Annealing device for photovoltaic cell chip assembly
By using an open heating hole and a floating movement mechanism in the photovoltaic cell chip annealing device, combined with the flexible contact between the adjustable temperature heating zone and the support, the problem of uneven crystallization caused by temperature differences is solved, thereby improving the annealing uniformity and photoelectric conversion efficiency of the chip assembly.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI UTMOST LIGHT TECH CO LTD
- Filing Date
- 2025-03-31
- Publication Date
- 2026-04-21
AI Technical Summary
In existing photovoltaic cell chip annealing devices, temperature differences caused by the support structure lead to uneven perovskite crystallization, affecting the chip surface color and photoelectric conversion efficiency.
The heating surface with open heating holes is set on the heating platform, and the chip assembly is suspended and moved by the moving part. Combined with multiple adjustable temperature heating zones and flexible contact method of the support part, the chip assembly is ensured to be heated evenly.
It improves annealing uniformity, reduces color differences on chip surfaces, enhances photoelectric conversion efficiency and crystal quality, adapts to the production needs of different batches of chips, and improves production efficiency and equipment versatility.
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Figure CN224154596U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic cells, and in particular to an annealing apparatus for photovoltaic cell chip assemblies. Background Technology
[0002] In related technologies, since a support is needed to fix the chip during the annealing process, the temperature difference between the support position and other areas of the chip is significant, resulting in inconsistent crystallization rates of perovskite. This uneven crystallization process will cause obvious color differences on the surface of the annealed chip, which will not only affect the appearance but also reduce the photoelectric conversion efficiency. The uneven temperature distribution directly leads to inconsistent crystallization quality of the perovskite film, which in turn affects the overall performance of the device. Therefore, how to improve the annealing uniformity of the annealing device has become the technical problem to be solved in this application. Utility Model Content
[0003] This application aims to at least address one of the technical problems existing in the prior art. To this end, one objective of this application is to provide an annealing apparatus for photovoltaic cell chip modules that can improve the annealing uniformity.
[0004] An annealing apparatus for a photovoltaic cell chip assembly according to an embodiment of this application includes: a heating stage, wherein a heating surface is formed on the heating stage, and an open heating hole is provided on the heating surface, the heating hole being adapted to output a heating medium and heat the chip assembly passing through the heating surface; and a moving part, the moving part being movable relative to the heating stage, the moving part being adapted to drive the chip assembly to levitate and move relative to the heating surface.
[0005] According to an embodiment of this application, an annealing apparatus for photovoltaic cell chip modules heats the surface of the chip module by outputting a heating medium through open heating holes on the heating surface of the heating stage. A moving part drives the chip module to float and move relative to the heating surface. The chip module passes over multiple heating holes in sequence within a unit of time, making the contact opportunity between the chip module and the heating medium nearly equal. Uniform heating can make the perovskite crystallization speed more consistent, reducing the problem of inconsistent film crystallization quality caused by different crystallization speeds. Ultimately, the surface of the annealed chip module will not have obvious color differences, while improving the photoelectric conversion efficiency and the annealing uniformity of the annealing apparatus.
[0006] According to some embodiments of this application, an annealing apparatus for photovoltaic cell chip modules is provided, wherein a plurality of heating zones are formed on the heating surface, the plurality of heating zones are spaced apart along the length of the heating table, and the temperature of each heating zone is adjustable.
[0007] According to some embodiments of this application, an annealing apparatus for photovoltaic cell chip modules is provided, wherein the heating table includes: a heating box, wherein the heating box is configured to be a plurality of sequentially arranged, each heating box having a heating cavity formed therein, and the top wall of each heating box having a heating hole communicating with the heating cavity, and the top wall of each heating box corresponding to the heating zone.
[0008] According to some embodiments of this application, an annealing apparatus for photovoltaic cell chip assemblies is provided in a heating chamber with an air inlet communicating with the heating cavity, and the air inlet is provided with a control valve for controlling the air inlet flow rate.
[0009] An annealing apparatus for photovoltaic cell chip modules according to some embodiments of this application further includes: a support portion disposed on the movable portion, the support portion selectively contacting the side or bottom surface of the chip module to drive the chip module to move relative to the heating surface.
