Power module and power converter

Abstract

The utility model relates to the technical field of power converters, in particular to a power module and a power converter. The utility model aims to solve the problem that miniaturization and integration of a power module are difficult to realize due to the fact that a shielding piece of the power module is relatively large in size. The utility model provides a power module which comprises a substrate, a chip and a plurality of first pins, the chip is arranged on the substrate, the first ends of the first pins are arranged on the substrate, and the first pins are coupled with the chip through the substrate. The power module further comprises a shielding piece, the shielding piece is arranged on the substrate, a shielding space is defined by the shielding piece and the substrate, the chip is located in the shielding space, electromagnetic interference generated by the chip can be shielded, and electromagnetic shielding is achieved. The first end of the first pin is exposed relative to the shielding member, so that the shielding effect of the shielding member can be ensured, the size of the shielding member can be reduced, miniaturization and integration of the power module can be realized, and self-shielding of the power module can be realized.

Description

Technical Field

[0001] This application relates to the field of power converter technology, specifically to a power module and a power converter. Background Technology

[0002] A power converter includes a circuit board and a power module, with the power module mounted on the circuit board. The power module consists of a chip and a substrate, with the chip mounted on the substrate. Due to the small size of the power module and the small distance between the chips, electromagnetic interference (EMI) is relatively high, affecting the normal operation of the chips. Therefore, a shielding cover is usually placed on the outside of the power module. However, the shielding cover is complex to manufacture and has a large size, which cannot meet the requirements for miniaturization and integration of the power module. Utility Model Content

[0003] This application provides a power module and power converter that can reduce the size of the shielding component and achieve miniaturization and integration of the power module.

[0004] In a first aspect, embodiments of this application provide a power module, including a substrate, a chip, and a plurality of first pins. The chip is disposed on the substrate, and the first end of the first pin is disposed on the substrate, and the first pin is coupled to the chip through the substrate. The power module also includes a shielding member disposed on the substrate and forming a shielding space with the substrate. The chip is located within the shielding space, and the first end of the first pin is exposed in the shielding space relative to the shielding member.

[0005] The power module provided in this application includes a shielding component disposed on a substrate, which together with the substrate encloses a shielding space. The chip is located within the shielding space, which can shield the electromagnetic interference generated by the chip, thereby achieving electromagnetic shielding. The first end of the first pin is exposed relative to the shielding component in the shielding space, which can reduce the size of the shielding component while ensuring its shielding effect, thereby achieving miniaturization and integration of the power module, and thus realizing self-shielding of the power module.

[0006] In some embodiments that may include the above embodiments, the orthographic projection of the shielding member on the substrate is located within the edge of the substrate in the thickness direction of the substrate.

[0007] The orthographic projection of the shielding component onto the substrate is located within the edge of the substrate. In other words, the area of ​​the shielding component is smaller than the area of ​​the substrate in the thickness direction. This allows for the reduction of the shielding component's area while ensuring its shielding effect, thereby enabling the miniaturization and integration of the power module.

[0008] In some embodiments that may include the above embodiments, the substrate includes an insulating layer and a conductive layer, the conductive layer being located between the shielding member and the insulating layer, the conductive layer including a first sub-part and a second sub-part disposed at intervals from each other, a first end of at least one first pin being disposed on the first sub-part, and the second sub-part being connected to the shielding member.

[0009] The first end of the first pin is located in the first sub-section, enabling electrical connection between the chip and electronic devices. The second sub-section is connected to the shielding component, allowing the shielding component to be fixed to the substrate, thus forming a shielding space. The first and second sub-sections are spaced apart, ensuring mutual insulation between them, thereby guaranteeing insulation between the shielding component and the internal circuitry of the power module, and preventing interference between the shielding component and the internal circuitry.

[0010] In some embodiments that may include the above embodiments, the conductive layer has a groove surrounding the second sub-part, and the first and second sub-parts are spaced apart from each other by the groove.

