Liquid cooling plate structure with water-drop-shaped flow blocking body

Abstract

The utility model discloses a liquid cooling plate structure with a water-drop-shaped flow blocking body, which comprises a metal aluminum stamping liquid cooling plate, and a cooling liquid inlet flow channel and a cooling liquid outlet flow channel are respectively formed on two sides of the width direction of the metal aluminum stamping liquid cooling plate; the water inlet and the water outlet are respectively communicated with the cooling liquid inlet flow channel and the cooling liquid outlet flow channel; the plurality of fluid blocking bodies are distributed on the surface of the metal aluminum stamping liquid cooling plate; the flow blocking bodies are provided with flow dividing ends, the direction of the flow dividing ends is opposite to the flow direction of the cooling liquid, and the cooling liquid flowing through the corresponding flow blocking bodies is divided to the two sides of the flow blocking bodies through the flow dividing ends. The liquid cooling plate structure is integrated at the bottom of the BDU device, the liquid cooling area is provided with the water-drop-shaped flow blocking body, liquid can be effectively shunted through the water-drop-shaped flow blocking body, cooling liquid with better temperature uniformity takes away heat of a relay inverted connection point copper bar / aluminum bar, the copper bar / aluminum bar keeps the maximum comprehensive heat dissipation coefficient, and the heat dissipation efficiency of the relay inverted connection point copper bar / aluminum bar is improved. Therefore, the current-carrying capability of the copper bar / aluminum bar is improved.

Description

Technical Field

[0001] This utility model relates to the field of new energy power battery technology, and in particular to a liquid cooling plate structure with a water droplet-shaped fluid blocking feature. Background Technology

[0002] With the rapid development of new energy power batteries, the need to cope with fast charging and supercharging, and to achieve 360kW-level ultra-high power charging, has a direct impact on the heating problem of existing DC bus (BDU). The greater the current, the greater the heat generation of the copper bus, and the internal resistance will increase with the temperature, resulting in a large amount of energy loss.

[0003] In existing technologies, BDU heat dissipation problems are all addressed through passive cooling, with very few solutions involving adding a standard liquid cooling plate to the bottom. However, none of these solutions can guarantee a uniform temperature across all areas.

[0004] Therefore, based on the above-mentioned technical problems, those skilled in the art urgently need to develop a liquid cooling plate structure with a teardrop-shaped fluid-blocking structure. Utility Model Content

[0005] The purpose of this invention is to provide a liquid cooling plate structure with a water droplet-shaped flow barrier. This structure mainly solves the problem of heat generation when the copper busbar is subjected to excessive current, and provides an effective heat dissipation measure. At the same time, by designing a liquid cooling channel at the bottom of the BDU, the heat dissipation coefficient is improved by solving the problem of heat concentration. The water droplet-shaped flow barrier evenly distributed on the surface of the liquid cooling plate can effectively divert the liquid, making the temperature more uniform. The coolant carries away the heat of the copper busbar at the inverted connection point of the relay.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] This utility model discloses a liquid cooling plate structure with a water droplet-shaped fluid-blocking structure, which is integrated into the bottom of the BDU device;

[0008] The cooling plate structure includes:

[0009] A metal aluminum stamping liquid cooling plate, wherein the two sides of the metal aluminum stamping liquid cooling plate are respectively formed as a coolant inlet channel and a coolant outlet channel in the width direction;

[0010] The inlet and outlet are respectively connected to the coolant inlet channel and the coolant outlet channel; and

[0011] Multiple fluid baffles are distributed on the surface of the aluminum stamping liquid cooling plate;

[0012] The fluid barrier has a diversion end, and the orientation of the diversion end is opposite to the flow direction of the coolant. The coolant diverts the coolant flowing through the corresponding fluid barrier to both sides of the fluid barrier through the diversion end.

[0013] Furthermore, the aluminum stamping liquid cooling plate includes an integrally formed first liquid cooling plate area and a second liquid cooling plate area;

[0014] The width of the first liquid cooling plate area is smaller than that of the second liquid cooling plate area, and the inlet and the outlet are located in the first liquid cooling plate area;

[0015] The aluminum stamping liquid cooling plate is provided with a partition along its length axis, which divides the aluminum stamping liquid cooling plate into a coolant inlet channel and a coolant outlet channel on the left and right sides.