[0010] According to some embodiments of this application, an annealing apparatus for photovoltaic cell chip assemblies is provided on both sides of the heating table in the width direction, wherein at least one side of the support is provided with a support member, which can be selectively moved toward the other side of the support to be adapted to cooperate with the other side of the support to clamp the chip assembly.
[0011] According to some embodiments of this application, in an annealing apparatus for photovoltaic cell chip assemblies, the moving part has an adjustable speed as it passes through each of the heating zones.
[0012] An annealing apparatus for photovoltaic cell chip modules according to some embodiments of this application further includes: a moving track, the moving track being disposed on both sides of the heating table in the width direction and extending along the length direction of the heating table, and the moving part moving along the extension direction of the moving track.
[0013] According to some embodiments of this application, an annealing apparatus for photovoltaic cell chip modules is provided, wherein the moving track includes: a gear belt, the gear belt having a plurality of meshing teeth spaced apart, and the gear belt being constructed as multiple belts corresponding one-to-one with a plurality of heating zones, the multiple gear belts being connected in sequence; wherein the moving part is formed with a mating gear that engages with the gear belt.
[0014] An annealing apparatus for photovoltaic cell chip modules according to some embodiments of this application further includes: a limiting rail, the limiting rail being disposed on both sides of the heating table and extending along the length direction of the heating table, the limiting rail being in limiting cooperation with the support portion.
[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0016] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0017] Figure 1 This is a top view of an annealing apparatus for photovoltaic cell chip modules according to an embodiment of this application;
[0018] Figure 2 This is a side view of an annealing apparatus for a photovoltaic cell chip assembly according to an embodiment of this application;
[0019] Figure 3 This is a front view schematic diagram of an annealing apparatus for photovoltaic cell chip assembly according to an embodiment of this application;
[0020] Figure label:
[0021] 100. Annealing apparatus;
[0022] 10. Chip components;
[0023] 1. Heating platform; 11. Heating surface; 111. Heating hole; 112. Heating zone;
[0024] 12. Heating box; 121. Heating chamber; 122. Air inlet; 123. Control valve;
[0025] 2. Mobility Unit;
[0026] 3. Support section;
[0027] 4. Moving track;
[0028] 5. Limiting track. Detailed Implementation
[0029] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0030] The following is for reference. Figures 1-3 This application describes an annealing apparatus 100 for a photovoltaic cell chip assembly 10 according to an embodiment of the present application.
[0031] An annealing apparatus 100 for a photovoltaic cell chip assembly 10 according to an embodiment of this application includes: a heating stage 1 and a moving part 2. A heating surface 11 is formed on the heating stage 1, and an open heating hole 111 is provided on the heating surface 11. The heating hole 111 is adapted to output a heating medium and heat the chip assembly 10 passing through the heating surface 11. The moving part 2 is movable relative to the heating stage 1 and is adapted to drive the chip assembly 10 to float and move relative to the heating surface 11.
[0032] In related technologies, because a support is needed to fix the chip during the annealing process, the temperature difference between the support location and other areas of the chip is significant, resulting in inconsistent perovskite crystallization rates. This uneven crystallization process causes obvious color differences on the surface of the annealed chip, affecting not only its appearance but also its photoelectric conversion efficiency. The uneven temperature distribution directly leads to inconsistent crystallization quality of the perovskite film, thus affecting the overall performance of the device.
