BMS PCB assembly and battery control unit including same

Abstract

The utility model discloses a BMS (Battery Management System) PCB (Printed Circuit Board) assembly body and a battery control unit comprising the BMS PCB assembly body. According to one aspect of the utility model, the BMS PCB assembly comprises a first PCB which can be electrically connected with an external BDU assembly; a second PCB coupled to the first PCB so as to be electrically conductive; and an insulating member located between the first PCB and the second PCB and coupled to the first PCB and the second PCB, respectively, the first PCB, the insulating member, and the second PCB may be stacked in order in a height direction.

Description

Technical Field

[0001] This utility model relates to a BMS (Battery Management System) PCB (Printed Circuit Board) assembly and a battery control unit including the BMS PCB assembly. More specifically, it relates to a BMS PCB assembly in which a BDU (Battery Disconnect Unit) for controlling the battery and the BMS are integrated into one unit and can maintain insulation between them, and to a battery control unit including the BMS PCB assembly. Background Technology

[0002] Electric vehicles (EVs) are a type of next-generation mobility solution. EVs eliminate the need for traditional fuels like diesel or gasoline, instead using electricity for propulsion. Compared to conventional vehicles that emit carbon dioxide and other pollutants, EVs are considered more environmentally friendly because they produce no additional byproducts during operation.

[0003] One of the core components of an electric vehicle is the battery. The battery is configured to supply the electricity required for the electric vehicle's operation and the function of other structures within the vehicle. Therefore, for the electric vehicle to operate stably, the battery needs to be controlled to supply the required amount of electricity to the appropriate locations.

[0004] For this purpose, a BMS (Battery Management System) and a BDU (Battery Disconnect Unit) can be configured together with the battery. The BMS determines (or judges) whether the battery supplies power to other structures or cuts off the power supply. In addition, the BDU is communicatively connected to the BMS and is configured to supply power to or cut off the power supply to the other structures based on the BMS's decision.

[0005] Therefore, for the stable operation of the battery and the battery-powered electric vehicle, the communication status between the BMS and BDU must remain reliable. This is especially important in electric vehicles, where, unlike other electronic devices, accidents can have fatal consequences for occupants.

[0006] Korean Patent Publication No. 10-2021-0133886 discloses a battery pack and an apparatus including the battery pack. Specifically, it discloses a battery pack and an apparatus including the battery pack, which includes: a BDU module connected to an HV line to control the electrical connection of the battery module; and a BMS module connected to an LV line to monitor and control the operation of the battery module.

[0007] However, the battery packs and devices including such battery packs disclosed in the existing literature do not provide a solution for maintaining a reliable connection between the BDU module and the BMS module. In the cases described in the existing literature, the BDU module and the BMS module are simply separate components connected to each other via arbitrary wires, and cannot be directly connected.

[0008] International Patent Publication No. 2019 / 117449 discloses a battery pack. Specifically, it discloses a battery pack in which the first circuit board and the second circuit board can be cooled by forming an airflow between the first circuit board, which functions as a BDU, and the second circuit board, which functions as a BMS.

[0009] However, the battery packs disclosed in the existing literature also have a first circuit board and a second circuit board, which are connected by separate structures. That is, the existing literature also fails to provide a solution for maintaining a reliable connection between the first and second circuit boards.

[0010] Furthermore, the existing literature, due to the separate setup and combination of BDU and BMS, cannot provide a solution to the problem of excessive space occupation.

[0011] Korean Patent Publication No. 10-2021-0133886 (November 8, 2021)

[0012] International Patent Publication No. 2019 / 117449 (June 20, 2019) Utility Model Content

[0013] Problems to be solved by utility models

[0014] This invention is intended to solve the above-mentioned problems. The purpose of this invention is to provide a BMS PCB assembly with a structure that enables reliable connection between the BDU and the BMS, and a battery control unit including the assembly.

[0015] Another objective of this invention is to provide a BMS PCB assembly with a structure in which multiple PCBs are electrically connected to each other and a battery control unit including the assembly, which can stably maintain the state of such connection.

[0016] Another objective of this invention is to provide a BMS PCB assembly and a battery control unit including the assembly, wherein, apart from the structure in which multiple PCBs are electrically connected to each other, other structures can be electrically insulated.

[0017] Another objective of this invention is to provide a BMS PCB assembly with a structure that can stably maintain the connection state of multiple PCBs and a battery control unit including the assembly.

[0018] Another objective of this invention is to provide a BMS PCB assembly and a battery control unit including the assembly, which can reduce the space occupied by the BDU and BMS to achieve miniaturization.

[0019] Another objective of this invention is to provide a BMS PCB assembly with a structure that can prevent arbitrary movement of the combined BDU and BMS, and a battery control unit including the assembly.

[0020] The technical problems of this utility model are not limited to those mentioned above. Those skilled in the art to which this utility model pertains can clearly understand other technical problems not mentioned through the following description.

[0021] means for solving problems

[0022] According to one aspect of the present invention, a BMS PCB assembly is provided, comprising: a first PCB electrically connected to an external BDU assembly; a second PCB electrically coupled to the first PCB; and an insulating member located between the first PCB and the second PCB, and coupled to the first PCB and the second PCB respectively, wherein the first PCB, the insulating member and the second PCB can be stacked sequentially in the height direction.

[0023] At this time, a BMS PCB assembly can be provided, wherein the insulating member includes: an insulating body supporting the first PCB and being supported by the second PCB; an insulating bonding hole formed through the interior of the insulating body; and a bonding member bonding with the insulating bonding hole and bonding with the first PCB or the second PCB.

[0024] Alternatively, a BMS PCB assembly can be provided, wherein the first PCB includes a first PCB coupling connector that can be electrically coupled to the second PCB, and the second PCB includes a second PCB coupling terminal that can be electrically coupled to the first PCB coupling connector, wherein the first PCB coupling connector and the second PCB coupling terminal are located on the outside of the insulating member in the horizontal direction.

[0025] At this time, a BMS PCB assembly can be provided, wherein the first PCB includes: a first PCB substrate covering at least a portion of the insulating member and electrically engaging with the first PCB using a connector; and a first fastening member engagement hole formed through the interior of the first PCB substrate, wherein multiple insulating engagement holes can be formed, and a portion of the multiple insulating engagement holes overlap with the first fastening member engagement hole in the height direction, and the engaging member passes through the first fastening member engagement hole and engages with the insulating engagement hole.

[0026] Alternatively, a BMS PCB assembly can be provided, wherein the second PCB includes: a second PCB substrate, at least a portion of which is covered by the insulating member, the second PCB substrate being electrically connected to the second PCB bonding terminal; and a second fastening member bonding hole formed through the interior of the second PCB substrate, wherein a plurality of the insulating bonding holes are formed, a portion of which are arranged to overlap with the second fastening member bonding hole in the height direction, and the bonding member passes through the second fastening member bonding hole and is bonded to the insulating bonding hole.

[0027] At this time, a BMS PCB assembly can be provided, wherein the connecting member is composed of a pair of portions arranged horizontally spaced apart, each of the pair of portions extending in the height direction, the diameter of the end of the connecting member being larger than the diameter of the other portions of the connecting member, and the connecting member being configured to snap fit with the insulating connecting hole, the first PCB and the second PCB.

[0028] Alternatively, a BMS PCB assembly can be provided, wherein the connecting member is configured as a screw member, and the connecting member is threadedly connected to the insulating connecting hole, the first PCB, and the second PCB.

[0029] At this time, a BMS PCB assembly can be provided, wherein the insulating member includes: a first insulating space formed inside the insulating body and open to one side of the first PCB; and a second insulating space formed inside the insulating body, physically separated from the first insulating space and open to one side of the second PCB.

[0030] Alternatively, a BMS PCB assembly can be provided, wherein the insulating body includes: an insulating surface located in the height direction between the first insulating space and the second insulating space, physically separating the first PCB and the second PCB; and an insulating edge extending along the outer periphery of the insulating surface and protruding in the height direction compared to the insulating surface, wherein the first PCB is mounted at one end of the insulating edge in the height direction, and the other end of the insulating edge in the height direction is mounted on the second PCB.

[0031] At this time, a BMS PCB assembly can be provided, wherein the insulating body includes: a pair of connector guides extending to one side of the insulating body from the outer periphery of the insulating surface and spaced apart in the width direction of the insulating body; and a connector receiving opening formed between the pair of connector guides to receive a second PCB connector disposed on the second PCB, wherein the connector receiving opening is formed on the side opposite to the insulating surface.

