Power semiconductor device combined packaging device and electronic power equipment

Abstract

The utility model provides a power semiconductor device combined packaging device and electronic power equipment, the power semiconductor device combined packaging device comprises a cover plate assembly, a power semiconductor device positioning cavity and a detection device positioning cavity are enclosed by the cover plate assembly, the power semiconductor device positioning cavity is used for accommodating and positioning a power semiconductor device, and the detection device positioning cavity is used for positioning the power semiconductor device; the detection device positioning cavity is arranged on one side of the power semiconductor device positioning cavity, and the detection device positioning cavity is used for accommodating and positioning the temperature detection assembly; the temperature detection assembly is at least partially embedded in the detection device positioning cavity, and the detection end of the temperature detection assembly is in contact with the power semiconductor device; and the fastener is used for providing a locking force for the cover plate assembly so as to fix the power semiconductor device and the temperature detection assembly. The temperature of the power semiconductor device is efficiently detected, and the installation reliability and stability of the power semiconductor device are improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more specifically, to a power semiconductor device combination packaging apparatus. It also relates to an electronic power device including the aforementioned power semiconductor device combination packaging apparatus. Background Technology

[0002] Power semiconductor devices are the core power devices in power electronic equipment. They generate a lot of heat when they are working, and temperature has a significant impact on their performance and reliability. Excessive temperature can lead to a decrease in device performance, a shortened lifespan, or even damage.

[0003] Currently, most common power semiconductor device packaging structures do not integrate temperature detection functions, or although they do have temperature detection, the integration is inaccurate, complex to install, and unreliable, failing to meet the requirements for real-time and accurate temperature monitoring of power semiconductor devices, thus affecting the stability and reliability of the entire power electronic system. Utility Model Content

[0004] In a first aspect, this application provides a power semiconductor device assembly and packaging device that enables efficient temperature detection of power semiconductor devices, thereby improving the reliability and stability of power semiconductor device installation.

[0005] This application provides a power semiconductor device assembly packaging device, including:

[0006] A cover plate assembly surrounds and forms a power semiconductor device positioning cavity and a detection device positioning cavity. The power semiconductor device positioning cavity is used to accommodate and position the power semiconductor device, and the detection device positioning cavity is disposed on one side of the power semiconductor device positioning cavity. The detection device positioning cavity is used to accommodate and position a temperature detection component.

[0007] A temperature detection component, wherein the temperature detection component is at least partially embedded in the positioning cavity of the detection device, and the detection end of the temperature detection component is electrically connected to the power semiconductor device;

[0008] Fastener, the fastener being used to provide a clamping force to the temperature sensing component so that the sensing end of the temperature sensing component is attached to the power semiconductor device.

[0009] In some embodiments, the cover plate assembly includes a first cover plate and a second cover plate disposed on the side of the first cover plate opposite to the power semiconductor device; wherein...

[0010] The first cover plate has a power semiconductor device positioning cavity and a first detection device positioning part on the side facing the power semiconductor device, and the first cover plate has a first through hole along the thickness direction;

[0011] The second cover plate is provided with a second detection device positioning part, the first detection device positioning part and the second detection device positioning part form the detection device positioning cavity, and the second cover plate is provided with a second through hole coaxially distributed with the first through hole.

[0012] In some embodiments, the first cover plate is provided with a first latching portion on both sides along the first direction, and the second cover plate is provided with a second latching portion on both sides along the first direction. The first latching portion is provided with a latching slot, and the second latching portion is provided with a latching head, which engages with the latching slot.

[0013] In some embodiments, the first cover plate is at least partially located between the orthographic projections of the power semiconductor device and the second cover plate.

[0014] In some embodiments, the first cover plate is provided with pressing members on both sides along the second direction, and the pressing members are provided with at least one pressing head, which is used to press against the power semiconductor device in the second direction to limit the power semiconductor device.

[0015] In some embodiments, the cover plate assembly further includes a pressure plate, wherein the first cover plate has a pressure plate positioning cavity on the side opposite to the power semiconductor device, the pressure plate is at least partially embedded in the pressure plate positioning cavity, and the pressure plate has a third through hole coaxially connected to the first through hole and the second through hole.

[0016] In some embodiments, there are four pressing members distributed at the corners of the second cover plate.

[0017] In some embodiments, a positioning member is provided on the side of the second cover plate opposite to the power semiconductor device. The positioning member has a locking hole for placing the fastener, and a locking buckle is provided on the outer peripheral surface of the positioning member.

