplary embodiment of the present disclosure;

[0032] Figure 18 Another view of a circular embodiment of the package according to an exemplary embodiment of the present disclosure is illustrated;

[0033] Figure 19 Another view of a circular embodiment of the package according to an exemplary embodiment of the present disclosure is illustrated, showing an acoustic aperture;

[0034] Figure 20 A cross-sectional view of an encapsulation according to an exemplary embodiment of the present disclosure is illustrated. Detailed Implementation

[0035] Some embodiments of this disclosure will now be described more fully with reference to the accompanying drawings, which illustrate some, but not all, of these embodiments. In fact, various embodiments of this disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure may meet applicable legal requirements. The same reference numerals refer to the same elements throughout.

[0036] As used herein, the term “comprising” means including but not limited to, and should be interpreted in the manner commonly used in the patent context. The use of broader terms such as including, comprising, and having should be understood to support narrower terms such as consisting of, substantially consisting of, and substantially consisting of.

[0037] The phrases “in multiple embodiments,” “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally mean that the specific feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure and can be included in more than one embodiment of this disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0038] The terms “example” or “exemplary” are used herein to mean “served as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations.

[0039] If the specification states that a component or feature "may," "can," "may," "should," "will," "preferably," "possibly," "usually," "optionally," "for example," "often," or "may" (or other such language) be included or have that characteristic, then it is not required that the specific component or feature be included or have that characteristic. Such a component or feature may be optionally included in some embodiments or may be excluded.

[0040] The term "circuit system" as used herein with respect to components of a system or apparatus should be understood to include specific hardware configured to perform functions associated with a particular circuit system as described herein. The term "circuit system" should be broadly understood to include hardware, and in some embodiments, includes software for configuring the hardware. For example, in some embodiments, "circuit system" may include processing circuit systems, communication circuit systems, input / output circuit systems, etc. In some embodiments, other elements may provide for or complement the functionality of a particular circuit system.

[0041] Various embodiments of this disclosure relate to the packaging of multiple loudspeakers, and more particularly, to an apparatus, system, and method for packaging multiple MEMS-based loudspeakers in a compact form factor, which improves manufacturability and enhances the audio quality of the loudspeakers.

[0042] Semiconductor packages, including MEMS-based speakers, are shrinking in size and being used in increasingly size-constrained environments, such as mobile phones and portable electronic devices. Miniaturizing semiconductor packages requires reducing the size of all components within the package, some of which are physically limited in size due to one or more of existing manufacturing technologies, production costs, structural requirements, etc. An effective way to reduce the overall size of a semiconductor package is to eliminate components, if there are possible ways to otherwise provide functionality for the eliminated components. These components can be included in the package when improvements in the overall package layout can be utilized.

[0043] Wafer-level packaging provides an efficient manufacturing process for producing integrated circuits (ICs) and attaching components to the IC before it is diced into individual circuits. Components such as the top and bottom layers of the package and solder bumps are attached to the IC through a process that eliminates the need to handle individual ICs. This process enables efficient and consistent package assembly of ICs without the need to handle and align individual ICs to assemble components on them. Fan-out wafer-level packaging employs a similar technique; however, the IC is diced before at least some of the components of the wafer-level package are attached to the IC. Fan-out wafer-level packaging allows portions of the entire semiconductor package to be larger than the IC itself (e.g., a die-cut wafer). The embodiments described herein can be used in both wafer-level packaging and fan-out wafer-level packaging with some modifications to the manufacturing process. However, the final product remains substantially unchanged.

[0044] Electronic devices such as mobile phones or in-ear speakers (e.g., earbuds) are highly portable and are frequently carried by users throughout the day. Therefore, the size of mobile phones or other portable electronic devices is crucial to their portability and usability. These devices have a very high level of functionality and require robust design to withstand frequent use and constant, unintentional abuse and wear. Consequently, the structure of these electronic devices needs a certain degree of rigidity while maintaining a small form factor. The chassis of the electronic device, which carries its hardware components (e.g., sensors, communication modules, speakers, cameras, screens, etc.), becomes a significant factor in the overall size, limiting the available space for these components. Competing hardware components need to be sized to fit the small form factor; otherwise, the components will be omitted, which adversely affects the functionality and desirableness of the electronic device. Therefore, small form factor packaging for one or more sensors or speakers is highly desirable, and smaller components allow the electronic device to be manufactured with a smaller form factor and / or to contain more components, thereby increasing the functionality of the electronic device.

