Rapid heat dissipation power amplifier

Abstract

The utility model discloses a quick heat dissipation power amplifier, which relates to the technical field of power amplifiers, and comprises a shell and a circuit board, a plurality of groups of air outlet holes penetrate through one end of the shell, an axial flow fan component is mounted at the other end of the shell, an air inlet hole penetrates through the other end of the shell, and a power tube is mounted at the upper end of the circuit board. And a U-shaped heat dissipation plate is arranged on the outer wall of the power tube. According to the utility model, the heat generated by the power tube can be quickly absorbed, the heat is transferred to the shell through air convection, the U-shaped structure increases the contact area with air, the heat dissipation is facilitated, and the air inlet hole, the air outlet hole and the axial flow fan are arranged to form a good air channel, so that the heat dissipation efficiency is improved. The axial flow fan assembly sucks cold air from the multiple sets of air inlet holes, the cold air passes through the U-shaped heat dissipation plate and the circuit board, heat is taken away, and then the cold air is exhausted from the multiple sets of air outlet holes, forced air cooling is achieved, and the heat dissipation speed is further increased.

Description

Technical Field

[0001] This utility model relates to the field of power amplifier technology, and in particular to a power amplifier with rapid heat dissipation. Background Technology

[0002] With the rapid development of electronic information technology, power amplifiers are increasingly widely used in fields such as communications, broadcasting, and industrial control, and the requirements for their power and performance are also increasing. In actual operation, the core components inside the power amplifier, such as power transistors and integrated circuits, generate a large amount of heat due to the current flowing through them. If this heat cannot be dissipated in a timely and effective manner, it will cause the internal temperature of the power amplifier to rise sharply.

[0003] However, in the existing technology, the forced air cooling method has many unreasonable aspects in terms of fan layout and heat dissipation channel design. The installation position of the fan does not fully consider the heat flow distribution inside the power amplifier, resulting in heat in some areas not being carried away in time, forming local high temperature. The heat dissipation channel design is not smooth enough, with large air resistance, which affects the air flow speed and reduces the heat dissipation effect. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art by proposing a power amplifier with rapid heat dissipation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a power amplifier with rapid heat dissipation, comprising a housing and a circuit board, wherein a plurality of air outlet holes are opened through one end of the housing, an axial fan assembly is installed at the other end of the housing, an air inlet hole is opened through the other end of the housing, a power transistor is installed at the upper end of the circuit board, and a U-shaped heat sink is provided on the outer wall of the power transistor.

[0006] Preferably, the inner wall of the U-shaped heat sink is coated with a thermally conductive silicone grease layer, and the thermally conductive silicone grease layer is in contact with the outer wall of the power transistor, and the air outlet of the axial fan assembly is located on one side of the multiple sets of air inlets.

[0007] Preferably, a heat dissipation fin assembly is installed at the upper end of the outer casing, and the two protrusions at the lower end of the U-shaped heat sink are fixed to the upper end of the circuit board.

[0008] Preferably, the lower end of the circuit board is fixed to the inner bottom of the housing, and the circuit board, power transistor and U-shaped heat sink are arranged in the middle of multiple sets of air outlets and multiple sets of air inlets.

[0009] Preferably, a temperature sensor is fixedly mounted on the upper end of the circuit board, the temperature sensor is connected to the controller signal, and the axial fan assembly is connected to the controller signal.

[0010] Preferably, a control panel is fixedly mounted on one end of the outer casing, and the circuit board is electrically connected to the control panel.

[0011] Preferably, support columns are fixedly installed at the lower end of the outer casing and near the four corners.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0013] 1. In this utility model, the axial fan assembly and the U-shaped heat sink are designed to fit tightly against the power transistor, which can quickly absorb the heat generated by the power transistor and transfer the heat to the outer casing through air convection. The U-shaped structure increases the contact area with the air, which is conducive to heat dissipation. Secondly, the arrangement of the air inlet and outlet holes and the axial fan forms a good airflow channel. The axial fan assembly draws in cool air through multiple sets of air inlets, passes through the U-shaped heat sink and the circuit board, removes the heat, and then discharges it through multiple sets of air outlet holes, achieving forced air cooling and further accelerating the heat dissipation speed.

