Air-cooled fixing seat, adjusting mechanism and coupling device
By using an air-cooled mounting bracket, the airflow release device dissipates heat from the PCB board, solving the problem of the PCB board structure being unable to dissipate heat and achieving stable fixation of components and precise coupling of the lens.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU GUANGCHUANGLIAN CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-04-21
AI Technical Summary
The existing PCB board structure cannot effectively dissipate heat, causing the temperature of components to rise and affecting the normal operation of electronic devices.
Design a wind-cooled mounting bracket to fix the PCB board through a fixing structure and use an airflow release device to release airflow to the PCB board for heat dissipation. The airflow release device is set below the receiving gap to improve the heat dissipation effect.
It achieves effective heat dissipation of the PCB board, maintains the normal working state of the components, adapts to the fixing requirements of different types of PCB boards, and maintains the PCB board in a horizontal state for lens coupling through the adjustment mechanism.
Smart Images

Figure CN224154554U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of PCB boards, specifically relating to a wind-cooled fixing base, adjustment mechanism and coupling device. Background Technology
[0002] A PCB, or Printed Circuit Board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical interconnections. PCBs are also widely used in optical modules, where lenses can be mounted by adhesive bonding. When mounting a lens onto a PCB, the board must remain stable to ensure the lens is precisely positioned at the coupling point.
[0003] However, conventional PCB board structures typically only provide a basic fixation for the PCB board (for PCB board structures, please refer to the applicant's earlier application, application number 202211053358.1, entitled "A Coupling System and Lens Assembly Method"). In practice, it has been found that during the coupling process, components located on the back of the PCB board experience temperature increases, which in turn affects the operation of other related components. Utility Model Content
[0004] This utility model provides an air-cooled mounting base, the purpose of which is to solve the problem that the existing PCB board structure cannot achieve heat dissipation of the PCB board.
[0005] To achieve the above objectives, this utility model provides a wind-cooled mounting base, including...
[0006] A fixing structure, comprising a first fixing component and a second fixing component, wherein the first fixing component and the second fixing component are disposed opposite to each other and a receiving gap is provided between the first fixing component and the second fixing component;
[0007] A cooling structure, comprising an airflow release device and an air source, wherein the air source is connected to the airflow release device and the air outlet of the airflow release device faces the receiving gap.
[0008] In this solution, the PCB board is fixed using a fixing structure. Once the PCB board is fixed, the airflow release device in the cooling structure releases airflow to the PCB board. The airflow contacts the PCB board, achieving heat dissipation and overcoming the shortcomings of existing technologies.
[0009] Preferably, since the heat source is located at the bottom of the PCB board, in order to achieve better heat dissipation, the airflow release device described in this solution is located below the receiving gap.
[0010] This design places the airflow release device below the receiving gap, so the airflow released by the airflow release device is released to the bottom of the PCB board, resulting in better heat dissipation for the PCB board.
[0011] Preferably, in order to reduce airflow diffusion, the fixing structure of this solution includes a mounting base, the mounting base having an internal cavity, and the airflow release device located inside the cavity; the accommodating gap is located above the mounting base, and the cavity communicates with the accommodating gap.
[0012] In this design, the airflow release device is located inside the receiving cavity, which is connected to the receiving gap. Therefore, when the airflow release device releases airflow, the receiving cavity can constrain the airflow, ensuring that the airflow flows to the receiving gap, thereby achieving better heat dissipation for the PCB board fixed at the receiving gap.
[0013] Preferably, in order to improve the heat dissipation effect of the PCB board, the airflow release device described in this solution is provided with multiple air outlets.
[0014] This solution features multiple air outlets to release airflow, with the airflow from different outlets dissipating heat at different locations on the PCB board, ensuring better heat dissipation for the PCB board.
[0015] Preferably, in order to improve heat dissipation at different locations on the PCB board, the air outlets in this solution are arranged in a straight line along the length of the accommodating gap.
[0016] Preferably, since the edges of different PCB boards are irregular, the fixing structure of this solution preferably includes multiple first fixing components, which are arranged in a straight line along the length of the accommodating gap, and the first fixing components can be telescopically installed.