[0016] Furthermore, one end of the partition is connected to the end of the first liquid cooling plate area, and the other end extends toward the end of the second liquid cooling plate area, with a certain gap reserved between it and the end of the second liquid cooling plate area.

[0017] The gap is a coolant flow channel between the coolant inlet channel and the coolant outlet channel.

[0018] Furthermore, the surface of the region of the second liquid cooling plate that matches the partition plate protrudes to form the fluid barrier.

[0019] Furthermore, the fluid barrier includes:

[0020] The first and second ends of the fluid-blocking device;

[0021] The first end of the fluid-blocking device is a sharp end, and the first end of the fluid-blocking device is formed as the diversion end through the sharp end;

[0022] The second end of the fluid barrier is an arc end, and the first end of the fluid barrier and the second end of the fluid barrier are connected by a slope.

[0023] Furthermore, the fluid baffles are arranged in multiple rows, and the number of fluid baffles in adjacent rows is not equal.

[0024] Furthermore, from the first liquid cooling plate region to the second liquid cooling plate region, the number of the fluid baffles in the odd-numbered rows is twice the number of the fluid baffles in the even-numbered rows;

[0025] Furthermore, the even-numbered rows of fluid deflectors are positioned between two adjacent fluid deflectors in the odd-numbered rows.

[0026] Furthermore, the BDU device includes:

[0027] A BDU base disposed on the upper surface of the liquid cooling plate structure; and

[0028] The BDU top cover is assembled and fixed to the BDU base;

[0029] The BDU base integrates a fuse and multiple inverted relays, and the connection points of the fuse and the relays are connected to copper busbars / aluminum busbars.

[0030] The BDU device also has a Hall sensor connected to a copper busbar / aluminum busbar;

[0031] The copper / aluminum busbars are connected to the bottom liquid cooling plate structure via connecting columns and come into contact with the internal coolant.

[0032] In the above technical solution, the liquid cooling plate structure with a teardrop-shaped fluid-blocking feature provided by this utility model has the following beneficial effects:

[0033] The liquid cooling plate structure of this utility model is integrated into the bottom of the BDU device, and its liquid cooling area is designed with a water droplet-shaped fluid baffle. The water droplet-shaped fluid baffle can effectively divert the liquid, allowing the coolant to carry away the heat of the copper / aluminum busbar at the relay inverted connection point, thus maintaining the maximum comprehensive heat dissipation coefficient of the copper / aluminum busbar and improving the current carrying capacity of the copper / aluminum busbar.

[0034] The liquid cooling plate structure of this utility model effectively reduces the material cost and size of the copper / aluminum busbars inside the BDU. Furthermore, the copper / aluminum busbars of the BDU relays are not affected by ambient temperature. The independent uniform temperature cooling system can ensure a stable temperature rise, making the system safer to operate and extending its service life. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0036] Figure 1 This is a schematic diagram of the liquid cooling plate structure with a water droplet-shaped fluid-blocking feature disclosed in an embodiment of this application;

[0037] Figure 2 This is a diagram showing the arrangement of the fluid-blocking liquid-cooled plate structure with teardrop-shaped fluid-blocking features disclosed in an embodiment of this application.

[0038] Figure 3 This is a schematic diagram of the liquid cooling plate structure with a water droplet-shaped fluid-blocking feature disclosed in an embodiment of this application.

[0039] Figure 4 This is a schematic diagram of a liquid cooling plate structure with a teardrop-shaped fluid-blocking feature integrated at the bottom of a BDU device, as disclosed in an embodiment of this application.