[0011] The conductive layer has grooves, meaning that the conductive layer in the grooved portion is removed, exposing the insulating layer, so that the first sub-part and the second sub-part cannot be electrically connected through the conductive layer, thereby ensuring insulation between the first sub-part and the second sub-part.

[0012] In some embodiments that may include the above embodiments, the power module further includes a second pin, the first end of which is disposed in the second sub-part and exposed relative to the shielding member, and the second end of which is used for grounding.

[0013] The second pin can lead out the current on the shielding component, preventing interference with the chip within the shielding space. Simultaneously, the first end of the second pin is located in the second sub-section, which is insulated from the first sub-section, thus isolating the second pin from the chip and ensuring that the shielding component and the chip do not interfere with each other.

[0014] In some embodiments that may include the above embodiments, the chip is disposed in the first sub-part.

[0015] The chip is located in the first sub-section and can be electrically connected to electronic devices on the circuit board through the first pin. The first and second sub-sections are spaced apart to ensure that the chip and the shielding do not interfere with each other.

[0016] In some embodiments that may include the above embodiments, the conductive layer further includes a third sub-part, which is disposed at a distance from the first sub-part and the second sub-part, and a first end of at least one first pin is disposed on the third sub-part. The power module further includes bonding wires, through which the chip is connected to the third sub-part.

[0017] Since the third sub-section is not directly connected to the chip, the circuitry on the third sub-section needs to connect to the chip to realize the corresponding functions of the power module. Therefore, bonding wires can be used to connect the third sub-section to the chip, establishing an electrical loop between the chip and the circuitry on the third sub-section. Simultaneously, the third sub-section and the first sub-section are spaced apart, allowing the internal circuitry of the power module to be divided into regions, making the circuit layout clearer and facilitating maintenance and troubleshooting. The third sub-section and the second sub-section are also spaced apart, ensuring that the shielding and internal circuitry do not interfere with each other, preventing current on the shielding from affecting the internal circuitry.

[0018] In some embodiments that may include the above embodiments, the number of second sub-parts is multiple, wherein multiple second sub-parts are arranged in a first column along the length direction of the substrate, multiple second sub-parts are arranged in a second column along the length direction of the substrate, and multiple second sub-parts in the first column and multiple second sub-parts in the second column are arranged in a one-to-one correspondence along the width direction of the substrate.

[0019] Along the width direction of the substrate, multiple second sub-parts in the first column and multiple second sub-parts in the second column are arranged in a one-to-one correspondence. In other words, the symmetrical arrangement of the second sub-parts can make the connection between the shielding component and the substrate more stable and improve the stability of the shielding component. At the same time, the symmetrical arrangement of the second sub-parts can make the force on the shielding component more uniform during welding.

[0020] In some embodiments that may include the above embodiments, the power module further includes a package that encloses a shield and encloses at least a portion of the substrate and at least a portion of the first pin.

[0021] The package encapsulates the substrate, protecting the internal circuitry of the power module and the chip from dust and mechanical damage, thus extending the chip's lifespan. Encapsulating at least a portion of the first pin ensures that the connection between the first pin and the circuit board remains unaffected, while also improving the stability of the connection between the first pin and the substrate, and increasing the strength of the first pin.

[0022] In some embodiments that may include the above embodiments, the package includes an interconnected package body and a filling protrusion, the package body encapsulating at least a portion of the shield, the substrate, and at least a portion of the first pin, and the filling protrusion being located within a gap between the shield and the substrate.

[0023] The filler protrusions are located in the gap between the shield and the substrate. The filler protrusions can add a protective layer to the circuit surface within the shielding space, enhance the strength of the circuit, and extend the service life of the circuit. At the same time, the filler protrusions can also support the shield and improve the stability of the shield.

[0024] The package body encapsulates the substrate, protecting the circuitry on the substrate and the chip from dust and mechanical damage, thus extending the chip's lifespan. Encapsulating at least a portion of the first pin ensures that the connection between the first pin and the circuit board remains unaffected, while also improving the stability of the connection between the first pin and the substrate, and increasing the strength of the first pin.

