Heat dissipation and vibration prevention integrated circuit base

Abstract

The utility model relates to the technical field of integrated circuit bases, and discloses a heat dissipation and vibration prevention integrated circuit base which comprises a base, a buffer mechanism is installed in the middle of the surface of the base, a placing plate is fixedly connected to the top of the buffer mechanism, a sealing cover is arranged on one side of the placing plate, and the sealing cover is arranged on the other side of the placing plate. And the surface of the sealing cover is in threaded connection with a heat dissipation mechanism. According to the integrated circuit base integrating heat dissipation and vibration prevention, through the arrangement of the buffer mechanism, when the integrated circuit base is used, two rotating rods are arranged at the bottom of a placement plate, the rotating rods are stressed and drive sliding blocks at the bottom to extrude buffer springs on the two sides, and the buffer springs are stressed and deformed to generate elastic potential energy to relieve impact force generated by the top; therefore, the effect of buffering and damping the integrated circuit board on the top placing plate is achieved, and the situation that pins of an integrated circuit are loosened and welding spots are cracked due to stress vibration of the integrated circuit board, so that the connection stability and reliability of the circuit are affected, and even permanent damage is caused is avoided.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit base technology, and in particular to an integrated circuit base that integrates heat dissipation and vibration damping. Background Technology

[0002] With the rapid development of information technology, integrated circuits, as the core components of modern electronic devices, are rapidly advancing towards high performance, high integration, and miniaturization. Today, integrated circuits are widely used in smartphones, computers, automotive electronics, artificial intelligence, the Internet of Things, and many other fields. Their performance directly determines the functionality and competitiveness of various electronic devices. Driven by the pursuit of higher performance and more functions, the integration level of integrated circuits is constantly increasing, with the number of transistors per unit area growing exponentially. At the same time, the operating frequency of chips is also increasing, which leads to a sharp increase in the heat generated by integrated circuits during operation. For example, high-end processor chips can consume tens of watts or even more when running at full load. If the heat generated cannot be dissipated effectively and in a timely manner, it will cause the chip temperature to become too high, leading to performance degradation, decreased stability, or even damage. On the other hand, the trend towards miniaturization makes the installation space of integrated circuits increasingly compact, leaving very limited space for heat dissipation and protection structures. This places higher demands on heat dissipation and vibration damping solutions, requiring efficient heat dissipation and reliable vibration damping functions within a limited space.

[0003] Due to the increased heat generated by the improved performance of integrated circuits, traditional heat dissipation methods, such as simple heat sinks, are no longer sufficient to meet the cooling requirements. The operating environment of integrated circuits is becoming increasingly complex and diverse, with numerous vibration sources. In fields such as automotive and aerospace, equipment is subjected to various vibrations during operation, such as engine vibration and vibrations caused by road bumps. These vibrations may cause integrated circuit pins to loosen and solder joints to crack, thereby affecting the connection stability and reliability of the circuit, and even causing permanent damage. Therefore, an integrated circuit base integrating heat dissipation and vibration damping is proposed. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] The purpose of this invention is to provide an integrated circuit base that integrates heat dissipation and vibration damping, thereby solving the heat dissipation and vibration reduction problems mentioned in the background art.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit base integrating heat dissipation and vibration damping, comprising a base, a buffer mechanism installed in the middle of the surface of the base, a placement plate fixedly connected to the top of the buffer mechanism, a sealing cover provided on one side of the placement plate, a heat dissipation mechanism threadedly connected to the surface of the sealing cover, the buffer mechanism comprising two support blocks installed in the middle of the surface of the base, a sliding rod fixedly connected to one side of the support block, buffer springs installed at both ends of the sliding rod, a sliding block fixedly connected to one side of the buffer spring, and a rotating rod rotatably connected to the surface of the sliding block; the heat dissipation mechanism comprising a connecting frame threadedly connected to the surface of the sealing cover, two cooling fans installed inside the connecting frame, and dustproof nets provided on both sides of the cooling fans.

[0008] As a further embodiment of this utility model, a limiting hole is formed on the surface of the sliding block, and the sliding rod is slidably connected inside the limiting hole. The limiting hole serves to support the sliding rod.

[0009] As a further embodiment of this utility model, a connecting block is rotatably connected to the top of the rotating rod, and the connecting block is fixedly connected to the bottom of the placement plate. The connecting block serves to support the rotating rod.

[0010] As a further embodiment of this utility model, two rotating columns are fixedly connected to the bottom of the sealing cover, and spring-back mechanisms are fixedly connected to both sides of the rotating columns. The spring-back mechanisms enable the sealing cover to be opened.

