Bonding device capable of conveniently taking down mold

Abstract

The utility model discloses a bonding device capable of conveniently taking down a die, which relates to the technical field of hard alloy and comprises a bonding device bottom frame and a pressing mechanism, the pressing mechanism is positioned on the front side of the bonding device bottom frame, and a flexible paper placing frame is clamped on the inner side of the bonding device bottom frame. A flexible paper placing frame is arranged on the upper side of the bonding device bottom frame, bonding flexible paper is arranged in an inner cavity of the flexible paper placing frame, a driving lifting mechanism is arranged on the rear side of the bonding device bottom frame, a positioning mold mechanism is arranged above the bonding device bottom frame, a hard alloy limiting mechanism is arranged at the top of the positioning mold mechanism, and the driving lifting mechanism comprises an extension plate. Through mutual cooperation of the driving lifting mechanism, the mold positioning mechanism and the hard alloy limiting mechanism, a round hard alloy can be stably separated from a mold, the mold is prevented from being adhered to flexible paper, and meanwhile, the hard alloy can be conveniently and rapidly positioned by means of back-and-forth swinging of a brush.

Description

Technical Field

[0001] This utility model relates to the field of cemented carbide technology, specifically to an adhesive device that facilitates the removal of molds. Background Technology

[0002] The production process of cemented carbide (in cylindrical shape) requires the following processing steps: polishing to smooth the surface; bonding: the cemented carbide is bonded to a flexible, adhesive paper (mostly plastic paper) in a specific pattern (such as a rectangular array). This process requires a mold, which is the same shape as the flexible paper but slightly smaller. The mold has pre-drilled holes that match the size of the cemented carbide. By inserting the cemented carbide into these holes and bonding it to the flexible paper, the cemented carbide is secured. Finally, it is packaged and transported. The existing technology has the following problems:

[0003] Because the mold cannot avoid sticking to the flexible paper during the bonding process of the existing technology, and the hard alloy is manually pulled in when it is pushed into the preset hole, which is time-consuming and inconvenient, the process needs to be optimized. At the same time, because the hard alloy is stuck to the flexible paper in the existing technology, the hard alloy is easy to fall off during the handling and packaging process due to the bending of the flexible paper. Utility Model Content

[0004] This invention provides an adhesive device that facilitates the removal of molds, thereby solving the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] An adhesive bonding device for easy mold removal includes an adhesive bonding device base frame and a clamping mechanism. The clamping mechanism is located on the front side of the adhesive bonding device base frame. A flexible paper placement frame is snapped into the inner side of the adhesive bonding device base frame. The inner cavity of the flexible paper placement frame is filled with adhesive flexible paper. A driving lifting mechanism is located on the rear side of the adhesive bonding device base frame. A positioning mold mechanism is located above the adhesive bonding device base frame. A hard alloy limiting mechanism is located on the top of the positioning mold mechanism. The driving lifting mechanism includes an extension plate. The extension plate is fixedly installed on the rear side of the adhesive bonding device base frame. Two lifting threaded rods are movably installed on the top of the extension plate. A lifting plate one is threaded onto the outer wall of the left lifting threaded rod, and a lifting plate two is threaded onto the outer wall of the right lifting threaded rod. A hanging plate is fixedly installed on the front side of the lifting plate two. A rotating handle is fixedly installed on the top of each of the two lifting threaded rods.

[0007] The positioning mold mechanism includes a mold plate, the bottom of the hanging plate is fixedly connected to the top and last side of the mold plate, and the hanging plate is the same width as the mold plate. A release film is fixedly bonded to the bottom of the mold plate. The top of the mold plate has a rectangular array of several hard alloy placement holes that extend to the bottom of the release film. The mold plate is engaged with the inner cavity of the flexible paper placement frame.

[0008] A further improvement of this utility model is that: the cemented carbide limiting mechanism includes a lower pressure plate, the front side of the lifting plate one is fixedly connected to the rear side of the lower pressure plate, a plurality of cemented carbide pressure rods are fixedly installed in a rectangular array at the bottom of the lower pressure plate, the plurality of cemented carbide pressure rods are engaged with a plurality of cemented carbide placement holes, and two sliding rods are fixedly installed on the top of the extension plate, the two sliding rods are respectively located on the left side of the two lifting threaded rods, the lifting plate one is slidably connected to the left sliding rod, and the lifting plate two is slidably connected to the right sliding rod.

