Semiconductor pressure control valve mechanism

Abstract

The utility model discloses a semiconductor pressure control valve mechanism, which relates to the technical field of vacuum pressure control valves of semiconductor equipment and comprises a first valve body assembly. The valve body assembly comprises a valve body, a sealing pressing rod driving assembly is arranged at the bottom of the valve body, and the top of the sealing pressing rod driving assembly is connected with a sealing pressing rod body through a first bolt. The valve plate assembly comprises a valve plate base, a valve plate driving assembly is installed at the bottom of the valve plate base, and the bottom of the suspension arm is connected with a valve plate body through a third bolt. According to the semiconductor pressure control valve mechanism, in the using process, a single-shaft synchronous driving mode is adopted, the situation that the sealing effect is affected by the synchronism difference of double-shaft driving is avoided, and the sealing performance of the valve mechanism can be further improved through the auxiliary sealing mode that the valve plate is matched with the sealing pressing plate in a sealing mode; and meanwhile, the whole pressure control valve mechanism adopts an assembled drawer type design, so that the subsequent maintenance and overhaul operation of the product is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of vacuum pressure control valve technology for semiconductor equipment, specifically a semiconductor pressure control valve mechanism. Background Technology

[0002] In dry etching and deposition equipment for semiconductors and solar energy, mushroom-type (SFV) pressure control valves are required. The valve plate adjusts its axial position within the valve body through the axial movement of the drive shaft, thereby adjusting the valve plate opening and controlling the pressure in the equipment cavity to meet the cavity pressure requirements of the dry etching and deposition equipment processing technology.

[0003] The existing pressure-controlled mushroom valve is structured by controlling the axial movement of the valve plate through the synchronous lifting and lowering of two drive shafts. When the two drive shafts move upward synchronously, the valve plate opens and is fully open when the maximum stroke is reached. When the two drive shafts move downward, the valve plate gradually closes. The valve plate is in the closed state when the sealing ring at the bottom of the valve plate contacts the valve body surface. ① Due to machining and parts assembly errors, the two shafts cannot completely and synchronously contact the bottom plane of the valve body, resulting in uneven force on the sealing ring. The fully closed state cannot ensure good airtightness of the cavity. ② The top surface of the valve is connected to the process cavity of the equipment, and the bottom surface is connected to the molecular vacuum pump. The valve actuator or valve plate requires the entire equipment to be disassembled for maintenance, which is inconvenient. Utility Model Content

[0004] The purpose of this utility model is to provide a semiconductor pressure-controlled valve mechanism to solve the problems mentioned in the background art. In the process of use, due to machining and parts assembly errors, the two drive shafts cannot fully and synchronously contact the bottom plane of the valve body, resulting in uneven force on the sealing ring. In the fully closed state, the good airtightness of the cavity cannot be guaranteed. At the same time, the top surface of the valve is connected to the process cavity of the equipment, and the bottom surface is connected to the molecular vacuum pump. The valve driver or valve plate needs to be completely disassembled for maintenance, which is inconvenient.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor pressure-controlled valve mechanism, comprising a first valve body assembly, a valve plate assembly disposed on the right side of the first valve body assembly, the valve plate assembly being fixed to the right side of the valve body assembly by a fourth bolt, the valve body assembly and the valve plate assembly constituting a complete pressure-controlled valve mechanism.

[0006] The valve body assembly includes a valve body body, a sealing rod drive assembly is provided at the bottom of the valve body body, and the top of the sealing rod drive assembly is connected to the sealing rod body by a first bolt. The sealing rod body is located on the left side inside the pressure control valve mechanism.

[0007] The valve plate assembly includes a valve plate base, a valve plate drive assembly is mounted on the bottom of the valve plate base, a suspension arm is connected to the top of the valve plate drive assembly by a second bolt, the suspension arm is located on the inside right side of the pressure control valve mechanism, and a valve plate body is connected to the bottom of the suspension arm by a third bolt, the valve plate body is positioned directly opposite the opening of the valve.

[0008] Furthermore, a second sealing ring is provided on the top of the valve mechanism formed by the valve body assembly and the valve plate assembly, the top of the pressure control valve mechanism is connected to the upper part of the semiconductor, the bottom of the pressure control valve mechanism is connected to the molecular vacuum pump, and the valve plate assembly is inserted from the side of the valve body assembly and is fixed and sealed by the second sealing ring and the fourth bolt.

