Temperature detection mounting structure of wafer aging test fixture

Abstract

The utility model discloses a temperature detection mounting structure of a wafer aging test fixture. The temperature detection mounting structure comprises an upper needle clamping seat, a lower chuck and a locking device, the wafer bearing disc is used for bearing a wafer and transferring heat to the wafer; a first temperature detection device, a second temperature detection device, a third temperature detection device and a fourth temperature detection device which are respectively used for detecting temperature are arranged on the wafer bearing disc; one side, far away from the lower chuck, of the wafer bearing disc is provided with an embedding groove, and the embedding groove is used for installing the first temperature detection device, the second temperature detection device, the third temperature detection device and the fourth temperature detection device. According to the utility model, the heating temperature of the wafer can be comprehensively and fully detected.

Description

Technical Field

[0001] This utility model relates to the field of wafer aging test fixtures, specifically to a temperature detection mounting structure for a wafer aging test fixture. Background Technology

[0002] Silicon carbide (SiC), a typical representative of third-generation wide-bandgap semiconductor materials, possesses characteristics such as high critical breakdown field strength, high thermal conductivity, high electron saturation drift velocity, large bandgap, and strong radiation resistance. It has found widespread application in the new energy field. However, the yield of SiC wafers is generally low due to current manufacturing processes. Screening is done solely through traditional wafer probes for electrical performance testing, which is insufficient to effectively eliminate early device failures. SiC wafers must undergo high-temperature, electrical stress aging before they can be effectively rejected; therefore, aging tests must be performed in wafer aging test fixtures.

[0003] During wafer testing, the heating temperature of the wafer needs to be detected. However, existing wafer aging test fixtures detect the heating temperature of the wafer through temperature detection devices. However, the installation structure of each temperature detection device has the defects of being cumbersome to process and inconvenient to install. As a result, the temperature detection devices are prone to not being able to fully and adequately detect the heating temperature of the wafer due to improper layout. Summary of the Invention

[0004] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a temperature detection installation structure for a wafer aging test fixture, which facilitates the installation of the first temperature detection device, the second temperature detection device, the third temperature detection device, and the fourth temperature detection device, while making the processing more convenient, ensuring that each temperature detection device is properly arranged, and enabling comprehensive and sufficient detection of the wafer heating temperature.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A temperature detection mounting structure for a wafer aging test fixture includes an upper pin holder, a lower chuck, and a locking device. The lower chuck is fixed to the upper pin holder by the locking device, and the upper pin holder and the lower chuck form a venting cavity for introducing protective gas. A wafer carrier plate is disposed within the venting cavity. The wafer carrier plate is used to carry the wafer and transfer heat to the wafer. A first temperature detection device, a second temperature detection device, a third temperature detection device, and a fourth temperature detection device are respectively mounted on the wafer carrier plate. An embedding groove is provided on the side of the wafer carrier plate away from the lower chuck, and the embedding groove is used to install the first temperature detection device, the second temperature detection device, the third temperature detection device, and the fourth temperature detection device.

[0007] The first temperature detection device, the second temperature detection device, the third temperature detection device, and the fourth temperature detection device are all temperature sensors.

[0008] The lower chuck is equipped with a probe device that is electrically connected to the cables of the first temperature detection device, the second temperature detection device, the third temperature detection device, and the fourth temperature detection device.

[0009] The wafer carrier disk is detachably fixed to the lower chuck.

[0010] The wafer carrier disk is fixed to the lower chuck by locking screws.

[0011] The wafer carrier disk is positioned on the lower chuck by a positioning pin.

[0012] The lower chuck is also equipped with a sealing ring for sealing between the wafer carrier disk and the lower chuck.

[0013] The lower chuck is provided with an annular groove for embedding the sealing ring.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This utility model provides a temperature detection mounting structure for a wafer aging test fixture. By providing an embedding groove on the side of the wafer carrier disk away from the lower chuck, and by reasonably setting the embedding groove, it facilitates the installation of the first, second, third, and fourth temperature detection devices, while also making the processing more convenient. It ensures that the first, second, third, and fourth temperature detection devices are properly positioned to comprehensively and fully detect the heating temperature of the wafer. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model.