[0025] In some embodiments that may include the above embodiments, the shielding component includes a top plate and a side plate, the side plate being disposed around the top plate and connected to the substrate; the top plate and the side plate are an integral structure.

[0026] The side plates surround the top plate and are connected to the substrate, allowing the shielding component to be connected to the substrate. The top plate and side plates are an integral structure, which reduces the processing difficulty of the shielding component and simplifies the processing steps.

[0027] In some embodiments that may include the above embodiments, there is a gap between the side plate and the substrate.

[0028] There is a gap between the side plate and the substrate to ensure that the shielding component and the chip do not interfere with each other, thus ensuring the normal operation of the chip.

[0029] Secondly, embodiments of this application provide a power converter, including a circuit board and the aforementioned power module, wherein the power module is disposed on the circuit board.

[0030] The power converter provided in this application includes the power module in any of the above embodiments, so both can solve the same technical problem and achieve the same technical effect. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0032] Figure 2 This is a schematic diagram of the power module provided in the embodiments of this application;

[0033] Figure 3 for Figure 2 Sectional view along axis AA;

[0034] Figure 4 Schematic diagram of the structure of the power module with shielding removed provided in the embodiments of this application. Figure 1 ;

[0035] Figure 5 Schematic diagram of the structure of the power module with shielding removed provided in the embodiments of this application. Figure 2 ;

[0036] Figure 6 for Figure 2 BB-direction sectional view.

[0037] Explanation of reference numerals in the attached figures:

[0038] 10: Power converter; 11: Power module; 12: Circuit board; 13: Electronic device; 20: Substrate; 21: Chip; 22: First pin; 221: First end of the first pin; 222: Second end of the first pin; 23: Shielding component; 231: Top plate; 232: Side plate; 233: Third pin; 24: Second pin; 241: First end of the second pin; 242: Second end of the second pin; 25: Package; 251: Package body; 252: Filler protrusion; 26: Shielding space; 27: Bonding wire; 28: Gap; 31: Insulating layer; 32: Conductive layer; 33: Groove; 41: First sub-section; 42: Second sub-section; 43: Third sub-section. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0040] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0041] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0042] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. The term "coupled" should also be interpreted broadly. For example, "coupled" can be a direct connection or an indirect connection through an intermediate medium; coupling can be the transfer of energy and the exchange of signals between circuits.

[0043] Please refer to Figure 1This application provides an electronic device 1, which includes a power converter 10 and a housing 2. The power converter 10 is disposed within the space enclosed by the housing 2. The power converter 10 is used to convert electrical signals of the electronic device 1. This application does not limit the electronic device 1. Exemplary examples include, but are not limited to, wind turbines, photovoltaic generators, electric vehicles, white goods, and other electronic devices 1 equipped with power converters 10.

[0044] Continue to refer to Figure 1 The power converter 10 provided in this embodiment includes a circuit board 12 and a power module 11, with the power module 11 disposed on the circuit board 12. This embodiment does not limit the power converter 10; for example, the power converter 10 can be an inverter, rectifier, etc. The power module 11 can realize power transmission and conversion. Electronic devices 13 are also disposed on the circuit board 12, and the power module 11 and the electronic devices 13 can be connected on the circuit board 12. This embodiment does not limit the electronic devices 13; for example, the electronic devices 13 can be resistors, inductors, capacitors, etc.

[0045] Please refer to Figure 2 and Figure 3 The power module 11 provided in this application embodiment includes a substrate 20, a chip 21, and a plurality of first pins 22. The chip 21 is disposed on the substrate 20, the first end 221 of the first pin is disposed on the substrate 20, and the first pin 22 is coupled to the chip 21 through the substrate 20.

[0046] This application does not limit the substrate 20. For example, the substrate 20 can be a copper-clad ceramic substrate (DirectBonding Copper, DBC), a copper-plated ceramic substrate (Direct Plate Copper, DPC), etc. DBC has good thermal conductivity and can dissipate the heat generated by the chip 21 to the outside as soon as possible, further improving the heat dissipation function.

