Heat sink, power module, and electronic device
By staggering the heat dissipation holes on the heat sink components, the coolant forms an impact jet and complex flow channels, solving the problems of insufficient flow volume temperature and turbulence intensity in the power module, and achieving more efficient heat dissipation and temperature uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU INOSA UNITED POWER SYST CO LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-21
AI Technical Summary
In the existing heat dissipation substrate design of power modules, the fluid flow direction is prone to heat accumulation, resulting in large junction temperature differences at the inlet and outlet positions, poor temperature uniformity of each bridge arm chip, and insufficient fluid-solid convection heat transfer effect.
Design a radiator with multiple heat dissipation holes arranged in different directions on the heat dissipation component. The coolant forms a vertical impact jet and flows between adjacent layers, forming a complex flow channel, enhancing the turbulence intensity, and realizing secondary heat exchange.
It significantly improves the fluid-solid convection heat transfer effect, reduces the maximum junction temperature of the power module, improves the temperature uniformity between the chips of each bridge arm, and solves the heat dissipation shortcomings in traditional designs.
Smart Images
Figure CN224154521U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic equipment technology, and in particular to a heat sink, a power module, and an electronic device. Background Technology
[0002] Currently, the heat dissipation substrates for power modules mainly have parallel fin structures and pin-fin structures. Parallel fin structures are simple and have low flow resistance. Pin-fin structures have pins of various shapes and array sizes. They can also be distinguished by water channel layout, either horizontally connected or vertically connected, in order to balance heat dissipation and flow resistance.
[0003] For example, Figure 1 This is a schematic diagram of fluid flow in an HPD packaged module with a parallel fin heat dissipation structure. The fluid flows parallel to the fins between them. Figure 2 The simulation results for the junction temperature of each bridge arm are as follows: due to the gradual increase of fluid temperature in the flow direction, there is a temperature difference between different phases, with a junction temperature difference of about 11℃ between the inlet and outlet. Due to the weak turbulence intensity between parallel fins, the highest junction temperature of the module is 139.6℃.
[0004] or, Figure 3 This is a schematic diagram of fluid flow in an HPD packaged module with a Pin-Fin heat dissipation structure. The fluid flows along the long side. Figure 4 The simulation results for the junction temperature of each bridge arm show that, due to the gradual increase in fluid temperature in the flow direction, there is a temperature difference between different phases. The junction temperature difference between the inlet and outlet is 7.5℃. The fluid turbulence intensity of Pin-Fin is significantly improved compared to parallel fins. The highest junction temperature of the module is 134.5℃, and the temperature rise is reduced by 7%.
[0005] From the above examples, it is easy to see that: the series water circuit is prone to heat accumulation in the direction of fluid flow, resulting in significant differences in junction temperature at the inlet and outlet of the power module, poor temperature uniformity of each bridge arm chip, and shortcomings in module heat dissipation; and whether it is parallel fin flow or pin-fin flow around the column, the fluid turbulence intensity is still relatively low, and the fluid-solid convection heat transfer effect needs to be improved. Utility Model Content
[0006] The main purpose of this invention is to provide a heat sink, a power module, and an electronic device, which aims to improve the overall heat dissipation effect of the power devices in the power module.
[0007] To achieve the above objectives, the present invention provides a radiator comprising:
[0008] The heat sink is provided with a plurality of heat dissipation holes, which are arranged in at least one row in a first direction and in at least two layers in a second direction, wherein the projections of the heat dissipation holes in at least two adjacent layers in the second direction are at least partially staggered.
[0009] In this process, after the coolant enters the heat sink, it passes through the heat sink holes of each layer in sequence along the second direction, and forms an impact jet perpendicular to the first direction in a local area of the heat sink hole corresponding to the previous layer. Then, it flows along the first direction between the heat sink holes of at least two adjacent layers to achieve secondary heat exchange. The first direction and the second direction are intersecting.
[0010] In one embodiment, the heat sink includes heat sink fins stacked along the second direction, each heat sink fin having a heat sink hole opened along the second direction, and the projections of the heat sink holes of at least two adjacent heat sink fins in the second direction are at least partially staggered.
[0011] The coolant enters the heat sink along a third direction, then passes through the heat dissipation holes of each heat sink fin in sequence along a second direction. It forms an impact jet perpendicular to the heat sink fin in a local area of the heat dissipation hole of the next heat sink fin corresponding to the previous heat sink fin. Subsequently, it flows along a first direction between at least two adjacent heat sink fins to achieve secondary heat exchange. The first direction, the second direction, and the third direction are arranged to intersect each other.
[0012] In one embodiment, in any two adjacent heat dissipation fins, the projection of each preset number of heat dissipation holes of one heat dissipation fin in the second direction forms a polygon, and the projection of one heat dissipation hole of the other heat dissipation fin in the second direction is located at the center of the polygon.
[0013] In one embodiment, the heat sink further includes:
[0014] The housing has a mounting groove, and the heat sink is disposed in the mounting groove and cooperates with the housing to form a cooling channel.
[0015] In one embodiment, the cooling channel includes:
[0016] The inlet flow channel is arranged along the second direction, and the heat dissipation component is disposed in the inlet flow channel.