[0040] Figure 5This is a diagram showing the arrangement of internal components after the top cover of the BDU is removed, when the liquid cooling plate structure with a teardrop-shaped fluid-blocking feature disclosed in this application is integrated into the bottom of the BDU device.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100. Liquid-cooled plate structure; 200. BDU device;

[0043] 1. Metal aluminum stamped liquid cooling plate; 2. Fluid baffle;

[0044] 101. First liquid cooling plate area; 102. Second liquid cooling plate area; 103. Coolant inlet channel; 104. Coolant outlet channel; 105. Baffle; 106. Coolant flow channel; 107. Inlet; 108. Outlet;

[0045] 201. First end of the flow barrier; 202. Second end of the flow barrier; 203. Inclined surface;

[0046] 301. BDU base; 302. BDU top cover;

[0047] 401. Fuse; 402. Relay; 403. Hall effect sensor; 404. Copper busbar / aluminum busbar. Detailed Implementation

[0048] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0049] See Figures 1 to 5 As shown;

[0050] This embodiment discloses a liquid cooling plate structure with a water droplet-shaped fluid-blocking structure, the cooling plate structure 100 being integrated into the bottom of the BDU device 200;

[0051] The cooling plate structure 100 includes:

[0052] A metal aluminum stamping liquid cooling plate 1 has a coolant inlet channel 103 and a coolant outlet channel 104 formed on both sides in the width direction of the metal aluminum stamping liquid cooling plate 1.

[0053] The inlet 107 and outlet 108 are respectively connected to the coolant inlet channel 103 and the coolant outlet channel 104; and

[0054] Multiple fluid baffles 2 are distributed on the surface of the aluminum stamping liquid cooling plate 1;

[0055] The baffle 2 has a split end, and the direction of the split end is opposite to the flow direction of the coolant. The coolant that flows through the corresponding baffle 2 is split to both sides of the baffle 2 through the split end.

[0056] Specifically, this embodiment discloses a novel liquid cooling plate structure 100, which is integrated into the bottom of the BDU device 200. First, the main body of the liquid cooling plate structure 100 in this embodiment is made of aluminum stamping liquid cooling plate 1, which is divided into coolant inlet channels 103 on the left and right sides and coolant outlet channels 104. The coolant enters the coolant inlet channel 103 from the inlet 107, and then flows into the coolant outlet channel 104 through the diversion of multiple baffles 2, and finally exits from the outlet 108, thereby forming a coolant circulation.

[0057] Preferably, the aluminum stamping liquid cooling plate 1 in this embodiment includes an integrally formed first liquid cooling plate region 101 and a second liquid cooling plate region 102;

[0058] The width of the first liquid cooling plate region 101 is smaller than that of the second liquid cooling plate region 102, and the inlet 107 and the outlet 108 are located in the first liquid cooling plate region 101.

[0059] A partition 105 is provided along the axis of the aluminum stamping liquid cooling plate 1 along its length direction. The partition 105 divides the aluminum stamping liquid cooling plate 1 into a coolant inlet channel 103 and a coolant outlet channel 104 on the left and right sides.

[0060] Furthermore, in this embodiment, the aluminum stamping liquid cooling plate 1 is also provided with the aforementioned partition 105. One end of the partition 105 is connected to the end of the first liquid cooling plate region 101, and the other end extends toward the end of the second liquid cooling plate region 102, with a certain gap reserved between it and the end of the second liquid cooling plate region 102. This gap is a coolant flow channel 106 between the coolant inlet channel 103 and the coolant outlet channel 104.

[0061] In this embodiment, the surface of the area where the second liquid cooling plate region 102 matches the partition 105 is protruding and formed with a fluid-blocking 2.

[0062] This embodiment further defines the structure of the aluminum stamping liquid cooling plate 1. Firstly, it is divided into left and right parts by a partition 105 extending along its longitudinal axis, namely the aforementioned coolant inlet channel 103 and coolant outlet channel 104. Secondly, at the position where the second liquid cooling plate region 102 and the partition 105 mate, that is, the portion of the second liquid cooling plate region 102 excluding the lower coolant flow channel 106 protrudes to form multiple rows of baffles for the fluid 2.

[0063] Preferably, this embodiment further defines the structure of the fluid baffle 2. The fluid baffle 2 in this embodiment mainly diverts the coolant to both sides of the fluid baffle in the direction of coolant flow, thereby achieving the diversion effect. Specifically, the fluid baffle 2 in this embodiment includes a first fluid baffle end 201 and a second fluid baffle end 202.

[0064] The end of the first fluid-blocking end 201 is a sharp end, and the first fluid-blocking end 201 is formed as a flow-diverting end through the sharp end;

[0065] The second end 202 of the fluid barrier is an arc end, and the first end 201 of the fluid barrier and the second end 202 of the fluid barrier are connected by a slope 203.

