VCP electroplating conductive structure

Abstract

The utility model relates to the technical field of VCP electroplating production, and discloses a VCP electroplating conductive structure which comprises an electroplating pool, the four supporting legs are fixedly connected to the bottom surface of the electroplating tank; the two bases are fixedly connected to the bottom surfaces of the two adjacent supporting legs respectively; the supporting frame is fixedly connected to the top surface of the electroplating pool, and an electroplating assembly is arranged on the inner side of the supporting frame; a mixing assembly is arranged in the electroplating pool, and the electroplating assembly comprises a fixing frame in the supporting frame. Through the mixing assembly, the stirring plate is driven by the rotating rod to mix and stir the plating solution in the electroplating pool, so that precipitates (such as metal salt crystals or organic matter precipitation) in the plating solution are effectively prevented from depositing at the pool bottom or adhering to the surfaces of the clamping plates, and the components in the plating solution are kept uniform; and the risks of production interruption and equipment failure caused by non-uniform plating solution or non-uniform current distribution are reduced, so that the uniformity and the consistency of an electroplated layer are improved, and the phenomena of local over-thinness or skip plating are reduced.

Description

Technical Field

[0001] This utility model relates to the field of VCP electroplating production technology, specifically to a VCP electroplating conductive structure. Background Technology

[0002] VCP electroplating conductivity refers to the conductivity technology in a vertical continuous electroplating process. VCP electroplating is a highly efficient electroplating method widely used in printed circuit board (PCB) manufacturing. Its basic principle is to use an electrical control system and a transmission system to drive the circuit board to complete the electroplating process, achieving a continuous electroplating process, thereby improving production efficiency and product quality.

[0003] In current VCP electroplating conductive processes, precipitation occurs in the plating solution. This precipitation (such as metal salt crystals or organic matter) adheres to the surface of the conductive copper rails or fixtures, increasing contact resistance, affecting the uniformity of current distribution, and ultimately leading to problems such as locally thin plating layers or incomplete plating. Therefore, a VCP electroplating conductive structure is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a VCP electroplated conductive structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a VCP electroplating conductive structure, including an electroplating bath;

[0006] Four support legs are fixedly connected to the bottom of the electroplating tank;

[0007] Two bases are fixedly connected to the bottom surfaces of two adjacent support legs;

[0008] And a support frame fixedly connected to the top surface of the electroplating tank, wherein an electroplating assembly is provided on the inner side of the support frame;

[0009] The electroplating tank is equipped with a mixing component.

[0010] Preferably, the electroplating assembly includes a fixed frame inside the support frame. A motor is fixedly connected to the top surface of the fixed frame. The bottom end face of the motor output rod extends through the top surface of the fixed frame to the inner side of the fixed frame. A double-threaded rod and two sliding plates are provided on the inner side of the fixed frame. The two sliding plates are symmetrically arranged. Bevel gears are fixedly sleeved on the surface of the double-threaded rod and the surface of the motor output rod. The two bevel gears are symmetrically arranged. The rear end face of the double-threaded rod extends through the front face of the two sliding plates to the rear side of the two sliding plates. The front and rear end faces of the double-threaded rod are rotatably connected to the inner side of the fixed frame through bearing seats. A clamping plate is fixedly connected to the bottom surface of the sliding plate.

[0011] Preferably, protective plates are fixedly connected to the adjacent surfaces of the two clamping plates. The clamping plates are made of stainless steel, and the protective plates prevent the clamping plates from damaging the surface of the PCB board.

[0012] Preferably, the side of the clamping plate and the surface of the protective plate are both provided with through holes to facilitate the plating solution to pass through the protective plate and the clamping plate.

[0013] Preferably, a connecting frame and two support rods are provided above the fixed frame. The upper and lower end faces of the support rods are fixedly connected to the inner top surface of the connecting frame and the top surface of the fixed frame, respectively. The support rods serve to connect the connecting frame and the fixed frame.

[0014] Preferably, an electric push rod is fixedly connected to the top surface of the support frame. The bottom end of the output rod of the electric push rod extends through the top surface of the support frame to the inner side of the support frame. The bottom end of the output rod of the electric push rod is fixedly connected to the top surface of the connecting frame. The electric push rod facilitates the adjustment of the height of the support frame.