[0017] Figure 2 This is a cross-sectional view of the present invention.

[0018] Figure 3 This is a schematic diagram showing the separated state of the upper needle holder and the lower chuck.

[0019] Figure 4 This is a bottom view of the lower chuck.

[0020] Figure 5 This is an exploded view of the locking device.

[0021] Among them, 10 is the upper needle holder; 20 is the lower chuck; 30 is the locking device; 31 is the locking nut; 40 is the locking component; 41 is the mounting base; 42 is the connecting component; 43 is the spring; 44 is the non-removable screw; 45 is the gasket; 50 is the venting chamber; 81 is the first temperature detection device; 82 is the second temperature detection device; 83 is the third temperature detection device; 84 is the fourth temperature detection device; 90 is the wafer carrier; 91 is the probe device; 92 is the sealing ring; and 93 is the embedded annular groove. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0023] like Figure 1-5 As shown, a temperature detection mounting structure for a wafer aging test fixture includes an upper pin holder 10, a lower chuck 20, and a locking device 30. The lower chuck 20 is fixed to the upper pin holder 10 by the locking device 30, and the upper pin holder 10 and the lower chuck 20 form a venting cavity 50 for introducing protective gas. A wafer carrier 90 is disposed within the venting cavity 50. The wafer carrier 90 is used to carry the wafer and transfer heat to the wafer. A first temperature detection device 81, a second temperature detection device 82, a third temperature detection device 83, and a fourth temperature detection device 84 are respectively mounted on the wafer carrier 90 for detecting temperature. An embedding groove is provided on the side of the wafer carrier 90 away from the lower chuck 20, and the embedding groove is used to install the first temperature detection device 81, the second temperature detection device 82, the third temperature detection device 83, and the fourth temperature detection device 84.

[0024] During use, the wafer is placed in the venting cavity 50 for testing. The wafer is supported by a wafer carrier 90, which is in direct contact with the wafer. The wafer carrier 90 heats the wafer uniformly through heat conduction. During the heating process, the temperature of the center and periphery of the wafer carrier 90 can be detected by the first temperature detection device 81, the second temperature detection device 82, the third temperature detection device 83, and the fourth temperature detection device 84. Since the wafer carrier 90 heats the wafer uniformly through heat conduction, the heating temperature of the wafer can be reflected by the detection of the first temperature detection device 81, the second temperature detection device 82, the third temperature detection device 83, and the fourth temperature detection device 84. Therefore, the temperature detection mounting structure of the wafer aging test fixture provided by this utility model ensures that the first temperature detection device 81, the second temperature detection device 82, the third temperature detection device 83, and the fourth temperature detection device 84 are properly positioned by setting an embedding groove on the side of the wafer carrier 90 away from the lower chuck 20. This allows for comprehensive detection of the temperature differences of the wafer heating in different areas, thus ensuring a thorough and complete detection of the wafer heating temperature and preventing local overheating or uneven cooling through monitoring.

[0025] The first temperature detection device 81, the second temperature detection device 82, the third temperature detection device 83, and the fourth temperature detection device 84 are all temperature sensors, which can detect temperature while reducing costs.

[0026] As a further preferred embodiment of the present invention, the lower chuck 20 may also be provided with a probe device 91 that is electrically connected to the cables of the first temperature detection device 81, the second temperature detection device 82, the third temperature detection device 83, and the fourth temperature detection device 84.

[0027] The wafer carrier 90 is detachably fixed to the lower chuck 20, which facilitates the individual replacement of the wafer carrier 90 and reduces overall maintenance costs. Specifically, the wafer carrier 90 is fixed to the lower chuck 20 with locking screws to facilitate the disassembly of the wafer carrier 90 and reduce costs.