[0017] This solution addresses the need to secure different types of PCBs by incorporating multiple retractable first fixing components. Simply adjusting the extension of each component to bring it into contact with the edge of the PCB allows the PCB to be held in place. By using multiple retractable first fixing components, the solution achieves secure mounting of various PCB types.
[0018] Preferably, in order to facilitate the placement and removal of the PCB board, the fixing structure of this solution further includes a driving unit, which is connected to the second fixing component, and the driving unit drives the second fixing component to move closer to or away from the first fixing component.
[0019] This design connects the drive unit to the second fixing component. When the second fixing component moves, the accommodating gap between the first and second fixing components widens. When the accommodating gap widens, the PCB board can be placed in the accommodating gap and can also be removed from the accommodating gap; when the accommodating gap narrows, the PCB board is clamped and fixed by the first and second fixing components.
[0020] Preferably, in order to realize the movement of the second fixed component, the driving unit of this solution includes a sliding module and a driver, the second fixed component is connected to the sliding module, and the driver is connected to the sliding module.
[0021] This solution uses a driver to provide power, which drives the sliding module to slide. When the sliding module slides, it causes the second fixed component to move, and the first and second fixed components move closer to each other.
[0022] The second aspect of this utility model discloses an adjustment mechanism, including the aforementioned air-cooled fixing base and a moving component, wherein the moving component is connected to the air-cooled fixing base. In this solution, the air-cooled fixing base is used to fix the PCB board, and then the moving component operates to adjust the orientation of the PCB board, thereby adjusting the PCB board to a horizontal state. A horizontally adjusted PCB board facilitates subsequent lens coupling.
[0023] Preferably, in order to adjust the orientation of the PCB board, the moving component includes a rotary displacement stage, which is used to drive the air-cooled mounting base to rotate; in order to adjust the tilt angle of the PCB board, the moving component includes a tilt displacement stage, which is used to drive the air-cooled mounting base to tilt.
[0024] The third aspect of this utility model discloses a coupling device, including the aforementioned adjustment mechanism. By incorporating the adjustment mechanism into the coupling device, the PCB board can be kept in a horizontal state for coupling.
[0025] The beneficial effects of this utility model are as follows: the PCB board is fixed through a fixing structure. After the PCB board is fixed, the airflow release device in the cooling structure releases airflow to the PCB board. The airflow contacts the PCB board, achieving heat dissipation and overcoming the shortcomings of the prior art. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the air-cooled mounting bracket.
[0027] Figure 2 This is a schematic diagram of the cooling structure.
[0028] Figure 3 This is a schematic diagram of a fixed structure.
[0029] Figure 4 This is a schematic diagram of the structure of the first fixed component.
[0030] Figure 5 This is a schematic diagram of the mounting base.
[0031] Figure 6 This is a schematic diagram of the second fixed component.
[0032] Figure 7 This is a schematic diagram showing the connection between the second fixed component and the drive unit.
[0033] Figure 8 A structural diagram for adjusting the structure.
[0034] The reference numerals in the accompanying drawings include: fixed structure 1, first fixed component 11, first inclined surface 11a, second fixed component 12, second inclined surface 12a, mounting base 13, mounting groove 131, pick-up and drop-out port 132, positioning protrusion 133, drive unit 14, sliding module 141, driver 142, mounting column 142a, tension spring 142b, operating part 143, cooling structure 2, airflow release device 21, air source 22, mounting plate 3, moving assembly 4, rotary displacement stage 41, tilt displacement stage 42. Detailed Implementation
[0035] To make the objectives, technical solutions, and advantages of the embodiments clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.
[0036] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" are defined based on the contours of the corresponding components. Terms such as "first" and "second" used in this disclosure are for distinguishing one element from another and do not imply sequence or importance.
[0037] Example 1
[0038] The basics are as follows: Figure 1 To be continued Figure 2 As shown, an air-cooled mounting base includes a fixing structure 1, a cooling structure 2, and a mounting component. The fixing structure 1 is mounted on the mounting component, which is preferably a mounting plate 3. The cooling structure 2 is mounted on the fixing structure 1, so that the cooling structure 2 and the fixing structure 1 are stably fitted together.