[0009] A further improvement of this utility model is that: side plates are fixedly installed on the top left and right sides of the mold plate, and the opposite sides of the two side plates are respectively attached to the left and right sides of the inner wall of the flexible paper placement frame. A sliding groove is opened on the right side plate, and a sliding handle is slidably installed on the inner side of the sliding groove. A flattening brush is fixedly installed on the left end of the sliding handle. The left and right sides of the flattening brush are respectively attached to the opposite surfaces of the two side plates, and the bottom of the flattening brush is attached to the top of the mold plate.

[0010] A further improvement of this utility model is that: a sealing cover is hinged to the front end of the bottom frame of the bonding device, the bottom frame of the bonding device is made of metal, and magnetic strips are provided on both the left and right sides of the front end of the sealing cover, and the two magnetic strips are attracted to each other with the front end of the bottom frame of the bonding device.

[0011] A further improvement of this utility model is that: locking threaded holes are provided on both the left and right sides of the flexible paper placement frame, and positioning threaded holes penetrating the inner cavity are provided on both the left and right sides of the bottom frame of the bonding device. The two positioning threaded holes are respectively aligned with the two locking threaded holes. A threaded rod is threadedly installed on the inner ring of each of the two positioning threaded holes, and the opposite faces of the two threaded rods are respectively threadedly connected to the two locking threaded holes.

[0012] A further improvement of this utility model is that: the top left and right sides of the flexible paper placement frame are respectively provided with through slots; the pressing mechanism includes a merging pressure plate; a contact plate is fixedly installed at the bottom of the merging pressure plate; the merging pressure plate is engaged with the inner side of the flexible paper placement frame; L-shaped buckles are fixedly installed on both the left and right sides of the merging pressure plate; the horizontal parts of the two L-shaped buckles are engaged with the two slots respectively; the vertical parts of the two L-shaped buckles are respectively provided with through threaded holes; the inner rings of the two threaded holes are threaded with threaded rods II; the dimensions of the two threaded rods II are the same as those of the two threaded rods I.

[0013] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0014] 1. This utility model provides a bonding device that facilitates the removal of molds. Through the cooperation between the driving lifting mechanism, the positioning mold mechanism, and the cemented carbide limiting mechanism, the circular cemented carbide can be stably separated from the mold, avoiding the mold from sticking to the flexible paper. At the same time, the back-and-forth swinging of the brush facilitates the quick positioning of the cemented carbide.

[0015] 2. This utility model provides an adhesive device that facilitates the removal of molds. Through the cooperation between the flexible paper placement frame and the pressing mechanism, the hard alloy bonded to the flexible paper can be pressed and positioned by the alloy of the combined pressure plate and the flexible paper placement frame during transportation, preventing the hard alloy from detaching from the flexible paper and ensuring stability during transportation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the drive lifting mechanism of the present invention.

[0018] Figure 3 This is a schematic diagram of the mold plate of the present invention.

[0019] Figure 4 This is a schematic diagram of the flexible paper placement frame of this utility model in the pulled-out state.

[0020] Figure 5 This is a schematic diagram of the clamping mechanism of the present invention.