[0018] In some embodiments, the temperature detection component includes a temperature sensor and a signal lead electrically connected to the temperature sensor, the signal lead passing through the temperature sensor along the thickness direction and connected to a PCB board.

[0019] This utility model also provides an electronic power device, including a power semiconductor device combination packaging device as described above.

[0020] The power semiconductor device packaging device provided in this embodiment of the application includes a cover plate assembly that encloses a power semiconductor device positioning cavity and a detection device positioning cavity. The power semiconductor device is positioned within the power semiconductor device positioning cavity of the cover plate assembly, where it is installed and positioned. A temperature detection component is positioned within the detection device positioning cavity, and fasteners provide a locking force to the cover plate assembly to secure the power semiconductor device and temperature detection component. This design eliminates the need for additional fixing structures for the power semiconductor device and temperature detection component, effectively securing them and improving the reliability and stability of their installation. It also simplifies the installation and maintenance process. Furthermore, the integrated temperature detection component facilitates real-time and accurate temperature detection of the power semiconductor device. The cover plate assembly provides a pre-reserved positioning cavity for the detection device, allowing the temperature detection component to be installed without occupying additional external space, thus contributing to the integration and miniaturization of the packaging device. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0022] Figure 1 An exploded view of the assembly structure of the power semiconductor device combination packaging device, power semiconductor device, PCB board and heat sink provided in some embodiments of this application;

[0023] Figure 2 for Figure 1 A cross-sectional view of the AA section;

[0024] Figure 3 This is a schematic diagram of the structure of the cover plate assembly in a power semiconductor device combination packaging device provided in some embodiments of this application;

[0025] Figure 4 This is a schematic diagram of the assembly structure of a power semiconductor device combination packaging device, a power semiconductor device, and a PCB board provided in some embodiments of this application;

[0026] Figure 5 A schematic diagram of the assembly structure of a power semiconductor device combination packaging device and a PCB board provided in some embodiments of this application;

[0027] Figure 6 for Figure 5 A cross-sectional view of the BB section.

[0028] The attached figures are labeled as follows:

[0029] 1-Cover assembly; 2-Temperature sensing assembly; 3-Fasteners; 4-Power semiconductor devices; 5-PCB board; 6-Heat sink;

[0030] 11-First cover plate; 12-Second cover plate; 13-Pressure plate; 21-Temperature sensor; 22-Signal lead;

[0031] 101 - Positioning cavity for power semiconductor devices; 102 - Positioning cavity for detection devices;

[0032] 111-First detection device positioning part; 112-First through hole; 113-First locking part; 114-Clip head; 115-Pressure plate positioning cavity; 116-Pressure member; 117-Pressure head; 121-Second detection device positioning part; 122-Second through hole; 123-Second locking part; 124-Bayonet; 127-Positioning member; 128-Locking buckle; 131-Third through hole;

[0033] X - First direction; Y - Second direction; Z - Thickness direction. Detailed Implementation

[0034] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0036] With the rapid development of information technology, people have higher and higher requirements for power electronic equipment, and power electronic equipment is increasingly developing towards integration and miniaturization.

[0037] Power semiconductor devices, such as IGBTs, MOSFETs, BJTs, GTOs, MCTs, SITs, and IEGTs, are widely used in power electronic equipment such as motor controls, frequency converters, uninterruptible power supplies, inverters, and power supplies. As core power devices in power electronic equipment, these devices generate a significant amount of heat during operation. Temperature has a significant impact on the performance and reliability of power semiconductor devices; excessively high temperatures can lead to performance degradation, shortened lifespan, or even damage. Therefore, external temperature sensing devices are needed to measure the temperature of the packaged power semiconductor devices.

[0038] Currently, temperature detection for power semiconductor devices is mostly performed by external temperature sensing components after the devices are packaged into electronic products. This method is inefficient, and adding temperature sensing components to electronic devices increases their overall size. Furthermore, the packaging of power semiconductor devices often uses screws or other fasteners to secure them between the PCB board and the heatsink. Since the tightening force of screws has a limited range, this can easily lead to loosening of the power semiconductor device and poor contact. Therefore, how to integrate temperature detection functionality for power semiconductor devices while ensuring secure packaging, without increasing the package size, is a technical problem that urgently needs to be solved by those skilled in the art.