[0017] An outlet flow channel is arranged along a first direction and is connected to the inlet flow channel.
[0018] In one embodiment, the outlet flow channel includes a first outlet flow channel and a second outlet flow channel, which are distributed on both sides of the heat sink, and are offset from the inlet flow channel in a third direction.
[0019] And / or, the housing has a liquid inlet, a liquid outlet, and a liquid guiding channel, the liquid outlet being connected to the outlet flow channel, the liquid guiding channel connecting the liquid inlet and the inlet flow channel, the liquid guiding channel being used to guide coolant entering from the liquid inlet to the inlet flow channel, the heat dissipation component being arranged along a first direction, and the liquid guiding channel being arranged along a first direction.
[0020] In one embodiment, the housing includes:
[0021] The shell body is provided with the mounting groove and the liquid guiding channel;
[0022] The cover body, together with the shell body, forms the inlet flow channel and the outlet flow channel, and the cover body is provided with the liquid inlet and the liquid outlet;
[0023] A sealing plate is disposed in the mounting groove and cooperates with the shell body to form the inlet flow channel. The heat dissipation component is disposed on the sealing plate. The sealing plate has an opening at the position corresponding to the liquid guiding channel, and the top end of the liquid guiding channel communicates with the opening.
[0024] In one embodiment, the cross-sectional shape of the opening is adapted to the cross-sectional shape of the liquid guiding channel;
[0025] And / or, a plurality of heat sinks are provided, and the plurality of heat sinks are arranged at intervals along the first direction on the sealing plate;
[0026] And / or, the sealing plate is provided with a plurality of isolation plates, each of the isolation plates separating two adjacent heat sinks.
[0027] This utility model also proposes a power module, the power module comprising:
[0028] substrate;
[0029] Power devices, disposed on the substrate; and
[0030] As described above, the top of the heat sink is connected to the substrate.
[0031] This invention also proposes an electronic device, including the power module described above.
[0032] The heat sink of this invention includes a heat sink component with multiple heat dissipation holes. These heat dissipation holes are arranged in at least one row in a first direction and in at least two layers in a second direction, with the projections of the heat dissipation holes in at least two adjacent layers in the second direction being at least partially staggered. This layout allows the coolant to enter the heat sink component and pass through each layer of heat dissipation holes sequentially along the second direction, forming an impact jet perpendicular to the first direction in a local area corresponding to the heat dissipation hole of the previous layer. This impact jet not only enhances the local turbulence intensity and improves the local heat transfer efficiency but also effectively breaks up heat accumulation, avoiding the temperature buildup phenomenon in traditional series water circuit designs. Subsequently, the coolant flows along the first direction between at least two adjacent layers of heat dissipation holes, achieving secondary heat transfer and further improving the overall heat dissipation effect. The heat sink of this invention can significantly improve the effect of fluid-solid convection heat transfer, reduce the maximum junction temperature of the power module, and improve the temperature uniformity between the chips in each bridge arm, effectively solving the heat dissipation shortcomings existing in parallel fin and pin-fin structures. Attached Figure Description
[0033] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.
[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0035] Figure 1 A schematic diagram of fluid flow in a prior art parallel fin heat dissipation structure.
[0036] Figure 2 Simulation cloud diagrams of junction temperatures for each arm of existing parallel fin heat dissipation structures;
[0037] Figure 3 This is a schematic diagram of fluid flow in a prior art Pin-Fin heat dissipation structure.
[0038] Figure 4 Simulation cloud diagrams of junction temperatures for each arm of the existing Pin-Fin heat dissipation structure;
[0039] Figure 5 A schematic diagram of a radiator embodiment provided by this utility model;
[0040] Figure 6 for Figure 5 A schematic diagram of the structure of one embodiment of a heat dissipation fin;
[0041] Figure 7for Figure 5 A schematic diagram of the structure of another embodiment of the heat dissipation fins;
[0042] Figure 8 for Figure 6 The heat dissipation fins and Figure 7 A schematic diagram of the structure of an embodiment showing the relative positions of the heat dissipation holes of the heat dissipation fins;
[0043] Figure 9 for Figure 6 The heat dissipation fins and Figure 7 A schematic diagram of another embodiment showing the relative positions of the heat dissipation holes of the heat dissipation fins;
[0044] Figure 10 for Figure 5 Exploded view of one embodiment;
[0045] Figure 11 for Figure 5 A structural diagram from another angle;
[0046] Figure 12 for Figure 11 A sectional view;
[0047] Figure 13 A schematic diagram of the structure of an embodiment of the power module provided by this utility model;
[0048] Figure 14 Simulation cloud diagrams of junction temperatures of various power devices in the power module provided by this utility model.
[0049] Explanation of icon numbers:
[0050] 1000, Power Module;
[0051] 100. Radiator; 1. Heat sink component; 101. Heat dissipation hole; 11. Heat dissipation fin; 111. First heat dissipation fin; 112. Second heat dissipation fin; 113. Third heat dissipation fin; 2. Shell; 201. Mounting slot; 202. Cooling channel; 2021. Inlet channel; 2022. Outlet channel; 2022a. First outlet channel; 2022b. Second outlet channel; 203. Liquid inlet; 204. Liquid outlet; 205. Liquid guiding channel; 206. Opening; 21. Shell body; 22. Cover; 23. Sealing plate; 24. Isolation plate;
[0052] 200. Substrate;
[0053] 300. Power devices.