[0045] MEMS-based speakers are intended for use in devices with compact form factor, such as in-ear or earbud headphones, mobile device speakers (e.g., cellular phones), or other devices with relatively small overall package size. Accordingly, MEMS-based speakers are typically very small. However, since sound is generated by conventional techniques that drive air or sound waves at specific frequencies, the amount of air moved is directly related to the audible volume of the sound. Furthermore, sound quality and frequency response degrade when the speaker is driven to its physical limits. Therefore, while MEMS-based speakers offer the advantage of small form factor speakers, they also tend to move less air and thus have lower audible volume capabilities.

[0046] To improve upon the audio volume challenges of small, MEMS-based loudspeakers, multiple loudspeakers can be formed together in a package. However, more loudspeakers typically require more space, making space constraints an additional challenge to generating large audio volumes using MEMS loudspeakers. MEMS loudspeaker packages typically require a printed circuit board (PCB), a MEMS loudspeaker die, and a diaphragm. The package usually also requires some kind of housing for the loudspeaker enclosure and an audio chamber. The diaphragm moves as it drives air to generate sound, necessitating gaps to allow the diaphragm to move freely. Increasing the amount of air moving by doubling the number of MEMS loudspeaker packages to increase the audio volume from the device significantly increases the overall package size of the loudspeaker, thereby reducing the efficiency of small MEMS loudspeakers.

[0047] Simply increasing the number of speaker enclosures doubles the overall volume of the speaker components, thereby doubling the amount of air that can be moved, and thus increasing the volume. The embodiments described herein provide a single enclosure with two or more loudspeakers that provides an efficient overall package for doubling the amount of air that can be moved without doubling the overall volume of the speaker enclosure in the same proportion.

[0048] Embodiments of this disclosure provide a single package having two or more MEMS loudspeakers, which are manufactured on a substrate and manipulated to face each other. The embodiments provide a rigid-flexible substrate for attachment of the MEMS loudspeaker dies, as well as a single set of electrical connections. According to an example embodiment, two MEMS loudspeaker dies are formed on the same substrate, and the substrate is folded so that the loudspeaker dies face each other. Spacers can be used between the facing loudspeaker dies to provide sufficient front acoustic chamber. The embodiments are suitable for packages that mass-produce multiple loudspeakers, having a smaller form factor and fewer electrical connections than conventional solutions.

[0049] The substrate described in this embodiment includes a pair of rigid segments connected by flexible segments. In some embodiments, the substrate further includes a third rigid segment connected to one of two other rigid segments via another flexible segment, wherein the third rigid segment provides a substrate for a connector to connect a speaker system to a drive circuit.

[0050] Figure 1 The illustration shows a package 100 of an exemplary embodiment described herein, comprising three rigid segments connected by two flexible segments. As shown, a first rigid segment 110 is connected to a second rigid segment 120 via a first flexible segment 115. A third rigid segment 130 is connected to the first rigid segment 110 via a second flexible connection 125. In the illustrated embodiment, the first rigid segment 110 includes a first vent 112, the second rigid segment 120 includes a second vent 122 for a MEMS speaker diaphragm, and the third rigid segment 130 is dedicated to a connector for electrical signals from a drive circuit. Each of the rigid segments in the illustrated embodiment is a printed circuit board or a wafer-level semiconductor.

[0051] Figure 2 The illustration shows the attachment of connector 140 to a third rigid segment 130. Connector 140 can be attached by depositing solder paste onto the third rigid segment and then applying connector 140 to the third rigid segment 130. Connector 140 provides convenient electrical connection for devices (such as mobile phones), for assembling devices, and for possible servicing and replacement of package 100.