[0039] Therefore, this application provides a power semiconductor device assembly packaging device, which employs a pre-reserved positioning cavity for the power semiconductor device and a positioning cavity for the detection device within a cover plate assembly. The power semiconductor device and the temperature detection component are integrated and installed within the cover plate assembly and secured using fasteners. Compared to the traditional screw fixing method, this application increases the fastening area between the packaging device and the power semiconductor device, thereby achieving a reliable fixation of the power semiconductor device and the temperature detection component.

[0040] The embodiments of this application will now be described with reference to the accompanying drawings.

[0041] Figure 1 This is a schematic diagram of a power semiconductor device combination packaging device provided in some embodiments of this application.

[0042] Firstly, please refer to Figure 1 This application provides a power semiconductor device combined packaging device, including a cover plate assembly 1, a temperature detection assembly 2, and a fastener 3.

[0043] like Figure 2As shown. The cover plate assembly 1 encloses to form a power semiconductor device positioning cavity 101 and a detection device positioning cavity 102. Both the power semiconductor device positioning cavity 101 and the detection device positioning cavity 102 can be disposed inside the cover plate assembly 1. The power semiconductor device 4 is disposed in the power semiconductor device positioning cavity 101 and is positioned by the power semiconductor device positioning cavity 101.

[0044] The positioning cavity 102 of the detection device can be disposed on one side of the positioning cavity 101 of the power semiconductor device. The temperature detection component 2 is disposed in the positioning cavity 102 of the detection device, and the positioning cavity 102 of the detection device positions the temperature detection component 2. Specifically, the temperature detection component 2 is at least partially embedded in the positioning cavity 102 of the detection device. The detection end of the temperature detection component 2 protrudes from the cover plate assembly 1 and contacts the power semiconductor device 4 to achieve electrical connection. The fastener 3 can provide a locking force to the temperature detection component 2, thereby making the detection end of the temperature detection component 2 fit against the power semiconductor device 4.

[0045] Fastener 3 can be, but is not limited to, screws, bolts, and nuts, and can also be washers, retaining rings, keys, clips, etc. Fastener 3 can fix the power semiconductor device 4 and the temperature detection component 2 by pressing against the cover plate assembly 1, or it can pass through the cover plate assembly 1 and lock to achieve compression and fixation of the power semiconductor device 4 and the temperature detection component 2. For example, fastener 3 passes through the PCB board 5 and the cover plate assembly 1 in sequence, locks itself inside the heat dissipation component, and fixes the power semiconductor device 4 and the temperature detection component 2.

[0046] This application integrates a temperature detection component 2 within the cover plate assembly 1. The detection end of the temperature detection component 2 is in contact with the power semiconductor device 4 to achieve electrical connection, enabling real-time and accurate temperature detection of the power semiconductor device 4. This provides reliable temperature data for equipment operation, facilitating timely temperature monitoring and adjustment, thereby ensuring that the power semiconductor device 4 operates within a suitable temperature range. Furthermore, this application features a compact overall packaging structure, simple installation, and convenient disassembly, facilitating maintenance and replacement of the IGBT single transistor and temperature detection module, reducing maintenance costs. In addition, this application occupies little space, making it suitable for power electronic equipment with high space requirements.

[0047] refer to Figure 3 In one specific embodiment, the cover plate assembly 1 includes a first cover plate 11 and a second cover plate 12. The second cover plate 12 is disposed on the side of the first cover plate 11 opposite to the power semiconductor device 4. The first cover plate 11 is provided with a power semiconductor device positioning cavity 101 and a first detection device positioning part 111. The power semiconductor device 4 is disposed in the power semiconductor device positioning cavity 101, and the temperature detection assembly 2 is disposed in the first detection device positioning part 111.

[0048] Optionally, the first detection device positioning part 111 is disposed on the side facing the power semiconductor device 4, so that the power semiconductor device 4 and the temperature detection component 2 are installed on the same side, thereby saving installation space and reducing the size of the packaging device.

[0049] Furthermore, the second cover plate 12 is provided with a second detection device positioning part 121. The first detection device positioning part 111 and the second detection device positioning part 121 form a detection device positioning cavity 102. The temperature detection component 2 is disposed in the detection device positioning cavity 102. The first cover plate 11 and the second cover plate 12 can be closed to achieve the positioning of the temperature detection component 2. In addition, the first cover plate 11 is provided with a first through hole 112 along its thickness direction Z. The second cover plate 12 is provided with a second through hole 122 coaxially distributed with the first through hole 112. The second through hole 122 penetrates the second cover plate 12 along its thickness direction Z. The fastener 3 passes through the first through hole 112 and the second through hole 122 and is locked inside the heat sink 6. The temperature detection component 2 is embedded in the detection device positioning cavity 102 between the first cover plate 11 and the second cover plate 12, and is in contact with the outer shell surface of the power semiconductor device 4. The signal lead 22 of the temperature detection component 2 is led out through the lead hole of the second cover plate 12.

