Low-stress passivation layer packaging structure of FRD chip

Abstract

The utility model relates to the technical field of chip packaging, and discloses a low-stress passivation layer packaging structure of an FRD chip, which comprises a heat dissipation table, a packaging operation table is arranged above the heat dissipation table, a packaging operation mechanical arm is arranged below the packaging operation table, a liquid cooling water pipe is fixed in the heat dissipation table, and the liquid cooling water pipe is fixed in the heat dissipation table. According to the utility model, the liquid cooling water pipe is arranged in the heat dissipation table, so that the liquid cooling water pipe dissipates heat in the heat dissipation table through the external water pipe, and meanwhile, when the chip main body is packaged on the packaging table, heat on the chip substrate and the chip main body is conducted to the heat dissipation table through the heat conducting sheet, so that the heat dissipation efficiency is improved. And the heat on the chip substrate and the chip main body is taken out through the liquid cooling water pipe in the heat dissipation table, so that the problems that the chip often needs to go through a high-temperature environment during packaging, and a traditional FRD chip passivation layer usually easily generates relatively large stress in a continuous high-temperature environment to influence the performance and the service life of a device are solved.

Description

Technical Field

[0001] This utility model application relates to the field of chip packaging technology, specifically a low-stress passivation layer packaging structure for an FRD chip. Background Technology

[0002] Chip packaging is the process of encapsulating integrated circuit chips in a protective casing to provide physical protection, electrical connectivity, and heat dissipation. Packaging materials typically include plastics, ceramics, or metals. The casing connects to external circuitry via leads, solder balls, or contacts. Packaging not only protects the chip from mechanical damage, moisture, and dust but also enables electrical signal transmission between the chip and the printed circuit board via pins or solder balls. Common packaging forms include QFP, BGA, and CSP, each suitable for different application scenarios. Packaging technology also affects the chip's heat dissipation, electrical performance, and size, making it a crucial aspect of chip design and manufacturing. With the development of chip miniaturization and high performance, packaging technology is constantly advancing, such as the application of 3D packaging and advanced packaging technologies, further improving chip performance and integration.

[0003] In the manufacturing process of FRD chips, the formation of the passivation layer is a crucial step. The passivation layer can protect the chip surface from the influence of the external environment and improve the reliability and stability of the device. During the packaging process, the chip often needs to undergo high temperature environment. Traditional FRD chip passivation layers are prone to generating large stress under continuous high temperature environment, which can lead to problems such as chip warping and cracking, affecting the performance and lifespan of the device. Summary of the Invention

[0004] To address the issue that traditional FRD chip passivation layers often experience significant stress during continuous high-temperature environments, affecting device performance and lifespan, this invention provides a low-stress passivation layer packaging structure for FRD chips to solve the aforementioned problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A low-stress passivation layer packaging structure for an FRD chip includes a heat sink platform, a packaging operation stage above the heat sink platform, a packaging operation robot arm below the packaging operation stage, a liquid cooling water pipe fixed inside the heat sink platform, one end of the liquid cooling water pipe being connected to an external water pipe, a packaging stage rotatably mounted inside the heat sink platform, a plurality of limiting grooves being formed on the top surface of the packaging stage, a chip substrate being placed inside each limiting groove, a chip body being placed on the chip substrate, and a thermal conductive sheet being fixed at the bottom of the packaging stage, the thermal conductive sheet being attached to the top surface of the heat sink platform.

[0007] Furthermore, two cooling fans are fixed inside the packaging operation table, and the air outlets of the two cooling fans correspond to the positions of the limiting grooves.

[0008] Furthermore, a fixed base is fixed to the bottom of the heat sink, and two support columns are symmetrically fixed inside the fixed base and between it and the bottom of the heat sink. A support platform is slidably connected to the support columns, and a hydraulic cylinder is provided below the support platform. The output end of the hydraulic cylinder is fixedly connected to the support platform.

[0009] Furthermore, a servo motor is fixed on the top surface of the support platform, the output end of the servo motor is fixedly connected to the packaging platform, and a through hole is provided on the heat dissipation platform to cooperate with the output end of the servo motor.