[0047] The embodiments of this application do not limit the number of substrates 20. For example, there may be one substrate 20 or multiple substrates 20. In an embodiment where there is only one substrate 20, since heat is typically transferred from the chip 21 to the substrate 20 and then from the substrate 20 to the heat sink, the heat transfer distance is shorter when the substrate 20 is a single layer, allowing for faster heat transfer to the outside environment and improving the heat dissipation rate of the power module 11. In embodiments where there are multiple substrates 20, the more substrates 20 there are, the larger the area of ​​the substrates 20, resulting in more wiring space.

[0048] It is understood that the first end 221 of the first pin is coupled to the chip 21 through the substrate 20, and the second end 222 of the first pin can be connected to the circuit board 12 to realize the electrical connection between the chip 21 and the electronic device 13 on the circuit board 12, forming an electrical circuit.

[0049] The power module 11 also includes a shield 23, which is disposed on the substrate 20 and forms a shielding space 26 with the substrate 20. The chip 21 is located within the shielding space 26, and the first end 221 of the first pin is exposed relative to the shield 23. This application embodiment does not limit the shield 23. For example, the shield 23 can be a metal device with a similar shape, such as a clip, which can simplify the manufacturing process of the shield 23.

[0050] Chip 21 is located within the shielding space 26 formed by shielding member 23 and substrate 20. Shielding member 23 can block the electromagnetic interference (EMI) generated by chip 21 from propagating outward and can also protect chip 21 from external electromagnetic interference, ensuring the normal operation of chip 21, thereby ensuring the normal operation of power converter 10. Figure 1 (As shown) is working normally.

[0051] The first end 221 of the first pin is exposed in the shielding space 26 relative to the shielding component 23. This can reduce the size of the shielding component 23 while ensuring the shielding effect of the shielding component 23, thereby realizing the miniaturization and integration of the power module 11 and achieving self-shielding of the power module 11.

[0052] Here, self-shielding means that the power module 11 can achieve electrical shielding, reducing electrical interference from the inside to the outside and from the outside to the inside. At the same time, the power module 11 can achieve shielding function inside the power module 11, without the need to build a shielding cover outside the power module 11, which can achieve integration and miniaturization.

[0053] The material of the shielding component 23 is metal. This application embodiment does not limit the specific material of the shielding component 23. For example, the material of the shielding component 23 can be copper, aluminum, etc.

[0054] The power module 11 provided in this embodiment includes a shielding member 23, which is disposed on a substrate 20 and forms a shielding space 26 with the substrate 20. The chip 21 is located within the shielding space 26, which can shield the electromagnetic interference generated by the chip 21, thereby achieving electromagnetic shielding. The first end 221 of the first pin is exposed relative to the shielding member 23 in the shielding space 26. This can reduce the size of the shielding member 23 while ensuring its shielding effect, thereby achieving miniaturization and integration of the power module 11, and thus realizing self-shielding of the power module 11.

[0055] Continue to refer to Figure 2 In the above embodiment, in the thickness direction (z direction) of the substrate 20, the orthogonal projection of the shield 23 on the substrate 20 is located inside the edge of the substrate 20.

[0056] The orthographic projection of the shielding member 23 on the substrate 20 is located inside the edge of the substrate 20. That is to say, in the thickness direction of the substrate 20, the area of ​​the shielding member 23 is smaller than the area of ​​the substrate 20. While ensuring the shielding effect of the shielding member 23, the area of ​​the shielding member 23 can be reduced, thereby realizing the miniaturization and integration of the power module 11.

[0057] Please refer to Figure 3 and Figure 4 In the above embodiment, the substrate 20 includes an insulating layer 31 and a conductive layer 32. The conductive layer 32 is located between the shield 23 and the insulating layer 31. The conductive layer 32 includes a first sub-part 41 and a second sub-part 42 that are spaced apart from each other. The first end 221 of at least one first pin is disposed on the first sub-part 41, and the second sub-part 42 is connected to the shield 23.