[0054] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0055] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0056] In current power module thermal management solutions, the design of heat sink substrates mainly revolves around two structures: one is the more traditional parallel fin design, and the other is the more complex pin-fin design. The parallel fin structure is known for its simple construction and relatively low fluid resistance; in contrast, the pin-fin structure optimizes heat dissipation performance by using columnar fins of different shapes and sizes, and is divided into transverse or longitudinal series layouts depending on the coolant path, thereby achieving a balance between heat dissipation efficiency and flow resistance.
[0057] The following specific examples illustrate the difference in effectiveness between these two structures:
[0058] In HPD packaged modules equipped with parallel fin heat dissipation systems, the coolant flows parallel along the channels between the fins (e.g., Figure 1 (As shown). This design causes the temperature to rise gradually as the coolant flow direction changes, resulting in temperature differences between phases. According to simulation results (see... Figure 2 The junction temperature difference from inlet to outlet reached approximately 11°C, and due to the weak turbulence effect between parallel fins, the maximum junction temperature reached by the module was 139.6°C.
[0059] On the other hand, in HPD packaging modules that employ a pin-fin heat dissipation structure, the coolant flows along the long side (see...). Figure 3 Similarly, the temperature of the coolant gradually increases during flow, causing temperature differences between different phases; however, according to simulation data ( Figure 4 The junction temperature difference between the inlet and outlet was reduced to 7.5℃. Thanks to the effective enhancement of fluid turbulence intensity by the Pin-Fin structure, the maximum junction temperature of the module was reduced to 134.5℃, and the overall temperature rise was reduced by 7% compared to the parallel fin structure.
[0060] From the above examples, it is easy to see that when a series water circuit design is adopted, as the coolant moves along the flow direction, heat gradually accumulates, which leads to a significant temperature difference between the inlet and outlet of the power module, affecting the temperature uniformity between the chips of each bridge arm and becoming a bottleneck in the module's heat dissipation performance. Furthermore, whether it is the fluid flow in the parallel fin structure or the flow around the columnar fins in the Pin-Fin structure, the current fluid turbulence intensity is still insufficient, resulting in the convective heat transfer efficiency between the solid and the fluid not reaching the ideal level, leaving room for further improvement.
[0061] To improve the above problems, this utility model proposes a radiator 100.
[0062] In one embodiment of this utility model, reference is made to Figures 5 to 13 and Figure 14 The radiator 100 includes:
[0063] The heat sink 1 is provided with a plurality of heat dissipation holes 101. The plurality of heat dissipation holes 101 are arranged in at least one row in a first direction and in at least two layers in a second direction. The projections of the heat dissipation holes 101 in at least two adjacent layers in the second direction are at least partially staggered. After the coolant enters the heat sink 1, it passes through each layer of heat dissipation holes 101 in sequence along the second direction and forms an impact jet perpendicular to the first direction in a local area of the heat dissipation holes 101 corresponding to the previous layer of heat dissipation holes 101. Then, it flows along the first direction between at least two adjacent layers of heat dissipation holes 101 to achieve secondary heat exchange. The first direction and the second direction are intersecting.
[0064] It is understood that the heat sink 100 proposed in this utility model is applied to the power module 1000 of an electronic device to dissipate heat from the power module 1000. The power module 1000 may include a substrate 200, a power device 300, and the heat sink of this embodiment. The power device 300 is mainly a bridge arm chip, which is mounted on the substrate 200 and attached to the surface of the substrate 200. In this configuration, the heat generated by the bridge arm chip during operation can be conducted to the substrate 200. The substrate 200 is a heat dissipation substrate, which may include at least one of a metal substrate, a ceramic substrate, a thin film substrate, and a plastic substrate. Preferably, the substrate 200 is a metal substrate. A metal substrate is a high-heat-dissipation substrate with excellent thermal conductivity, usually composed of metal materials such as aluminum substrate, copper substrate, and nickel substrate. These materials have good thermal conductivity and can quickly conduct the heat generated by the bridge arm chip to the heat sink 100. The heat sink 100 can carry away this heat, thereby dissipating heat from the power device 300 and improving its heat dissipation performance.
[0065] In this embodiment, the heat sink 100 includes a heat sink 1, the top of which is directly connected to the substrate 200. This design allows heat to be conducted from the power device 300 to the substrate 200 and then transferred to the heat sink 1 through physical contact, thereby effectively removing heat from the power device 300.