[0032] Additionally, according to one aspect of this utility model, a BMS PCB assembly can be provided, comprising: a cover having an internal space; a BDU assembly housed in the cover and electrically connected to an external battery cell; and a BMS PCB assembly coupled to and electrically connected to the BDU assembly, and supported by the cover. The BDU assembly includes: a BDU component housed in the cover and electrically connected to the battery cell; and a BDU housing coupled to the cover, located between the BDU component and the BMS PCB assembly, and coupled to and electrically connected to both the BDU component and the BMS PCB assembly. The PCB assembly includes: a first PCB electrically connected to the BDU assembly; a second PCB electrically coupled to the first PCB; and an insulating member located between the first PCB and the second PCB, coupled to both the first PCB and the second PCB respectively. The first PCB includes a first PCB coupling connector electrically coupled to the second PCB, and the second PCB includes a second PCB coupling terminal electrically coupled to the first PCB coupling connector. The insulating member is configured to insulate other structures in the first PCB except for the first PCB coupling connector and other structures in the second PCB except for the second PCB coupling terminal.

[0033] At this time, a BMS PCB assembly can be provided, wherein the first PCB includes: a first PCB substrate covering at least a portion of the insulating member and electrically connected to the first PCB via a connector; a first PCB terminal electrically connected to the first PCB substrate, extending toward the BDU housing and electrically connected to the BDU assembly; and a first PCB connector electrically connected to the first PCB substrate, protruding toward the BDU housing and electrically connected to the BDU assembly.

[0034] Alternatively, a BMS PCB assembly can be provided, wherein the second PCB includes: a second PCB substrate, at least a portion of which is covered by the insulating member, the second PCB substrate being electrically connected to the second PCB bonding terminal; and a second PCB connector, electrically connected to the second PCB substrate, located outside the insulating member and electrically connected to an external control power supply.

[0035] Utility Model Effect

[0036] Based on the above structure, the BMS PCB assembly and the battery control unit including the BMS PCB assembly according to the embodiments of the present invention can reliably connect the BDU and the BMS.

[0037] Furthermore, based on the above structure, the BMS PCB assembly and the battery control unit including the BMS PCB assembly according to the embodiments of the present invention can maintain a stable state in which multiple PCBs are electrically connected to each other.

[0038] Furthermore, according to the above structure, the BMS PCB assembly and the battery control unit including the BMS PCB assembly according to the present invention can make other structures, except for the structure in which multiple PCBs are electrically connected to each other, electrically insulated from each other.

[0039] Furthermore, based on the above structure, the BMS PCB assembly and the battery control unit including the BMS PCB assembly according to the embodiments of the present invention can keep the connection state of multiple PCBs stable.

[0040] Furthermore, based on the above structure, the BMS PCB assembly and the battery control unit including the BMS PCB assembly according to the present invention can reduce the space occupied by the BDU and BMS to achieve miniaturization.

[0041] Furthermore, based on the above structure, the BMS PCB assembly and the battery control unit including the BMS PCB assembly according to the present invention can prevent arbitrary movement of the combined BMS and BMS.

[0042] The effects of this utility model are not limited to those described above, but should be understood to include all effects that can be derived from the structure of the utility model as set forth in the detailed description of this utility model or the appended claims. Attached Figure Description

[0043] Figure 1 This is a perspective view showing a battery control unit according to an embodiment of the present invention.

[0044] Figure 2 It is shown Figure 1 An exploded perspective view of the battery control unit.

[0045] Figure 3 It shows the setting in Figure 1 A 3D view of the BMS PCB assembly of the battery control unit.

[0046] Figure 4 It is shown Figure 3 An exploded perspective view of the structure of the BMS PCB assembly.

[0047] Figure 5 It shows the setting in Figure 3 A three-dimensional view of the first PCB of the BMS PCB assembly.

[0048] Figure 6 It is shown Figure 5 The first front view of the PCB.

[0049] Figure 7 It is shown Figure 5 The first bottom view of the PCB.

[0050] Figure 8 It shows the setting in Figure 3 A three-dimensional view of the second PCB of the BMS PCB assembly.

[0051] Figure 9 It is shown Figure 8 The second PCB front view.

[0052] Figure 10 It is shown Figure 8 The second PCB plan view.

[0053] Figure 11 It is shown Figure 8 The bottom view of the second PCB.

[0054] Figure 12 It shows the setting in Figure 3 A three-dimensional view of the insulating components of the BMS PCB assembly.

[0055] Figure 13 It is shown Figure 12 A plan view of the insulating components.

[0056] Figure 14 It is shown Figure 13 A cross-sectional view of the insulating component.

[0057] Figures 15 to 16 It is shown Figure 3 A 3D view of the assembly process of the BMS PCB assembly.

[0058] Figure 17 It is shown Figure 3 A plan view of the BMS PCB assembly.

[0059] Figure 18 It is shown Figure 17 A bottom view of the BMS PCB assembly.

[0060] Figure 19 It is shown Figure 17 Front view of the BMS PCB assembly.

[0061] Figure 20 It is shown Figure 17 Rear view of the BMS PCB assembly.

[0062] Figure 21 It is shown Figure 17 Left view of the BMS PCB assembly.

[0063] Figure 22 It is shown Figure 17 Right view of the BMS PCB assembly.

[0064] Figure 23 It is shown Figure 17 BB cross-sectional view of the BMS PCB assembly.

[0065] Figure 24 It is shown Figure 17 CC cross-sectional view of the BMS PCB assembly.

[0066] Explanation of reference numerals in the attached figures

[0067] 1: Battery control unit; 10: Cover;

[0068] 11: Top cover; 12: Bottom cover;

[0069] 20: BDU assembly; 21: BDU housing;

[0070] 22: BDU assembly; 30: BMS PCB assembly;

[0071] 100: First PCB; 110: First PCB substrate;

[0072] 120: First PCB terminal; 130: First PCB connector;

[0073] 140: First PCB connector; 150: First fastening member mating hole;

[0074] 200: Second PCB; 210: Second PCB substrate;

[0075] 220: Second PCB connector; 230: Second PCB mating terminal;

[0076] 240: Second fastening component mating hole; 300: Insulating component;

[0077] 310: Insulating body; 311: Insulating surface;

[0078] 312: Insulating edge; 313: Connector guide;

[0079] 314: Connector receiving opening; 320: First insulation space;

[0080] 330: Second insulating space; 340: Insulating connection hole;

[0081] 350: Connecting component Detailed Implementation

[0082] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement them. The present invention can be implemented in various different forms and is not limited to the embodiments described herein. For clarity of illustration, parts unrelated to the description have been omitted from the drawings, and the same or similar structural elements are given the same reference numerals throughout the specification.

[0083] The words and terms used in this specification and the appended claims should not be construed as limited to their ordinary or dictionary meanings, but rather, in order to best describe the utility model, they should be interpreted as meanings and concepts consistent with the technical idea of ​​the utility model, in accordance with the principle that the inventor is able to define terms and concepts.

[0084] Therefore, the embodiments described in this specification and the structures shown in the accompanying drawings correspond to a preferred embodiment of the present invention, and do not represent all the technical ideas of the present invention. Thus, various equivalents and modifications of the corresponding structures can be derived from the perspective of the present invention.

[0085] In the following description, some structural elements may be omitted in order to make the features of this utility model clear.

[0086] The term "connection" as used in the following description means that one or more components can be fluidly connected to each other. In one embodiment, a connection can be formed by components such as conduits, pipes, and tubes. In the following description, a connection may be used in the same sense as one or more components being "fluidly connected" to each other.

[0087] As used in the following description, the term "energized" refers to the connection between one or more components that enables the transmission of current or electrical signals. In one embodiment, energization can be achieved in a wired manner using conductors or the like, or wirelessly using methods such as Bluetooth, Wi-Fi, or RFID (Radio Frequency Identification). In one embodiment, energization can also include the meaning of "communication."

[0088] As used in the following description, the term "fluid" refers to a substance that flows under external force and whose shape or volume can change. In one embodiment, the fluid may be a liquid such as water or a gas such as air.

[0089] The terms “upper side”, “lower side”, “left side”, “right side”, “front side”, and “rear side” used in the following description should be understood with reference to the coordinate system shown in the overall attached figure.

[0090] Reference Figures 1 to 2 The following example illustrates a battery control unit 1 according to an embodiment of the present invention. The battery control unit 1 according to the illustrated embodiment can be installed in electric vehicles, etc. In this embodiment, the battery control unit 1 is electrically connected to a battery cell (not shown) and can be used to control the battery cell (not shown).

[0091] Alternatively, the battery control unit 1 may be disposed in any device having a battery cell (not shown) and may be used to control the battery cell (not shown).