[0050] In this way, the first cover plate 11 and the second cover plate 12 cooperate to position the temperature detection component 2, and the fastener 3 passes through the first cover plate 11 and the second cover plate 12 to fasten it. This can improve the installation accuracy of the temperature detection component 2, improve the installation firmness of the temperature detection component 2, and ensure the accuracy of the detection results of the temperature detection component 2.

[0051] In one embodiment, the first cover plate 11 is provided with a first latching portion 113, which is disposed on both sides of the first cover plate 11 along a first direction X. Correspondingly, the second cover plate 12 is provided with a second latching portion 123, which is disposed on both sides of the second cover plate 12 along the first direction X. The first latching portion 113 has a slot 124, and correspondingly, the second latching portion 123 has a latch head 114. The latch head 114 engages with the corresponding slot 124 to fix the first cover plate 11 and the second cover plate 12. The snap-fit ​​connection structure allows the first cover plate 11 and the second cover plate 12 to be connected relatively easily and quickly, thereby making the installation and maintenance of the temperature detection component 2 and the power semiconductor device 4 more convenient. Optionally, the first latching portions 113 on both sides are symmetrically arranged with respect to the central cross-section of the first cover plate 11. The symmetrical connection method can further improve the reliability of the connection between the first cover plate 11 and the second cover plate 12.

[0052] Furthermore, the specific positional relationship between the first cover plate 11 and the second cover plate 12 is not limited in this embodiment. Optionally, the orthographic projection of the first cover plate 11 onto the power semiconductor device 4 is at least partially located between the orthographic projections of the second cover plate 12 onto the power semiconductor device 4, to ensure the secure mounting of the power semiconductor device 4.

[0053] like Figure 4 As shown. In this embodiment, the cover plate assembly 1 includes a first cover plate 11 and a second cover plate 12. The first cover plate 11 and the second cover plate 12 can overlap or be partially offset in the orthographic projection of all the power semiconductor devices 4. The first cover plate 11 is correspondingly disposed with respect to the power semiconductor devices 4 and covers them. The second cover plate 12 can cover the first cover plate 11 to improve the installation firmness of the power semiconductor devices 4. The first cover plate 11 can completely accommodate all the power semiconductor devices 4, and the second cover plate 12 can be correspondingly disposed with respect to the first cover plate 11. Therefore, the first cover plate 11 and the second cover plate 12 can fix the power semiconductor devices 4 from one side, which helps to achieve reliable installation of the power semiconductor devices 4.

[0054] Both the first cover plate 11 and the second cover plate 12 can be made of insulating and heat-resistant engineering plastics, such as modified nylon. The second cover plate 12 encapsulates the pressure plate 13 assembly and is fixed to the PCB board 5, and is fixed to the first cover plate 11 by a snap-fit ​​connection. The temperature detection component 2 is integrated between the first cover plate 11 and the second cover plate 12.

[0055] like Figure 2 As shown, the cover plate assembly 1 also includes a pressure plate 13. The first cover plate 11 is provided with a pressure plate positioning cavity 115. The pressure plate 13 is at least partially embedded in the pressure plate positioning cavity 115. The pressure plate 13 is provided with a third through hole 131. The third through hole 131 is coaxially distributed with the first through hole 112 on the first cover plate 11 and the second through hole 122 on the second cover plate 12. The fastener 3 passes through the first cover plate 11, the pressure plate 13 and the second cover plate 12 in sequence along the third direction Z, and is locked and fixed with the heat sink 6.

[0056] Optionally, the pressure plate 13 is made of spring steel, such as 65 manganese steel, and presses the power semiconductor device 4 under the action of the fastener 3, and contacts the heat sink 6. The first cover plate 11 is used to encapsulate the pressure plate 13 and pre-fix it. Mounting holes are provided at both ends of the pressure plate 13, which is fixed to the heat sink 6 by screws to provide uniform pressure.

[0057] For example, in the embodiments of this application, the first direction X refers to Figure 1 The forward and backward directions and the second direction Y refer to Figure 1 In the left and right directions, the thickness direction Z refers to... Figure 1 The up and down directions in the middle.