[0066] The heat sink 100 is provided with a plurality of heat dissipation holes 101. The axial direction of the heat dissipation holes 101 can be perpendicular to the surface of the heat sink 1. For example, the heat dissipation holes 101 can be arranged in a matrix. The plurality of heat dissipation holes 101 are arranged in one or more rows along a first direction (X-axis direction). Each row of heat dissipation holes 101 is distributed at intervals in the first direction. The plurality of heat dissipation holes 101 are arranged in layers in a second direction (Y-axis direction), with at least two layers, for example, two or more layers along the second direction. Each layer of heat dissipation holes 101 is stacked along the second direction, but the projections of heat dissipation holes 101 in adjacent layers in the second direction are at least partially staggered. For example, the center line of the second layer of heat dissipation holes 101 in the second direction is offset to the left or right relative to the first layer by a certain distance to avoid the second layer of heat dissipation holes 101 being completely aligned with the first layer of heat dissipation holes 101 in the second direction. The staggered arrangement of the heat dissipation holes 101 forces the coolant to change its path when flowing in the second direction, forming a complex flow channel, increasing fluid resistance, and thus improving turbulence intensity. At the same time, the staggered layout can avoid the local "short circuit" phenomenon caused by the alignment of fluid channels in traditional parallel fin or pin-fin structures, making the heat distribution more uniform.
[0067] In practical applications, after the coolant enters the heat sink 1, it can sequentially pass through each layer of heat dissipation holes 101 along the second direction, forming an impact jet perpendicular to the first direction in a local area corresponding to the heat dissipation hole 101 of the previous layer. This impact jet not only enhances the local turbulence intensity and improves the local heat transfer efficiency, but also effectively breaks the heat accumulation, avoiding the temperature buildup phenomenon in traditional series water circuit designs. Subsequently, the coolant flows along the first direction between at least two adjacent layers of heat dissipation holes 101, achieving secondary heat transfer and further improving the overall heat dissipation effect. The heat sink 100 of this technical solution can significantly improve the effect of fluid-solid convection heat transfer, reduce the maximum junction temperature of the power module 1000, and improve the temperature uniformity between the chips of each bridge arm, effectively solving the heat dissipation shortcomings existing in parallel fins and pin-fin structures.
[0068] In one embodiment of this utility model, reference is made to Figures 6 to 9The heat sink 1 includes heat sink fins 11 stacked along a second direction. Each heat sink fin 11 has a heat sink hole 101 opened along the second direction. The projections of the heat sink holes 101 of at least two adjacent heat sink fins 11 in the second direction are at least partially staggered. After the coolant enters the heat sink 1 along a third direction, it passes through the heat sink holes 101 of each layer of heat sink fins 11 in sequence along the second direction. An impact jet perpendicular to the heat sink fins 11 is formed in a local area of the next layer of heat sink fins 11 corresponding to the heat sink holes 101 of the previous layer of heat sink fins 11. Then, it flows along a first direction between at least two adjacent heat sink fins 11 to achieve secondary heat exchange. The first direction, the second direction, and the third direction are intersecting each other.
[0069] In this embodiment, the heat sink 1 is formed by stacking multiple heat sink fins 11 along the second direction (Y-axis direction). These heat sink fins 11 can increase the heat dissipation surface area of the power device 300, which helps to improve air circulation and heat exchange, allowing heat to be dissipated to the surrounding environment more quickly. Each heat sink fin 11 has a heat dissipation hole 101 facing the second direction (Y-axis direction). The projection portions of the heat dissipation holes 101 of adjacent heat sink fins 11 in the first direction are staggered, which means that when viewed from the first direction, the heat dissipation holes 101 of different heat sink fins 11 are not perfectly aligned, but rather they are arranged in an alternating pattern.
[0070] In one example, refer to Figures 7 to 9The number of heat dissipation fins 11 can be three. The three heat dissipation fins 11 are a first heat dissipation fin 111, a second heat dissipation fin 112, and a third heat dissipation fin 113 stacked along the second direction. Each of the first heat dissipation fins 111, the second heat dissipation fin 112, and the third heat dissipation fin 113 is provided with a plurality of heat dissipation holes 101. The heat dissipation holes 101 of the first heat dissipation fin 111 can be partially or completely offset from the heat dissipation holes 101 of the second heat dissipation fin 112, or the heat dissipation holes 101 of the second heat dissipation fin 112 can be partially or completely offset from the heat dissipation holes 101 of the third heat dissipation fin 113, or the heat dissipation holes 101 of the first heat dissipation fin 111 can be partially or completely offset from the heat dissipation holes 101 of the third heat dissipation fin 113. No special positional limitation is made here. In practical applications, the coolant can enter the heat sink 1 from the first direction (Z-axis direction), flow along the third direction (Y-axis direction), and pass through the heat dissipation holes 101 of the first heat dissipation fin 111, the second heat dissipation fin 112, and the third heat dissipation fin 113 in sequence. An impact jet is formed in the local area of the second heat dissipation fin 112 corresponding to the heat dissipation hole of the first heat dissipation fin 111, thereby increasing the turbulence intensity of the coolant and improving the heat dissipation intensity of the first heat dissipation fin 111 and the second heat dissipation fin 112. Then, the coolant flows along the first direction (X-axis direction) between the first heat dissipation fin 111 and the second heat dissipation fin 112, adhering to the surface of the first heat dissipation fin 111 and the second heat dissipation fin 112 to achieve secondary heat exchange. A new impact jet is formed again in the local area of the third heat dissipation fin 113 corresponding to the heat dissipation hole of the second heat dissipation fin 112, which further increases the turbulence intensity of the coolant. This process is repeated until the coolant flows out of the heat sink 1. This example clearly demonstrates that the staggered heat dissipation holes 101 of different heat dissipation fins 11 can guide the coolant through the heat sink 1 in a non-linear manner, thereby increasing turbulence, improving the heat exchange efficiency between the coolant and the heat dissipation fins 11, and reducing the potential "thermal short circuit" phenomenon, i.e., the situation where hot air rises rapidly without being sufficiently cooled, thus improving the heat dissipation performance of the power device 300. Furthermore, when the number of heat dissipation fins 11 increases to four, five, or more, the layout design and technical effectiveness of the heat dissipation holes 101 are similar to the aforementioned example, and therefore will not be described in detail further.