[0092] Furthermore, in the battery control unit 1 according to this embodiment of the present invention, the BMS and BDU can be integrated as a single unit. The BMS is used to calculate control information for controlling the battery cell (not shown), and the BDU is used to control the battery cell (not shown) in accordance with the control information calculated by the BMS. Specifically, the BMS and BDU can be connected to be directly energized.

[0093] Therefore, compared to connecting the BMS and BDU using additional components such as wires, communication between the BMS and BDU can be performed quickly. Furthermore, the connection status between the BMS and BDU can be maintained stably.

[0094] Furthermore, in the battery control unit 1 according to the present invention, in the structure of BMS and BDU, structures that do not require power to each other are separated by a predetermined distance, and an insulating material is disposed between them to prevent arbitrary power to each other.

[0095] Therefore, while maintaining a stable integration and communication between the BMS and BDU, the overall size of the battery control unit 1 can be reduced. Furthermore, the insulation between the BMS and other structures of the BDU can be maintained stably.

[0096] In the illustrated embodiment, the battery control unit 1 includes a cover 10, a BDU assembly 20, and a BMS PCB assembly 30.

[0097] The cover 10 forms the outer shape of the battery control unit 1. The interior of the cover 10 forms a space to accommodate other structures of the battery control unit 1. Additionally, a portion of the cover 10 can support these other structures of the battery control unit 1.

[0098] The cover 10 may be made of an electrically insulating material. This is to prevent arbitrary electrical contact between the other structures of the battery control unit 1 housed in the cover 10 and the outside. The cover 10 may also be made of a lightweight but high-strength material. This is to prevent damage to the other structures of the battery control unit 1 housed inside the cover 10 when external forces are applied.

[0099] In one embodiment, the cover 10 may be made of a synthetic resin material, such as reinforced plastic.

[0100] In the illustrated embodiment, the cover 10 includes an upper cover 11 and a lower cover 12.

[0101] The upper cover 11 forms part of the cover portion 10. The interior of the upper cover 11 forms a space to accommodate other structures of the battery control unit 1. In the illustrated embodiment, the upper cover 11 forms the upper portion of the cover portion 10 and accommodates part of the BDU assembly 20.

[0102] The top cover 11 is combined with the BDU assembly 20. Specifically, the top cover 11 is combined with the BDU housing 21. At this time, the top cover 11 can accommodate the BDU assembly 22 and is combined with the BDU housing 21.

[0103] The top cover 11 can be a shape corresponding to the shape of the BDU housing 21. In the illustrated embodiment, the top cover 11 is a three-dimensional shape with a length in the front-to-back direction shorter than its width in the left-to-right direction and a height in the vertical direction.

[0104] Multiple openings can be formed on one side of the top cover 11 in the height direction (the upper surface in the illustrated embodiment). Heat generated inside the top cover 11 can be discharged to the outside through these openings. The other side of the top cover 11 in the height direction (the lower side in the illustrated embodiment) is open, forming a channel for accommodating the BDU assembly 20. This other side of the top cover 11 communicates the internal space with the outside.

[0105] The lower cover 12 constitutes the rest of the cover portion 10. The lower cover 12 is combined with and supports the BMS PCB assembly 30. In the illustrated embodiment, the lower cover 12 constitutes the lower portion of the cover portion 10 and supports the BMS PCB assembly 30 from below.

[0106] The lower cover 12 can be a shape corresponding to the shape of the BMS PCB assembly 30. In the illustrated embodiment, the lower cover 12 is a three-dimensional shape with a length in the front-to-back direction shorter than its width in the left-to-right direction and a height in the vertical direction.

[0107] A groove may be formed on one side (the upper side in the illustrated embodiment) of the lower cover 12 in the height direction. The groove can accommodate part of the structure of the BMS PCB assembly 30 (i.e., the second PCB 200 described later).

[0108] The BDU assembly 20 is electrically connected to both the battery cell (not shown) and the BMS PCB assembly 30. The BDU assembly 20 can control the battery cell (not shown) in accordance with the control information calculated in the BMS PCB assembly 30. For this purpose, the BDU assembly 20 can be configured as a battery disconnect unit.

[0109] The BDU assembly 20 is combined with the cover 10. Specifically, part of the structure of the BDU assembly 20 can be accommodated in the space formed inside the upper cover 11. In addition, other structures of the BDU assembly 20 can be combined with the upper cover 11.

[0110] The BDU assembly 20 is combined with the BMS PCB assembly 30. The BDU assembly 20 and the BMS PCB assembly 30 are electrically connected and can receive calculated control information. Specifically, the BDU assembly 20 is electrically connected to the first PCB 100 disposed on the BMS PCB assembly 30.

[0111] As described below, the first PCB 100 can be directly electrically connected to the second PCB 200. Therefore, the BDU assembly 20 connected to the first PCB 100 can also be directly electrically connected to the second PCB 200.

[0112] In the illustrated embodiment, the BDU assembly 20 includes a BDU housing 21 and a BDU component 22.

[0113] The BDU housing 21 forms the outer shape of the BDU assembly 20. The BDU housing 21 is combined with the BDU component 22 and supports the BDU component 22. In the illustrated embodiment, the BDU housing 21 supports the BDU component 22 from below.

[0114] The BDU housing 21 may contain a structure electrically connected to the BDU assembly 22. This structure may also be electrically connected to the BMS PCB assembly 30. Therefore, when the BDU assembly 22 is combined with the BDU housing 21, the BDU assembly 22 can be electrically connected to the BMS PCB assembly 30.

[0115] The BDU housing 21 is attached to the top cover 11. The horizontal sides of the BDU housing 21 (front, rear, left, and right sides in the illustrated embodiment) can be attached to the top cover 11. In one embodiment, the BDU housing 21 can be snap-fitted to the top cover 11.

[0116] The BDU housing 21 can have a shape corresponding to the shape of the top cover 11 and the BMS PCB assembly 30. In the illustrated embodiment, the BDU housing 21 is a three-dimensional shape with a rectangular cross-section and a height in the vertical direction.

[0117] The BDU housing 21 may be made of an electrically insulating material. This is to prevent accidental energization between the BDU assembly 22 and the BMS PCB assembly 30. Therefore, it should be understood that the BDU assembly 22 and the BMS PCB assembly 30 can only be electrically connected through the structure of the BDU housing 21.

[0118] BDU component 22 actually performs the function of controlling BDU assembly 20 (i.e., controlling the battery cell (not shown)). BDU component 22 is electrically connected to the battery cell (not shown), thereby controlling the battery cell (not shown) in accordance with the calculated control information.

[0119] BDU component 22 is combined with BDU housing 21. BDU component 22 is electrically connected to BMSPCB assembly 30 through the other structures of BDU housing 21, thereby enabling it to receive calculated control information.

[0120] The BDU component 22 is housed in a space formed inside the top cover 11. The BDU component 22 is covered by the top cover 11 so that it is not exposed to the outside at all.

[0121] Re-reference Figures 1 to 2According to an embodiment of the present invention, the battery control unit 1 includes a BMS PCB assembly 30.

[0122] The BMS PCB assembly 30 calculates control information for controlling the battery cell (not shown). The control information calculated by the BMS PCB assembly 30 is transmitted to the BDU assembly 20, so that it can be used to control the battery cell (not shown).

[0123] At this time, the BMS PCB assembly 30 can be directly electrically connected to the BDU assembly 20. That is, the energized state of the BMS PCB assembly 30 and the BDU assembly 20 is not formed by additional wire components, but by the direct connection between the BMS PCB assembly 30 and the BDU assembly 20.

[0124] That is, through the aforementioned combination, the battery control unit 1 according to the present invention can be constructed by integrating BDU and BMS.

[0125] The BMS PCB assembly 30 is coupled to the cover 10. Specifically, one side of the BMS PCB assembly 30 in the height direction (the lower side in the illustrated embodiment) is coupled to the lower cover 12. The BMS PCB assembly 30 can be supported by the lower cover 12. Part of the structure of the BMS PCB assembly 30 (i.e., the second PCB 200 described later) is covered by the lower cover 12 and is not exposed to the outside at all.

[0126] The BMS PCB assembly 30 is combined with the BDU assembly 20. Specifically, the other side of the BMS PCB assembly 30 in the height direction (the upper side in the illustrated embodiment) is combined with the BDU housing 21 of the BDU assembly 20.

[0127] As described above, a portion of the structure of the BDU housing 21 is integrated with and energized by the BDU assembly 22. Therefore, it can be understood that the first PCB 100 located on the other side (i.e., the upper side) of the BMS PCB assembly 30 is integrated with and energized by the BDU assembly 20.