[0028] The wafer carrier 90 is positioned on the lower chuck 20 by a positioning pin, which facilitates the positioning between the wafer carrier 90 and the lower chuck 20, and facilitates the installation and fixation between the wafer carrier 90 and the lower chuck 20.

[0029] The lower chuck 20 is also equipped with a sealing ring 92 for sealing between the wafer carrier 90 and the lower chuck 20. By adopting the above structure, the sealing performance between the wafer carrier 90 and the lower chuck 20 can be improved, and leakage of protective gas from the wafer carrier 90 and the lower chuck 20 can be prevented.

[0030] The lower chuck 20 is provided with an annular groove 93 for embedding the sealing ring 92. The annular groove 93 ensures that the sealing ring 92 is installed in a precise position, prevents displacement or extrusion deformation, and improves sealing reliability.

[0031] The locking device 30 can be any type of locking device available on the market, as long as it can fix the lower chuck 20 and the upper pin holder 10 together.

[0032] In a preferred embodiment of this utility model, the locking device 30 includes a locking nut 31 and a locking component 40; the locking nut 31 is disposed on the lower chuck 20; the locking component 40 is disposed on the upper needle holder 10 and includes a mounting base 41, a connecting component 42, and a spring 43; the mounting base 41 is detachably fixed to the upper needle holder 10; the connecting component 42 passes through the mounting base 41, and the spring 43 abuts against the mounting base 41 and the connecting component 42; the connecting component 42 includes a captive screw 44, which passes through the mounting base 41, and the connecting end of the captive screw 44 engages with the locking nut 31, allowing for easy replacement of the captive screw 44 by removing the locking component 40 as a whole from the upper needle holder 10. The connecting component 42 also includes a washer 45 abutting against the captive screw 44, and the spring 43 abuts against the washer 45.

[0033] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A temperature detection mounting structure for a wafer aging test fixture, characterized in that: The device includes an upper needle holder (10), a lower chuck (20), and a locking device (30). The lower chuck (20) is fixed to the upper needle holder (10) by the locking device (30), and the upper needle holder (10) and the lower chuck (20) form a venting cavity (50) for introducing protective gas. A wafer carrier is provided in the venting cavity. The wafer carrier is used to carry the wafer and to transfer heat to the wafer. A first temperature detection device (81), a second temperature detection device (82), a third temperature detection device (83), and a fourth temperature detection device (84) are installed on the wafer carrier. An embedding groove is provided on the side of the wafer carrier away from the lower chuck, and the embedding groove is used to install the first temperature detection device (81), the second temperature detection device (82), the third temperature detection device (83), and the fourth temperature detection device (84).

2. The temperature detection mounting structure of the wafer aging test fixture as described in claim 1, characterized in that: The first temperature detection device (81), the second temperature detection device (82), the third temperature detection device (83), and the fourth temperature detection device (84) are all temperature sensors.

3. The temperature detection mounting structure of the wafer aging test fixture as described in claim 1, characterized in that: The lower chuck (20) is provided with a probe device (91) that is electrically connected to the cables of the first temperature detection device (81), the second temperature detection device (82), the third temperature detection device (83), and the fourth temperature detection device (84).

4. The temperature detection mounting structure of the wafer aging test fixture as described in claim 1, characterized in that: The wafer carrier disk is detachably fixed to the lower chuck (20).

5. The temperature detection mounting structure of the wafer aging test fixture as described in claim 4, characterized in that: The wafer carrier disk is fixed to the lower chuck (20) by locking screws.

6. The temperature detection mounting structure of the wafer aging test fixture as described in claim 5, characterized in that: The wafer carrier disk is positioned on the lower chuck (20) by a positioning pin.

7. The temperature detection mounting structure of the wafer aging test fixture as described in claim 1, characterized in that: The lower chuck (20) is also equipped with a sealing ring (92) for sealing between the wafer carrier disk and the lower chuck (20).

8. The temperature detection mounting structure of the wafer aging test fixture as described in claim 7, characterized in that: The lower chuck (20) is provided with an embedded annular groove (93) for the sealing ring (92) to be embedded.

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