[0071] In one embodiment of this utility model, reference is made to Figures 6 to 9 In any two adjacent heat dissipation fins 11, the projection of each preset heat dissipation hole 101 of one heat dissipation fin 11 in the second direction forms a polygon, and the projection of one heat dissipation hole 101 of the other heat dissipation fin 11 in the second direction is located at the center of the polygon.
[0072] In this embodiment, refer to Figure 8In any two adjacent heat dissipation fins 11, the projection of every four heat dissipation holes 101 on one of the heat dissipation fins 11 in the second direction forms a quadrilateral. This means that the positions of these four heat dissipation holes 101 are relatively fixed, and their relative distances and angles are also consistent to ensure that a quadrilateral structure is formed. The other adjacent heat dissipation fin 11 has one heat dissipation hole 101, whose projection in the second direction is exactly located at the center of the aforementioned quadrilateral. This design allows the heat dissipation holes 101 of any two adjacent heat dissipation fins 11 to be completely staggered in the second direction. When the coolant passes through these heat dissipation holes 101, due to the staggered arrangement of the holes, the coolant is forced to undergo complex three-dimensional movement between different layers of heat dissipation fins 11. This not only increases the flow intensity but also promotes the mixing of fluids between different layers, improving heat exchange efficiency. Furthermore, this method can more effectively disperse heat, avoid localized overheating, and make the temperature distribution of the entire power device 300 more uniform, contributing to improved reliability and lifespan. Because the coolant is thoroughly mixed between different heat dissipation fin layers, the temperature gradient along the flow direction can be reduced, which can reduce the so-called "temperature accumulation" phenomenon and reduce the temperature difference between the inlet and outlet.
[0073] In one embodiment of this utility model, reference is made to Figure 10 The radiator 100 also includes:
[0074] The housing 2 has a mounting groove 201, and the heat sink 1 is disposed in the mounting groove 201 and cooperates with the housing 2 to form a cooling channel 202.
[0075] In this embodiment, the housing 2 not only provides mechanical protection but also has a specific mounting groove 201 designed internally to accommodate the heat sink 1. The heat sink 1 is placed in this mounting groove 201, ensuring its fixed position and effectively isolating it from the external environment to prevent dust and other contaminants from affecting its heat dissipation performance. The heat sink 1 and the housing 2 cooperate to form a cooling channel 202, which provides a controlled flow path for the coolant, ensuring that the coolant can efficiently flow through the heat dissipation holes 101 between the heat dissipation fins 11, carrying away heat. In practical applications, the coolant can enter the heat sink 1 through the cooling channel 202, flow in the second direction, and interweave through the heat dissipation holes 101 on the heat dissipation fins 11. This staggered flow enhances the turbulence effect of the coolant, improves heat exchange efficiency, and allows heat to be more effectively conducted from the power device 300 to the heat sink fins 11, then to the cooling channel 202, and finally out through the cooling channel 202. Due to the presence of the cooling channel 202, the coolant can be evenly distributed throughout the heat sink 1, thereby reducing the possibility of local hot spots and improving the overall temperature distribution of the power device 300.
[0076] In one embodiment of this utility model, reference is made to Figures 10 to 12 The cooling channel 202 includes:
[0077] The inlet flow channel 2021 is arranged along the second direction, and the heat dissipation component 1 is disposed in the inlet flow channel 2021;
[0078] The outlet flow channel 2022 is arranged along the first direction and is connected to the inlet flow channel 2021.
[0079] In this embodiment, the inlet channel 2021 is the passage for coolant to enter the heat sink 1. It is arranged along the second direction, meaning that after the coolant flows into the inlet channel 2021 from the third direction, it first passes through the heat sink 1 along the second direction before flowing to other areas. This arrangement helps ensure that the coolant has the highest cooling capacity at the beginning, effectively absorbing heat from the power device 300. The outlet channel 2022 is the passage for coolant to exit the heat sink 1, arranged along the first direction, ensuring that the coolant can be smoothly discharged after completing the secondary heat exchange. The outlet channel 2022 is interconnected with the inlet channel 2021, forming a complete cooling circuit. This design allows the coolant to enter the inlet channel 2021 along the third direction, undergo heat exchange along the heat sink 1 in the second direction, and finally exit through the outlet channel 2022 in the first direction. By arranging the inlet flow channel 2021 and outlet flow channel 2022 in different directions, more turbulence can be generated in the coolant, increasing the contact area with the surface of the heat sink fins 11, thereby improving the heat exchange efficiency between the coolant and the heat sink fins 11. This allows the heat sink 100 to provide higher cooling performance for the power device 300 within a limited space. The different flow channel directions allow for more precise control of the coolant flow, ensuring that it can cover the entire heat sink 1 without dead zones or uneven flow.