[0014] 2. In this utility model, the combined use of temperature sensor and controller enables the axial fan assembly to automatically adjust its speed according to the internal temperature of the power amplifier. When the temperature rises, the axial fan assembly speed increases to enhance the heat dissipation effect. When the temperature drops, the axial fan assembly speed decreases to reduce noise and energy consumption, thus achieving intelligent heat dissipation control. Attached Figure Description

[0015] Figure 1 A three-dimensional structural diagram of a power amplifier with rapid heat dissipation is provided for this utility model.

[0016] Figure 2 A schematic diagram of the rear structure of a power amplifier with rapid heat dissipation proposed in this utility model is shown.

[0017] Figure 3 A bottom view of a U-shaped heat sink in a power amplifier for rapid heat dissipation is provided for this utility model.

[0018] Figure 4 A top view of a power amplifier with rapid heat dissipation is provided for this utility model.

[0019] Legend: 1. Housing; 2. Heat sink fin assembly; 3. Air outlet; 4. Axial fan assembly; 5. Controller; 6. Support column; 7. Circuit board; 8. Air inlet; 9. Power transistor; 10. U-shaped heat sink; 11. Temperature sensor; 12. Thermal grease layer; 13. Control panel. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Example 1: As Figure 1 - Figure 4 As shown, this utility model provides a power amplifier with rapid heat dissipation, including a housing 1 and a circuit board 7. Multiple sets of air outlets 3 are opened through one end of the housing 1, and an axial fan assembly 4 is installed at the other end of the housing 1. An air inlet 8 is also opened through the other end of the housing 1. A power transistor 9 is installed at the upper end of the circuit board 7. A U-shaped heat sink 10 is provided on the outer wall of the power transistor 9, and a thermally conductive silicone grease layer 12 is applied to the inner wall of the U-shaped heat sink 10, with the thermally conductive silicone grease layer 12 in contact with the outer wall of the power transistor 9. The air outlet of the axial fan assembly 4 is located on one side of the multiple sets of air inlets 8. A heat dissipation fin assembly is installed at the upper end of the housing 1. 2. The two protrusions at the lower end of the U-shaped heat sink 10 are fixed to the upper end of the circuit board 7. The lower end of the circuit board 7 is fixed to the inner bottom of the housing 1. The circuit board 7, power tube 9 and U-shaped heat sink 10 are arranged in the middle of multiple sets of air outlet holes 3 and multiple sets of air inlet holes 8. A temperature sensor 11 is fixedly installed at the upper end of the circuit board 7. The temperature sensor 11 is connected to the controller 5. The axial fan assembly 4 is connected to the controller 5. A control panel 13 is fixedly installed at one end of the housing 1. The circuit board 7 is electrically connected to the control panel 13. Support columns 6 are fixedly installed at the lower end of the housing 1 and near the four corners.

[0023] The specific setup and function of this embodiment are described below. By mounting the power transistor 9 on the circuit board 7 and placing the U-shaped heat sink 10 on the outer wall of the power transistor 9, and fixing the U-shaped heat sink 10 on the upper end of the circuit board 7, the heat generated by the power transistor 9 can be quickly absorbed and transferred to the outer casing 1 through air convection. The U-shaped structure increases the contact area with the air, which is conducive to heat dissipation. Multiple sets of air outlet holes 3 are opened through one end of the outer casing 1, and multiple sets of air inlet holes 8 are opened through the other end. The axial fan assembly 4 is installed on the other end of the outer casing 1, thus forming a good air duct. The axial fan assembly 4 draws in cool air from the multiple sets of air inlet holes 8, passes through the U-shaped heat sink 10 and the circuit board 7, removes the heat, and is discharged from the multiple sets of air outlet holes 3, realizing forced air cooling and further accelerating the heat dissipation speed.