[0052] Figure 3 The illustration shows the deposition of adhesive or binder around a first vent 112 with a first adhesive pattern 114, and around a second vent 122 with a second adhesive pattern 124. The adhesive patterns can be deposited based on trenches formed in a solder mask layer on a rigid segment, wherein the trenches in the solder mask layer help prevent the deposited adhesive from reaching the vent and impairing the quality and performance of the speaker. Figure 4 An example trench 214 surrounding a vent hole 212 is illustrated in the solder mask layer 211 of a rigid substrate 210. The trench 214 provides a flow path for the deposited adhesive, which also helps to deposit more uniformly around the vent hole 212.

[0053] Figure 5The illustration shows a first adhesive pattern 114 attaching a first MEMS speaker die 116 to a first rigid segment 110, and a second adhesive pattern 124 attaching a second MEMS speaker die 126 to a second rigid segment 120. The MEMS speaker die includes a diaphragm that moves in response to a drive signal, thus moving air to generate audible sound. This requires the MEMS speaker die to have gaps above and below the diaphragm portion to allow this movement. Interference with diaphragm movement can cause audio output distortion and frequency limitation of the audio output. The MEMS speaker die includes a frame around the diaphragm to which the adhesive pattern is adhered, allowing the diaphragm to move freely and generate an audio signal. Each MEMS speaker die package requires acoustic isolation on either side of the MEMS speaker die. A consistent adhesive pattern is crucial to ensuring acoustic isolation between the front and rear sides of the MEMS speaker die. Figure 5 In the embodiment shown, the front side of each of the illustrated MEMS speaker dies faces upward, while the rear side of the MEMS speaker die faces the corresponding vent in the rigid segment.

[0054] MEMS speaker die leads are bonded to solder pads on corresponding rigid segments. As shown, the first MEMS speaker die lead is bonded to solder pad 118 of the first rigid segment 110, while the second MEMS speaker die lead is bonded to solder pad 128 of the second rigid segment 120. The lead bonding of the MEMS speaker dies ensures that they are electrically connected to the connector 140 soldered to the third rigid segment 130. The solder pad 128 of the second rigid segment 120 is electrically connected to the first rigid segment 110 across the first flexible segment 115. The solder pads 118 of the first rigid segment 110 and the second rigid segment 120 are electrically connected to the solder pads of the third rigid segment 130 via the second flexible segment 125. This allows the connector connected to the connector 140 from the drive circuitry to provide electrical signals to each of the first MEMS speaker die 116 and the second MEMS speaker die 118.

[0055] Each MEMS loudspeaker requires an acoustic chamber on the front side of the MEMS loudspeaker die. For example... Figure 6As shown, a first spacer adhesive pattern 152 is deposited on the first rigid segment 110, and a second spacer adhesive pattern 162 is deposited on the second rigid segment 120. The first rigid segment 110 and the second rigid segment 120 may include adhesive grooves in the solder mask for the respective spacer adhesive patterns. However, this may not be necessary because the spacer adhesive patterns are not located near vents or MEMS speaker dies. The grooves in the solder mask can facilitate spacer attachment by providing improved adhesive sealing during spacer attachment, as further described below, and can provide improved acoustic isolation of the acoustic chamber by reducing the likelihood of acoustic air leakage from unintended locations of the spacers.

[0056] Figure 7 The illustration shows a spacer 170 attached to a first spacer adhesive pattern 152 on a first rigid segment 110. The spacer 170 includes an acoustic port 180. In the illustrated embodiment, the acoustic port 180 is a "break" or discontinuity in the spacer where there is no connection between the spacer and the acoustic port 180. In such embodiments, the first spacer adhesive pattern 152 and the second spacer adhesive pattern 162 may also include a break at the location of the acoustic port 180. According to some embodiments, the acoustic port may be formed as a hole within the spacer, wherein the acoustic port is not a complete discontinuity or break in the spacer 170.