[0011] As a further embodiment of this utility model, the rebound mechanism includes torsion springs fixedly connected to both sides of the rotating column. A fixed cylinder is fixedly connected to one side of the torsion spring, and the rotating column is rotatably connected to the inside of the fixed cylinder. The torsion springs provide a reverse force.

[0012] As a further embodiment of this utility model, two limiting blocks are fixedly connected to one side of both the placement plate and the sealing cover. A positioning pin is inserted inside the limiting block, and the positioning pin serves to fix the limiting block.

[0013] As a further embodiment of this utility model, four telescopic columns are fixedly connected to the surface of the base, and the top of the telescopic columns is fixedly connected to the bottom of the placement plate. The telescopic columns serve to support the placement plate.

[0014] (III) Beneficial Effects

[0015] This utility model provides an integrated circuit base that integrates heat dissipation and vibration damping, and has the following beneficial effects:

[0016] 1. This integrated circuit base, which integrates heat dissipation and vibration damping, features a buffer mechanism. During use, two rotating rods are located at the bottom of the mounting plate. When the rotating rods are subjected to force, they drive the sliding block at the bottom to compress the buffer springs on both sides. The buffer springs deform under force, generating elastic potential energy to reduce the impact force generated at the top. This achieves the effect of buffering and shock absorption for the integrated circuit board on the top mounting plate, preventing the integrated circuit board from being subjected to force and vibration, which could lead to loosening of integrated circuit pins, cracking of solder joints, and thus affect the connection stability and reliability of the circuit, or even cause permanent damage.

[0017] 2. This integrated circuit base, which combines heat dissipation and vibration damping, features a heat dissipation mechanism. During use, a detachable connecting frame is threaded onto the surface of the sealing cover. Two cooling fans are installed inside the connecting frame, and dust filters are installed on both sides of the cooling fans. When the cooling fans are activated, they dissipate the heat generated by the dust-collecting circuit board inside the sealing cover, ensuring that the dust-collecting circuit board is in a suitable temperature environment. After long-term use, the cooling fans can be disassembled for maintenance and replacement by unscrewing the bolts on the surface of the connecting frame, thus extending the service life of the cooling fans. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the buffer mechanism structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the heat dissipation mechanism of this utility model;

[0021] Figure 4 This is a schematic diagram of the springback mechanism of this utility model.

[0022] In the diagram: 1. Base; 2. Buffer mechanism; 201. Support block; 202. Sliding rod; 203. Buffer spring; 204. Sliding block; 205. Rotating rod; 3. Placement plate; 4. Sealing cover; 5. Heat dissipation mechanism; 501. Connecting frame; 502. Cooling fan; 503. Dustproof net; 6. Connecting block; 7. Rotating column; 8. Rebound mechanism; 801. Torsion spring; 802. Fixing cylinder; 9. Limiting block; 10. Positioning pin; 11. Telescopic column. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0024] Please see Figures 1 to 4 This utility model provides a technical solution: an integrated circuit base integrating heat dissipation and vibration damping, including a base 1. A buffer mechanism 2 is installed in the middle of the surface of the base 1. The buffer mechanism 2 buffers and dampens the integrated circuit board on the top placement plate 3, preventing the integrated circuit board from being loosened or the solder joints from cracking due to force and vibration, which would affect the connection stability and reliability of the circuit, or even cause permanent damage. The placement plate 3 is fixedly connected to the top of the buffer mechanism 2. A sealing cover 4 is provided on one side of the placement plate 3. A heat dissipation mechanism 5 is threadedly connected to the surface of the sealing cover 4. The heat dissipation mechanism 5 ensures that the integrated circuit board is in a suitable temperature environment. After long-term use, the cooling fan 502 can be disassembled for maintenance and replacement by unscrewing the bolts on the surface of the connecting frame 501, thus extending the service life of the cooling fan 502.

[0025] The buffer mechanism 2 includes two support blocks 201 installed in the middle of the surface of the base 1. A sliding rod 202 is fixedly connected to one side of the support block 201. Buffer springs 203 are installed at both ends of the sliding rod 202. A sliding block 204 is fixedly connected to one side of the buffer spring 203. A rotating rod 205 is rotatably connected to the surface of the sliding block 204.

[0026] The heat dissipation mechanism 5 includes a connecting frame 501 threaded to the surface of the sealing cover 4. Two cooling fans 502 are installed inside the connecting frame 501, and dustproof nets 503 are provided on both sides of the cooling fans 502.

[0027] A limiting hole is provided on the surface of the sliding block 204, and the sliding rod 202 is slidably connected inside the limiting hole. The limiting hole serves to support the sliding rod 202.