[0066] This embodiment further defines the structure of the fluid baffle 2, which is "teardrop-shaped", specifically including a first end 201 and a second end 202. The first end 201 is a diversion end, and the second end 202 is an arc end. The overall structure gradually increases in size from the first end 201 to the second end 202, and then gradually decreases, similar to the shape of a water droplet. The main function is the sharp end structure of the first end 201. When the coolant flows through this point, the coolant is diverted to both sides of the fluid baffle 2 by the sharp end of the first end 201. In this way, the uniform temperature of the entire aluminum stamping liquid cooling plate 1 is achieved by arranging the fluid baffle 2.

[0067] Preferably, in this embodiment, the fluid blocking 2 is provided in multiple rows, and the number of fluid blocking 2 in adjacent rows is not equal.

[0068] More preferably, from the first liquid cooling plate region 101 to the second liquid cooling plate region 102, the number of the odd-numbered rows of baffles 2 is twice the number of the even-numbered rows of baffles 2; and the even-numbered rows of baffles 2 are arranged between two adjacent baffles 2 in the odd-numbered rows.

[0069] As an extended implementation, in this embodiment, the arrangement of the baffles 2 can be designed such that there are 8 baffles 2 in odd-numbered rows, i.e., 4 each in the coolant inlet channel 103 and the coolant outlet channel 104; and 4 baffles 2 in even-numbered rows, i.e., 2 each in the coolant inlet channel 103 and the coolant outlet channel 104. According to the limitations of the above embodiment, the even-numbered rows of baffles 2 need to be arranged in the area between two adjacent baffles 2 in the odd-numbered rows, see [reference]. Figures 1 to 3 As shown.

[0070] See Figure 4 and Figure 5 As shown, this embodiment further defines the structure of the BDU device 200, specifically as follows:

[0071] The BDU device 200 of this embodiment includes a BDU base 301 disposed on the upper surface of the liquid cooling plate structure 100; and a BDU top cover 302 assembled and fixed with the BDU base 301; the BDU base 301 integrates a fuse 401 and a plurality of inverted relays 402, and the connection points of the fuse 401 and the connection points of the relays 402 are all connected to the copper busbar / aluminum busbar 404.

[0072] The BDU device 200 also has a Hall sensor 403 connected to the copper busbar / aluminum busbar 404;

[0073] The copper / aluminum busbar 404 is connected to the bottom liquid cooling plate structure 100 via connecting columns and comes into contact with the internal coolant.

[0074] The current-carrying capacity of the copper / aluminum busbar 404 inside the BDU is reflected in the temperature rise, while the current-carrying capacity of the copper / aluminum busbar 404 is determined by the temperature rise, cross-sectional area, current, internal resistance, and the comprehensive heat dissipation coefficient Kt of the conductor surface, where Kt = (I 2 R = Kt * A * ΔT).

[0075] This embodiment improves the surface heat dissipation coefficient of the copper / aluminum busbar 404 by using a bottom-temperature homogenizing method, thereby increasing the current carrying capacity of the corresponding copper / aluminum busbar 404 and meeting the requirements of high-power supercharging.

[0076] In the above technical solution, the liquid cooling plate structure with a teardrop-shaped fluid-blocking feature provided by this utility model has the following beneficial effects:

[0077] The liquid cooling plate structure 100 of this utility model is integrated into the bottom of the BDU device 200, and its liquid cooling area is designed with a water droplet-shaped fluid baffle 2. The water droplet-shaped fluid baffle 2 can effectively divert the liquid, allowing the coolant to carry away the heat of the copper busbar / aluminum busbar 404 at the inverted connection point of the relay 402, so that the copper busbar / aluminum busbar 404 maintains the maximum comprehensive heat dissipation coefficient, thereby improving the current carrying capacity of the copper busbar / aluminum busbar 404.

[0078] The liquid cooling plate structure 100 of this utility model effectively reduces the material cost and size of the copper / aluminum busbar 404 inside the BDU, and the copper / aluminum busbar 404 of the BDU relay is not affected by the ambient temperature. The independent uniform temperature cooling system can ensure a stable temperature rise, making the system operate more safely and extending its service life.