[0128] The BMS PCB assembly 30 can have a shape corresponding to that of the cover 10 or the BDU assembly 20. In the illustrated embodiment, the BMS PCB assembly 30 can be a three-dimensional shape with a length in the front-to-back direction shorter than its width in the left-to-right direction and a height in the vertical direction.

[0129] At this time, as described below, the first PCB100 and the second PCB200 constituting the BMS PCB assembly 30 are formed in a plate shape, or the BMS PCB assembly 30 is formed in a plate shape.

[0130] The BMS PCB assembly 30 can be directly electrically connected to the BDU assembly 20, and can include any structure capable of transmitting calculated control information to the BDU assembly 20. Figures 3 to 4 In the embodiment shown, the BMSPCB assembly 30 includes a first PCB 100, a second PCB 200, and an insulating member 300. The first PCB 100, the insulating member 300, and the second PCB 200 are stacked sequentially in a top-to-bottom direction.

[0131] That is, the first PCB100 is configured such that the insulating member 300 is placed in the middle opposite to the second PCB200 in the height direction (i.e., the vertical direction) of the BMS PCB assembly 30.

[0132] The first PCB 100 forms part of the BMS PCB assembly 30. The first PCB 100 is the portion where the BMS PCB assembly 30 and the BDU assembly 20 are combined. The first PCB 100 is combined with and energized by the BDU housing 21. Therefore, it can be understood that the first PCB 100 and the BDU assembly 22 can be electrically connected. At this time, the first PCB 100 and the BDU housing 21 can be electrically connected to each other through their respective structures without the need for additional structures.

[0133] The first PCB 100 is combined with the second PCB 200. The first PCB 100 can be combined with the second PCB 200 and powered on. At this time, the first PCB 100 and the second PCB 200 can be electrically connected to each other through their respective structures without the need for additional structures.

[0134] That is, the BDU assembly 20, the first PCB 100, and the second PCB 200 can be directly connected to each other and energized. Therefore, the energized state of the BDU assembly 20, the first PCB 100, and the second PCB 200 can be maintained reliably.

[0135] The first PCB 100 is coupled to the insulating member 300. Specifically, the first PCB 100 is mounted and supported on one side (the upper side in the illustrated embodiment) of the insulating member 300 in the height direction. The first PCB 100 can be coupled to the insulating member 350 (see reference 350). Figure 12 ) and insulating body 310 (refer to Figure 12 Combined. At least a portion of the first PCB 100 may be accommodated in the first insulating space 320.

[0136] exist Figures 5 to 7 In the embodiment shown, the first PCB 100 includes a first PCB substrate 110, a first PCB terminal 120, a first PCB connector 130, a first PCB bonding connector 140, and a first fastening member bonding hole 150.

[0137] The first PCB substrate 110 constitutes the main body of the first PCB 100. Other structures of the first PCB 100 are bonded to the first PCB substrate 110. The first PCB substrate 110 supports the other structures of the first PCB 100.

[0138] Printed circuits can be formed on the first PCB substrate 110. The other structures of the first PCB 100, which are combined with the first PCB substrate 110, can be electrically connected to each other.

[0139] In the above embodiment, it can be understood that the first PCB substrate 110 is configured as a printed circuit board (PCB).

[0140] The first PCB substrate 110 is supported by the insulating member 300. Specifically, the first PCB substrate 110 can be connected to the insulating body 310 of the insulating member 300 (see reference). Figure 12 They are combined and supported. The first PCB substrate 110 places the insulating member 300 in the middle to be opposite to the second PCB substrate 210.

[0141] The first PCB substrate 110 may have a shape corresponding to the shape of the BDU housing 21 or the insulating member 300. In the illustrated embodiment, the first PCB substrate 110 is configured as a polygonal plate with a length in the front-to-back direction shorter than its width in the left-to-right direction and a thickness in the vertical direction.

[0142] The first PCB substrate 110 is coupled with the first PCB terminal 120 and the first PCB connector 130. In the illustrated embodiment, the first PCB terminal 120 and the first PCB connector 130 are located on one side (i.e., the upper side) of the first PCB substrate 110 in the thickness direction.

[0143] The first PCB substrate 110 is coupled to the first PCB bonding connector 140. In the illustrated embodiment, the first PCB bonding connector 140 is located on the other side (the lower side in the illustrated embodiment) of the thickness direction of the first PCB substrate 110.

[0144] A first fastening member engagement hole 150 is formed on the first PCB substrate 110. In the illustrated embodiment, a plurality of first fastening member engagement holes 150 are respectively formed at each corner of the first PCB substrate 110 in the length direction and width direction.

[0145] The first PCB terminal 120 is a structure in which the first PCB 100 is partially connected to and energized with the BDU assembly 20. The first PCB terminal 120 is connected to and energized with the structure disposed in the BDU housing 21.

[0146] The first PCB terminal 120 is coupled to the first PCB substrate 110. As described above, a printed circuit is formed on the first PCB substrate 110, and the first PCB terminal 120 can be electrically connected to other structures of the first PCB 100 (such as the first PCB connector 130 and the first PCB bonding connector 140).

[0147] The first PCB terminal 120 can be of any shape capable of being coupled to and energized with the BDU assembly 20. In the illustrated embodiment, the first PCB terminal 120 has a vertical height, with its lower side coupled to and energized with the first PCB substrate 110, and its upper side coupled to and energized with the BDU assembly 20. The first PCB terminal 120 protrudes to one side of the height direction of the first PCB substrate 110 (the upper side in the illustrated embodiment).

[0148] Multiple first PCB terminals 120 can be provided. Multiple first PCB terminals 120 are arranged at different positions on the first PCB substrate 110, spaced apart from each other, and can be electrically connected to the BDU assembly 20 respectively.

[0149] In the illustrated embodiment, a total of 11 first PCB terminals 120 are configured, including a pair of groups offset to the left, one located on the front left, and a pair located at the rear and spaced apart in the left-right direction. The pairs of groups are spaced apart in the front-back direction, and each group consists of 4 first PCB terminals 120.

[0150] The number and configuration of the first PCB terminals 120 can be changed in correspondence with the number and configuration of the structures disposed in the BDU assembly 20 and electrically connected to the first PCB terminals 120.

[0151] The first PCB connector 130 is a structure that connects and powers the first PCB 100 to other structures in the BDU assembly 20. The first PCB connector 130 connects and powers a relay (not given a reference numeral) disposed in the BDU assembly 22.

[0152] Therefore, it should be understood that the first PCB 100 can be connected to the BDU assembly 20 at different locations via the first PCB terminal 120 and the first PCB connector 130, so that the structures are different from each other and can be powered.

[0153] The first PCB connector 130 is coupled to the first PCB substrate 110. In embodiments where printed circuitry is formed on the first PCB substrate 110, the first PCB connector 130 can be electrically connected to the first PCB terminal 120 and the first PCB coupling connector 140, respectively.

[0154] The first PCB connector 130 can have any configuration that allows it to connect and energize a relay (not shown) disposed on the BDU assembly 22. In the illustrated embodiment, the first PCB connector 130 is configured as a female connector, and can be electrically connected to a relay (not shown) configured as a male connector. The first PCB connector 130 protrudes from the upper side of the first PCB substrate 110.

[0155] Multiple first PCB connectors 130 can be provided, and the multiple first PCB connectors 130 are configured to be spaced apart from each other, and can be electrically connected to multiple relays (not given reference numerals).

[0156] In the illustrated embodiment, a pair of first PCB connectors 130 are provided. One of the first PCB connectors 130 is located on the upper side of the first PCB substrate 110, offset to the right corner. The other first PCB connector 130 is located on the upper side of the first PCB substrate 110, spaced to the left from the other first PCB connector 130.

[0157] The number and configuration of the first PCB connector 130 can be changed in correspondence with the number and configuration of the relays (not shown) provided in the BDU component 22.

[0158] The first PCB connector 140 is the part that allows the first PCB 100 and the second PCB 200 to be electrically connected. Specifically, the first PCB connector 140 and the second PCB connector terminal 230 (see reference) Figure 8 They can be directly connected and powered. Through this connection, the first PCB100 and the second PCB200 can be directly connected and powered without any additional structure.

[0159] The first PCB connector 140 is coupled to the first PCB substrate 110. In embodiments where printed circuitry is formed on the first PCB substrate 110, the first PCB connector 140 can be electrically connected to the first PCB terminal 120 and the first PCB connector 130, respectively.

[0160] Through the connection, the BDU assembly 20, the first PCB 100, and the second PCB 200 can be electrically connected.

[0161] The first PCB connector 140 can be configured in any way that allows it to connect with and be energized by the second PCB connector 230. In the illustrated embodiment, the first PCB connector 140 is configured as a female connector and can be energized to connect with the second PCB connector 230, which is configured as a male connector. The first PCB connector 140 protrudes from the lower side of the first PCB substrate 110.