[0033] The heating surface 11 of the heating platform 1 is provided with open heating holes 111, and the heating medium is output from the heating holes 111. When the moving part 2 drives the chip assembly 10 to float and move relative to the heating surface 11, each part of the chip assembly 10 will pass evenly over the heating surface 11 during the movement. Since the heating medium is output through the open heating holes 111, the contact time and frequency between each part and the heating medium are basically the same when the chip assembly 10 floats and moves, ensuring that the chip assembly 10 has an equal opportunity to contact the heating medium. This avoids the problem of insufficient heating in the blocked areas caused by the presence of the support body in the traditional fixed support method. During the movement, the heat is evenly distributed. The heat is transferred to all parts of the chip assembly 10, resulting in more uniform heating of the entire chip assembly 10 during the annealing process. Each unit area of the chip assembly 10 receives approximately the same amount of heat within the same time period. For perovskite materials, uniform heating makes the perovskite crystallization process more stable, and the perovskite crystallization speed tends to be consistent, reducing the problem of inconsistent film crystallization quality caused by different crystallization speeds. The improvement in crystallization quality is directly reflected on the surface of the annealed chip, without obvious color differences. Moreover, the uniform crystallization process is conducive to improving the photoelectric conversion efficiency of the chip. The annealing device 100 can effectively improve the annealing uniformity of the annealing device 100, providing a strong guarantee for the production of high-quality photovoltaic cell chip assembly 10.
[0034] According to some embodiments of this application, an annealing apparatus 100 for a photovoltaic cell chip assembly 10 has a plurality of heating zones 112 formed on a heating surface 11. The plurality of heating zones 112 are spaced apart along the length of the heating table 1, and the temperature of each heating zone 112 is adjustable.
[0035] Due to the inherent thermal conductivity of the chip assembly 10, a temperature gradient may form inside the chip, leading to uneven annealing. Multiple temperature-adjustable heating zones 112 can be configured with appropriate temperature gradients based on the chip's thermal conductivity and size. For larger chip assemblies 10, a gradually increasing or decreasing temperature gradient can be set along the length of the heating stage 1, resulting in a more uniform temperature distribution inside the chip and reducing uneven annealing caused by temperature gradients. Furthermore, in continuous production, different batches of chip assemblies 10 may require different annealing processes. By rapidly adjusting the temperature of each heating zone 112, the annealing process can be switched quickly to meet the production needs of different batches of chips, reducing equipment setup time and improving production efficiency.
[0036] According to some embodiments of this application, an annealing apparatus 100 for a photovoltaic cell chip assembly 10 includes a heating table 1, which is configured as a plurality of heating boxes arranged sequentially. Each heating box 12 has a heating cavity 121 formed therein. The top wall of each heating box 12 is provided with a heating hole 111 communicating with the heating cavity 121. The top wall of each heating box 12 is correspondingly provided with a heating zone 112.
[0037] Each heating chamber 12 independently forms a heating cavity 121 with a corresponding heating zone 112 on its top wall. The temperature of different heating zones 112 can be individually controlled. At the same time, the heating medium is suitable for buffering within the heating cavity 121 to output a heating medium with a uniform temperature. The heating holes 111 on the top walls of multiple heating chambers 12 allow the heating medium to be sprayed out evenly. When the chip assembly 10 moves, each part passes through the heating zone 112 on the top wall of different heating chambers 12 in sequence. Distributed heating reduces heat transfer dead zones and avoids the situation where uneven heat distribution is easily caused by the flow of heating medium in traditional large heating cavities 121.
[0038] According to some embodiments of this application, an annealing apparatus 100 for a photovoltaic cell chip assembly 10 is provided in a heating chamber 12, which is connected to a heating cavity 121. The heating chamber 122 is provided with a control valve 123 for controlling the air intake flow.
[0039] By adjusting the air intake flow rate through control valve 123, the appropriate amount of heating medium can be provided for various chip components 10, ensuring that the chip components 10 can be heated, held, and cooled according to the ideal temperature curve during the annealing process. This improves the accuracy and adaptability of the annealing process. Control valve 123 can adjust the flow rate of each air inlet 122 according to the structure and size of the heating chamber 121. In areas with larger heating chambers 121, the air intake flow rate can be appropriately increased to ensure that heat can be quickly and evenly transferred to all corners. In areas where airflow turbulence is likely to occur, the flow rate can be finely adjusted by control valve 123 to stabilize the airflow direction, so that the heating medium circulates evenly in the chamber, reducing the temperature gradient. Ultimately, this achieves a high degree of temperature uniformity in the heating chamber 121, providing a more stable and consistent annealing environment for the chip components 10.