[0058] At least one first pin has a first end 221 disposed on the first sub-part 41, meaning that the first sub-part 41 can be used to realize the electrical connection between the chip 21 and the electronic device 13. The second sub-part 42 is connected to the shield 23, which can fix the shield 23 to the substrate 20, so that the shield 23 is connected to the substrate 20 and forms a shielding space 26. The first sub-part 41 and the second sub-part 42 are spaced apart, which can make the first sub-part 41 and the second sub-part 42 insulated from each other, thereby ensuring that the shield 23 is insulated from the internal circuit of the power module 11, and ensuring that the shield 23 and the internal circuit do not interfere with each other.

[0059] In addition, the second sub-part 42 and the first sub-part 41 are both part of the conductive layer 32. The shielding component 23 can be reflow soldered together with the chip 21 by surface mounting, thereby simplifying the fixing process of the shielding component 23.

[0060] In the embodiment where the substrate 20 is DBC, the insulating layer 31 is a ceramic layer and the conductive layer 32 is a copper layer.

[0061] Continue to refer to Figure 2 In the above embodiment, the shielding member 23 includes a plurality of third pins 233, which are disposed on the second sub-part 42. The shielding member 23 is connected to the substrate 20 through the third pins 233, which can reduce the contact area between the shielding member 23 and the substrate 20 while ensuring the shielding effect of the shielding member 23, thus ensuring the wiring area on the substrate 20 and facilitating the miniaturization and integration of the power module 11.

[0062] Continue to refer to Figure 4In the above embodiment, the conductive layer 32 has a groove 33, which is disposed around the second sub-part 42, and the first sub-part 41 and the second sub-part 42 are disposed at intervals from each other through the groove 33.

[0063] The conductive layer 32 has a groove 33, that is, the conductive layer 32 in the groove 33 portion is removed, exposing the insulating layer 31, so that the first sub-part 41 and the second sub-part 42 cannot be electrically connected through the conductive layer 32, thereby ensuring insulation between the first sub-part 41 and the second sub-part 42.

[0064] In the above embodiment, the power module 11 further includes a second pin 24. The first end 241 of the second pin is disposed on the second sub-part 42, and the first end 241 of the second pin is exposed relative to the shield 23. The second end 242 of the second pin is used for grounding. Specifically, the second pin 24 can be connected to the circuit board 12 ( Figure 1 The ground wire connection is shown.

[0065] Compared to the shield 23 being connected to the ground wire via a wire, in this embodiment the shield 23 is connected to the ground wire on the circuit board 12 via the second pin 24, which can avoid cumbersome grounding steps, reduce process flow, and increase feasibility.

[0066] The area of ​​the second sub-part 42 is smaller than that of the first sub-part 41. This ensures the connection between the substrate 20 and the shield 23 while reducing the impact of the second sub-part 42 on the circuit layout on the substrate 20, thus maximizing the wiring area on the substrate 20 and ensuring that the power module 11 can work normally.

[0067] Understandably, when shielding against electromagnetic interference, the shield 23 will generate a current under the influence of electromagnetic induction. The second pin 24 can draw out the current from the shield 23 to avoid interfering with the chip 21 within the shielding space 26. At the same time, the first end 241 of the second pin is located on the second sub-part 42, which is insulated from the first sub-part 41, thus insulating the second pin 24 from the chip 21 and ensuring that the shield 23 and the chip 21 do not interfere with each other.

[0068] Continue to refer to Figure 4 In some embodiments, chip 21 is disposed on the first sub-part 41.

[0069] Chip 21 is located in the first sub-section 41 and can be electrically connected to electronic device 13 on circuit board 12 through the first pin 22. The first sub-section 41 and the second sub-section 42 are arranged alternately to ensure that chip 21 and shield 23 do not interfere with each other.

[0070] In the above embodiment, the area of ​​the first sub-part 41 is larger than the area of ​​the second sub-part 42. The larger area of ​​the first sub-part 41 can ensure that the wiring area on the substrate 20 is larger, avoid the shielding member 23 from affecting the circuit layout on the substrate 20, and facilitate the miniaturization of the power module 11.