[0010] Furthermore, the heat-conducting sheet is located directly below the limiting groove, and the top surface of the heat-conducting sheet is attached to the bottom surface of the chip substrate.

[0011] Furthermore, the distances between the plurality of limiting slots are all equal, and the two cooling fans are disposed above two adjacent limiting slots.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. In this utility model, by setting liquid cooling water pipes inside the heat sink, the liquid cooling water pipes dissipate heat to the inside of the heat sink through external water pipes. At the same time, when the chip body is packaged on the packaging platform, the heat on the chip substrate and the chip body is conducted to the heat sink through the heat-conducting sheet, and then the heat on the chip substrate and the chip body is carried away through the liquid cooling water pipes inside the heat sink. This solves the problem that chips often need to be subjected to high-temperature environments during packaging, and the passivation layer of traditional FRD chips is prone to large stress under continuous high-temperature environments, which affects the performance and lifespan of the device.

[0014] 2. In this utility model, by setting a cooling fan on the packaging operation table, after the packaging operation robot arm packages the chip body, the packaging table is rotated by a servo motor, so that the packaged chip substrate and chip body are moved under the cooling fan. This allows the packaging operation robot arm to package the next chip substrate and chip body at the same time, while the cooling fan and liquid cooling water pipes dissipate heat from the packaged chip substrate and chip body, thus avoiding the problem of heat accumulation on the chip substrate and chip body. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural schematic diagram according to an embodiment of the present application;

[0017] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the packaging arm structure in the embodiment shown;

[0018] Figure 3 yes Figure 1 The diagram shows a three-dimensional view of the operating platform structure in the embodiment shown.

[0019] Figure 4 yes Figure 1 The above-view three-dimensional structure diagram of the packaging platform in the embodiment shown;

[0020] Figure 5 yes Figure 1 The diagram shows a top view of the heat dissipation structure in the embodiment shown.

[0021] The meanings of the labels in the attached diagram are as follows: 1. Heat sink; 2. Fixed base; 3. Support column; 4. Hydraulic cylinder; 5. Support platform; 6. Servo motor; 7. Packaging platform; 8. Heat-conducting sheet; 9. Chip substrate; 10. Chip body; 11. Liquid cooling water pipe; 12. Packaging operation platform; 13. Packaging operation robotic arm; 14. Cooling fan; 15. Limiting groove. Detailed Implementation

[0022] To make the purpose, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5A low-stress passivation layer packaging structure for an FRD chip includes a heat sink 1, a packaging operation table 12 above the heat sink 1, a packaging operation robot arm 13 below the packaging operation table 12, a liquid cooling water pipe 11 fixed inside the heat sink 1, one end of the liquid cooling water pipe 11 connected to an external water pipe, a packaging platform 7 rotatably mounted inside the heat sink 1, a plurality of limiting grooves 15 formed on the top surface of the packaging platform 7, a chip substrate 9 placed inside each limiting groove 15, a chip body 10 placed on the chip substrate 9, and a heat-conducting sheet 8 fixed at the bottom of the packaging platform 7, the heat-conducting sheet 8 being in contact with the top surface of the heat sink 1, so that the liquid cooling water pipe 11 dissipates heat from the chip substrate 9 and the chip body 10.

[0024] Specifically, a fixed base 2 is fixed to the bottom of the heat sink 1. Two support columns 3 are symmetrically fixed inside the fixed base 2 and between it and the bottom of the heat sink 1. A support platform 5 is slidably connected to the support columns 3. A hydraulic cylinder 4 is set below the support platform 5. The output end of the hydraulic cylinder 4 is fixedly connected to the support platform 5. A servo motor 6 is fixed to the top surface of the support platform 5. The output end of the servo motor 6 is fixedly connected to the packaging platform 7. A through hole is opened on the heat sink 1 to cooperate with the output end of the servo motor 6. The heat conduction sheet 8 is located directly below the limiting groove 15. The top surface of the heat conduction sheet 8 is in contact with the bottom surface of the chip substrate 9 to improve the heat dissipation efficiency of the heat conduction sheet 8.