[0009] Furthermore, the sealing rod drive assembly includes a sealing rod drive shaft, and a first vacuum bellows is provided on the outer side of the sealing rod drive shaft. The valve body and the sealing rod drive assembly are assembled and sealed through the first vacuum bellows.

[0010] Furthermore, the sealing rod body is assembled and connected to the sealing rod drive shaft, the sealing rod body is configured with a "Z" shaped structure, and the sealing rod body abuts against the top left side of the valve plate body.

[0011] Furthermore, the valve plate drive assembly includes a valve plate drive shaft and a second vacuum bellows. The valve plate base and the valve plate drive assembly are assembled and sealed through the second vacuum bellows. The valve plate drive shaft is located in the middle of the second vacuum bellows, and the suspension arm is fixed to the top of the valve plate drive shaft by a second bolt.

[0012] Furthermore, the suspension arm is assembled and connected to the valve plate body via a spherical washer and a third bolt, and a first sealing ring is fitted at the bottom of the valve plate body.

[0013] Furthermore, the valve plate body forms a compression sealing structure through the first sealing ring, and the area of ​​the valve plate body is larger than the area of ​​the valve outlet.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This semiconductor pressure-controlled valve mechanism adopts a single-axis synchronous drive during use to avoid the impact of dual-axis drive synchronization differences on the sealing effect. Furthermore, the valve mechanism's sealing performance can be further improved through the auxiliary sealing method of valve plate sealing combined with sealing pressure plate. At the same time, the pressure-controlled valve mechanism adopts an assembled drawer-type design, which facilitates subsequent maintenance and repair work.

[0016] 1. Furthermore, the valve plate uses a single-axis drive to avoid poor sealing caused by asynchronous dual-axis drives.

[0017] 2. Furthermore, the valve plate suspension arm is designed to apply pressure and seal near the center of the valve plate. The flatness of the sealing posture is adjusted by a spherical gasket to ensure excellent sealing performance of the valve plate.

[0018] 3. Furthermore, a sealing pressure rod is designed on the opposite side of the valve plate drive shaft to assist in sealing, increasing the pressure on the valve plate on the opposite side of the valve plate drive shaft and ensuring excellent sealing performance of the valve plate.

[0019] 4. Furthermore, the drawer-type valve plate design and valve body assembly facilitate product assembly and maintenance. Attached Figure Description

[0020] Figure 1 This is a top view of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the overall bottom view of the present invention;

[0022] Figure 3 This is a side sectional view of the sealing rod drive assembly and valve plate drive assembly of this utility model;

[0023] Figure 4 This is a schematic diagram of the orthographic section of the valve body of this utility model;

[0024] Figure 5 This is a schematic diagram showing the distribution structure of the valve body, the first sealing ring, and the second sealing ring of this utility model;

[0025] Figure 6 This is an exploded structural diagram of the sealing pressure rod, valve plate body, and suspension arm of this utility model.

[0026] In the diagram: 1. Valve body assembly; 1.1 Valve body; 1.2 Sealing rod drive assembly; 1.21 Sealing rod drive shaft; 1.22 First vacuum bellows; 1.3 First bolt; 1.4 Sealing rod body; 2. Valve plate assembly; 2.1 Valve plate base; 2.2 Valve plate drive assembly; 2.21 Valve plate drive shaft; 2.22 Second vacuum bellows; 2.3 Valve plate body; 2.4 First sealing ring; 2.5 Suspension arm; 2.6 Second bolt; 2.7 Spherical gasket; 2.8 Third bolt; 3. Second sealing ring; 4. Fourth bolt. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1: Please refer to Figures 1-6 This utility model provides the following technical solution: a semiconductor pressure-controlled valve mechanism, including a first valve body assembly 1, a valve plate assembly 2 disposed on the right side of the first valve body assembly 1, the valve plate assembly 2 being fixed to the right side of the valve body assembly 1 by a fourth bolt 4, the valve body assembly 1 and the valve plate assembly 2 constituting a complete pressure-controlled valve mechanism, the valve body assembly 1 including a valve body 1.1, a sealing rod drive assembly 1.2 disposed at the bottom of the valve body 1.1, and the top of the sealing rod drive assembly 1.2 being connected by a first bolt 1.3. The valve includes a sealing rod body 1.4, which is located on the left side inside the pressure control valve mechanism. The valve plate assembly 2 includes a valve plate base 2.1, and a valve plate drive assembly 2.2 is installed at the bottom of the valve plate base 2.1. A suspension arm 2.5 is connected to the top of the valve plate drive assembly 2.2 by a second bolt 2.6. The suspension arm 2.5 is located on the right side inside the pressure control valve mechanism. The valve plate body 2.3 is connected to the bottom of the suspension arm 2.5 by a third bolt 2.8. The valve plate body 2.3 is positioned directly opposite the valve opening.