[0162] Multiple first PCB bonding connectors 140 can be provided. Multiple first PCB bonding connectors 140 are arranged spaced apart from each other and can be electrically bonded to multiple second PCB bonding terminals 230 respectively.

[0163] In the illustrated embodiment, a pair of first PCB coupling connectors 140 are provided. The pair of first PCB coupling connectors 140 are located in front of the first PCB substrate 110 and are spaced apart in the width direction (i.e., the left-right direction) of the first PCB substrate 110.

[0164] The number and configuration of the first PCB connector 140 can be changed in correspondence with the number and configuration of the second PCB connector 230.

[0165] The first fastening member mating hole 150 is the mating member 350 provided on the insulating member 300 (see reference). Figure 12 The structure is combined. The connecting member 350 can be connected through to the first fastening member connecting hole 150. For this purpose, the first fastening member connecting hole 150 can be formed through in the thickness direction (i.e., the vertical direction) of the first PCB substrate 110.

[0166] The first fastening member engagement hole 150 can be of any shape capable of engaging with the engagement member 350. In the illustrated embodiment, the first fastening member engagement hole 150 is formed as a disk-shaped space having a circular cross-section and a thickness in the vertical direction.

[0167] Multiple first fastening member engagement holes 150 can be provided. These multiple first fastening member engagement holes 150 are arranged in different positions and can engage with multiple engagement members 350 respectively. In the illustrated embodiment, a total of four first fastening member engagement holes 150 are formed.

[0168] A pair of first fastening member engagement holes 150 are located on one side of the width direction of the first PCB substrate 110 (left side in the illustrated embodiment) and spaced apart in the length direction (i.e., front-to-back direction). Another pair of first fastening member engagement holes 150 are located on the other side of the width direction of the first PCB substrate 110 (right side in the illustrated embodiment) and spaced apart in the length direction (i.e., front-to-back direction).

[0169] The number and configuration of the first fastening member mating holes 150 can be the same as those of the second fastening member mating holes 240 (see reference). Figure 8 The configuration method of the components 350 or the number and configuration method of the components 350 can be changed accordingly.

[0170] The second PCB 200 constitutes the remaining part of the BMS PCB assembly 30. The second PCB 200 is combined with and powered on the first PCB 100. As described above, the first PCB 100 can be combined with and powered on the BDU assembly 20. Therefore, it should be understood that as the second PCB 200 is combined with and powered on the first PCB 100, the BDU assembly 20 and the BMS PCB assembly 30 are also combined with and powered on.

[0171] At this point, the second PCB 200 and the first PCB 100 can be electrically connected to each other through their respective structures without requiring additional structures. In other words, the second PCB 200 and the first PCB 100 can be directly electrically connected. Therefore, as described above, the power-on and connection state of the first PCB 100 and the second PCB 200 can remain reliable.

[0172] The second PCB 200 is coupled to the insulating member 300. Specifically, the second PCB 200 is coupled to and supports the insulating member 300 on the other side (the lower side in the illustrated embodiment) in the height direction. The second PCB 200 can be coupled to the insulating body 310 via the coupling member 350. At least a portion of the second PCB 200 can be accommodated in the second insulating space 330 (see reference). Figure 14 ).

[0173] exist Figures 8 to 11 In the embodiment shown, the second PCB 200 includes a second PCB substrate 210, a second PCB connector 220, a second PCB bonding terminal 230, and a second fastening member bonding hole 240.

[0174] The second PCB substrate 210 constitutes the main body of the second PCB 200. Other structures of the second PCB 200 are bonded to the second PCB substrate 210. The second PCB substrate 210 supports the other structures of the second PCB 200.

[0175] Printed circuits can be formed on the second PCB substrate 210. The other structures of the second PCB 200, which are combined with the second PCB substrate 210, can be electrically connected to each other. In this embodiment, the second PCB substrate 210 can be understood as being configured as a printed circuit board.

[0176] The second PCB substrate 210 is combined with the insulating member 300. Specifically, the second PCB substrate 210 can support the insulating member 300 on the underside of the insulating body 310 of the insulating member 300. The second PCB substrate 210 places the insulating member 300 in the middle and is configured opposite to the first PCB substrate 110.

[0177] The second PCB substrate 210 may have a shape corresponding to that of the insulating member 300. In the illustrated embodiment, the second PCB substrate 210 is configured as a polygonal plate having a length in the front-back direction, a width in the left-right direction, and a thickness in the top-bottom direction.

[0178] The second PCB substrate 210 is coupled with the second PCB connector 220 and the second PCB bonding terminal 230. In the illustrated embodiment, the second PCB connector 220 and the second PCB bonding terminal 230 are located on one side (i.e., the upper side) of the second PCB substrate 210 in the thickness direction.

[0179] A second fastening member engagement hole 240 is formed on the second PCB substrate 210. In the illustrated embodiment, the second fastening member engagement hole 240 is formed at positions adjacent to each corner in the length and width directions of the second PCB substrate 210.

[0180] The second PCB connector 220 is a structure that allows the second PCB 200 to be electrically connected to an external source. A connector (not shown) that connects to an external control power supply (not shown) can be engaged and energized on the second PCB connector 220.

[0181] The second PCB connector 220 is coupled to the second PCB substrate 210. As described above, printed circuits are formed on the second PCB substrate 210, and the second PCB connector 220 can be electrically connected to other structures of the second PCB 200 (e.g., the second PCB bonding terminal 230).

[0182] The second PCB connector 220 can be located in the connector receiving opening 314 of the insulating body 310 (see reference). Figure 12 The insulating body 310 of the second PCB connector 220 is surrounded by the connector guide portion 313 in the width direction, i.e., the left and right sides in the illustrated embodiment.

[0183] The second PCB connector 220 can be of any shape capable of connecting and energizing an external control power source (not shown). In the illustrated embodiment, the second PCB connector 220 is configured as a female connector and can connect and energize a male connector (not shown) (i.e., a connector (not shown) that connects to an external control power source (not shown)).

[0184] Multiple second PCB connectors 220 can be provided. Multiple second PCB connectors 220 are disposed separately at different positions on the second PCB substrate 210, and can be electrically connected to an external control power supply (not shown).

[0185] In the illustrated embodiment, two pairs of second PCB connectors 220 are provided. Each pair of second PCB connectors 220 has a relatively long second PCB connector 220 and a relatively short second PCB connector 220. The two pairs of second PCB connectors 220 are spaced apart in the width direction (left-right direction in the illustrated embodiment) of the second PCB substrate 210, and each connector constituting a pair of second PCB connectors 220 is also spaced apart in the left-right direction.

[0186] The number and configuration of the second PCB connector 220 can be changed to correspond to the number and configuration of the connector (not shown) combined with the control power supply (not shown).

[0187] The second PCB connection terminal 230 is the part that allows the second PCB 200 and the first PCB 100 to be electrically connected. Specifically, the second PCB connection terminal 230 can be electrically and directly connected to the first PCB connection connector 140. Through this connection, the second PCB 200 and the first PCB 100 can be directly connected and powered without additional structures.

[0188] The second PCB bonding terminal 230 is bonded to the second PCB substrate 210. In embodiments where printed circuitry is formed on the second PCB substrate 210, the second PCB bonding terminal 230 can be electrically connected to the second PCB connector 220. Through this connection, an external control power supply (not shown) can be electrically connected to the BDU assembly 20, the first PCB 100, and the second PCB 200, respectively.

[0189] The second PCB connector 230 can have any shape that allows it to connect with and be energized by the first PCB connector 140. In the illustrated embodiment, the second PCB connector 230 is provided in the form of a male connector and can be energized to connect with the first PCB connector 140, which is provided in the form of a female connector. The second PCB connector 230 protrudes from the upper side of the second PCB substrate 210.

[0190] Multiple second PCB bonding terminals 230 can be provided. Multiple second PCB bonding terminals 230 are arranged spaced apart from each other and can be electrically bonded to multiple first PCB bonding connectors 140 respectively.

[0191] In the illustrated embodiment, a pair of second PCB bonding terminals 230 are provided. The pair of second PCB bonding terminals 230 are located on the front side of the second PCB substrate 210 and are spaced apart in the width direction (left-right direction in the illustrated embodiment) of the second PCB substrate 210.

[0192] The number and configuration of the second PCB bonding terminals 230 can be changed in accordance with the number and configuration of the first PCB bonding connectors 140.

[0193] The second fastening member engagement hole 240 is a structure in which the second PCB 200 is joined to the engagement member 350 disposed on the insulating member 300. The engagement member 350 can be connected through the second fastening member engagement hole 240. For this purpose, the second fastening member engagement hole 240 can be formed through the thickness direction (i.e., the vertical direction) of the second PCB substrate 210.