[0080] In one embodiment of this utility model, reference is made to Figures 10 to 12 The outlet flow channel 2022 includes a first outlet flow channel 2022a and a second outlet flow channel 2022b. The first outlet flow channel 2022a and the second outlet flow channel 2022b are distributed on both sides of the heat sink 1. The first outlet flow channel 2022a and the second outlet flow channel 2022b are staggered from the inlet flow channel 2021 in the third direction.
[0081] In this embodiment, the outlet flow channel 2022 is subdivided into a first outlet flow channel 2022a and a second outlet flow channel 2022b, which are located on both sides of the heat sink 1. Coolant enters from the inlet flow channel 2021, flows through the heat sink 1, and then splits into two streams, exiting from the first outlet flow channel 2022a and the second outlet flow channel 2022b respectively. By distributing the outlet flow channels 2022 on both sides of the heat sink 1, heat can be distributed more evenly, avoiding overheating on one side of the heat sink 1 while the other side is undercooled, thereby improving the temperature uniformity of the entire power device 300. The first outlet flow channel 2022a and the second outlet flow channel 2022b are offset from the inlet flow channel 2021 in the third direction. That is, the first outlet flow channel 2022a and the inlet flow channel 2021 are not on the same straight line in the third direction, but are offset to a certain extent. Similarly, the second outlet flow channel 2022b and the inlet flow channel 2021 are also not on the same straight line in the third direction and are offset to a certain extent. With this design, the coolant needs to bypass more flow paths before leaving the radiator 100. This actually prolongs the residence time of the coolant in the heat sink 1, giving it more opportunities to contact the heat sink fins 11, thereby reducing the temperature accumulation along the flow direction, reducing the temperature difference between the inlet and outlet, and the offset flow channels can effectively reduce the possibility of the coolant being discharged from the radiator 100 without sufficient heat exchange, ensuring that each part of the coolant can effectively absorb heat.
[0082] In one embodiment of this utility model, reference is made to Figures 10 to 12 The housing 2 has a liquid inlet 203, a liquid outlet 204 and a liquid guiding channel 205. The liquid outlet 204 is connected to the outlet flow channel 2022. The liquid guiding channel 205 connects the liquid inlet 203 and the inlet flow channel 2021. The liquid guiding channel 205 is used to guide the coolant entering from the liquid inlet 203 to the inlet flow channel 2021.
[0083] In this embodiment, the inlet 203 is located on the housing 2 and serves as the entrance for coolant into the radiator 100. The inlet 203 faces a third direction, ensuring that coolant enters through the inlet 203, flows through the inlet channel 2021, and impacts the substrate 200 via the heat sink 1, increasing the contact area between the coolant and the substrate 200, enhancing turbulence, and improving heat exchange efficiency. The outlet 204 is located on the housing 2 and serves as the outlet for coolant flowing out of the radiator 100. The outlet 204 is connected to the outlet channel 2022, ensuring that the coolant is smoothly discharged after heat exchange. The guide channel 205 connects the inlet 203 and the inlet channel 2021, guiding the coolant entering from the inlet 203 to the inlet channel 2021, ensuring that the coolant is evenly and efficiently distributed throughout the heat sink 1 for sufficient heat exchange and avoiding localized overheating. Figure 12As shown in the figure, the dashed arrows indicate the flow direction of the coolant. Through a clear fluid path planning (inlet 203 → guide channel 205 → inlet flow channel 2021 → heat sink 1 → outlet flow channel 2022 → outlet 204), it can be ensured that the coolant is always in the optimal working state throughout the cooling process, thereby improving the cooling efficiency of the heat sink 1 for the power device 300.
[0084] In one embodiment of this utility model, reference is made to Figures 10 to 12 Heat sink 1 is arranged along the first direction, and liquid guiding channel 205 is arranged along the first direction.
[0085] In this embodiment, both the heat sink 1 and the liquid guiding channel 205 are arranged along the first direction, that is, the heat sink 1 and the liquid guiding channel 205 are arranged in the same direction. This simplifies the flow path of the coolant, reduces unnecessary turning or detours, thereby reducing flow resistance and improving the flow efficiency of the coolant. Furthermore, the linear arrangement of the liquid guiding channel 205 helps to improve the flow effect of the coolant, enabling the coolant to quickly and evenly cover the entire heat sink 1 for efficient heat exchange.
[0086] In one embodiment of this utility model, reference is made to Figures 10 to 12 The housing 2 includes:
[0087] The shell body 21 is provided with an installation groove 201 and a liquid guiding channel 205;
[0088] The cover 22 and the shell body 21 enclose an inlet flow channel 2021 and an outlet flow channel 2022. The cover 22 is provided with a liquid inlet 203 and a liquid outlet 204.