[0057] Figure 8 The illustration shows a second rigid segment 120 being moved to superimpose on the first rigid segment 110 and attach to the spacer 170. As shown, a first flexible segment 115 provides the flexibility to achieve this movement while maintaining electrical continuity between the first rigid segment 110 and the second rigid segment 120. Figure 9 The illustration shows the second rigid segment 120 folded to fully overlap the first rigid segment 110. The second rigid segment 120 is via... Figure 9 The invisible second spacer adhesive pattern 162 is attached to the spacer 170 opposite to the first rigid segment 110.

[0058] Figure 10 Another view of the package 100 is illustrated, looking toward the acoustic port 180 in the spacer 170. As shown, the first rigid segment 110, the second rigid segment 120, and the spacer 170 form a cavity, where the acoustic port 180 is the only path for air to move into and out of the cavity. This acoustic port 180 provides audio output from the MEMS speaker with a compact form factor, thanks to two MEMS speakers in a single package, which is efficient and effectively packaged. Figure 10The package 100 shown is suitable for mounting in many cases as illustrated. The second flexible segment 125 provides flexibility within the device when the package 100 is mounted. Furthermore, the flexibility of the second flexible segment 125 allows movement of the connector 140 and the third rigid segment 130 when attaching and / or removing the mating connector, making it less likely to damage the packaged MEMS speaker assembly compared to rigid attachment of the second flexible segment 125 between the first rigid segment 110 and the third rigid segment 130.

[0059] Although Figure 10 The embodiments shown are applicable to many applications, but some applications will require a rear chamber to cover the vent holes for the speaker assembly. An unlimited rear chamber, where there is no covering over the vent holes in the package, is suitable for devices such as, for example, augmented reality glasses. However, some devices, such as in-ear headphones or earbuds, may require a limited rear chamber.

[0060] Figure 11 The illustration shows package 100 in its folded state, as shown. Figure 7 As shown; however, the first rear chamber adhesive pattern 252 has been deposited, and the second rear chamber adhesive pattern 262 has also been deposited. Figure 12 The diagram illustrates the relationship with Figure 8 A similar folding process is used, in which the second rigid segment 120 is folded onto the spacer 170 by means of the first flexible segment 115. Figure 13 The illustration shows the second rigid portion 120 folded and secured to the spacer 170, as shown. Figure 9 As shown in the diagram. However, the second cover 240 has been fixed to the second rigid segment 120, thereby forming the second rear chamber through the second rear chamber adhesive pattern 262. The first cover 230 is fixed to the rear side of the first rigid segment 110 to form the first rear chamber through the first rear chamber adhesive pattern. The first cover 230 and the second cover 240 provide chambers on the rear side of the vent holes of the rigid segments. The first cover and the second cover can be formed of plastic, metal, or even using a B-stage adhesive.

[0061] Although connector 140 is shown as being mounted to third rigid segment 130 in the embodiment shown above, the embodiment may not require such a connector and may instead use third rigid segment 130 as the connection point. Figure 14 An embodiment is illustrated in which the third rigid segment 130 includes a plurality of connection pads 132, allowing the third rigid segment 130 to be inserted into a connector to connect the package 100 to the drive circuitry of a device. In this embodiment, the second rigid segment 125 provides flexibility for mounting the third rigid segment 130 into a receiving connector (not shown) and for positioning the package 100 within the device, while reducing the risk of damage to the package during connection to the drive circuitry.

[0062] Figure 15 Another example embodiment of package 100 is illustrated, in which a third rigid segment is not required. Figure 15 The package does not require a rear chamber or cover, so that the rear surface of the first rigid segment 110 may include a contact pad 134 to which a connector can be attached or wires can be soldered from the drive circuit to the contact pad 134 to drive the MEMS speaker of the package 100.

[0063] The embodiments described herein provide an improved package for multiple MEMS loudspeakers with an effective package size. Furthermore, the embodiments described herein can be modular in nature, allowing multiple packages to be combined depending on the device for which the loudspeakers are designed. Figure 16 The illustration depicts an example embodiment where two packages are arranged in a stacked configuration to provide four MEMS loudspeakers, which combine to generate sound from two acoustic apertures. In this stacked arrangement, the second package 300 is stacked on top of the first package 100. The loudspeaker package of the illustrated embodiment comprises components such as... Figure 13 The cover shown forms the rear cavity. This enables a stacked arrangement, where the cover of the first package 100 allows the cover of the second package 300 to be stacked on top of it. The two packages can be glued to each other or mechanically connected to form a multi-package arrangement.