[0025] As an optimization solution, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, there are two cooling fans 14 fixed inside the packaging operation table 12. The air outlets of the two cooling fans 14 correspond to the positions of the limiting grooves 15, so that the cooling fans 14 assist the liquid cooling water pipes 11 in heat dissipation.

[0026] Specifically, the distance between several limiting slots 15 is equal, and two cooling fans 14 are set above two adjacent limiting slots 15 to improve the cooling efficiency of the cooling fans 14.

[0027] Working principle: By placing the chip substrate 9 and chip body 10 on the limiting groove 15, and then starting the servo motor 6, the servo motor 6 drives the packaging stage 7 to rotate. This causes the packaging stage 7 to move the chip substrate 9 and chip body 10 to below the packaging operation robot arm 13. The packaging operation stage 12 then controls the packaging operation robot arm 13 to package the chip substrate 9 and chip body 10. At the same time, the heat generated during the packaging process is transferred to the heat dissipation platform 1 through the heat-conducting sheet 8, and water is transferred to the liquid cooling water pipe 11 through the water pipe. This allows the liquid cooling water pipe 11 to cool the heat dissipation platform 1. The heat is carried away. After the chip substrate 9 and chip body 10 are packaged, the hydraulic cylinder 4 is activated, which drives the support platform 5 to move upward. This causes the support platform 5 to drive the servo motor 6 to move upward. At the same time, the servo motor 6 drives the packaging platform 7 to move upward. Then, the servo motor 6 is activated, which drives the packaging platform 7 to rotate. The packaged chip substrate 9 and chip body 10 are moved to the area below the cooling fan 14. At this time, the cooling fan 14 is activated, so that the cooling fan 14 and the liquid cooling water pipe 11 simultaneously dissipate heat from the packaged chip substrate 9 and chip body 10.

[0028] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of the equivalent elements of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A low-stress passivation layer packaging structure of an FRD chip, comprising a heat dissipation table (1), a packaging operation table (12) is arranged above the heat dissipation table (1), and a packaging operation mechanical arm (13) is arranged below the packaging operation table (12), characterized in that: The heat dissipation platform (1) is fixed with a liquid cooling water pipe (11), one end of which is connected to an external water pipe. The heat dissipation platform (1) is rotatably installed with an encapsulation platform (7). The top surface of the encapsulation platform (7) is provided with several limiting grooves (15). Each limiting groove (15) contains a chip substrate (9). A chip body (10) is placed on the chip substrate (9). A heat-conducting sheet (8) is fixed at the bottom of the encapsulation platform (7). The heat-conducting sheet (8) is attached to the top surface of the heat dissipation platform (1).

2. The low stress passivation encapsulation structure for FRD chip of claim 1, wherein: The encapsulation operation table (12) has two heat dissipation fans (14) fixed inside, and the air outlets of the two heat dissipation fans (14) correspond to the positions of the limiting grooves (15).

3. The low stress passivation encapsulation structure for FRD chip of claim 1, wherein: The bottom of the heat sink (1) is fixed with a fixed base (2). Inside the fixed base (2), there are two support columns (3) symmetrically fixed between the bottom of the heat sink (1) and the fixed base (2). A support platform (5) is slidably connected on the support column (3). A hydraulic cylinder (4) is provided below the support platform (5). The output end of the hydraulic cylinder (4) is fixedly connected to the support platform (5).

4. The low-stress passivation encapsulation structure for FRD chips of claim 3, wherein: A servo motor (6) is fixed on the top surface of the support platform (5). The output end of the servo motor (6) is fixedly connected to the packaging platform (7). A through hole is provided on the heat dissipation platform (1) to cooperate with the output end of the servo motor (6).

5. The low stress passivation encapsulation structure for FRD chip of claim 1, wherein: The heat-conducting sheet (8) is located directly below the limiting groove (15), and the top surface of the heat-conducting sheet (8) is attached to the bottom surface of the chip substrate (9).

6. The low-stress passivation encapsulation structure for FRD chips of claim 2, wherein: The distances between the plurality of limiting slots (15) are all equal, and the two cooling fans (14) are disposed above two adjacent limiting slots (15).

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