[0079] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A liquid-cooled plate structure with a teardrop-shaped fluid-blocking feature, characterized in that, The liquid-cooled plate structure (100) is integrated into the bottom of the BDU device (200); The liquid cooling plate structure (100) includes: A metal aluminum stamping liquid cooling plate (1) has a coolant inlet channel (103) and a coolant outlet channel (104) formed on both sides in the width direction of the metal aluminum stamping liquid cooling plate (1); An inlet (107) and an outlet (108) respectively connected to the coolant inlet channel (103) and the coolant outlet channel (104); and Multiple fluid baffles (2) are distributed on the surface of the aluminum stamping liquid cooling plate (1); The baffle (2) has a split end, and the direction of the split end is opposite to the flow direction of the coolant. The coolant is split by the split end to the two sides of the baffle (2) from the coolant flowing through the corresponding baffle (2).

2. The liquid-cooled plate structure with teardrop-shaped fluid-blocking structure according to claim 1, characterized in that, The aluminum stamping liquid cooling plate (1) includes an integrally formed first liquid cooling plate region (101) and a second liquid cooling plate region (102); The width of the first liquid cooling plate region (101) is smaller than that of the second liquid cooling plate region (102), and the inlet (107) and the outlet (108) are located in the first liquid cooling plate region (101); The aluminum stamping liquid cooling plate (1) is provided with a partition (105) along its length axis. The partition (105) divides the aluminum stamping liquid cooling plate (1) into a coolant inlet channel (103) and a coolant outlet channel (104) on the left and right sides.

3. The liquid-cooled plate structure with teardrop-shaped fluid-blocking structure according to claim 2, characterized in that, One end of the partition (105) is connected to the end of the first liquid cooling plate area (101), and the other end extends toward the end of the second liquid cooling plate area (102) with a certain gap reserved between it and the end of the second liquid cooling plate area (102). The gap is a coolant flow channel (106) between the coolant inlet channel (103) and the coolant outlet channel (104).

4. The liquid-cooled plate structure with teardrop-shaped fluid-blocking structure according to claim 3, characterized in that, The surface of the area of ​​the second liquid cooling plate region (102) that matches the partition (105) is formed with the fluid barrier (2).

5. The liquid-cooled plate structure with teardrop-shaped fluid-blocking structure according to claim 4, characterized in that, The fluid barrier (2) includes: The first end (201) and the second end (202) of the fluid barrier; The end of the first fluid-blocking end (201) is a sharp end, and the first fluid-blocking end (201) is formed as the diversion end through the sharp end; The second end (202) of the fluid barrier is an arc end, and the first end (201) of the fluid barrier and the second end (202) of the fluid barrier are connected by a slope (203).

6. The liquid-cooled plate structure with teardrop-shaped fluid-blocking structure according to claim 5, characterized in that, The fluid baffles (2) are arranged in multiple rows, and the number of fluid baffles (2) in adjacent rows is not equal.

7. The liquid-cooled plate structure with teardrop-shaped fluid-blocking structure according to claim 6, characterized in that, From the first liquid cooling plate region (101) to the second liquid cooling plate region (102), the number of the baffles (2) in the odd-numbered rows is twice the number of the baffles (2) in the even-numbered rows; The even-numbered rows of baffles (2) are arranged between two adjacent baffles (2) in the odd-numbered rows.

8. The liquid-cooled plate structure with a teardrop-shaped fluid-blocking feature according to any one of claims 1 to 7, characterized in that, The BDU device (200) includes: A BDU base (301) disposed on the upper surface of the liquid cooling plate structure (100); and A BDU top cover (302) is assembled and fixed to the BDU base (301); The BDU base (301) integrates a fuse (401) and multiple inverted relays (402), and the connection points of the fuse (401) and the relays (402) are connected to the copper busbar / aluminum busbar (404). The BDU device (200) also has a Hall sensor (403) connected to the copper busbar / aluminum busbar (404); The copper / aluminum busbar (404) is connected to the bottom liquid cooling plate structure (100) via a connecting column and contacts the internal coolant.

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