[0024] By applying thermally conductive silicone grease layers 12 to both inner side walls of the U-shaped heat sink 10, and having the two sets of thermally conductive silicone grease layers 12 in contact with both sides of the power tube 9 respectively, the power tube 9 generates a large amount of heat when it is working. The metal-to-metal power tube 9 and the U-shaped heat sink 10 are in direct contact, and there are many tiny gaps and unevenness in the microscopic structure. These gaps are filled with air, and the thermal conductivity of air is extremely low, which will seriously hinder heat transfer. The thermal conductivity of the two sets of thermally conductive silicone grease layers 12 is usually much higher than that of air. After applying the thermally conductive silicone grease layers 12, these gaps can be effectively filled, so that a tight heat conduction channel is formed between the power tube 9 and the U-shaped heat sink 10, which greatly improves the heat conduction speed from the power tube 9 to the U-shaped heat sink 10, laying the foundation for subsequent heat dissipation.

[0025] By installing a temperature sensor 11 on the circuit board 7 and installing the controller 5 on one side of the housing 1, and connecting the temperature sensor 11 to the controller 5, the axial fan assembly 4 can automatically adjust its speed according to the internal temperature of the power amplifier. When the temperature rises, the axial fan assembly 4 speeds up to enhance the heat dissipation effect. When the temperature drops, the axial fan assembly 4 speeds down to reduce noise and energy consumption, thus achieving intelligent heat dissipation control.

[0026] The outer shell 1 is made of aluminum alloy, and heat dissipation fin group 2 is installed on its upper end. The good thermal conductivity of aluminum alloy can quickly conduct heat. Combined with heat dissipation fin group 2, it greatly increases the heat dissipation area and effectively improves heat dissipation efficiency.

[0027] The cooperation between the control panel 13 and the circuit board 7 allows the staff to control the circuit board 7 through the control panel 13. By installing four sets of support columns 6 at the lower end of the outer casing 1, the outer casing 1 can be supported.

[0028] The usage and working principle of this device are as follows: First, when the power amplifier is working, the heat generated by the power tube 9 is transferred to the U-shaped heat sink 10 through the thermal grease layer 12. At the same time, the components on the circuit board 7 also generate heat. At this time, the temperature sensor 11 monitors the internal temperature in real time and transmits the temperature signal to the controller 5. When the temperature rises, the controller 5 controls the axial fan assembly 4 to increase its speed. Cool air is drawn in from multiple sets of air inlets 8, passes through the U-shaped heat sink 10 and the circuit board 7, and after carrying away the heat, it is discharged from multiple sets of air outlets 3. When the temperature drops to a certain level, the controller 5 controls the axial fan assembly 4 to reduce its speed to reduce noise and energy consumption.

[0029] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A power amplifier with fast heat dissipation, comprising a housing (1) and a circuit board (7), characterized in that: Multiple sets of air outlets (3) are opened through one end of the outer casing (1), an axial fan assembly (4) is installed at the other end of the outer casing (1), an air inlet (8) is opened through the other end of the outer casing (1), a power tube (9) is installed at the upper end of the circuit board (7), and a U-shaped heat sink (10) is provided on the outer wall of the power tube (9).

2. The power amplifier of claim 1, wherein: The inner wall of the U-shaped heat sink (10) is coated with a thermal grease layer (12), and the thermal grease layer (12) is in contact with the outer wall of the power tube (9). The air outlet of the axial fan assembly (4) is located on one side of multiple air inlets (8).

3. The power amplifier of claim 2, wherein: The upper end of the outer casing (1) is equipped with a heat dissipation fin assembly (2), and the two protrusions at the lower end of the U-shaped heat sink (10) are fixed to the upper end of the circuit board (7).

4. The power amplifier of claim 3, wherein: The lower end of the circuit board (7) is fixed to the inner bottom of the outer casing (1). The circuit board (7), power tube (9) and U-shaped heat sink (10) are located in the middle of multiple sets of air outlets (3) and multiple sets of air inlets (8).

5. The power amplifier of claim 1, wherein: A temperature sensor (11) is fixedly installed on the upper end of the circuit board (7). The temperature sensor (11) is connected to the controller (5) by signal, and the axial fan assembly (4) is connected to the controller (5) by signal.

6. The power amplifier of claim 1, wherein: A control panel (13) is fixedly installed at one end of the outer casing (1), and the circuit board (7) is electrically connected to the control panel (13).

7. The power amplifier of claim 1, wherein: Support columns (6) are fixedly installed at the lower end of the outer shell (1) and near the four corners.

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