[0194] The second fastening member engagement hole 240 can be of any shape capable of engaging with the engagement member 350. In the illustrated embodiment, the second fastening member engagement hole 240 is formed as a disk-shaped space having a circular cross-section and a thickness in the vertical direction.

[0195] Multiple second fastening member engagement holes 240 can be provided. These multiple second fastening member engagement holes 240 are arranged in different positions and engage with multiple engagement members 350 respectively. In the illustrated embodiment, a total of four second fastening member engagement holes 240 are formed.

[0196] A pair of second fastening member engagement holes 240 are located on one side of the second PCB substrate 210 in the width direction (left side in the illustrated embodiment) and are spaced apart in the length direction (i.e., front-to-back direction). Another pair of second fastening member engagement holes 240 are located on the other side of the second PCB substrate 210 in the width direction (right side in the illustrated embodiment) and are spaced apart in the length direction (i.e., front-to-back direction).

[0197] The number and configuration of the second fastening member mating holes 240 can be changed in accordance with the configuration of the first fastening member mating holes 150 or the number and configuration of the mating members 350.

[0198] The insulating member 300 constitutes the remainder of the BMS PCB assembly 30. The insulating member 300 is coupled to and supports the first PCB 100 and the second PCB 200, respectively. The insulating member 300 is located between the first PCB 100 and the second PCB 200 in the height direction (vertical direction in the illustrated embodiment) of the BMS PCB assembly 30. The insulating member 300 is coupled to and supports the first PCB 100 and the second PCB 200, respectively.

[0199] The insulating member 300 can separate the first PCB 100 and the second PCB 200 by a predetermined distance. That is, the insulating member 300 can act as a spacer. Simultaneously, the insulating member 300 can be configured to be made of an electrically insulating material to prevent arbitrary current flow between the first PCB 100 and the second PCB 200. Therefore, the first PCB 100 and the second PCB 200 can prevent current flow between structures other than the first PCB coupling connector 140 and the second PCB coupling terminal 230.

[0200] Therefore, even when the BDU assembly 20 and the BMS PCB assembly 30 of the battery control unit 1 according to the embodiment of the present invention are integrally formed, arbitrary power supply between the BDU assembly 20 and the BMS PCB assembly 30 can be prevented. As a result, the size of the battery control unit 1 can be reduced, and the insulation reliability between the various structures can be improved.

[0201] Furthermore, by supporting the first PCB100 and the second PCB200 respectively with insulating members 300, arbitrary shaking of the first PCB100 and the second PCB200 can be prevented. As a result, the energized state of the first PCB100 and the second PCB200 can be stably maintained.

[0202] exist Figures 12 to 14 In the embodiment shown, the insulating member 300 includes an insulating body 310, a first insulating space 320, a second insulating space 330, an insulating connection hole 340, and a connection member 350.

[0203] The insulating body 310 constitutes the main body of the insulating member 300. Other structures of the insulating member 300 are formed or incorporated into the insulating body 310. In the illustrated embodiment, a first insulating space 320, a second insulating space 330, and an insulating bonding hole 340 are formed inside the insulating body 310. A bonding member 350 is bonded to the insulating bonding hole 340 formed in the insulating body 310.

[0204] The insulating body 310 is coupled to the first PCB 100. Specifically, the insulating body 310 is coupled to the first PCB substrate 110 through a coupling member 350 that engages with an insulating coupling hole 340 formed therein. The insulating body 310 supports the first PCB 100 and accommodates at least a portion of the structure of the first PCB 100.

[0205] The insulating body 310 is coupled to the second PCB 200. Specifically, the insulating body 310 is coupled to the second PCB substrate 210 through a coupling member 350 that engages with an insulating coupling hole 340 formed therein. The insulating body 310 can be supported by the second PCB 200.

[0206] The insulating body 310 can be any shape that can be combined with and support the first PCB 100 and the second PCB 200, respectively. In the illustrated embodiment, the insulating body 310 is a three-dimensional shape with a length in the front-to-back direction longer than its width in the left-to-right direction and a height in the vertical direction.

[0207] The insulating body 310 may be made of an electrically insulating material. This is to prevent the first PCB 100 and the second PCB 200, which are coupled to the insulating body 310, from being energized through any structure other than the first PCB coupling connector 140 and the second PCB coupling terminal 230.

[0208] The insulating body 310 can be formed with a predetermined height (the vertical length in the illustrated embodiment). Therefore, the insulating body 310 can separate the first PCB 100 and the second PCB 200 by its own height. Thus, a sufficient distance can be ensured to electrically insulate the other structures of the first PCB 100 and the second PCB 200.

[0209] In the illustrated embodiment, the insulating body 310 includes an insulating surface 311, an insulating edge 312, a connector guide portion 313, and a connector receiving opening portion 314.

[0210] The insulating surface 311 constitutes a portion of the insulating body 310 that is exposed to the outside. The insulating surface 311 divides the space formed inside the insulating body 310 in the height direction (the vertical direction in the illustrated embodiment). In the illustrated embodiment, the insulating surface 311 divides the space formed inside the insulating body 310 into a first insulating space 320 and a second insulating space 330.

[0211] The insulating surface 311 surrounds the first insulating space 320 and the second insulating space 330 formed inside the insulating body 310 on one side and the other side in the height direction, respectively.

[0212] Specifically, the insulating surface 311 surrounds the first insulating space 320 on one side of the height direction (the lower side in the illustrated embodiment). Additionally, the insulating surface 311 surrounds the second insulating space 330 on the other side of the height direction (the upper side in the illustrated embodiment).

[0213] As described below, the first insulating space 320 and the second insulating space 330 are open on the opposite side to the insulating surface 311. Therefore, it should be understood that the insulating surface 311 is disposed inside the insulating body 310, but exposed to the outside.

[0214] The insulating surface 311 can be a shape corresponding to the shape of the insulating body 310. In the illustrated embodiment, the insulating surface 311 is formed as a plate with a length in the front-to-back direction longer than its width in the left-to-right direction and a thickness in the vertical direction.

[0215] An insulating bonding hole 340 is formed on the insulating surface 311. Multiple insulating bonding holes 340 can be formed at different positions on the insulating surface 311. A bonding member 350 is bonded to each insulating bonding hole 340.

[0216] The insulating edge 312 forms the outer periphery of the insulating body 310. The insulating edge 312 surrounds and extends the space formed inside the insulating body 310 on the outside. The insulating edge 312 is continuous with the insulating surface 311.

[0217] Compared to the insulating surface 311, the insulating edge 312 can protrude along the height direction (i.e., the vertical direction in the illustrated embodiment). Therefore, the first PCB 100 is mounted on the insulating edge 312, and the structure of the first PCB 100 located in the first insulating space 320 can be arranged separately from the insulating surface 311 in the height direction. Similarly, the insulating edge 312 is mounted on the second PCB 200, and the structure of the second PCB 200 located in the second insulating space 330 can be arranged separately from the insulating surface 311 in the height direction.

[0218] The insulating edge 312 may surround the first insulating space 320 on the outside. Compared with the insulating surface 311, the insulating edge 312 protrudes upward and may extend along the outer periphery of the insulating surface 311 and the connector guide portion 313.

[0219] The insulating edge 312 may surround the second insulating space 330 on the outside. Compared with the insulating surface 311, the insulating edge 312 protrudes downward and may extend along the outer periphery of the insulating surface 311 and the connector guide portion 313.

[0220] The connector guide 313 guides the second PCB connector 220 of the second PCB 200. Through the connector guide 313, the second PCB connector 220 is not exposed externally along the length or width direction of the insulating body 310. In the illustrated embodiment, the connector guide 313 is formed to surround the second PCB connector 220 along the width direction (i.e., the left-right direction) of the insulating body 310.

[0221] The connector guide portion 313 is continuous with the insulating surface 311. The connector guide portion 313 is formed extending rearward from one side (the rear side in the illustrated embodiment) of the insulating surface 311 along its length direction.

[0222] The connector guide portion 313 is continuous with the insulating edge 312. The insulating edge 312 may extend along the outer periphery of the connector guide portion 313.

[0223] Multiple connector guides 313 may be formed. These multiple connector guides 313 are spaced apart in the direction guiding the second PCB connector 220 (left-right direction in the illustrated embodiment) and can extend outwards respectively. In the illustrated embodiment, a pair of connector guides 313 are provided, spaced apart in the left-right direction. The pair of connector guides 313 surround the second PCB connector 220 on the left and right sides respectively.

[0224] The space formed between a pair of connector guides 313 can be defined as the connector receiving opening 314.