[0040] The annealing apparatus 100 for a photovoltaic cell chip assembly 10 according to some embodiments of this application further includes a support 3, which is disposed on the moving part 2. The support 3 can selectively contact the side or bottom surface of the chip assembly 10 to drive the chip assembly 10 to move relative to the heating surface 11.
[0041] The support portion 3 can selectively contact the side or bottom surface of the chip assembly 10. Different types of photovoltaic cell chip assemblies 10 vary in size, shape, and structure. For some chip assemblies 10 with fragile bottom surfaces or special structures, the support portion 3 can choose to contact the side to avoid damage to the bottom surface and ensure the integrity of the chip assembly 10 during the annealing process. For chip assemblies 10 with relatively flat bottom surfaces suitable for support, contact between the support portion 3 and the bottom surface provides more stable support, ensuring that the chip assembly 10 does not shake or shift during movement. This allows for more precise control of the movement trajectory of the chip assembly 10 relative to the heating surface 11, meeting the annealing process requirements of different chip assemblies 10. The choice of contact method for the support portion 3 affects the relative position and distance between the chip assembly 10 and the heating surface 11, thus affecting the heat transfer effect. When the support portion 3 contacts the bottom surface, the distance between the chip assembly 10 and the heating surface 11 is relatively fixed, which is beneficial for the uniform transfer of heat from the heating surface 11 to the chip assembly 10. When the support part 3 comes into contact with the side, the angle and distance between the chip assembly 10 and the heating surface 11 can be adjusted to adapt to different heat transfer requirements.
[0042] According to some embodiments of this application, an annealing apparatus 100 for a photovoltaic cell chip assembly 10 has a support portion 3 disposed on both sides of the heating table 1 in the width direction, wherein at least one side of the support portion 3 is provided with a support member, and the support member can be selectively moved toward the other side of the support portion 3 to be adapted to cooperate with the other side of the support portion 3 to clamp the chip assembly 10.
[0043] The support parts 3 are arranged on both sides of the heating table 1 in the width direction, and the support members on at least one side of the support part 3 can move towards the other side, so that the annealing device 100 can flexibly adapt to photovoltaic cell chip modules 10 of different widths. For narrower chip modules 10, the support members can be moved inward to cooperate with the other side of the support part 3 to accurately clamp the chip module 10; for wider chip modules 10, the support members can be moved outward to increase the distance between the two support parts 3, thereby being able to firmly clamp chip modules 10 of different widths, improving the versatility of the annealing device 100, reducing the trouble of replacing or adjusting the entire support structure due to different sizes of chip modules 10, and reducing production costs and equipment adjustment time.
[0044] The chip assembly 10 is held in place by the two side supports 3, which provide reliable positioning and fixation for the chip assembly 10. During the annealing process, the chip assembly 10 needs to maintain a stable position to ensure uniform heating and accurate annealing effect. When the support can be selectively moved and held, it can fit closely to the side of the chip assembly 10 to prevent the chip assembly 10 from shaking, shifting or flipping during the movement. Stable positioning helps to ensure that the chip assembly 10 is always in the best position during the annealing process, so that each part of the chip assembly 10 can maintain a suitable distance and angle with the heating surface 11, thereby improving the uniformity and consistency of annealing and improving the quality and performance of the chip assembly 10.
[0045] In some embodiments of this application, the support part 3 is constructed as a cylinder assembly, and a mating part is provided at one end of the support part 3 facing the photovoltaic module. The movement of the mating part is realized by the cylinder assembly to adapt to photovoltaic modules of different sizes.
[0046] According to some embodiments of this application, in an annealing apparatus 100 for a photovoltaic cell chip assembly 10, the moving part 2 has an adjustable moving speed as it passes through each heating zone 112.