[0021] In the diagram: 1. Base frame of the bonding device; 11. Sealing cover; 12. Magnetic strip; 13. Positioning threaded hole; 14. Threaded rod one; 2. Flexible paper placement frame; 21. Adhesive flexible paper; 22. Locking threaded hole; 23. Slot; 24. Threaded rod two; 3. Drive lifting mechanism; 31. Extension plate; 32. Lifting threaded rod; 33. Lifting plate one; 34. Lifting plate two; 35. Hanging plate; 36. Slide rod; 37. Rotating handle; 4. Positioning mold mechanism; 41. Mold plate; 411. Side plate; 412. Slide groove; 413. Sliding handle; 414. Flattening brush; 42. Hard alloy placement hole; 43. Release film; 5. Hard alloy limiting mechanism; 51. Lower pressure plate; 52. Hard alloy pressure rod; 6. Pressing mechanism; 61. Merging pressure plate; 62. Contact plate; 63. L-shaped buckle plate; 64. Butt threaded hole. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0023] like Figure 1 , Figure 2As shown, this utility model provides an adhesive device that facilitates mold removal, including an adhesive device base frame 1 and a clamping mechanism 6. The clamping mechanism 6 is located on the front side of the adhesive device base frame 1. A flexible paper placement frame 2 is snapped into the inner side of the adhesive device base frame 1. The inner cavity of the flexible paper placement frame 2 is provided with adhesive flexible paper 21. A driving lifting mechanism 3 is provided on the rear side of the adhesive device base frame 1. A positioning mold mechanism 4 is provided above the adhesive device base frame 1. A hard alloy limiting mechanism 5 is provided on the top of the positioning mold mechanism 4. The driving lifting mechanism 3 includes an extension plate 31, which is fixedly installed on the rear side of the adhesive device base frame 1. Two lifting threaded rods 32 are movably installed on the top of the extension plate 31. A lifting plate 33 is threaded on the outer wall of the left lifting threaded rod 32, and a lifting plate 34 is threaded on the outer wall of the right lifting threaded rod 32. A hanging plate 35 is fixedly installed on the front side of the lifting plate 34. A rotating rod is fixedly installed on the top of each of the two lifting threaded rods 32. The handle 37 and the positioning mold mechanism 4 include a mold plate 41, a hanging plate 35 whose bottom is fixedly connected to the top and rearmost side of the mold plate 41, and the hanging plate 35 and the mold plate 41 are of the same width. A release film 43 is fixedly bonded to the bottom of the mold plate 41. The top of the mold plate 41 has a rectangular array of several hard alloy placement holes 42 that extend to the bottom of the release film 43. The mold plate 41 is engaged with the inner cavity of the flexible paper placement frame 2. The hard alloy limiting mechanism 5 includes a lower pressure plate 51 and a lifting mechanism. The front side of the first plate 33 is fixedly connected to the rear side of the lower pressure plate 51. Several hard alloy pressure rods 52 are fixedly installed in a rectangular array at the bottom of the lower pressure plate 51. The several hard alloy pressure rods 52 are engaged with several hard alloy placement holes 42. Two sliding rods 36 are fixedly installed on the top of the extension plate 31. The two sliding rods 36 are located on the left side of the two lifting threaded rods 32 respectively. The first lifting plate 33 is slidably connected to the left sliding rod 36, and the second lifting plate 34 is slidably connected to the right sliding rod 36.

[0024] Rotating the handle 37 at the top of the left lifting threaded rod 32 will rotate the left lifting threaded rod 32. This, combined with the sliding connection between the lifting plate 33 (threaded onto the outer wall of the left lifting threaded rod 32) and the left slide rod 36, will control the overall descent of the lower pressure plate 51 until several hard alloy pressure rods 52 press against the circular hard alloy in the several hard alloy placement holes 42, firmly adhering it to the top of the adhesive flexible paper 21 at the bottom of the inner wall of the flexible paper placement frame 2. Then, rotating the handle 37 on the right will drive the right lifting threaded rod 32 to rotate. By connecting the right-side lifting threaded rod 32 with the lifting plate 34, the right-side lifting plate 34 can be controlled to rise by sliding the right-side slide rod 36, thereby pulling the mold plate 41 up as a whole. The mold plate 41 can be easily separated from the top adhesive layer of the adhesive flexible paper 21 by means of the bottom release film 43, so that the hard alloy pressed by the hard alloy pressure rod 52 is stably stuck to the top of the adhesive flexible paper 21. Then, the driving plate 51 drives the hard alloy pressure rod 52 to rise away from the hard alloy, leaving enough space above the flexible paper placement frame 2.