[0029] In use, the valve plate base 2.1 of the valve plate assembly 2 is inserted from the right side into the right side of the valve body 1.1 of the first valve body assembly 1. It is assembled and fixed together with the second sealing ring 3 and the fourth bolt 4 to form a valve mechanism. The sealing rod drive assembly 1.2 drives the sealing rod body 1.4 to run through the first bolt 1.3. The valve plate drive assembly 2.2 drives the suspension arm 2.5 and the valve plate body 2.3 to run through the second bolt 2.6. The valve plate body 2.3 blocks or opens the outlet of the valve mechanism, thereby performing pressure control.

[0030] Example 2:

[0031] Based on Embodiment 1, a sealing pressure rod drive shaft 1.21 and a first vacuum bellows 1.22 are also disclosed. Please refer to [reference needed]. Figures 3-6 As shown, its specific structure is as follows: A second sealing ring 3 is provided on the top of the valve mechanism formed by the valve body assembly 1 and the valve plate assembly 2. The top of the pressure control valve mechanism is connected to the upper part of the semiconductor, and the bottom of the pressure control valve mechanism is connected to the molecular vacuum pump. The valve plate assembly 2 is inserted from the side of the valve body assembly 1 and is fixed and sealed by the second sealing ring 3 and the fourth bolt 4. The sealing rod drive assembly 1.2 includes a sealing rod drive shaft 1.21. A first vacuum bellows 1.22 is provided on the outside of the sealing rod drive shaft 1.21. The valve body 1.1 and the sealing rod drive assembly 1.2 are assembled and sealed through the first vacuum bellows 1.22. The sealing rod body 1.4 is assembled and connected to the sealing rod drive shaft 1.21. The sealing rod body 1.4 is set with a "Z" shaped structure and abuts against the top left side of the valve plate body 2.3.

[0032] During use, before the valve plate body 2.3 moves upward to open, the sealing rod body 1.4 is driven by the sealing rod drive shaft 1.21 via a motor screw or a cylinder. The sealing rod body 1.4 travels to its maximum stroke via the sealing rod drive shaft 1.21 and is in standby mode.

[0033] Example 3:

[0034] Based on Embodiment 2, a valve plate drive shaft 2.21, a second vacuum bellows 2.22, and a spherical gasket 2.7 are also disclosed. Please refer to [link / reference]. Figures 4-6 As shown, its specific structure is as follows: The valve plate drive assembly 2.2 includes a valve plate drive shaft 2.21 and a second vacuum bellows 2.22. The valve plate base 2.1 and the valve plate drive assembly 2.2 are assembled and sealed through the second vacuum bellows 2.22. The valve plate drive shaft 2.21 is located in the middle of the second vacuum bellows 2.22. The suspension arm 2.5 is fixed to the top of the valve plate drive shaft 2.21 by the second bolt 2.6. The suspension arm 2.5 is assembled and connected to the valve plate body 2.3 by the spherical gasket 2.7 and the third bolt 2.8. The bottom of the valve plate body 2.3 is equipped with a first sealing ring 2.4. The valve plate body 2.3 forms a compression sealing structure through the first sealing ring 2.4. The area of ​​the valve plate body 2.3 is larger than the area of ​​the valve outlet.