[0071] Please refer to Figure 5 In some embodiments, the conductive layer 32 further includes a third sub-section 43, which is spaced apart from the first sub-section 41 and the second sub-section 42, respectively, and the first end 221 of at least one first pin is disposed on the third sub-section 43. The power module 11 also includes a bonding wire 27, through which the chip 21 is connected to the third sub-section 43.

[0072] Both the first sub-section 41 and the third sub-section 43 are provided with circuits. The third sub-section 43 is spaced apart from the first sub-section 41, which can achieve electrical isolation between circuits in different areas. Circuits in different areas may require different voltages or signals, and dividing the conductive layer 32 can reduce interference. Since the first pin 22 is connected to the third sub-section 43, the chip 21 is connected to the third sub-section 43 through the bonding wire 27, which can realize the connection between the chip 21 and the first pin 22, thereby realizing the connection between the chip 21 and the electronic device 13. Figure 1 The connection between (as shown).

[0073] Understandably, the area of ​​the first sub-section 41 is larger than the area of ​​the third sub-section 43. Chip 21 generates a significant amount of heat during operation, and the large conductive layer 32 serves as a heat dissipation path, quickly transferring heat to the surrounding area and preventing overheating of chip 21 that could lead to performance degradation or damage. Furthermore, the smaller area of ​​the third sub-section 43 compared to the first sub-section 41 ensures that the circuitry is arranged as close as possible to the chip 21, reducing trace length, saving space, and lowering costs.

[0074] The area of ​​the third sub-part 43 is larger than that of the second sub-part 42, which can ensure that the wiring area on the substrate 20 is larger, avoid the second sub-part 42 from affecting the circuit layout on the substrate 20, and ensure the normal operation of the power module 11.

[0075] Since the third sub-section 43 is not directly connected to the chip 21, the circuitry on the third sub-section 43 needs to be connected to the chip 21 to realize the functions corresponding to the power module 11. Therefore, the third sub-section 43 can be connected to the chip 21 through the bonding wire 27, establishing an electrical loop between the chip 21 and the circuitry on the third sub-section 43. Simultaneously, the third sub-section 43 and the first sub-section 41 are spaced apart, allowing the internal circuitry of the power module 11 to be divided into regions, making the circuit layout clearer and facilitating maintenance and troubleshooting. The third sub-section 43 and the second sub-section 42 are spaced apart, ensuring that the shielding component 23 does not interfere with the internal circuitry, preventing the current on the shielding component 23 from affecting the internal circuitry.

[0076] In the above embodiment, the groove 33 can be disposed between the third sub-part 43 and the first sub-part 41 to achieve insulation between the third sub-part 43 and the first sub-part 41.

[0077] Continue to refer to Figure 2 and Figure 3 In some embodiments, there is one second sub-part 42, and the shield 23 is connected to the second sub-part 42 so that the shield 23 can be connected to the substrate 20 and form a shielding space 26.

[0078] Continue to refer to Figure 2 and Figure 5 In some embodiments, there are multiple second sub-parts 42, wherein multiple second sub-parts 42 are arranged in a first column along the length direction (y direction) of the substrate 20, and multiple second sub-parts 42 are arranged in a second column along the length direction of the substrate 20. Along the width direction of the substrate 20, multiple second sub-parts 42 in the first column and multiple second sub-parts 42 in the second column are arranged in a one-to-one correspondence.

[0079] Along the width direction (x direction) of the substrate 20, the plurality of second sub-parts 42 in the first column and the plurality of second sub-parts 42 in the second column are arranged in a one-to-one correspondence. That is to say, the symmetrical arrangement of the second sub-parts 42 can make the connection between the shield 23 and the substrate 20 more stable and improve the stability of the shield 23. At the same time, the symmetrical arrangement of the second sub-parts 42 can make the force on the shield 23 more uniform during welding.