[0015] Preferably, the mixing assembly includes a rotating rod and a stirring plate located inside the electroplating tank. The end face of the stirring plate is fixedly connected to the surface of the rotating rod. The left and right end faces of the rotating rod are rotatably connected to the left and right sides inside the electroplating tank through bearing seats, respectively. A gear is fixedly sleeved on the surface of the rotating rod. A toothed plate is provided on the side of the gear. The toothed plate meshes with the surface of the gear. The top surface of the toothed plate is fixedly connected to the bottom surface of the connecting frame. The toothed plate drives the gear to rotate, thereby causing the rotating rod to rotate.

[0016] Preferably, there are two rotating rods arranged symmetrically.

[0017] Preferably, the stirring plate is arranged on the left and right sides of the toothed plate, and is located on the front and rear sides of the clamping plate fixing frame, respectively. The stirring plate rotates to mix and stir the plating solution in the electroplating tank.

[0018] Preferably, a connecting plate is fixedly connected to the side of the toothed plate, and a wedge-shaped groove is opened through the inner side of the support frame. A wedge-shaped block is slidably arranged inside the wedge-shaped groove. The side of the wedge-shaped block is fixedly connected to the end face of the connecting plate. The wedge-shaped plate can limit the toothed plate, and at the same time, the wedge-shaped plate and the connecting plate support the toothed plate.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. This VCP electroplating conductive structure, through the mixing component, the stirring plate, driven by the rotating rod, mixes and stirs the plating solution in the electroplating tank, effectively preventing precipitates (such as metal salt crystals or organic matter precipitation) in the plating solution from settling at the bottom of the tank or adhering to the surface of the clamping plate. This ensures that the composition in the plating solution remains uniform, reducing the risk of production interruption and equipment failure caused by uneven plating solution or uneven current distribution, thereby improving the uniformity and consistency of the electroplated layer and reducing the occurrence of localized excessive thinness or missed plating.

[0021] 2. This VCP electroplated conductive structure uses an electroplating component and a double-ended threaded rod to drive two sliding plates closer together, allowing the clamping plate and protective plate to be quickly and accurately adjusted according to the thickness of the PCB board. This enhances the adaptability and flexibility of the device. At the same time, the stainless steel clamping plate and protective plate have good corrosion resistance and wear resistance, extending the service life of the VCP electroplated conductive structure. Attached Figure Description

[0022] Figure 1 This is a left perspective view of the fixing frame of this utility model;

[0023] Figure 2 This is a perspective view of the overall main view of this utility model;

[0024] Figure 3 This is a left-side perspective view of the entire utility model;

[0025] Figure 4 This is a left perspective view of the double-ended threaded rod of this utility model;

[0026] Figure 5 This is a perspective view of the left side of the wedge-shaped block of this utility model.

[0027] In the diagram: 1. Electroplating tank; 2. Support leg; 3. Base; 4. Support frame; 5. Drain pipe; 60. Electroplating assembly; 601. Electric push rod; 602. Connecting frame; 603. Support rod; 604. Fixing frame; 605. Motor; 606. Double-ended threaded rod; 607. Bevel gear; 608. Slide plate; 609. Clamping plate; 6010. Protective plate; 61. Mixing assembly; 611. Toothed plate; 612. Connecting plate; 613. Wedge block; 614. Rotating rod; 615. Gear; 616. Stirring plate. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Example 1: Please refer to Figure 1 - Figure 5 This utility model provides a technical solution: a VCP electroplating conductive structure, including an electroplating tank 1;

[0030] Four support legs 2 are fixedly connected to the bottom surface of the electroplating tank 1;

[0031] Two bases 3 are fixedly connected to the bottom surfaces of two adjacent support legs 2;

[0032] And a support frame 4 fixedly connected to the top surface of the electroplating tank 1, with an electroplating component 60 provided inside the support frame 4;

[0033] The electroplating tank 1 is equipped with a mixing component 61.