[0058] Optionally, the pressure plate positioning cavity 115 can be a groove structure formed by the first cover plate 11 recessing into it, or it can be formed by the circumferential distribution of the baffles provided on the side of the first cover plate 11 away from the power semiconductor device 4. The size of the pressure plate positioning cavity 115 is determined according to the outer size of the power semiconductor device 4, and can be equal to or slightly larger than the outer size of the power semiconductor device 4 to ensure the positioning effect.

[0059] The pressure plate 13 is disposed in the pressure plate positioning cavity 115. In order to ensure that each power semiconductor device 4 can be pressed and fixed, the pressure plate positioning cavity 115 should at least partially cover the positioning cavities 101 of each power semiconductor device on the first cover plate 11. After the first cover plate 11 and the second cover plate 12 are engaged and locked with fasteners 3, the pressure plate 13 between the first cover plate 11 and the second cover plate 12 presses the second cover plate 12, thereby pressing and fixing the power semiconductor device 4 and the detection device.

[0060] like Figure 5 As shown. In order to further improve the positioning effect of the power semiconductor device 4, pressing members 116 can be provided on both sides of the first cover plate 11 along the second direction Y. Each pressing member 116 is provided with at least one pressing head 117. The pressing head 117 can press against the power semiconductor device 4 in the second direction Y, thereby limiting the power semiconductor device 4.

[0061] like Figure 3 As shown. Taking the first cover plate 11 and the second cover plate 12 as rectangular covers as an example, the structure of the pressing member 116 is explained. Four pressing members 116 can be provided, respectively located at the four corners of the first cover plate 11, and each pressing member 116 is provided with two pressing heads 117. The pressing heads 117 are located in the power semiconductor device positioning cavity 101 and protrude toward the power semiconductor device 4. The pressing heads 117 are used to fix the power semiconductor device 4 to achieve a multi-directional positioning structure, making the installation of the power semiconductor device 4 more secure.

[0062] like Figure 2 As shown. Specifically, the pressure plate 13 includes an arc-shaped portion in the middle and pressing portions on both sides of the arc-shaped portion. The arc-shaped portion is bent toward the side away from the power semiconductor device 4, and the pressing portions abut against the first cover plate 11 or simultaneously with the first cover plate 11 and the second cover plate 12. Under the action of the clamping force, the arc-shaped portion deforms, and then the pressing portions apply a clamping force to the lower cover, thereby fixing the power semiconductor device 4.

[0063] In this embodiment, the pressure plate 13 can be a spring pressure plate. The deformation of the spring pressure plate provides clamping force to the first cover plate 11. While pressing the power semiconductor device 4, the pressure plate 13 also presses the temperature sensing component 2 against the outer surface of the power semiconductor device 4, thereby enabling rapid and accurate sensing of temperature changes in the device. This design reduces contact thermal resistance, simplifies the number of additional fasteners 3, and achieves a secure pressing effect.

[0064] like Figure 6 As shown. To ensure the installation accuracy of the second cover plate 12, a positioning member 127 can be provided on the second cover plate 12. The positioning member 127 is located on the side of the second cover plate 12 opposite to the power semiconductor device 4. The positioning member 127 has a locking hole for placing the fastener 3. After the fastener 3 is locked, it is placed in the locking hole, which can prevent the locking member from being exposed outside the second cover plate 12. The outer peripheral surface of the positioning member 127 is provided with a locking buckle 128. Correspondingly, the PCB board 5 is provided with a positioning hole. The positioning member 127 on the second cover plate 12 passes through the positioning hole and is locked by the locking buckle 128, thereby fixing the second cover plate 12 to the PCB board 5.

[0065] The temperature detection component 2 in this embodiment may include a temperature sensor 21 and a signal lead 22. The temperature sensor 21 may be, but is not limited to, an NTC thermistor. The housing of the temperature sensor 21 is made of a metal material such as brass. The signal lead 22 is electrically connected to the temperature sensor 21 and passes through the second cover plate 12 along the thickness direction Z, and is led out from the second cover plate 12. The signal lead 22 is connected to the PCB board 5. The temperature sensor 21 is embedded between the first and second cover plates, and its metal tongue contacts the back housing of the power semiconductor device 4 and is directly attached to the surface of the power semiconductor device 4. The signal lead 22 is led out from the top through the second cover plate 12 and soldered to the PCB board 5.

