Non-contact jacking device

Abstract

The utility model relates to the technical field of chips, in particular to a non-contact jacking device. Comprising a base, a mounting seat is arranged at the upper end of the base, a blowing area is arranged on the surface of the mounting seat, a plurality of closable air holes are formed in the blowing area, the lower ends of the air holes are connected with blowing pipes, blowing electromagnetic valves are arranged on the blowing pipes, a vacuum sleeve is arranged at the upper end of the blowing area, one end of the vacuum sleeve is connected with a vacuum pipe, and a vacuum electromagnetic valve is arranged on the vacuum pipe. Compared with the prior art, the air blowing device is not in direct contact with a chip, the abrasion problem caused by contact is prevented, the yield of the chip is improved, the air blowing size can be adjusted according to the thickness of the chip, the air blowing device is suitable for chips of most sizes, installation is convenient, and tools do not need to be disassembled and assembled repeatedly.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, specifically a non-contact lifting device. Background Technology

[0002] In the die bonding process of semiconductor packaging, the chip needs to be lifted and picked up from the ground and diced wafer. Currently, all lifting devices use tooling with different physical contacts, and motor-controlled steppers are used to pick up the chip, such as ejector pins and ejector blocks. The tooling material itself is a rigid object, which is susceptible to wear, uneven installation, and center misalignment. As the chip thickness is getting thinner, contact with the chip can easily cause chip chipping and breakage, leading to product failure and low yield. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, this utility model provides a non-contact lifting device.

[0004] To achieve the above objectives, a non-contact lifting device is designed, including a base, an upper mounting seat, an air blowing area on the surface of the mounting seat, several closable air holes in the air blowing area, an air blowing pipe connected to the lower end of the air holes, an air blowing solenoid valve on the air blowing pipe, a vacuum sleeve at the upper end of the air blowing area, a vacuum tube connected to one end of the vacuum sleeve, and a vacuum solenoid valve on the vacuum tube.

[0005] The air blowing pipe is equipped with a first one-way regulating valve, and the vacuum pipe is equipped with a second one-way regulating valve.

[0006] The vent has a threaded structure, and the vent is closed by inserting a bolt into it.

[0007] Several pores are arranged in a matrix.

[0008] The base surface is provided with fixing holes.

[0009] A positioning rod is provided on one side of the mounting base, and the structure of the positioning rod is compatible with the structure of the vacuum sleeve.

[0010] Compared with the prior art, this utility model does not have rigid direct contact with the chip, thus preventing wear caused by contact, improving chip yield, and allowing the air volume to be adjusted according to the chip thickness. It is suitable for chips of most sizes, and is easy to install without the need for multiple disassembly and assembly tools. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model.

[0012] Figure 2 This is a front view of the base of this utility model.

[0013] Figure 3 This is a top view of the base of this utility model.

[0014] Figure 4 This is a schematic diagram of the structure of the vacuum sleeve of this utility model. Detailed Implementation

[0015] The present invention will be further described below with reference to the accompanying drawings.

[0016] like Figures 1 to 4 As shown, the upper end of the base 1 is equipped with a mounting seat 2. The surface of the mounting seat 2 is provided with an air blowing area 3. Several closable air holes 4 are provided in the air blowing area 3. The lower end of the air holes 4 is connected to an air blowing pipe 5. An air blowing solenoid valve 6 is provided on the air blowing pipe 5. A vacuum sleeve 7 is provided at the upper end of the air blowing area 3. One end of the vacuum sleeve 7 is connected to a vacuum tube 8. A vacuum solenoid valve 9 is provided on the vacuum tube 8.

[0017] The air blowing pipe 5 is equipped with a first one-way regulating valve 11, and the vacuum pipe 8 is equipped with a second one-way regulating valve 12. During use, the amount of air blowing and vacuum is adjusted by the solenoid valve and the one-way regulating valve.

[0018] The air hole 4 has a threaded structure. In actual use, the bolt is inserted into the air hole 4 and tightened to close the air hole 4, which facilitates the adjustment of the area of ​​the air blowing zone 3 according to the chip size.

[0019] Several vents 4 are arranged in a matrix. In actual use, the number of vents 4 can be increased or decreased according to the size and thickness of the chip. When the chip size is large, more vents 4 can be added, and when the chip size is small, fewer vents 4 can be added, without the need to change to new tooling, making the operation simple.

[0020] The base 1 has a fixing hole 10 on its surface. The fixing hole 10 is used to cooperate with the fixing component to fix the base in the required position for use.

[0021] A positioning rod 13 is provided on one side of the mounting base 2. The structure of the positioning rod 13 is compatible with the structure of the vacuum sleeve 7. In actual use, the positioning rod 13 plays a positioning role in installing the vacuum sleeve 7.

[0022] In use, the number of air holes 4 in the air blowing area 3 is adjusted according to the chip size. Then, the chip is placed in the air blowing area 3, and a vacuum sleeve is installed. At this time, the lower surface of the chip is covered with a film, and the upper surface of the chip is in contact with the vacuum sleeve. Next, a vacuum is drawn through the vacuum tube 8, and the outer part of the chip is sucked in by the vacuum sleeve 7. Then, air is blown through the air holes 4. The blowing volume is adjusted to blow off the film, thereby separating the chip from the film.

[0023] In practical use, if the chip is not held in place by the vacuum sleeve, blowing air through the air tube or vent will blow the chip and the adhesive film together, failing to separate the chip from the adhesive film and thus making it impossible to pick up the chip.

Claims

1. A non-contact lift device comprising a base, characterized in that: The base (1) has an upper mounting seat (2), the surface of the mounting seat (2) is provided with an air blowing area (3), the air blowing area (3) has several closable air holes (4), the lower end of the air holes (4) is provided with an air blowing pipe (5), the air blowing pipe (5) is provided with an air blowing solenoid valve (6), the upper end of the air blowing area (3) is provided with a vacuum sleeve (7), one end of the vacuum sleeve (7) is connected to a vacuum tube (8), and the vacuum tube (8) is provided with a vacuum solenoid valve (9).

2. A non-contact lift device according to claim 1, wherein: The blowing pipe (5) is provided with a first one-way regulating valve (11), and the vacuum pipe (8) is provided with a second one-way regulating valve (12).

3. A non-contact lift device as claimed in claim 1, wherein: The air hole (4) is provided with a threaded structure, and the air hole (4) is closed by inserting a bolt into the air hole (4).

4. A non-contact lift device according to claim 1 or 3, wherein: Several pores (4) are arranged in a matrix.

5. A non-contact lift device as claimed in claim 1, wherein: The base (1) has fixing holes (10) on its surface.

6. A non-contact lift device as claimed in claim 1, wherein: The mounting base (2) is provided with a positioning rod (13) on one side, and the structure of the positioning rod (13) is compatible with the structure of the vacuum sleeve (7).

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