[0080] Meanwhile, having multiple second sub-parts 42 can reduce the connection area between the shield 23 and the substrate 20, increase the circuit area on the substrate 20, and improve the utilization rate of the substrate 20.

[0081] Continue to refer to Figure 2 and Figure 3 In the above embodiments, the power module 11 further includes a package 25, which encapsulates the shield 23 and at least a portion of the substrate 20 and at least a portion of the first pin 22. The structure including the package 25, the substrate 20, and the chip 21 can be referred to as a package structure.

[0082] The package 25 encapsulates the substrate 20, protecting the internal circuitry of the power module 11, protecting the chip 21 from dust and mechanical damage, and extending the lifespan of the chip 21. The package 25 encapsulates at least a portion of the first pin 22, ensuring that the connection between the first pin 22 and the circuit board 12 is not affected. At the same time, it improves the stability of the connection between the first pin 22 and the substrate 20 and increases the strength of the first pin 22.

[0083] In addition, the package 25 can fill the groove 33 to further improve the stability of the substrate 20.

[0084] Please refer to Figure 6 In the above embodiments, the package 25 includes an interconnected package body 251 and a filling protrusion 252. The package body 251 encloses at least a portion of the shield 23, the substrate 20, and at least a portion of the first pin 22. The filling protrusion 252 is located in the gap 28 between the shield 23 and the substrate 20.

[0085] It is understood that when forming the package 25, the substrate 20 with the chip 21 and shield 23 set is usually placed in a sealed box, and glue is injected into the sealed box. After the glue solidifies, the sealed box is removed. This application embodiment does not limit the type of glue. For example, the glue can be epoxy glue, polyurethane glue, UV-curable glue, etc.

[0086] Since the shielding member 23 is connected to the substrate 20 via the second sub-part 42, there is a portion on the shielding member 23 that does not contact the substrate 20. Therefore, there is a gap 28 between the shielding member 23 and the substrate 20. The filling protrusion 252 is located within the gap 28 between the shielding member 23 and the substrate 20. The filling protrusion 252 can support the shielding member 23 and improve its stability.

[0087] In addition, the shield 23 is located inside the package 25, which can improve the anti-interference capability of the power module 11, thereby improving the reliability of the power module 11.

[0088] In some embodiments, the filling protrusion 252 can also enter the shielding space 26 through the gap 28, filling the shielding space 26, thereby adding a protective layer to the circuit surface within the shielding space 26, enhancing the strength of the circuit, and extending the service life of the circuit.

[0089] The package body 251 encapsulates the substrate 20, protecting the circuitry on the substrate 20 and the chip 21 from dust and mechanical damage, thus extending the lifespan of the chip 21. The package body 251 encapsulates at least a portion of the first pin 22, ensuring that the connection between the first pin 22 and the circuit board 12 is not affected. At the same time, it improves the stability of the connection between the first pin 22 and the substrate 20 and increases the strength of the first pin 22.

[0090] Continue to refer to Figure 2 In the above embodiments, the shielding member 23 includes a top plate 231 and a side plate 232. The side plate 232 is arranged around the top plate 231 and is connected to the substrate 20. The top plate 231 and the side plate 232 are an integral structure.

[0091] The side plate 232 is arranged around the top plate 231 and is connected to the substrate 20, which allows the shielding component 23 to be connected to the substrate 20. The top plate 231 and the side plate 232 are an integral structure, which can reduce the processing difficulty of the shielding component 23 and simplify the processing steps of the shielding component 23.

[0092] Continue to refer to Figure 2 and Figure 3 In some embodiments, there is no gap 28 between the side plate 232 and the substrate 20. In embodiments where there is only one second sub-part 42, the side plate 232 is connected to the second sub-part 42, and a sealed shielding space 26 is formed between the shield 23 and the substrate 20, which can improve the shielding effect of the shield 23. The package 25 encapsulates at least a portion of the shield 23, the substrate 20, and at least a portion of the first pin 22, and the package 25 cannot enter the shielding space 26.

