A smartphone mainboard

Abstract

This utility model relates to a smartphone motherboard, including a board body. Several evenly distributed mounting slots are formed on the top of the board body near the front and rear sides. Several evenly distributed mounting holes are formed in the middle of the top of the board body. Grooves are formed on the top of the board body near the left and right sides. An extension plate is slidably connected within each groove. Insertion slots are formed on the inner walls of the front and rear sides of the grooves, and the extension plate is inserted into the insertion slots. A first threaded hole is formed on the top of the extension plate near the inner wall of the groove. This technical solution, through the cooperation of components such as grooves, insertion slots, extension plates, and guide grooves, enables effective airflow guidance, thereby achieving effective and sufficient heat dissipation, improving airflow speed and heat dissipation efficiency. Furthermore, its effective extension allows it to adapt to installation in different positions, thus improving its adaptability and usage efficiency.

Description

Technical Field

[0001] This utility model relates to the field of smartphone technology, specifically to a smartphone motherboard. Background Technology

[0002] With the development of technology, smartphones have become necessities in life. A smartphone, like a personal computer, has its own operating system and independent running space. Users can install software, games, navigation apps, and other programs provided by third-party service providers, and can access wireless networks via mobile communication networks. The operation of a smartphone mainly relies on its motherboard, also known as the mainboard, system board, logic board, motherboard, or baseboard. It is the core or main circuit board of a complex electronic system, such as a computer. In short, the phone's motherboard is the heart of a smartphone.

[0003] For example, the smartphone motherboard with high heat dissipation efficiency disclosed in application number 201911106456.5 can improve the efficiency and effect of heat dissipation when the motherboard generates a lot of heat, thereby ensuring the service life and performance of the motherboard and facilitating its use. However, the above structure cannot effectively guide airflow during use, thus preventing effective and sufficient heat dissipation, reducing its airflow speed and heat dissipation efficiency, and it cannot be effectively extended, thus making it unsuitable for installation in different positions, thereby limiting its adaptability and reducing its efficiency. Therefore, we propose a smartphone motherboard. Utility Model Content

[0004] To address the shortcomings of existing technologies, this application proposes a smartphone motherboard that can effectively guide airflow, thereby enabling effective and sufficient heat dissipation and improving its airflow speed and heat dissipation efficiency.

[0005] This utility model provides the following technical solution: a smartphone motherboard, including a board body, wherein a plurality of evenly distributed mounting grooves are respectively opened on the top of the board body near the front and rear sides, a plurality of evenly distributed mounting holes are opened in the middle of the top of the board body, and grooves are respectively opened on the top of the board body near the left and right sides, and an extension plate is slidably connected in the groove.

[0006] As a preferred embodiment of this utility model, the inner walls of the front and rear sides of the groove are respectively provided with insertion slots, and the extension plate is inserted into the insertion slots.

[0007] As a preferred embodiment of this utility model, a first threaded hole is provided at the top of the extension plate near the inner wall of the groove, and a plurality of evenly distributed second threaded holes matching the first threaded hole are provided at the bottom of the inner cavity of the groove.

[0008] As a preferred embodiment of this utility model, the first threaded hole and the corresponding second threaded hole are fitted with the same fastening screw, and the two extension plates are arranged symmetrically about the central axis of the plate body.

[0009] As a preferred embodiment of this utility model, a circular groove is provided at the bottom of the extension plate, and a fan is installed in the circular groove.

[0010] As a preferred embodiment of this utility model, the top of the extension plate is provided with a plurality of evenly distributed guide grooves, and the guide grooves are connected to the interior of the circular groove.

[0011] As a preferred embodiment of this utility model, the top of the extension plate is provided with docking holes near the front and rear sides, and the two docking holes are arranged symmetrically about the central axis of the extension plate.

[0012] The beneficial effects of this utility model are: through the cooperation between components such as grooves, insertion slots, extension plates and guide slots, this technical solution can effectively guide airflow, thereby enabling effective and sufficient heat dissipation, improving its airflow speed and heat dissipation efficiency, and can effectively extend, thus adapting to installation in different positions, thereby enabling effective installation, improving its adaptability and usage efficiency. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 for Figure 1 A three-dimensional view viewed from below; Figure 3 for Figure 1 Partial 3D view of the middle plate and groove components; Figure 4 for Figure 1 Partial 3D view of components such as the central circular groove and the guide groove; Figure 5 for Figure 4 A three-dimensional image viewed from below.