[0039] The fixing structure 1 in this embodiment includes a first fixing component 11, a second fixing component 12, a mounting base 13, and a driving unit 14. The mounting base 13 is rectangular and frustum-shaped. The top of the mounting base 13 is flat and is used to place the PCB board. The bottom of the mounting base 13 is mounted on the mounting component by welding or fasteners. The mounting base 13 has an internal receiving cavity and a connection port on its top that communicates with the outside. The first fixing component 11 and the second fixing component 12 are respectively provided on the left and right sides of the top of the mounting base 13, and a receiving gap is formed between the first fixing component 11 and the second fixing component 12 to accommodate the PCB board. The second fixing component 12 is connected to the driving unit 14, and the driving unit 14 drives the second fixing component 12 to move toward the first fixing component 11, thereby expanding or shrinking the receiving gap between the second fixing component 12 and the first fixing component 11.
[0040] To facilitate precise placement of the PCB board, an L-shaped positioning protrusion 133 is provided on the top left side of the mounting base 13. This L-shaped protrusion 133 contacts the top and left ends of the PCB board, providing initial positioning. To facilitate removal of the PCB board from the top of the mounting base 13, a through-hole 132 is provided at the top of the mounting base 13. The top of the through-hole 132 is open. When the PCB board needs to be removed, the operator inserts two fingers into the through-hole 132, which accommodates the fingers. The two fingers can then grasp both sides of the PCB board and remove it.
[0041] The cooling structure 2 in this embodiment includes an airflow release device 21 and an air source 22. The airflow release device 21 is rod-shaped, and its surface is provided with an air outlet for releasing cooling airflow. The airflow supply device can be a gas cylinder or a blower, etc., and the airflow supply device and the airflow release device 21 are connected by a pipe. When the airflow supply device is working, airflow is delivered to the airflow release device 21, and the airflow is finally discharged outward from the air outlet. The airflow release device 21 is housed inside the receiving cavity of the base, with the air outlet of the airflow release device 21 facing upward. The airflow released from the air outlet can be released into the receiving gap through the connection port, so that the airflow is directly facing the copper sheet at the bottom of the PCB board.
[0042] To achieve better heat dissipation, this embodiment features multiple air outlets arranged in a straight line. The air outlets are positioned along the length of the accommodating gap. This straight-line arrangement allows for heat dissipation from multiple locations on the bottom of the PCB board, resulting in superior cooling performance.
[0043] To facilitate the installation of the first fixing component 11, this embodiment provides a mounting groove 131 at the top left side of the mounting base 13. The mounting groove 131 communicates with both the receiving cavity and the connection port at the top of the mounting base 13. The first fixing component 11, which is rectangular in shape, is installed inside the mounting groove 131. The side of the first fixing component 11 is also provided with a first inclined surface 11a, which slopes downward. The first inclined surface 11a can contact the side of the PCB board, thereby limiting the top edge of the PCB board.
[0044] Taking one application scenario as an example: when the PCB board is placed on top of the mounting base 13, the first inclined surface 11a contacts the side of the PCB board. The top of the PCB board is restricted by the first inclined surface 11a, and the bottom of the PCB board contacts the top of the mounting base 13. Therefore, the upper and lower ends of the side of the PCB board are limited, and the side of the PCB board is fixed from top to bottom, making the PCB board more stable.
[0045] In this embodiment, multiple first fixing components 11 are preferably provided, specifically three. The three first fixing components 11 respectively contact the front, middle, and rear sides of the PCB board, making the PCB board more stable. Preferably, the first fixing components 11 are telescopically installed inside the mounting groove 131. In implementation, the first fixing component 11 is provided with a slot, which extends from top to bottom through the first fixing component 11. The mounting groove 131 has a threaded hole inside. When it is necessary to move the first fixing component 11, simply separate the bottom of the bolt from the threaded hole, allowing the first fixing component 11 to telescopically extend along the mounting groove 131, thus moving the first fixing component 11. When it is necessary to fix the first fixing component 11, pass the bolt through the slot, with the bottom of the bolt connecting to the threaded hole, thereby fixing the first fixing component 11 inside the mounting groove 131.