[0066] Secondly, this application also provides an electronic power device, including the power semiconductor device 4 combined packaging device as described above.

[0067] It should be noted that the electronic power equipment provided in this application embodiment has the beneficial effects of the power semiconductor device 4 combined packaging device in any of the foregoing embodiments. For details, please refer to the foregoing description of the beneficial effects of the power semiconductor device 4 combined packaging device, which will not be repeated in this application embodiment.

[0068] The electronic power equipment provided in this application embodiment can realize real-time and accurate detection of the temperature of power semiconductor devices, thereby improving the reliability and stability of power electronic equipment.

[0069] The power semiconductor device packaging apparatus and electronic power equipment provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the methods and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A power semiconductor device assembly and packaging device, characterized in that, include: A cover plate assembly (1) is formed to enclose a power semiconductor device positioning cavity (101) and a detection device positioning cavity (102). The power semiconductor device positioning cavity (101) is used to accommodate and position a power semiconductor device (4). The detection device positioning cavity (102) is disposed on one side of the power semiconductor device positioning cavity (101). The detection device positioning cavity (102) is used to accommodate and position a temperature detection component (2). Temperature detection component (2), the temperature detection component (2) is at least partially embedded in the positioning cavity (102) of the detection device, and the detection end of the temperature detection component (2) is electrically connected to the power semiconductor device (4). Fastener (3) is used to provide a fastening force to the temperature sensing component (2) so that the sensing end of the temperature sensing component (2) is attached to the power semiconductor device (4).

2. The power semiconductor device combined package apparatus according to claim 1, characterized by, The cover plate assembly (1) includes a first cover plate (11) and a second cover plate (12) disposed on the side of the first cover plate (11) opposite to the power semiconductor device (4); wherein, The first cover plate (11) is provided with the power semiconductor device positioning cavity (101) and the first detection device positioning part (111) on the side facing the power semiconductor device (4), and the first cover plate (11) is provided with a first through hole (112) along the thickness direction. The second cover plate (12) is provided with a second detection device positioning part (121), the first detection device positioning part (111) and the second detection device positioning part (121) form the detection device positioning cavity (102), and the second cover plate (12) is provided with a second through hole (122) coaxially distributed with the first through hole (112).

3. The power semiconductor device combined package apparatus according to claim 2, characterized by, The first cover plate (11) is provided with a first latching part (113) on both sides along the first direction, and the second cover plate (12) is provided with a second latching part (123) on both sides along the first direction. The second latching part (123) is provided with a latch (124) and a latch head (114). The latch head (114) engages with the latch (124).

4. The power semiconductor device combined package apparatus according to claim 2 or 3, characterized by The first cover plate (11) is at least partially located in the orthographic projection of the power semiconductor device (4) between the orthographic projections of the second cover plate (12) and the power semiconductor device (4).

5. The power semiconductor device combined package apparatus according to claim 2 or 3, characterized by The first cover plate (11) has pressing members (116) on both sides along the second direction. The pressing members (116) are provided with at least one pressing head (117). The pressing head (117) is used to press the power semiconductor device (4) in the second direction to limit the power semiconductor device (4).

6. The power semiconductor device combined package apparatus according to claim 2, wherein The cover plate assembly (1) further includes a pressure plate (13). The first cover plate (11) has a pressure plate positioning cavity (115) on the side opposite to the power semiconductor device (4). The pressure plate (13) is at least partially embedded in the pressure plate positioning cavity (115). The pressure plate (13) has a third through hole (131) coaxially connected to the first through hole (112) and the second through hole (122).

7. The power semiconductor device combined package apparatus according to claim 5, wherein There are four pressing members (116), which are distributed at the corners of the second cover plate (12).

8. The power semiconductor device combined package apparatus according to claim 7, characterized by The second cover plate (12) is provided with a positioning member (127) on the side opposite to the power semiconductor device (4). The positioning member (127) is provided with a locking hole for placing the fastener (3), and the outer peripheral surface of the positioning member (127) is provided with a locking buckle (128).

9. The power semiconductor device combined package apparatus according to claim 2, wherein The temperature detection component (2) includes a temperature sensor (21) and a signal lead (22) electrically connected to the temperature sensor (21). The signal lead (22) passes through the temperature sensor (21) along the thickness direction and is connected to the PCB board (5).

10. An electronic power device, characterized by Includes the power semiconductor device combination packaging apparatus as described in any one of claims 1 to 9 above.

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