[0064] While the illustrated embodiments described above have a generally rectangular shape factor, the package in various embodiments may include different shapes. For example, Figure 17 The illustration shows a package 400 with a circular form factor. Figure 17 The components in the illustrated embodiment are similar to those in the embodiments described above. As shown, the first rigid segment 410 is connected to the second rigid segment 420 via a first flexible segment 415. The third rigid segment 430 is connected to the first rigid segment 410 via a second flexible segment 425. The third rigid segment 430 in the illustrated embodiment includes a connector 440. A spacer 470 is adhered to the first rigid segment 110 via a first spacer adhesive pattern 452, and a second spacer adhesive pattern 462 is deposited on the second rigid substrate 420.

[0065] As with the embodiments described above, the second rigid segment 420 can be made flexible by the first flexible segment 415, such as... Figure 18 The figure shows it folded over onto the spacer 470 attached to the first rigid segment 410. Figure 19 The diagram shows... Figure 18A rotating version of package 400, wherein acoustic ports 480 are formed in spacers 470. The rigid segment can be any two-dimensional shape, which can accommodate vents and MEMS speaker dies. Different package shapes can be used to accommodate certain components within a component arrangement for adjacent device packages. Furthermore, the shape of the package can affect sound quality and fidelity. Thus, certain shapes may be more suitable for certain applications to provide accurate sound reproduction.

[0066] Figure 20 The illustration shows a cross-sectional view of a package 500 for a MEMS speaker pair as described herein. As shown, a first rigid segment 510 includes a first MEMS speaker die 516 attached to the first rigid segment above a first vent 512. A second MEMS speaker die 526 is attached to a second rigid segment 520 above a second vent 522. The first rigid segment 510 is attached to a first side of a spacer 570, and the second rigid segment 520 is attached to a second side of the spacer. The spacer includes an acoustic port 580 through which sound is guided along arrow 550. The first rigid segment 510 is attached to the second rigid segment 520 via a flexible segment 515. Figure 20 The embodiment also illustrates a first cover 530 attached to a first rigid segment 510 to form a first rear cavity 532, and a second cover 540 attached to a second rigid segment 520 to form a second rear cavity 542. This package 500 provides a superior arrangement for MEMS speaker pairs with a compact form factor.

[0067] When loudspeakers are packaged, acoustic isolation is required between the front and rear chambers. This isolation is even more critical when two loudspeakers face each other, as described in the embodiments herein. Appropriate spacing between the two facing loudspeaker dies enhances overall performance. The front chamber is shared between the two facing loudspeakers. Embodiments of this disclosure employ spacers that ensure consistent and accurate spacing between MEMS loudspeakers, thereby ensuring consistency between the package and the device to which the package is mounted.

[0068] While this specification contains numerous specific embodiments and implementation details, these should not be construed as limiting the scope of any disclosure or the scope of claims, but rather as descriptions of features specific to particular embodiments of a particular disclosure. Certain features described herein in the context of individual embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually in multiple embodiments or in any suitable sub-combination. Moreover, while features may be described above as functioning in certain combinations and even originally claimed in this way, in some cases one or more features from that combination may be removed from the claimed combination, and the claimed combination may involve sub-combinations or variations of sub-combinations.

[0069] While this detailed description has illustrated some embodiments of the invention, the appended claims cover other embodiments of the invention that differ from the described embodiments, based on various modifications and improvements.

[0070] In the appended claims, unless the specific terms “means for…” or “steps for…” are used in a given claim, the claims are not intended to be interpreted in accordance with 35 U.S.SC §112, paragraph 6.