[0089] In this embodiment, the housing 2 may consist of a housing body 21 and a cover 22. The housing body 21 has an internal mounting groove 201 for accommodating the heat sink 1, ensuring its fixed position and providing additional mechanical support and protection. The housing body 21 also has a liquid guiding channel 205, which guides the coolant entering from the inlet 203 into the inlet flow channel 2021, ensuring smooth flow of coolant to the heat sink 1. The cover 22 cooperates with the housing body 21 to form the inlet flow channel 2021 and the outlet flow channel 2022, meaning a space is formed between the cover 22 and the housing body 21 to serve as a path for coolant inflow and outflow. The cover 22 has an inlet 203 and an outlet 204, which are the channels for coolant to enter and leave the radiator 100, respectively. By placing the inlet 203 and outlet 204 on the cover 22, it is convenient to connect to an external cooling system, while avoiding the structural strength reduction problem that might result from opening holes in the shell 21. In practical applications, the coolant enters through the inlet 203 on the cover 22, is guided through the liquid guiding channel 205 in the shell 21 to the inlet channel 2021 where the heat sink 1 is located, and after heat exchange through the heat sink 1, the coolant is finally discharged from the outlet 204 on the cover 22 through the outlet channel 2022, thereby achieving the cooling of the power device 300 by the heat sink 100.
[0090] In one embodiment of this utility model, reference is made to Figures 10 to 12 The housing 2 also includes:
[0091] A sealing plate 23 is disposed in the mounting groove 201 and cooperates with the shell body 21 to form an inlet flow channel 2021. A heat dissipation component 1 is disposed on the sealing plate 23. The sealing plate 23 has an opening 206 at the position corresponding to the liquid guiding channel 205. The top end of the liquid guiding channel 205 is connected to the opening 206.
[0092] In this embodiment, the sealing plate 23 is located within the mounting groove 201 and cooperates with the shell body 21 to form an inlet flow channel 2021. This prevents coolant leakage from the gap between the shell body 21 and the heat sink 1, ensuring the cooling effect of the heat sink 1. The sealing plate 23 has an opening 206 corresponding to the liquid guiding channel 205, so that the top of the liquid guiding channel 205 communicates with the opening 206, ensuring that the coolant can smoothly enter the heat sink 1. The heat sink 1 is directly mounted on the sealing plate 23, and its position is fixed and directly contacts the substrate 200, which can enhance the contact between the two and ensure that the coolant can be evenly distributed in the heat sink 1, improving the heat exchange efficiency.
[0093] In one embodiment of this utility model, reference is made to Figures 10 to 12 The cross-sectional shape of the opening 206 is adapted to the cross-sectional shape of the liquid guiding channel 205.
[0094] In this embodiment, the cross-sectional shape of the opening 206 on the sealing plate 23 is adapted to the cross-sectional shape of the liquid guiding channel 205 inside the shell body 21. For example, when the cross-sectional shape of the opening 206 on the sealing plate 23 is rectangular, the cross-sectional shape of the liquid guiding channel 205 is also rectangular. This adapted cross-sectional shape design reduces the flow resistance of the coolant when passing through the opening 206, resulting in a smooth transition of the coolant from the opening 206 to the inlet channel 2021, reducing turbulence and pressure loss, improving the flow efficiency of the coolant, and enhancing the heat dissipation performance of the heat sink 1. Furthermore, the adapted cross-sectional shape also helps maintain a good seal between the sealing plate 23 and the shell body 21, preventing coolant leakage and further improving the reliability of the radiator 100.
[0095] In one embodiment of this utility model, reference is made to Figures 10 to 12 Multiple heat sinks 1 are provided, and the multiple heat sinks 1 are arranged at intervals along the first direction on the sealing plate 23.
[0096] In this embodiment, multiple heat sinks 1 are provided, and the multiple heat sinks 1 are arranged at intervals on the sealing plate 23 along the first direction. For example, when there are three bridge arm chips, three heat sinks 1 are provided. The three heat sinks 1 are arranged at intervals along the length direction of the substrate 200. The coolant flows along the first direction and passes through each heat sink 1 in sequence to ensure that each heat sink 1 can obtain sufficient coolant flow. Figure 14 The simulated junction temperature cloud diagrams of each bridge arm of the heat sink 100 in this embodiment demonstrate the following advantages: 1. The junction temperature of each bridge arm is relatively uniform, with a maximum junction temperature difference of 1.1℃; 2. The highest junction temperature is 125.1℃; 3. Compared with the parallel fin heat dissipation structure of the prior art, the chip hot spot temperature rise is reduced by about 20%; 4. Compared with the pin-fin heat dissipation structure, the chip hot spot temperature rise is reduced by about 13.5%. It can be seen that by arranging multiple heat sinks 1 at intervals, the convective heat transfer effect around each heat sink 1 can be enhanced, improving the overall heat dissipation efficiency. Furthermore, the parallel flow channel design allows the coolant to be evenly distributed to each heat sink 1, reducing local overheating and achieving a highly uniform temperature distribution. In addition, the interval arrangement between multiple heat sinks 1 can prevent overall failure due to the failure of a single heat sink 1, enhancing the redundancy of the heat sink 100.
[0097] In one embodiment of this utility model, reference is made to Figures 10 to 12 The sealing plate 23 is provided with multiple isolation plates 24, and each isolation plate 24 separates two adjacent heat sinks 1.