[0046] It is understandable that when PCBs of different shapes need to be fixed, the extension state of the first fixing component 11 is adjusted so that the first fixing component 11 fits against the side of the PCB. After the first fixing component 11 fits against the PCB, the PCB is fixed in place.
[0047] In this embodiment, the second fixing component 12 is sheet-shaped and Z-shaped overall. The top of the second fixing component 12 is used to contact the side of the PCB board. The second fixing component 12 is connected to the driving unit 14. When the driving unit 14 is working, it drives the second fixing component 12 to move, so that the first fixing component 11 and the second fixing component 12 move closer or further apart. When the first fixing component 11 and the second fixing component 12 move closer together, they clamp and fix the PCB board, keeping the PCB board stable; when the first fixing component 11 and the second fixing component 12 move further apart, they release the PCB board.
[0048] To ensure a more stable fixation of the PCB board, this embodiment provides a second inclined surface 12a on the top of the second fixing component 12, with the second inclined surface 12a tilting downwards. When the PCB board is placed on top of the mounting base 13, the second inclined surface 12a contacts the side of the PCB board. The top of the PCB board is restricted by the second inclined surface 12a, and the bottom of the PCB board contacts the top of the mounting base 13. The upper and lower ends of the side of the PCB board are limited, thus fixing the side of the PCB board vertically.
[0049] The drive unit 14 in this embodiment includes a sliding module 141 and a driver 142. The sliding module 141 includes a slide rail and a slider. The slide rail is mounted on the mounting plate 3, and the slider is mounted on the slide rail, allowing the slider to move along the slide rail. The top of the slider is fixedly connected to the second fixed component 12. When the slider moves along the slide rail, it drives the second fixed component 12 to move. The sliding module 141 guides and fixes the second fixed component 12, making the movement of the second fixed component 12 more precise and stable.
[0050] Meanwhile, in order to accommodate the sliding module 141, a receiving opening is provided on the side of the mounting base 13, which communicates with the interior of the mounting base 13. The front end of the sliding module 141 can extend into the interior of the mounting base 13 through the receiving opening, thus avoiding interference between the mounting base 13 and the sliding module 141.
[0051] To facilitate the operator moving the first fixing component 11 and the second fixing component 12 away from each other when handling the PCB board, this embodiment preferably includes an operating part 143 on the slider. The operating part 143 is rod-shaped. The operating part 143 can be integrally formed with the slider, or it can be connected to the slider by welding or fasteners. The operating rod extends through the mounting base 13 to the outside of the mounting base 13. When using the device, the operator can hold the mounting base 13 with one hand and simultaneously push the operating part 143 to move the first fixing component 11 and the second fixing component 12 away from each other.
[0052] The driver 142 in this embodiment includes a tension spring 142b and a mounting post 142a. One end of the tension spring 142b is fixedly connected to the slider or the second fixing component 12, and the other end of the tension spring 142b is fixedly disposed. In implementation, the mounting post 142a can be provided on the slider or the second fixing component 12, and one end of the tension spring 142b is sleeved on the mounting post 142a, so that the first end of the tension spring 142b is fixedly connected to the slider or the second fixing component 12; at the same time, a mounting post 142a is also provided at the bottom of the mounting plate 3 or inside the mounting base 13, and the second end of the spring is sleeved on the mounting post 142a to fix the second end of the spring.
[0053] In this embodiment, at least two tension springs 142b are preferably provided, and more preferably two. The two tension springs 142b are respectively adapted to both sides of the slider or the second fixing component 12. Through the two tension springs 142b, it is ensured that the slider or the second fixing component 12 is subjected to force on both sides, and the second fixing component 12 can be subjected to force evenly.