[0025] like Figure 3 As shown, side plates 411 are fixedly installed on the top left and right sides of the mold plate 41. The opposite sides of the two side plates 411 are respectively attached to the left and right sides of the inner wall of the flexible paper placement frame 2. The right side plate 411 has a sliding groove 412. A sliding handle 413 is slidably installed on the inner side of the sliding groove 412. A flattening brush 414 is fixedly installed on the left end of the sliding handle 413. The left and right sides of the flattening brush 414 are respectively attached to the opposite sides of the two side plates 411. The bottom of the flattening brush 414 is attached to the top of the mold plate 41. A sealing cover 11 is hinged to the front end of the bottom frame 1 of the bonding device. The bottom frame 1 of the bonding device is made of metal. Magnetic strips 12 are provided on the left and right sides of the front end of the sealing cover 11. The two magnetic strips 12 are attracted to each other by the front end of the bottom frame 1 of the bonding device.

[0026] In use, a large quantity of circular hard alloy can be evenly poured into the mold plate 41 inside the flexible paper placement frame 2. At this time, the bottom of the mold plate 41 is in contact with the adhesive flexible paper 21. Then, the sliding handle 413 inside the slide groove 412 can be used to swing the overall flattening brush 414 back and forth, so that the hard alloy between the two side plates 411 on the top of the mold plate 41 can be evenly pushed into the hard alloy placement hole 42 opened in the mold plate 41. The excess hard alloy can be flipped up by rotating the sliding handle 413, and when it moves to the last side of the mold plate 41, it can be flipped down and pushed forward. At this time, the sealing cover 11 that is attracted to the front side of the bottom frame 1 of the adhesive device by the magnetic strip 12 is flipped open, so that the excess hard alloy can be directly pushed out of the top of the mold plate 41 by the flattening brush 414 and collected by the container.

[0027] like Figure 4, Figure 5 As shown, locking threaded holes 22 are provided on both the left and right sides of the flexible paper placement frame 2, and positioning threaded holes 13 penetrating the inner cavity are provided on both the left and right sides of the bottom frame 1 of the bonding device. The two positioning threaded holes 13 are aligned with the two locking threaded holes 22 on the left and right respectively. Threaded rods 14 are threadedly installed on the inner rings of the two positioning threaded holes 13. The opposite faces of the two threaded rods 14 are threadedly connected to the two locking threaded holes 22 respectively. The top left and right sides of the flexible paper placement frame 2 are provided with through slots 23. The pressing mechanism 6 is packaged. It includes a merging pressure plate 61, a contact plate 62 fixedly installed at the bottom of the merging pressure plate 61, the merging pressure plate 61 is snapped into the inner side of the flexible paper placement frame 2, and L-shaped buckle plates 63 are fixedly installed on both the left and right sides of the merging pressure plate 61. The horizontal part of the two L-shaped buckle plates 63 is snapped into two slots 23 respectively. The vertical part of the two L-shaped buckle plates 63 is provided with a through threaded hole 64. The inner ring of the two threaded holes 64 is threaded with a threaded rod 24. The two threaded rods 24 are the same size as the two threaded rods 14.

[0028] By using the rotating threaded rod 14, and cooperating with the threaded connection between the threaded rod 14 and the positioning threaded hole 13 and the locking threaded hole 22, the restriction on the flexible paper placement frame 2 can be released, allowing the flexible paper placement frame 2, along with the adhesive flexible paper 21, to be pulled out of the bottom frame 1 of the bonding device. For convenient transportation, the merging pressure plate 61 and the L-shaped buckle plates 63 on both sides of the merging pressure plate 61 can be aligned with the slots 23 on the top left and right sides of the flexible paper placement frame 2 and inserted until the contact plate 62 presses against several hard alloys on the top of the adhesive flexible paper 21, at which point the mating threaded hole 6... 4. Align with the locking threaded hole 22. Then, use the threaded rod 24 to connect with the threaded hole 64 and the locking threaded hole 22 to complete the limiting of the merging pressure plate 61. This facilitates the transportation of the hard alloy bonded to the top of the adhesive flexible paper 21 and prevents the hard alloy from falling off during transportation. At the same time, the flexible paper placement frame 2 produced in the same batch can be inserted into the inner side of the bottom frame 1 of the bonding device and the adhesive flexible paper 21 cut to the same size can be placed on top of it to continue the bonding work between the hard alloy and the adhesive flexible paper 21.

[0029] The working principle of the bonding device that allows the mold to be removed will be explained in detail below.