[0034] The electroplating assembly 60 includes a fixing frame 604 inside the support frame 4. A motor 605 is fixedly connected to the top surface of the fixing frame 604. The bottom end of the output rod of the motor 605 extends through the top surface of the fixing frame 604 to the inside of the fixing frame 604. A double-threaded rod 606 and two sliding plates 608 are provided inside the fixing frame 604. The two sliding plates 608 are symmetrically arranged. Bevel gears 607 are fixedly sleeved on the surface of the double-threaded rod 606 and the surface of the output rod of the motor 605. The two bevel gears 607 are symmetrically arranged. The rear end thread of the double-threaded rod 606 extends through the front of the two sliding plates 608 to the two sliding plates 608. On the rear side, the front and rear ends of the double-ended threaded rod 606 are rotatably connected to the inner side of the fixed frame 604 via bearing seats. The bottom surface of the slide plate 608 is fixedly connected to the clamping plate 609. Through the electroplating assembly 60, the double-ended threaded rod 606 drives the two slide plates 608 to move closer to each other, so that the clamping plate 609 can drive the protective plate 6010 to make quick and precise adjustments according to the thickness of the PCB board, which enhances the adaptability and flexibility of the device. At the same time, the stainless steel clamping plate 609 and protective plate 6010 have good corrosion resistance and wear resistance, which extends the service life of the VCP electroplated conductive structure.

[0035] Protective plates 6010 are fixedly connected to the adjacent surfaces of the two clamping plates 609. The clamping plates 609 are made of stainless steel.

[0036] Both the side of the clamping plate 609 and the surface of the protective plate 6010 have through holes.

[0037] A connecting frame 602 and two support rods 603 are provided above the fixed frame 604. The upper and lower end faces of the support rods 603 are fixedly connected to the inner top surface of the connecting frame 602 and the top surface of the fixed frame 604, respectively.

[0038] An electric push rod 601 is fixedly connected to the top surface of the support frame 4. The bottom end of the output rod of the electric push rod 601 extends through the top surface of the support frame 4 to the inside of the support frame 4. The bottom end of the output rod of the electric push rod 601 is fixedly connected to the top surface of the connecting frame 602.

[0039] Example 2: Based on Example 1, a preferred embodiment of the VCP electroplated conductive structure provided by this utility model is as follows: Figure 1 and Figure 5 As shown: The mixing component 61 includes a rotating rod 614 and a stirring plate 616 located inside the electroplating tank 1. The end face of the stirring plate 616 is fixedly connected to the surface of the rotating rod 614. The left and right end faces of the rotating rod 614 are rotatably connected to the left and right sides inside the electroplating tank 1 through bearing seats, respectively. A gear 615 is fixedly sleeved on the surface of the rotating rod 614. A toothed plate 611 is provided on the side of the gear 615. The tooth surface of the toothed plate 611 meshes with the surface of the gear 615. The top surface of the toothed plate 611 is fixedly connected to the bottom surface of the connecting frame 602. Through the mixing component 61, the stirring plate 616 mixes and stirs the plating solution in the electroplating tank 1 under the drive of the rotating rod 614. This effectively prevents precipitates (such as metal salt crystals or organic matter precipitation) in the plating solution from depositing on the bottom of the tank or adhering to the surface of the clamping plate 609. This ensures that the composition in the plating solution remains uniform, reduces the risk of production interruption and equipment failure caused by uneven plating solution or uneven current distribution, thereby improving the uniformity and consistency of the electroplated layer and reducing the occurrence of local thinning or missed plating.

[0040] There are two symmetrically arranged rotating rods 614.

[0041] The stirring plate 616 is located on the left and right sides of the toothed plate 611, and is located on the front and rear sides of the clamping plate fixing frame 604 respectively.

[0042] A connecting plate 612 is fixedly connected to the side of the toothed plate 611. A wedge-shaped groove is opened through the inner side of the support frame 4. A wedge-shaped block 613 is slidably arranged inside the wedge-shaped groove. The side of the wedge-shaped block 613 is fixedly connected to the end face of the connecting plate 612.

[0043] In use, the PCB board is placed between the two clamping plates 609, and the motor 605 is turned on. The output rod of the motor 605 drives the connected bevel gear 607 to rotate. Through the meshing transmission of the two bevel gears 607, the double-threaded rod 606 rotates. The double-threaded rod 606 drives the two sliding plates 608 to move closer to each other, which in turn causes the sliding plates 608 to drive the clamping plates 609 to move closer to each other. This causes the clamping plates 609 to move the protective plate 6010 toward the PCB board, thereby clamping and fixing the non-plated area of ​​the PCB board.