[0093] Continue to refer to Figure 2 and Figure 6 In some embodiments, a gap 28 is provided between the side plate 232 and the substrate 20.

[0094] In embodiments where there are multiple second sub-parts 42, side plates 232 can be connected to the second sub-parts 42. The number and position of the side plates 232 correspond one-to-one with the number and position of the second sub-parts 42. This application embodiment does not limit the number and position of the side plates 232. For example, the more side plates 232 there are, the more stable the connection between the shielding member 23 and the substrate 20; the more symmetrical the positions of the side plates 232, the higher the stability of the shielding member 23. The encapsulation member 25 can fill the gap 28, and the encapsulation member 25 can also enter the shielding space 26 from the gap 28 and fill the shielding space 26.

[0095] It is understood that the side plate 232 and the substrate 20 can be connected through the second sub-part 42. Except for the part corresponding to the second sub-part 42, the side plate 232 does not contact the substrate 20 to avoid contact between the shielding member 23 and the substrate 20, which would interfere with the normal operation of the chip 21. There is a gap 28 between the side plate 232 and the substrate 20, which can ensure that the shielding member 23 and the chip 21 do not interfere with each other, thus ensuring the normal operation of the chip 21.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A power module, characterized by include: substrate; The chip is disposed on the substrate; Multiple first pins, with a first end of each first pin disposed on the substrate, and the first pin being coupled to the chip via the substrate; A shielding component is disposed on the substrate and forms a shielding space with the substrate. The chip is located within the shielding space, and the first end of the first pin is exposed in the shielding space relative to the shielding component.

2. The power module of claim 1, wherein, In the thickness direction of the substrate, the orthographic projection of the shielding member on the substrate is located inside the edge of the substrate.

3. The power module of claim 1 or 2, wherein, The substrate includes an insulating layer and a conductive layer. The conductive layer is located between the shield and the insulating layer. The conductive layer includes a first sub-part and a second sub-part that are spaced apart from each other. At least one first end of the first pin is disposed on the first sub-part, and the second sub-part is connected to the shield.

4. The power module of claim 3, wherein, The conductive layer has a groove that surrounds the second sub-part, and the first sub-part and the second sub-part are spaced apart from each other by the groove.

5. The power module of claim 3, wherein, The power module further includes a second pin, the first end of which is disposed in the second sub-part and exposed relative to the shielding member, and the second end of which is used for grounding.

6. The power module of claim 3, wherein, The chip is disposed in the first sub-section.

7. The power module of claim 6, wherein, The conductive layer further includes a third sub-part, which is disposed at intervals from the first sub-part and the second sub-part, and at least one first end of the first pin is disposed on the third sub-part; The power module also includes bonding wires, and the chip is connected to the third sub-unit via the bonding wires.

8. The power module of claim 3, wherein, The number of second sub-parts is multiple, wherein multiple second sub-parts are arranged in a first column along the length direction of the substrate, multiple second sub-parts are arranged in a second column along the length direction of the substrate, and multiple second sub-parts in the first column and multiple second sub-parts in the second column are arranged in a one-to-one correspondence along the width direction of the substrate.

9. The power module of claim 3, wherein, The shielding component includes a plurality of third pins, which are disposed in the second sub-part.

10. The power module of claim 1, wherein, The power module further includes a package that encloses the shield and at least a portion of the substrate and at least a portion of the first pin.

11. The power module of claim 10, wherein, The package includes an interconnected package body and a filler protrusion, the package body enclosing at least a portion of the shield, the substrate, and at least a portion of the first pin, and the filler protrusion being located within a gap between the shield and the substrate.

12. The power module of claim 1, wherein, The shielding component includes a top plate and a side plate, the side plate being disposed around the top plate and connected to the substrate; the top plate and the side plate are an integral structure.

13. The power module of claim 12, wherein, There is a gap between the side plate and the substrate.

14. A power converter characterized by, It includes a circuit board and the power module according to any one of claims 1-13, wherein the power module is disposed on the circuit board.

Images