[0030] like Figure 1-5As shown, during use, a large quantity of circular hard alloy can be evenly poured into the mold plate 41 inside the flexible paper placement frame 2. At this time, the bottom of the mold plate 41 is in contact with the adhesive flexible paper 21. Then, the sliding handle 413 inside the slide groove 412 can be used to swing the overall flattening brush 414 back and forth, so that the hard alloy between the two side plates 411 at the top of the mold plate 41 can be evenly pushed into the hard alloy placement hole 42 opened in the mold plate 41. The excess hard alloy can be flipped up by rotating the sliding handle 413, and when it moves to the last side of the mold plate 41, it can be flipped down and pushed forward. At this time, the sealing cover 11 that is attracted to the front side of the bottom frame 1 of the adhesive device by the magnetic strip 12 is flipped open, so that the excess hard alloy can be directly removed. The carbide is pushed out of the top of the mold plate 41 by the flattening brush 414 and collected by the container. Then, by rotating the rotating handle 37 on the top of the left lifting threaded rod 32, the left lifting threaded rod 32 can be rotated. The sliding connection between the lifting plate 33, which is threaded on the outer wall of the left lifting threaded rod 32, and the left slide rod 36 controls the overall descent of the pressure plate 51 until several carbide pressure rods 52 press the circular carbide in several carbide placement holes 42, so that it is firmly bonded to the top of the adhesive flexible paper 21 at the bottom of the inner wall of the flexible paper placement frame 2. Then, rotating the right rotating handle 37 drives the right lifting threaded rod 32 to rotate. The threaded connection between the right lifting threaded rod 32 and the lifting plate 34 controls the descent of the pressure plate 51. The right-side lifting plate 34, through its sliding connection with the right-side sliding rod 36, controls the lifting plate 35 to rise, thereby pulling the mold plate 41 upwards as a whole. The mold plate 41 can easily separate from the top adhesive layer of the adhesive flexible paper 21 using the bottom release film 43, thus ensuring that all the hard alloy pressed by the hard alloy pressure rod 52 is stably adhered to the top of the adhesive flexible paper 21. Subsequently, the driving plate 51 drives the hard alloy pressure rod 52 to rise away from the hard alloy, leaving sufficient space above the flexible paper placement frame 2. Then, by rotating the threaded rod 14 and engaging the threaded connection between the threaded rod 14 and the positioning threaded hole 13 and the locking threaded hole 22, the restriction on the flexible paper placement frame 2 can be released, allowing the flexible paper placement frame 2, along with the adhesive flexible paper 21, to be pulled out from the bottom of the bonding device. For ease of transport, frame 1 can be further aligned with the merging pressure plate 61 and the L-shaped buckle plates 63 on both sides of the merging pressure plate 61, and inserted into the slots 23 on the top left and right sides of the flexible paper placement frame 2 until the contact plate 62 presses firmly against the hard alloy on the top of the adhesive flexible paper 21. At this point, the mating threaded hole 64 can be aligned with the locking threaded hole 22. Then, the threaded rod 24 can be used to connect with the mating threaded hole 64 and the locking threaded hole 22 to complete the limiting of the merging pressure plate 61, thereby facilitating the transport of the hard alloy bonded to the top of the adhesive flexible paper 21 and preventing the hard alloy from falling off during transport. At the same time, the flexible paper placement frame 2 produced in the same batch can be inserted into the inner side of the bottom frame 1 of the bonding device, and the uniformly cut adhesive flexible paper 21 can be placed on top of it.Then the bonding process between the hard alloy and the adhesive flexible paper 21 can continue.