[0044] When the electric push rod 601 is activated, its output rod extends, causing the connecting frame 602 to move downwards. This causes the toothed plate 611 and the support rod 603 to move downwards. As the toothed plate 611 moves downwards, it drives the meshing gear 615 to rotate, which in turn causes the rotating rod 614 to rotate and drives the connected stirring plate 616 to rotate. The rotating stirring plate 616 mixes and stirs the plating solution in the electroplating tank 1, preventing sedimentation. When the support rod 603 moves downwards, it drives the fixing frame 604 to move downwards, thus moving the PCB board downwards into the electroplating tank 1 for electroplating.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A VCP electroplating conductive structure, comprising an electroplating bath (1). Four support legs (2) are fixedly connected to the bottom of the electroplating tank (1); Two bases (3) are fixedly connected to the bottom surfaces of two adjacent support legs (2); and a support frame (4) fixedly connected to the top surface of the electroplating tank (1), characterized in that: An electroplating assembly (60) is provided on the inner side of the support frame (4). The electroplating tank (1) is equipped with a mixing component (61).

2. The VCP electroplating conductive structure according to claim 1, characterized in that: The electroplating assembly (60) includes a fixed frame (604) inside the support frame (4). A motor (605) is fixedly connected to the top surface of the fixed frame (604). The bottom end face of the output rod of the motor (605) extends through the top surface of the fixed frame (604) to the inside of the fixed frame (604). A double-threaded rod (606) and two slide plates (608) are provided on the inside of the fixed frame (604). The two slide plates (608) are symmetrically arranged. Bevel gears (607) are fixedly sleeved on the surface of the double-threaded rod (606) and the surface of the output rod of the motor (605). The two bevel gears (607) are symmetrically arranged. The rear end face of the double-threaded rod (606) extends through the front face of the two slide plates (608) to the rear side of the two slide plates (608). The front and rear end faces of the double-threaded rod (606) are rotatably connected to the inner side of the fixed frame (604) through bearing seats. A clamping plate (609) is fixedly connected to the bottom surface of the slide plate (608).

3. The VCP electroplated conductive structure according to claim 2, characterized in that: The two mixing components (61) include a rotating rod (614) and a stirring plate (616) located inside the electroplating tank (1). The end face of the stirring plate (616) is fixedly connected to the surface of the rotating rod (614). The left and right end faces of the rotating rod (614) are rotatably connected to the left and right sides inside the electroplating tank (1) through bearing seats, respectively. A gear (615) is fixedly sleeved on the surface of the rotating rod (614). A toothed plate (611) is provided on the side of the gear (615). The tooth surface of the toothed plate (611) meshes with the surface of the gear (615). The top surface of the toothed plate (611) is fixedly connected to the bottom surface of the connecting frame (602).

4. The VCP electroplated conductive structure according to claim 2, characterized in that: Protective plates (6010) are fixedly connected to the adjacent surfaces of the clamping plates (609), and the clamping plates (609) are made of stainless steel.

5. The VCP electroplated conductive structure according to claim 4, characterized in that: Both the side of the clamping plate (609) and the surface of the protective plate (6010) are provided with through holes.

6. The VCP electroplated conductive structure according to claim 2, characterized in that: A connecting frame (602) and two support rods (603) are provided above the fixed frame (604). The upper and lower end faces of the support rods (603) are fixedly connected to the inner top surface of the connecting frame (602) and the top surface of the fixed frame (604), respectively.

7. A VCP electroplated conductive structure according to claim 2, characterized in that: An electric push rod (601) is fixedly connected to the top surface of the support frame (4). The bottom end of the output rod of the electric push rod (601) extends through the top surface of the support frame (4) to the inside of the support frame (4). The bottom end of the output rod of the electric push rod (601) is fixedly connected to the top surface of the connecting frame (602).

8. The VCP electroplated conductive structure according to claim 3, characterized in that: There are two symmetrically arranged rotating rods (614).

9. A VCP electroplated conductive structure according to claim 3, characterized in that: The stirring plate (616) is located on the left and right sides of the toothed plate (611), and on the front and rear sides of the clamping plate fixing frame (604), respectively.

10. A VCP electroplated conductive structure according to claim 3, characterized in that: The toothed plate (611) is fixedly connected to the side of the connecting plate (612), and the inner side of the support frame (4) is provided with a wedge-shaped groove. A wedge block (613) is slidably arranged inside the wedge-shaped groove, and the side of the wedge block (613) is fixedly connected to the end face of the connecting plate (612).

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