[0014] In the diagram: 1. Plate; 2. Mounting groove; 3. Butt hole; 4. Fastening screw; 5. Mounting hole; 6. Extension plate; 7. Fan; 8. Guide groove; 9. Circular groove; 10. Second threaded hole; 11. Groove; 12. Insertion groove; 13. First threaded hole. Detailed Implementation

[0015] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. Example

[0016] like Figures 1 to 5 As shown, a smartphone motherboard includes: a board body 1, a plurality of evenly distributed mounting grooves 2 are respectively opened on the top of the board body 1 near the front and rear sides, a plurality of evenly distributed mounting holes 5 are opened in the middle of the top of the board body 1, and grooves 11 are respectively opened on the top of the board body 1 near the left and right sides, and an extension plate 6 is slidably connected in the groove 11.

[0017] The inner walls of the front and rear sides of the groove 11 are respectively provided with insertion slots 12, and the extension plate 6 is inserted into the insertion slots 12. The top of the extension plate 6 is provided with a first threaded hole 13 near the inner wall of the groove 11. The bottom of the inner cavity of the groove 11 is provided with several evenly distributed second threaded holes 10 that match the first threaded holes 13. The first threaded hole 13 and the corresponding second threaded hole 10 are fitted with the same fastening screw 4. The two extension plates 6 are arranged symmetrically about the central axis of the plate body 1.

[0018] In this embodiment, it is designed to effectively guide airflow, thereby enabling effective and sufficient heat dissipation, which improves its airflow speed and heat dissipation efficiency.

[0019] The bottom of the extension plate 6 is provided with a circular groove 9, and a fan 7 is installed in the circular groove 9. The top of the extension plate 6 is provided with several evenly distributed guide grooves 8, and the guide grooves 8 are connected to the interior of the circular groove 9. The top of the extension plate 6 is provided with docking holes 3 near the front and rear sides, and the two docking holes 3 are arranged symmetrically about the central axis of the extension plate 6.

[0020] Implementation plan: This allows for effective extension, enabling it to adapt to different installation locations, thereby improving its adaptability and efficiency.

[0021] Working principle: In use, electrical components can be welded and installed through the mounting slot 2 and mounting hole 5. Then, the fastening screw 4 is removed, and the extension plate 6 is pulled to slide in the groove 11 and the insertion slot 12, so that it can be effectively extended, thereby adapting to different installation positions and improving its adaptability and efficiency. When the position adjustment is completed, the fastening screw 4 is tightened to fix it, and it is installed in the required position through the docking hole 3 and bolts. When it is working, the fan 7 rotates and guides the air through the guide groove 8 to the top of the plate body 1, so that it can effectively guide the airflow and achieve effective and sufficient heat dissipation, thereby improving its air circulation speed and heat dissipation efficiency.

[0022] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0023] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A smartphone motherboard, characterized in that, The plate (1) includes a plate body (1), which has several evenly distributed mounting grooves (2) on the top of the plate body (1) near the front and rear sides, several evenly distributed mounting holes (5) on the top center of the plate body (1), and grooves (11) on the top of the plate body (1) near the left and right sides, with an extension plate (6) slidably connected in the groove (11).

2. A smartphone motherboard according to claim 1, characterized in that, The inner walls of the front and rear sides of the groove (11) are respectively provided with insertion slots (12), and the extension plate (6) is inserted into the insertion slots (12).

3. A smartphone motherboard according to claim 2, characterized in that, The top of the extension plate (6) is provided with a first threaded hole (13) near the inner wall of the groove (11), and the bottom of the inner cavity of the groove (11) is provided with a number of evenly distributed second threaded holes (10) that match the first threaded hole (13).

4. A smartphone motherboard according to claim 3, characterized in that, The first threaded hole (13) and the corresponding second threaded hole (10) are fitted with the same fastening screw (4), and the two extension plates (6) are arranged symmetrically about the central axis of the plate body (1).

5. A smartphone motherboard according to claim 4, characterized in that, The bottom of the extension plate (6) is provided with a circular groove (9), and a fan (7) is installed in the circular groove (9).

6. A smartphone motherboard according to claim 5, characterized in that, The top of the extension plate (6) is provided with several evenly distributed guide grooves (8), and the guide grooves (8) are connected to the interior of the circular groove (9).

7. A smartphone motherboard according to claim 6, characterized in that, The top of the extension plate (6) is provided with docking holes (3) near the front and rear sides, and the two docking holes (3) are arranged symmetrically about the central axis of the extension plate (6).

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