[0031] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A bonding device for easy removal of a mold, comprising a base frame (1) and a clamping mechanism (6), characterized in that: The clamping mechanism (6) is located on the front side of the bottom frame (1) of the bonding device. A flexible paper placement frame (2) is snapped into the inner side of the bottom frame (1) of the bonding device. The inner cavity of the flexible paper placement frame (2) is provided with adhesive flexible paper (21). A driving lifting mechanism (3) is provided on the rear side of the bottom frame (1) of the bonding device. A positioning mold mechanism (4) is provided above the bottom frame (1) of the bonding device. A hard alloy limiting mechanism (5) is provided on the top of the positioning mold mechanism (4). The driving lifting mechanism (3) includes an extension plate. (31) The extension plate (31) is fixedly installed on the rear side of the bottom frame (1) of the bonding device. Two lifting threaded rods (32) are movably installed on the top of the extension plate (31). The outer wall of the left lifting threaded rod (32) is threaded with a lifting plate one (33), and the outer wall of the right lifting threaded rod (32) is threaded with a lifting plate two (34). A hanging plate (35) is fixedly installed on the front side of the lifting plate two (34). A rotating handle (37) is fixedly installed on the top of each of the two lifting threaded rods (32). The positioning mold mechanism (4) includes a mold plate (41), the bottom of the hanging plate (35) is fixedly connected to the top and last side of the mold plate (41), and the hanging plate (35) and the mold plate (41) are of the same width. A release film (43) is fixedly bonded to the bottom of the mold plate (41). The top of the mold plate (41) has a rectangular array of several hard alloy placement holes (42) that extend to the bottom of the release film (43). The mold plate (41) is engaged with the inner cavity of the flexible paper placement frame (2).

2. The bonding device for convenient mold removal according to claim 1, characterized in that: The carbide limiting mechanism (5) includes a lower pressure plate (51). The front side of the lifting plate one (33) is fixedly connected to the rear side of the lower pressure plate (51). A number of carbide pressure rods (52) are fixedly installed in a rectangular array at the bottom of the lower pressure plate (51). The number of carbide pressure rods (52) are engaged with a number of carbide placement holes (42). The top of the extension plate (31) is fixedly installed with two sliding rods (36). The two sliding rods (36) are located on the left side of the two lifting threaded rods (32). The lifting plate one (33) is slidably connected to the left sliding rod (36), and the lifting plate two (34) is slidably connected to the right sliding rod (36).

3. The bonding device for convenient mold removal according to claim 1, characterized in that: Side plates (411) are fixedly installed on the top left and right sides of the mold plate (41). The opposite sides of the two side plates (411) are respectively attached to the left and right sides of the inner wall of the flexible paper placement frame (2). The right side plate (411) has a sliding groove (412). A sliding handle (413) is slidably installed on the inner side of the sliding groove (412). A flattening brush (414) is fixedly installed on the left end of the sliding handle (413). The left and right sides of the flattening brush (414) are respectively attached to the opposite surfaces of the two side plates (411). The bottom of the flattening brush (414) is attached to the top of the mold plate (41).

4. The bonding device for convenient mold removal according to claim 1, characterized in that: The front end of the bottom frame (1) of the bonding device is hinged with a sealing cover (11). The bottom frame (1) of the bonding device is made of metal. Magnetic strips (12) are provided on both the left and right sides of the front end of the sealing cover (11). The two magnetic strips (12) are attracted to each other with the front end of the bottom frame (1) of the bonding device.

5. The bonding device for convenient mold removal according to claim 1, characterized in that: The flexible paper placement frame (2) has locking threaded holes (22) on both the left and right sides. The bottom frame (1) of the bonding device has positioning threaded holes (13) that penetrate its inner cavity on both the left and right sides. The two positioning threaded holes (13) are aligned with the two locking threaded holes (22) on the left and right respectively. The inner rings of the two positioning threaded holes (13) are threaded with threaded rods (14). The opposite faces of the two threaded rods (14) are threadedly connected to the two locking threaded holes (22) respectively.

6. The bonding device for convenient mold removal according to claim 5, characterized in that: The top left and right sides of the flexible paper placement frame (2) are respectively provided with through slots (23). The pressing mechanism (6) includes a merging pressure plate (61). A contact plate (62) is fixedly installed at the bottom of the merging pressure plate (61). The merging pressure plate (61) is engaged with the inner side of the flexible paper placement frame (2). L-shaped buckles (63) are fixedly installed on both the left and right sides of the merging pressure plate (61). The horizontal parts of the two L-shaped buckles (63) are engaged with the two slots (23) respectively. The vertical parts of the two L-shaped buckles (63) are respectively provided with through threaded holes (64). The inner rings of the two threaded holes (64) are threaded with threaded rods (24). The two threaded rods (24) are the same size as the two threaded rods (14).

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