[0028] A connecting block 6 is rotatably connected to the top of the rotating rod 205. The connecting block 6 is fixedly connected to the bottom of the placement plate 3. The connecting block 6 serves to support the rotating rod 205.

[0029] Two rotating columns 7 are fixedly connected to the bottom of the sealing cover 4. Spring-back mechanisms 8 are fixedly connected to both sides of the rotating columns 7. The spring-back mechanisms 8 are used to open the sealing cover 4.

[0030] The rebound mechanism 8 includes torsion springs 801 fixedly connected to both sides of the rotating column 7. A fixed cylinder 802 is fixedly connected to one side of the torsion spring 801. The rotating column 7 is rotatably connected to the inside of the fixed cylinder 802. The torsion spring 801 provides a reverse force.

[0031] Two limiting blocks 9 are fixedly connected to one side of both the placement plate 3 and the sealing cover 4. A positioning pin 10 is inserted inside the limiting block 9. The positioning pin 10 serves to fix the limiting block 9.

[0032] Four telescopic columns 11 are fixedly connected to the surface of the base 1. The top of the telescopic columns 11 is fixedly connected to the bottom of the placement plate 3. The telescopic columns 11 serve to support the placement plate 3.

[0033] In this invention, the working steps of the device are as follows:

[0034] First step: When in use, there are two rotating rods 205 at the bottom of the placement plate 3. The rotating rods 205 are subjected to force and drive the sliding block 204 at the bottom to squeeze the buffer springs 203 on both sides. The buffer springs 203 are subjected to force and deform to generate elastic potential energy to reduce the impact force generated at the top.

[0035] The second step: During use, a detachable connecting frame 501 is threaded onto the surface of the sealing cover 4. Two cooling fans 502 are installed inside the connecting frame 501, and dust filters 503 are provided on both sides of each cooling fan 502. Activating the cooling fans 502 dissipates the heat generated by the dust-collecting circuit board inside the sealing cover 4. It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. The technical details of the device's power mechanism, power supply system, and control system are not fully described. However, those skilled in the art, understanding the principle of the above utility model, can clearly understand the specifics of its power mechanism, power supply system, and control system. The control method in the application document is automatic control via a controller, and the controller's control circuit can be implemented through simple programming by those skilled in the art.

[0036] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation and anti-vibration integrated circuit base comprising a base (1), characterized in that: A buffer mechanism (2) is installed in the middle of the surface of the base (1). A placement plate (3) is fixedly connected to the top of the buffer mechanism (2). A sealing cover (4) is provided on one side of the placement plate (3). A heat dissipation mechanism (5) is threadedly connected to the surface of the sealing cover (4). The buffer mechanism (2) includes two support blocks (201) installed in the middle of the surface of the base (1). A sliding rod (202) is fixedly connected to one side of the support block (201). Buffer springs (203) are installed at both ends of the sliding rod (202). A sliding block (204) is fixedly connected to one side of the buffer spring (203). A rotating rod (205) is rotatably connected to the surface of the sliding block (204). The heat dissipation mechanism (5) includes a connecting frame (501) threaded to the surface of the sealing cover (4). Two cooling fans (502) are installed inside the connecting frame (501), and dustproof nets (503) are provided on both sides of the cooling fans (502).

2. The integrated circuit base of claim 1, wherein: The surface of the sliding block (204) has a limiting hole, and the sliding rod (202) is slidably connected to the inside of the limiting hole.

3. The heat-dissipating and anti-vibration integrated circuit base according to claim 1, wherein: The top of the rotating rod (205) is rotatably connected to a connecting block (6), which is fixedly connected to the bottom of the placement plate (3).

4. The heat-dissipating and anti-vibration integrated circuit base according to claim 1, wherein: The bottom of the sealing cap (4) is fixedly connected to two rotating columns (7), and the two sides of the rotating columns (7) are fixedly connected to a spring mechanism (8).

5. The heat-dissipating and anti-vibration integrated circuit base according to claim 4, wherein: The rebound mechanism (8) includes torsion springs (801) fixedly connected to both sides of the rotating column (7), and a fixed cylinder (802) is fixedly connected to one side of the torsion springs (801). The rotating column (7) is rotatably connected to the inside of the fixed cylinder (802).

6. The integrated circuit base integrating heat dissipation and vibration damping according to claim 1, characterized in that: Two limiting blocks (9) are fixedly connected to one side of the placement plate (3) and the sealing cover (4), and a positioning pin (10) is inserted into the inside of the limiting block (9).

7. The heat-dissipating and anti-vibration integrated circuit base according to claim 1, wherein: Four telescopic columns (11) are fixedly connected to the surface of the base (1), and the top of the telescopic columns (11) is fixedly connected to the bottom of the placement plate (3).

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