[0047] The moving part 2 has an adjustable moving speed when passing through each heating zone 112. It can precisely control the dwell time of the chip assembly 10 in each heating zone 112 according to the specific temperature and process requirements of each heating zone 112. It can be understood that during preheating, in order to make the chip assembly 10 heat up slowly and avoid internal stress caused by sudden temperature changes, the moving speed can be reduced, allowing the chip assembly 10 to stay in the zone for a longer time and fully absorb heat. However, during high-temperature annealing, if the chip assembly 10 has good tolerance to high temperatures and needs to achieve the annealing effect quickly, the moving speed can be appropriately increased to reduce the exposure time at high temperatures and prevent the chip assembly 10 from being overheated and damaged. It can provide the most suitable annealing conditions for the chip assembly 10 according to the characteristics of different heating zones 112, thereby improving the accuracy and adaptability of the annealing process.
[0048] During the annealing process, adjusting the moving speed of the chip assembly 10 can help balance the heating of different parts of the chip assembly 10. When the moving speed of the chip assembly 10 is uneven, some parts may be overheated while others are underheated. By adjusting the moving speed according to the temperature distribution of the heating zone 112 and the characteristics of the chip assembly 10, the chip assembly 10 can receive heat evenly when passing through each heating zone 112, thereby effectively improving the temperature uniformity of the chip assembly 10 and reducing annealing defects caused by uneven temperature, such as material deformation and uneven crystallization caused by local overheating, thus improving the annealing quality.
[0049] The annealing apparatus 100 for a photovoltaic cell chip assembly 10 according to some embodiments of this application further includes a moving track 4, which is disposed on both sides of the heating table 1 in the width direction and extends along the length direction of the heating table 1, and the moving part 2 moves along the extension direction of the moving track 4.
[0050] The moving track 4 is set on both sides of the heating table 1 in the width direction and extends along the length direction, providing a clear moving path for the moving part 2. During the annealing process, the moving part 2 needs to move the chip assembly 10 relative to the heating surface 11. Without the constraint of the track, the moving part 2 may experience unstable situations such as shaking or deviation. The existence of the track allows the moving part 2 to move smoothly along a fixed trajectory, ensuring the positional accuracy of the chip assembly 10 during the movement. During the movement, the track can effectively limit the lateral displacement of the moving part 2, preventing the chip assembly 10 from colliding with the heating table 1 or deviating from the predetermined heating area 112 due to the instability of the moving part 2, thereby ensuring the smooth progress of the annealing process and improving the stability and consistency of the annealing.
[0051] According to some embodiments of this application, the annealing apparatus 100 for a photovoltaic cell chip assembly 10 includes a moving track 4 comprising a gear belt with a plurality of meshing teeth spaced apart, and the gear belt is constructed as a plurality of belts corresponding one-to-one with a plurality of heating zones 112, the plurality of gear belts being connected in sequence; wherein the moving part 2 is formed with a mating gear that engages with the gear belt.
[0052] The meshing transmission method of gear belt and mating gear has high stability and reliability. During gear transmission, the force transmitted between meshing teeth is relatively uniform, which can effectively reduce the vibration and shaking of the moving part 2 during movement and avoid the slippage problem of other transmission methods. Gear transmission can ensure that the moving part 2 moves stably along the predetermined trajectory and speed. Especially in long-term continuous production, this stability and reliability can ensure the normal operation of the annealing device 100, reduce downtime and production losses caused by transmission system failures, and improve the overall operating efficiency of the equipment and the continuity of production.
[0053] In some embodiments of this application, the moving speed of the moving part 2 as it passes through each heating zone 112 can be adjusted by controlling the rotational speed of the gear belt.
[0054] The annealing apparatus 100 for a photovoltaic cell chip assembly 10 according to some embodiments of this application further includes a limiting track 5, which is disposed on both sides of the heating table 1 and extends along the length direction of the heating table 1. The limiting track 5 is in a limiting cooperation with the support part 3.
[0055] During the operation of the annealing device 100, the unexpected displacement or shaking of the support part 3 may cause collisions with other components or damage to the chip assembly 10. The setting of the limit rail 5 can effectively avoid these situations and define a safe range for the movement of the support part 3. When the support part 3 shows an abnormal movement trend, the limit rail 5 will restrict the support part 3 to prevent it from exceeding the safety limit. When the equipment is affected by external interference or internal malfunctions that may cause the support part 3 to shift, the limit rail 5 can promptly stop such shifts, ensuring the safety of the equipment and operators and reducing losses caused by safety accidents.