[0225] The connector receiving opening 314 can accommodate at least a portion of the second PCB connector 220 of the second PCB 200. The second PCB connector 220 can be exposed externally while being accommodated in the connector receiving opening 314. Therefore, the second PCB connector 220 can be electrically connected to an external control power supply (not shown) while being accommodated in the connector receiving opening 314.

[0226] A connector receiving opening 314 is located between a pair of connector guides 313. One side of the connector receiving opening 314 in the longitudinal direction (the front side in the illustrated embodiment) is surrounded by an insulating edge 312. The other side of the connector receiving opening 314 in the longitudinal direction (the rear side in the illustrated embodiment) is open and can be electrically connected to an external control power supply (not shown).

[0227] One side (the upper side in the illustrated embodiment) of the connector receiving opening 314 in the height direction is open. The other side (the lower side in the illustrated embodiment) of the connector receiving opening 314 in the height direction is closed by the second PCB substrate 210.

[0228] Each side (left and right sides in the illustrated embodiment) of the connector receiving opening 314 in the width direction is surrounded by a pair of connector guides 313.

[0229] Because the second PCB connector 220 is formed in the connector receiving opening 314, the overall height of the second PCB 200 and the insulating member 300 that are joined together can be reduced. Therefore, the overall height of the BMS PCB assembly 30 is also reduced, achieving miniaturization.

[0230] The first insulating space 320 accommodates a portion of the structure of the first PCB 100. The structure of the first PCB 100 is contained within the first insulating space 320 and is not exposed to the outside at all. In one embodiment, the first insulating space 320 may accommodate the lower portion of the first PCB terminal 120 and the lower portion of the first PCB connector 130.

[0231] The first insulating space 320 can be defined by dividing the space formed inside the insulating body 310 in the vertical direction. In the illustrated embodiment, the first insulating space 320 is defined as the space located on the side (i.e., the upper side) facing the first PCB 100 among the divided small spaces.

[0232] The first insulating space 320 is surrounded by an insulating surface 311 and an insulating edge 312. Each side of the first insulating space 320 in the length and width directions (front side, rear side, left side, and right side in the illustrated embodiment) is surrounded by the insulating edge 312. One side of the first insulating space 320 in the height direction (upper side in the illustrated embodiment) is open.

[0233] The other side (the lower side in the illustrated embodiment) of the first insulating space 320 in the height direction is surrounded by the insulating surface 311. The first insulating space 320 places the insulating surface 311 in the middle and is configured opposite to the second insulating space 330.

[0234] The first PCB100, supported by the upper end of the insulating edge 312, can be separated from the second PCB200 by a sufficient distance through the first insulating space 320.

[0235] The second insulating space 330 can accommodate a portion of the structure of the second PCB 200. The structure of the second PCB 200 is contained within the second insulating space 330 and is not exposed to the outside at all.

[0236] The second insulating space 330 can be defined by dividing the space formed inside the insulating body 310 in the vertical direction. In the illustrated embodiment, the second insulating space 330 is defined as the space located on the other side (i.e., the lower side) of the divided small space facing the second PCB 200.

[0237] The second insulating space 330 is surrounded by an insulating surface 311 and an insulating edge 312. Each side of the second insulating space 330 in the length and width directions (front side, rear side, left side, and right side in the illustrated embodiment) is surrounded by the insulating edge 312. One side of the second insulating space 330 in the height direction (lower side in the illustrated embodiment) is open.

[0238] The other side (the upper side in the illustrated embodiment) of the second insulating space 330 in the height direction is surrounded by the insulating surface 311. The second insulating space 330 places the insulating surface 311 in the middle and is configured opposite to the first insulating space 320.

[0239] The second PCB 200, supported by the lower end of the insulating edge 312, can be separated from the first PCB 100 by a sufficient distance through the second insulating space 330.

[0240] The insulating connection hole 340 is the portion where the insulating member 300 is joined to the first PCB 100 and the second PCB 200. The insulating connection hole 340 is formed inside the insulating surface 311 of the insulating body 310. In one embodiment, the insulating connection hole 340 is formed through the insulating surface 311 in the thickness direction (the vertical direction in the illustrated embodiment).

[0241] A connecting member 350 is attached to the insulating connecting hole 340. In one embodiment, at least a portion of the connecting member 350 may be through-connected to the insulating connecting hole 340.

[0242] The insulating engagement hole 340 can be of any shape capable of engaging with the engagement member 350. In the illustrated embodiment, the interior angle of the insulating engagement hole 340 is less than 180°, and it is a pair of arcs arranged opposite each other in the left-right direction. In the embodiment, the engagement member 350 is provided in the form of a bar with an outer diameter at one end larger than the outer diameter of the rest, and can snap-fit ​​with the insulating engagement hole 340.

[0243] In other embodiments, the insulating engagement hole 340 has a circular cross-section and a thickness in the vertical direction, and its inner circumference may be threaded. In the aforementioned embodiments, the engagement member 350 is provided as a screw member, which can be threadedly engaged with the insulating engagement hole 340.

[0244] Multiple insulating bonding holes 340 can be formed. The multiple insulating bonding holes 340 are located at different positions and can be bonded to multiple bonding members 350 respectively. At this time, a portion of the multiple insulating bonding holes 340 can be bonded to the bonding member 350 bonded to the first PCB 100, and the remaining portion of the multiple insulating bonding holes 340 can be bonded to the bonding member 350 bonded to the second PCB 200.

[0245] In the illustrated embodiment, the insulating bonding holes 340 are formed in pairs, with a total of 8 holes, each group consisting of 4 holes. Any group is arranged adjacent to each corner of the insulating surface 311 in both the length and width directions to engage with the bonding member 350 attached to the first PCB 100. Any group can be configured to overlap with the first fastening member bonding hole 150 in the vertical direction.

[0246] Another set is adjacent to each corner of the insulating surface 311 in the length and width directions, and is spaced apart from the aforementioned set, and is coupled to the coupling member 350 coupled to the second PCB 200. The other set can be configured to overlap with the coupling hole 240 of the second fastening member in the vertical direction.

[0247] The bonding member 350 is a structure that bonds the insulating member 300 to the first PCB 100 and the second PCB 200. The bonding member 350 bonds the first PCB 100 to the insulating body 310. In addition, the bonding member 350 bonds the second PCB 200 to the insulating body 310.

[0248] Multiple connecting members 350 can be provided. Multiple connecting members 350 can connect the first PCB100 and the second PCB200 to the insulating body 310 at different positions.

[0249] The connecting member 350, which is coupled to the first PCB 100, is coupled to the first fastening member connecting hole 150 and any one of the set of insulating connecting holes 340, respectively. In one embodiment, the connecting member 350 may be through-coupled or threadedly coupled to the first fastening member connecting hole 150 and any one of the set of insulating connecting holes 340.

[0250] The coupling member 350, which is coupled to the second PCB 200, is coupled to the second fastening member coupling hole 240 and the other set of insulating coupling holes 340, respectively. In one embodiment, the coupling member 350 may be through-coupled or threadedly coupled to the second fastening member coupling hole 240 and the other set of insulating coupling holes 340.

[0251] At this time, the bonding member 350 bonded to the first PCB100 and the bonding member 350 bonded to the second PCB200 can be bonded to the insulating bonding hole 340 independently of each other.

[0252] The connecting member 350 can be configured in any form to connect the insulating body 310 to the first PCB 100 and the second PCB 200. In one embodiment, the connecting member 350 can be formed as a rod capable of being snapped together, or it can be provided as a threaded member.

[0253] In an embodiment where the connecting member 350 is formed in the shape of a rod capable of being snapped together, the connecting member 350 extends in the vertical direction, and the diameter of one end in the extending direction can be formed to be larger than the diameter of the other parts. Furthermore, in this embodiment, each connecting member 350 is configured to have a semi-circular cross-section and can be arranged in a pair, spaced apart in the front-back direction or the left-right direction.

[0254] In the embodiment, portions of the pair of connecting members 350 press against each other and move or even change shape, thereby engaging with the first fastening member engaging hole 150 or the second fastening member engaging hole 240. Furthermore, when the external force is released, portions of the pair of connecting members 350 move or even change shape in opposite directions, thereby engaging with the first fastening member engaging hole 150 and the second fastening member engaging hole 240.

[0255] In one embodiment, the connecting member 350 may be integrally formed with the insulating body 310. That is, the connecting member 350 may be formed in a state that penetrates the insulating connecting hole 340. In the above embodiment, it should be understood that the connecting member 350 and the insulating body 310 may be constituted as a single component.