Claims

1. A package, characterized by, include: The first rigid segment defines the first vent. The second rigid segment defines the second exhaust port; The first speaker tube is attached to the first rigid segment and covers the first exhaust port; The second speaker tube is attached to the second rigid section and covers the second exhaust port; A first flexible segment is attached between a first rigid segment and a second rigid segment and provides electrical continuity between the first rigid segment and the second rigid segment; as well as A spacer defining an acoustic port, wherein a first rigid segment is attached to a first side of the spacer, a second rigid segment is attached to a second side of the spacer, and wherein a first speaker die faces a second speaker die.

2. The package of claim 1, wherein, The first rigid segment, the second rigid segment, and the spacer define an acoustic chamber, wherein sound from the acoustic chamber is guided through the acoustic port defined in the spacer.

3. The package of claim 2, wherein, Also includes: A first cover is attached to a first rigid segment, wherein a first speaker die is attached to a first side of the first rigid segment, and wherein the first cover is attached to a second side of the first rigid segment opposite to the first side; and A second cover is attached to a second rigid segment, wherein the second speaker die is attached to a first side of the second rigid segment, and wherein the second cover is attached to a second side of the second rigid segment opposite to the first side.

4. The package of claim 3, wherein, The first cover defines a first cavity between the first cover and the second side of the first rigid segment, and the second cover defines a second cavity between the second cover and the second side of the second rigid segment.

5. The package of claim 4, wherein, The first cavity is isolated from the acoustic chamber, and the second cavity is isolated from the acoustic chamber.

6. The package of claim 1, wherein, The first rigid segment is defined in a first groove around the first vent, and the second rigid segment is defined in a second groove around the second vent. The first speaker die is attached to the first rigid segment using an adhesive deposited in the first groove, and the second speaker die is attached to the second rigid segment using an adhesive deposited in the second groove.

7. The package of claim 1, wherein, Also includes: The third rigid segment; as well as The second flexible stage is attached between the first rigid segment and the third rigid segment and provides electrical continuity between the first rigid segment and the third rigid segment.

8. The package of claim 7, wherein, It also includes a connector attached to a third rigid segment, wherein the connector is electrically connected to the first speaker die and the second speaker die.

9. The package of claim 7, wherein, The third rigid segment includes an electrical lead, wherein the electrical lead is electrically connected to the first speaker die and the second speaker die.

10. The package of claim 9, wherein, The first electrical lead in the electrical leads is connected to the first speaker die via the second flexible segment, and the second electrical lead in the electrical leads is connected to the second speaker die via the second flexible segment and the first flexible segment.

11. The package of claim 1, wherein, The first speaker chip and the second speaker chip each include a microelectromechanical system (MEMS) speaker chip.

12. A microelectromechanical (MEMS) speaker system, characterized by, include: The first rigid segment defines the first vent. The second rigid segment defines the second exhaust port; The third rigid segment; The first speaker tube is attached to the first rigid segment and covers the first exhaust port; The second speaker tube is attached to the second rigid section and covers the second exhaust port; A first flexible segment is attached between a first rigid segment and a second rigid segment and provides electrical continuity between the first rigid segment and the second rigid segment; The second flexible segment is attached between the first rigid segment and the third rigid segment and provides electrical continuity between the first rigid segment and the third rigid segment, wherein the electrical connection on the third rigid segment is electrically connected to the first loudspeaker die via the second flexible segment, and is electrically connected to the second loudspeaker die via the first flexible segment and the second flexible segment. as well as A spacer defining an acoustic port, wherein a first rigid segment is attached to a first side of the spacer and a second rigid segment is attached to a second side of the spacer, wherein a first speaker die faces a second speaker die.

13. The system of claim 12, wherein, The first rigid segment, the second rigid segment, the third rigid segment, the first flexible segment, and the second flexible segment are formed to be coplanar to attach the first speaker die, the second speaker die, and the spacer.

14. The system of claim 12, wherein, The first speaker die is wired to the solder pad of the first rigid segment, and the second speaker die is wired to the solder pad of the second rigid segment.

15. The system of claim 12, wherein, The first rigid segment, the second rigid segment, and the spacer define a circular outline.

Images