[0056] It should be noted that when the moving track 4 includes a gear belt and the moving part 2 has a mating gear that engages with the gear belt, since the support part 3 and the moving part 2 are connected, the support part 3 will rotate together with the mating gear on the moving part 2. As a result, the rotation of the support part 3 will cause the photovoltaic module to rotate, which may affect the annealing quality. By setting the limiting track 5, the support part 3 is limited to prevent the rotation of the support part 3. The limiting track 5 can ensure that the support part 3 moves along the predetermined route, thereby ensuring that the chip module 10 can also stably pass through each heating zone 112, and avoiding the annealing effect of the chip module 10 due to the instability of the support part 3.
[0057] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0058] In the description of this application, "first feature" and "second feature" may include one or more of the features.
[0059] In the description of this application, "multiple" means two or more.
[0060] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.
[0061] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.
[0062] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0063] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. An annealing apparatus for a photovoltaic cell chip assembly, characterized by, include: A heating stage (1) is provided with a heating surface (11) formed on the heating stage (1). The heating surface (11) is provided with an open heating hole (111). The heating hole (111) is adapted to output a heating medium and heat the chip assembly (10) passing through the heating surface (11). The moving part (2) is movable relative to the heating platform (1) and is adapted to drive the chip assembly (10) to float and move relative to the heating surface (11).
2. The annealing apparatus for a photovoltaic cell chip assembly according to claim 1, wherein Multiple heating zones (112) are formed on the heating surface (11), and the multiple heating zones (112) are spaced apart in the length direction of the heating table (1), and the temperature of each heating zone (112) is adjustable.
3. The annealing apparatus for a photovoltaic cell chip assembly according to claim 2, wherein The heating platform (1) includes: Heating box (12), the heating box (12) is constructed as a plurality of them arranged in sequence, each heating box (12) has a heating cavity (121) formed inside, and the top wall of each heating box (12) is provided with a heating hole (111) communicating with the heating cavity (121), and the top wall of each heating box (12) is correspondingly arranged with the heating area (112).
4. The annealing apparatus for a photovoltaic cell chip assembly according to claim 3, wherein The heating box (12) is provided with an air inlet (122) communicating with the heating chamber (121), and the air inlet (122) is provided with a control valve (123) for controlling the air intake flow.
5. The annealing apparatus for a photovoltaic cell chip assembly according to claim 1, wherein Also includes: A support part (3) is disposed on the moving part (2). The support part (3) can selectively contact the side or bottom surface of the chip assembly (10) to drive the chip assembly (10) to move relative to the heating surface (11).
6. The annealing apparatus for a photovoltaic cell chip assembly according to claim 5, wherein The support portion (3) is disposed on both sides of the heating table (1) in the width direction, wherein at least one side of the support portion (3) is provided with a support member, which can be selectively moved toward the other side of the support portion (3) to be suitable for cooperating with the other side of the support portion (3) to clamp the chip assembly (10).
7. The annealing apparatus for a photovoltaic cell chip assembly according to claim 2, wherein The moving part (2) has an adjustable moving speed as it passes through each of the heating zones (112).
8. The annealing apparatus for a photovoltaic cell chip assembly according to claim 7, wherein Also includes: The moving track (4) is arranged on both sides of the heating table (1) in the width direction and extends along the length direction of the heating table (1). The moving part (2) moves along the extension direction of the moving track (4).
9. The annealing apparatus for a photovoltaic cell chip assembly according to claim 8, wherein The moving track (4) includes: A gear belt, wherein multiple meshing teeth are spaced apart, and the gear belt is constructed as multiple belts corresponding one-to-one with multiple heating zones (112), and the multiple gear belts are connected sequentially; wherein The moving part (2) is formed with a mating gear that engages with the gear belt.
10. The annealing apparatus for a photovoltaic cell chip assembly according to claim 6, wherein Also includes: The limiting track (5) is provided on both sides of the heating table (1) and extends along the length of the heating table (1). The limiting track (5) is in a limiting fit with the support part (3).