[0256] Reference Figures 15 to 16 An example of the assembly process of the BMS PCB assembly 30 according to an embodiment of the present invention is shown.

[0257] In the illustrated embodiment, the second PCB 200 located on the lower side is first joined with the insulating member 300. At this time, after the second fastening member joining hole 240 and the other set of insulating joining holes 340 are arranged to overlap in the vertical direction, the joining member 350 can be joined with them respectively.

[0258] Next, the first PCB100 located on the upper side is combined with the second PCB200 and the insulating member 300. At this time, after the first fastening member coupling hole 150 and any one set of insulating coupling holes 340 are arranged to overlap in the vertical direction, the coupling member 350 can be combined with them respectively.

[0259] At the same time, the first PCB connector 140 connects with the second PCB connector 230 located vertically below and is powered on.

[0260] It should be understood that, although not illustrated, it is also possible to first combine the first PCB100 with the insulating member 300, and then combine the second PCB200 with the first PCB100 and the insulating member 300.

[0261] Reference Figures 17 to 24 The diagram shows a BMSPCB assembly 30 formed by combining a first PCB 100, a second PCB 200, and an insulating member 300.

[0262] The first PCB 100 is mounted on and supported by the insulating edge 312. In the structure of the first PCB 100, the first PCB substrate 110 is configured to cover the insulating body 310, the lower part of the first PCB terminal 120 is located in the first insulating space 320, and the first PCB coupling connector 140 is located on the outer side in front of the insulating body 310.

[0263] In addition, the first fastening member engagement hole 150 and a portion of the multiple insulating engagement holes 340 are arranged to overlap in the vertical direction, and the engagement member 350 is engaged with the first fastening member engagement hole 150 and the insulating engagement hole 340 respectively.

[0264] The second PCB 200 is coupled to the lower side of the insulating member 300 and supports the insulating member 300. The second PCB connector 220 in the structure of the second PCB 200 is accommodated in the connector accommodating opening 314, and each side (i.e. the left and right sides) of the second PCB 200 is surrounded by the connector guide portion 313.

[0265] The second PCB connector 220 protrudes along the length of the connector receiving opening 314 (the rear side in the illustrated embodiment), allowing it to be electrically connected to an external control power supply (not shown). As described above, with the second PCB connector 220 housed in the connector receiving opening 314, the overall height of the BMS PCB assembly 30 can be reduced by an amount equivalent to the height of the second PCB connector 220.

[0266] In addition, the second fastening member engagement hole 240 and the remaining portion of the plurality of insulating engagement holes 340 are arranged to overlap in the vertical direction, and the engagement member 350 is engaged with the second fastening member engagement hole 240 and the insulating engagement hole 340 respectively.

[0267] At this time, as Figure 23 As shown, a portion of the connecting member 350 that connects to the first fastening member connecting hole 150 and the connecting member 350 that connects to the second fastening member connecting hole 240 can be arranged to overlap in the vertical direction, while the remaining connecting members 350 can be arranged to be spaced apart in the vertical direction.

[0268] In any case, as long as the first PCB100, the second PCB200 and the insulating member 300 can be combined and formed to the minimum height, it is acceptable.

[0269] Although the embodiments of the present invention have been described above, the concept of the present invention is not limited to the embodiments disclosed in this specification. Those skilled in the art who understand the concept of the present invention can easily propose other embodiments by adding, changing, deleting, or adding structural elements within the same scope of the concept, but this should be within the scope of the concept of the present invention.

Claims

1. A BMS PCB assembly, characterized in that, include: The first PCB can be electrically connected to the external BDU assembly. The second PCB is electrically connected to the first PCB, and An insulating component is located between the first PCB and the second PCB, and is respectively coupled to the first PCB and the second PCB; The first PCB, the insulating component, and the second PCB are stacked sequentially in the height direction.

2. The BMS PCB assembly according to claim 1, characterized in that, The insulating component includes: An insulating body supports the first PCB and is supported by the second PCB. An insulating bonding hole is formed through the interior of the insulating body, and The bonding member is bonded to the insulating bonding hole and to the first PCB or the second PCB.

3. The BMS PCB assembly according to claim 2, characterized in that, The first PCB includes a first PCB bonding connector that can be electrically connected to the second PCB. The second PCB includes second PCB bonding terminals that can be electrically bonded to the bonding connector of the first PCB. The first PCB bonding connector and the second PCB bonding terminal are located on the outside of the insulating member in the horizontal direction.

4. The BMS PCB assembly according to claim 3, characterized in that, The first PCB includes: A first PCB substrate, covering at least a portion of the insulating member, and electrically connected to the first PCB by a connector, and The first fastening member connection hole is formed through the interior of the first PCB substrate; Multiple insulating connection holes are formed, and a portion of these insulating connection holes overlap with the connection hole of the first fastening member in the height direction. The connecting member passes through the connecting hole of the first fastening member and is connected to the insulating connecting hole.

5. The BMS PCB assembly according to claim 3, characterized in that, The second PCB includes: A second PCB substrate, at least a portion of which is covered by the insulating member, is electrically connected to the second PCB bonding terminal. The second fastening component connection hole is formed through the interior of the second PCB substrate; Multiple insulating connection holes are formed, and a portion of these insulating connection holes overlap with the connection holes of the second fastening member in the height direction. The connecting member passes through the connecting hole of the second fastening member and is connected to the insulating connecting hole.

6. The BMS PCB assembly according to claim 3, characterized in that, The connecting member is composed of a pair of portions arranged horizontally spaced apart, each of the pairs of portions extending in the vertical direction, and the diameter of one end of the connecting member is larger than the diameter of the other portions of the connecting member. The connecting member is configured to engage with the insulating connecting hole, the first PCB, and the second PCB.

7. The BMS PCB assembly according to claim 3, characterized in that, The connecting component is configured as a screw component. The connecting member is threadedly connected to the insulating connecting hole, the first PCB, and the second PCB.

8. The BMS PCB assembly according to claim 3, characterized in that, The insulating component includes: A first insulating space is formed inside the insulating body, opening towards one side of the first PCB, and The second insulating space is formed inside the insulating body, physically separated from the first insulating space, and is open to one side of the second PCB.

9. The BMS PCB assembly according to claim 8, characterized in that, The insulating body includes: An insulating surface, located in the height direction between the first insulating space and the second insulating space, physically separates the first PCB and the second PCB. An insulating edge extends along the outer periphery of the insulating surface and protrudes in the height direction relative to the insulating surface; The first PCB is mounted on one end of the insulating edge in the height direction, and the other end of the insulating edge in the height direction is mounted on the second PCB.

10. The BMS PCB assembly according to claim 9, characterized in that, The insulating body includes: A pair of connector guides extend from the outer periphery of the insulating surface toward one side of the insulating body and are spaced apart in the width direction of the insulating body. The connector receiving opening is formed between the pair of connector guides to accommodate a second PCB connector disposed on the second PCB; The connector receiving opening is formed on the side opposite to the insulating surface.

11. A battery control unit, characterized in that, include: The cover has an internal space. The BDU assembly, housed within the cover, is electrically connected to an external battery cell. The BMS PCB assembly is combined with the BDU assembly and electrically connected, and is supported by the cover. The BDU assembly includes: The BDU assembly, housed within the cover, is electrically connected to the battery cell, and The BDU housing, which is combined with the cover, is located between the BDU assembly and the BMS PCB assembly, and is combined with and powered on both the BDU assembly and the BMS PCB assembly. The BMS PCB assembly includes: The first PCB is electrically connected to the BDU assembly. The second PCB is electrically connected to the first PCB, and An insulating component is located between the first PCB and the second PCB, and is respectively coupled to the first PCB and the second PCB; The first PCB includes a first PCB bonding connector that can be electrically connected to the second PCB. The second PCB includes second PCB bonding terminals that can be electrically bonded to the bonding connector of the first PCB. The insulating member is configured to insulate other structures in the first PCB except for the first PCB-connected connector and other structures in the second PCB except for the second PCB-connected terminal.

12. The battery control unit according to claim 11, characterized in that, The first PCB includes: A first PCB substrate covers at least a portion of the insulating member, and a connector is electrically connected to the first PCB substrate. A first PCB terminal, electrically connected to the first PCB substrate, extends into the BDU housing and electrically connected to the BDU assembly, and The first PCB connector is electrically connected to the first PCB substrate, protrudes into the BDU housing, and is electrically connected to the BDU assembly.

13. The battery control unit according to claim 11, characterized in that, The second PCB includes: A second PCB substrate, at least a portion of which is covered by the insulating member, is electrically connected to the second PCB bonding terminal. The second PCB connector, which is electrically connected to the second PCB substrate, is located outside the insulating member and is electrically connected to an external control power supply.

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