[0098] In this embodiment, the presence of the isolation plate 24 reduces the mixing of coolant between different heat sinks 1, allowing each heat sink 1 to operate independently. This ensures that heat is distributed more evenly across the entire power device 300, reducing the possibility of localized overheating. Furthermore, through the physical separation provided by the isolation plate 24, heat from one heat sink 1 is effectively prevented from being transferred to adjacent heat sinks 1, reducing thermal interference and ensuring the independence and stability of each heat sink 1. Notably, the coolant does not pass through the location of the isolation plate 24, but rather concentrates more in the central area of the heat sink 1, ensuring that the coolant carries away heat where it is most needed, further improving the heat dissipation effect.
[0099] This utility model also proposes a power module 1000, as shown in the reference. Figure 13 and Figure 14 The power module 1000 includes a substrate 200, a power device 300, and a heat sink 100. The specific structure of the heat sink 100 is as described in the above embodiments. Since this power module 1000 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The power device 300 is disposed on the substrate 200, and the top of the heat sink 100 is connected to the substrate 200. This design allows heat to be conducted from the power device 300 to the substrate 200, and then transferred to the heat sink 1 through physical contact, thereby effectively removing heat from the power device 300.
[0100] This utility model also proposes an electronic device, which includes a power module 1000. The specific structure of the power module 1000 is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0101] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. A heat sink, characterized by, The heat sink includes: The heat sink is provided with a plurality of heat dissipation holes, which are arranged in at least one row in a first direction and in at least two layers in a second direction, wherein the projections of the heat dissipation holes in at least two adjacent layers in the second direction are at least partially staggered. In this process, after the coolant enters the heat sink, it passes through the heat sink holes of each layer in sequence along the second direction, and forms an impact jet perpendicular to the first direction in a local area of the heat sink hole corresponding to the previous layer. Then, it flows along the first direction between the heat sink holes of at least two adjacent layers to achieve secondary heat exchange. The first direction and the second direction are intersecting.
2. The heat spreader of claim 1, wherein, The heat sink includes heat sink fins stacked along the second direction; each heat sink fin has a heat sink hole opened along the second direction, and the projections of the heat sink holes of at least two adjacent heat sink fins in the second direction are at least partially staggered. The coolant enters the heat sink along a third direction, then passes through the heat dissipation holes of each heat sink fin in sequence along a second direction. It forms an impact jet perpendicular to the heat sink fin in a local area of the heat dissipation hole of the next heat sink fin corresponding to the previous heat sink fin. Subsequently, it flows along a first direction between at least two adjacent heat sink fins to achieve secondary heat exchange. The first direction, the second direction, and the third direction are arranged to intersect each other.
3. The heat spreader of claim 2, wherein, In any two adjacent heat dissipation fins, the projection of each preset heat dissipation hole of one heat dissipation fin in the second direction forms a polygon, and the projection of one heat dissipation hole of the other heat dissipation fin in the second direction is located at the center of the polygon.
4. The heat spreader of claim 1, wherein, The radiator also includes: The housing has a mounting groove, and the heat sink is disposed in the mounting groove and cooperates with the housing to form a cooling channel.
5. The heat spreader of claim 4, wherein, The cooling channel includes: The inlet flow channel is arranged along the second direction, and the heat dissipation component is disposed in the inlet flow channel. An outlet flow channel is arranged along a first direction and is connected to the inlet flow channel.
6. The radiator as described in claim 5, characterized in that, The outlet flow channel includes a first outlet flow channel and a second outlet flow channel, which are distributed on both sides of the heat sink. The first outlet flow channel and the second outlet flow channel are offset from the inlet flow channel in a third direction. And / or, the housing has a liquid inlet, a liquid outlet, and a liquid guiding channel, the liquid outlet being connected to the outlet flow channel, the liquid guiding channel connecting the liquid inlet and the inlet flow channel, the liquid guiding channel being used to guide coolant entering from the liquid inlet to the inlet flow channel, the heat dissipation component being arranged along a first direction, and the liquid guiding channel being arranged along a first direction.
7. The heat spreader of claim 6, wherein, The housing includes: The shell body is provided with the mounting groove and the liquid guiding channel; The cover body, together with the shell body, forms the inlet flow channel and the outlet flow channel, and the cover body is provided with the liquid inlet and the liquid outlet; A sealing plate is disposed in the mounting groove and cooperates with the shell body to form the inlet flow channel. The heat dissipation component is disposed on the sealing plate. The sealing plate has an opening at the position corresponding to the liquid guiding channel, and the top end of the liquid guiding channel communicates with the opening.
8. The heat spreader of claim 7, wherein, The cross-sectional shape of the opening is adapted to the cross-sectional shape of the liquid guiding channel; And / or, a plurality of heat sinks are provided, and the plurality of heat sinks are arranged at intervals along the first direction on the sealing plate; And / or, the sealing plate is provided with a plurality of isolation plates, each of the isolation plates separating two adjacent heat sinks.
9. A power module, characterized by The power module includes: substrate; Power devices, disposed on the substrate; and The heat sink as described in any one of claims 1 to 8, wherein the top end of the heat sink is connected to the substrate.
10. An electronic device, comprising: Includes the power module as described in claim 9.