[0035] Then, the sealing rod body 1.4 drives the valve plate body 2.3 to move upward, gradually opening to any safe stroke to control the pressure inside the cavity. When the cavity needs to be sealed, the valve plate drive shaft 2.21 pulls the valve plate body 2.3 towards the bottom surface of the valve body 1.1 through the suspension arm 2.5. The valve plate body 2.3 drives the first sealing ring 2.4 at the bottom to move downward simultaneously. When the first sealing ring 2.4 contacts the bottom of the valve body 1.1, the spherical gasket 2.7 is subjected to pressure from the suspension arm 2.5. After being compressed, the spherical gasket 2.7 adjusts the flatness of the valve plate body 2.3 to form a good seal. At the same time, the valve plate drive shaft 2.21 pulls the sealing rod body 1.4 to compact the valve plate body 2.3 for auxiliary sealing, forming a good sealing state and ensuring stable pressure control.

[0036] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0037] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor pressure-controlled valve mechanism, comprising a first valve body assembly (1), wherein a valve plate assembly (2) is disposed on the right side of the first valve body assembly (1), the valve plate assembly (2) being fixed to the right side of the valve body assembly (1) by a fourth bolt (4), the valve body assembly (1) and the valve plate assembly (2) constituting a complete pressure-controlled valve mechanism; Its features are: The valve body assembly (1) includes a valve body body (1.1), a sealing rod drive assembly (1.2) is provided at the bottom of the valve body body (1.1), and a sealing rod body (1.4) is connected to the top of the sealing rod drive assembly (1.2) by a first bolt (1.3). The sealing rod body (1.4) is located on the left side inside the pressure control valve mechanism. The valve plate assembly (2) includes a valve plate base (2.1), a valve plate drive assembly (2.2) is installed at the bottom of the valve plate base (2.1), a suspension arm (2.5) is connected to the top of the valve plate drive assembly (2.2) by a second bolt (2.6), the suspension arm (2.5) is located on the right side inside the pressure control valve mechanism, and a valve plate body (2.3) is connected to the bottom of the suspension arm (2.5) by a third bolt (2.8), the valve plate body (2.3) is positioned directly opposite the opening of the valve.

2. The semiconductor pressure-controlled valve mechanism according to claim 1, characterized in that: The valve mechanism formed by the valve body assembly (1) and the valve plate assembly (2) is provided with a second sealing ring (3) at the top. The top of the pressure control valve mechanism is connected to the upper part of the semiconductor, and the bottom of the pressure control valve mechanism is connected to the molecular vacuum pump. The valve plate assembly (2) is inserted from the side of the valve body assembly (1) and is fixed and sealed by the second sealing ring (3) and the fourth bolt (4).

3. The semiconductor pressure-controlled valve mechanism according to claim 2, characterized in that: The sealing rod drive assembly (1.2) includes a sealing rod drive shaft (1.21), and a first vacuum bellows (1.22) is provided on the outside of the sealing rod drive shaft (1.21). The valve body (1.1) and the sealing rod drive assembly (1.2) are assembled and sealed through the first vacuum bellows (1.22).

4. The semiconductor pressure-controlled valve mechanism according to claim 3, characterized in that: The sealing rod body (1.4) is assembled and connected to the sealing rod drive shaft (1.21). The sealing rod body (1.4) is configured with a "Z" shaped structure and abuts against the top left side of the valve plate body (2.3).

5. A semiconductor pressure-controlled valve mechanism according to claim 4, characterized in that: The valve plate drive assembly (2.2) includes a valve plate drive shaft (2.21) and a second vacuum bellows (2.22). The valve plate base (2.1) and the valve plate drive assembly (2.2) are assembled and sealed through the second vacuum bellows (2.22). The valve plate drive shaft (2.21) is located in the middle of the second vacuum bellows (2.22). The suspension arm (2.5) is fixed to the top of the valve plate drive shaft (2.21) by a second bolt (2.6).

6. A semiconductor pressure-controlled valve mechanism according to claim 5, characterized in that: The suspension arm (2.5) is assembled and connected to the valve plate body (2.3) by a spherical gasket (2.7) and a third bolt (2.8), and the bottom of the valve plate body (2.3) is equipped with a first sealing ring (2.4).

7. A semiconductor pressure-controlled valve mechanism according to claim 6, characterized in that: The valve plate body (2.3) forms a compression sealing structure through the first sealing ring (2.4), and the area of ​​the valve plate body (2.3) is larger than the area of ​​the valve outlet.

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