[0054] The following detailed description illustrates the process: When the PCB board needs to be fixed, firstly, the operating part 143 is pushed to separate the first fixing part 11 and the second fixing part 12. Then, the PCB board is placed on top of the mounting base 13, with the front end and left side of the PCB board contacting the L-shaped positioning protrusion 133 respectively, achieving initial positioning of the PCB board. Next, the operating part 143 is released, and the first fixing part 11 and the second fixing part 12 move closer together under the action of the tension spring 142b, clamping and fixing the PCB board. Finally, the extension state of the first fixing part 11 is adjusted so that it contacts the left side of the PCB board.
[0055] Example 2
[0056] This embodiment provides an adjustment mechanism, including the air-cooled fixed base described in Embodiment 1 and a moving component 4, wherein the moving component 4 is connected to the air-cooled fixed base. The moving component 4 drives the air-cooled fixed base to move, thereby adjusting the posture of the PCB board, and keeping the PCB board in a horizontal state.
[0057] The moving component 4 in this embodiment includes a rotary displacement stage 41 and a tilt displacement stage 42, both of which employ existing technology. The tilt displacement stage 42 is disposed at the bottom of the air-cooled mounting base, which can be installed onto the tilt displacement stage 42 using fasteners; while the rotary displacement stage 41 is disposed at the bottom of the tilt displacement stage 42, and the rotary displacement stage 41 and the tilt displacement stage 42 are connected by fasteners.
[0058] Example 3
[0059] This embodiment provides a coupling device, including the adjustment mechanism, lens moving mechanism, adhesive application mechanism, and fixing mechanism of Embodiment 3.
[0060] In this embodiment, the adjustment mechanism fixes the PCB board, ensuring it is horizontal; the lens moving mechanism moves the lens from the lens container to the coupling position on the PCB board; the adhesive application mechanism releases adhesive onto the coupling position on the PCB, which is used to adhere and fix the lens; and the fixing mechanism cures the adhesive. The lens moving mechanism, adhesive application mechanism, and fixing mechanism in this embodiment can employ existing technologies.
[0061] The above descriptions are merely embodiments of this utility model, and common knowledge regarding specific structures and characteristics is not elaborated upon here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of this utility model, and these should also be considered within the scope of protection of this utility model. These modifications will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.
Claims
1. An air-cooled fixture mount, characterized by: include A fixing structure, comprising a first fixing component and a second fixing component, wherein the first fixing component and the second fixing component are disposed opposite to each other and a receiving gap is provided between the first fixing component and the second fixing component; A cooling structure, comprising an airflow release device and an air source, wherein the air source is connected to the airflow release device and the air outlet of the airflow release device faces the receiving gap.
2. The air-cooled fixture of claim 1, wherein: The airflow release device is located below the receiving gap.
3. The air-cooled fixture of claim 2, wherein: The fixing structure includes a mounting base, the mounting base having an internal cavity, and the airflow release device located inside the cavity. The receiving gap is located above the mounting base, and the receiving cavity communicates with the receiving gap.
4. The air-cooled fixture of claim 1, wherein: The airflow release device is provided with multiple air outlets.
5. The air-cooled fixture of claim 1, wherein: The fixing structure includes a plurality of first fixing components, which are arranged in a straight line along the length of the accommodating gap, and the first fixing components are retractable.
6. The air-cooled fixture of claim 1, wherein: The fixing structure further includes a driving unit, which is connected to the second fixing component. The driving unit drives the second fixing component to move closer to or away from the first fixing component.
7. The air-cooled fixture of claim 6, wherein: The driving unit includes a sliding module and a driver, the second fixed component is connected to the sliding module, and the driver is connected to the sliding module.
8. An adjustment mechanism characterized by: It includes the air-cooled fixed base and the movable component as described in any one of claims 1 to 7, wherein the movable component is connected to the air-cooled fixed base.
9. The adjustment mechanism of claim 8, wherein: The moving component includes a rotary displacement stage, which is used to drive the air-cooled fixed base to rotate. And / or, The moving component includes a tilting stage, which is used to drive the air-cooled fixed base to tilt.
10. A coupling device, characterized by: Includes the adjustment mechanism of claim 8 or 9.
Citation Information
Patent Citations
Coupling system and lens assembly method
CN115509024A