Integrated radiator with high heat conduction, heat storage and heat dissipation functions

Abstract

The utility model provides a high heat conduction, heat storage and heat dissipation integrated radiator which comprises a high heat conduction layer, a heat storage layer and a heat dissipation layer which are arranged in sequence with a graphite foam material as a framework, and the high heat conduction layer, the heat storage layer and the heat dissipation layer are of an integrated structure. The high-thermal-conductivity layer is a composite material formed by impregnating the graphite foam material with a metal material; the heat storage layer is formed by filling the graphite foam material with a phase change material; the heat dissipation layer is of a fin-shaped structure. The heat dissipation layer of the radiator is of a fin structure and forms convection with air, and the purpose of rapid heat dissipation is achieved; the heat storage layer is made of a phase change composite material composed of a graphite foam material and a phase change material, the heat transfer efficiency is improved through the high-heat-conduction graphite foam material, the phase change material can be well packaged through the porous structure of the high-heat-conduction graphite foam material, and therefore the phase change material can rapidly store heat; the high-thermal-conductivity layer is a composite material bottom plate formed by dipping a graphite foam material by a metal material, so that heat at a heat source can be quickly and uniformly distributed.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and in particular to an integrated radiator with high thermal conductivity for heat storage and dissipation. Background Technology

[0002] Heat sinks are now widely used in various fields. With the advancement of technology, electronic components are developing towards multi-functionality, miniaturization, and high integration, which also significantly increases heat generation and power consumption. If heat is not dissipated in time, it is highly likely to damage electronic components, leading to a significant decrease in component lifespan and performance.

[0003] In practical applications, if there are rapid changes in the external ambient temperature, such as during vertical takeoff and landing of aircraft, laser weapon firing, or rapid orbital changes and rotations of spacecraft facing away from or towards the sun, or when components suddenly heat up due to unstable current, ordinary heat sinks cannot absorb, store, and dissipate the heat in a short time. This can lead to damage or even burnout of electronic components, posing significant safety hazards. Furthermore, low ambient temperatures reduce the performance of components, affecting the overall performance of the device. Therefore, there is an urgent need for a heat sink that can absorb a large amount of heat in a short time and heat components when the ambient temperature is too low. Summary of the Invention

[0004] In view of the above-mentioned problems in the existing technology, this application provides an integrated heat sink with high thermal conductivity for heat storage and heat dissipation. This heat sink can not only achieve rapid and uniform heat transfer, but also store and absorb a large amount of heat energy generated in a short period of time, and dissipate heat quickly.

[0005] To achieve the above objectives, the specific technical solution provided in this application is as follows: an integrated radiator with high thermal conductivity, heat storage and heat dissipation, comprising a high thermal conductivity layer, a heat storage layer and a heat dissipation layer arranged sequentially with graphite foam material as the skeleton, wherein the high thermal conductivity layer, the heat storage layer and the heat dissipation layer are an integrated structure;

[0006] The high thermal conductivity layer is a composite material formed by impregnating the graphite foam material with a metal material;

[0007] The heat storage layer is formed by filling the graphite foam material with a phase change material;

[0008] The heat dissipation layer has a finned structure.

[0009] As an example, the graphite foam material is mesophase pitch-based foamed carbon.

[0010] As an example, the metal material is copper.

[0011] As an example, the phase change material includes any one of paraffin, polyethylene glycol, and erythritol.

[0012] As an example, the porosity of the graphite foam material is 65% to 80%.

[0013] As an example, the thickness of the high thermal conductivity layer is 1 to 3 mm.

[0014] As an example, the thickness of the heat storage layer is 1 to 5 cm.

[0015] Compared with the prior art, the above-conceptual technical solution conceived in this application can achieve the following beneficial effects:

[0016] 1. This radiator uses graphite foam material as the skeleton to form a high thermal conductivity layer with rapid heat transfer, a heat storage layer of phase change material that can store heat, and a heat dissipation layer of fin structure that can dissipate heat quickly. It is an integrated radiator. The graphite foam material can act as both a heat spreader and a radiator, making the radiator have higher heat transfer efficiency.

[0017] 2. This heat sink uses graphite foam material, which has advantages such as light weight, making it particularly suitable for weight reduction needs in aerospace and other fields. Graphite foam material of the same volume weighs only 4% to 25% of metal, while maintaining the same high thermal conductivity. Furthermore, the thermal conductivity and weight of the material can be adjusted simply by changing the porosity of the graphite foam material, offering convenience, flexibility, and a wider range of applications.

[0018] 3. The high thermal conductivity layer of this heat sink uses a high thermal conductivity material composed of graphite foam and metal, which can achieve rapid and uniform heat transfer, while having a low thermal expansion coefficient comparable to that of the chip.

[0019] 4. Graphite foam materials have advantages such as high porosity and high thermal conductivity. Moreover, most of the pores are open-cell structures, which provides a good space for the storage of phase change materials. A larger amount of phase change material can be filled, which not only solves the problem of easy leakage of phase change materials, but also improves the heat transfer efficiency of phase change composite materials. The heat storage layer can also act as a heat storage device while transferring heat.

[0020] 5. The graphite foam in this heat sink runs through the entire structure, enabling rapid heat diffusion in any direction. This allows heat to be transferred to the heat dissipation fins more quickly. At the same time, the unique porous structure of the graphite foam material itself provides a larger heat dissipation area compared to traditional fin structures, giving this heat dissipation layer a fast and good heat dissipation effect. This effectively ensures the reliability and stability of electronic devices and extends their service life.

[0021] 6. Due to the advantages of graphite foam material such as high strength, high temperature resistance, oxidation resistance, and acid and alkali corrosion resistance, this radiator also has good reliability in some extreme thermal management environments, and its application range is wider. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the integrated heat sink with high thermal conductivity for heat storage and heat dissipation in this application.

[0024] Figure label:

[0025] 1-High thermal conductivity layer, 2-Heat storage layer, 3-Heat dissipation layer, 31-Fin, 32-Fin notch. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] like Figure 1 As shown in the figure, an embodiment of this application provides an integrated heat sink with high thermal conductivity for heat storage and heat dissipation, comprising a high thermal conductivity layer, a heat storage layer, and a heat dissipation layer arranged sequentially with graphite foam material as the skeleton, wherein the high thermal conductivity layer, the heat storage layer, and the heat dissipation layer are an integrated structure; the high thermal conductivity layer is a composite material formed by impregnating graphite foam material with a metal material; the heat storage layer is formed by filling graphite foam material with a phase change material; and the heat dissipation layer has a finned structure.

[0028] The heat dissipation layer is made of graphite foam material, which can be machined by CNC or by using a grooving machine. The required fin structure can be cut by controlling the height, thickness and spacing of the blades. Due to the strength of the graphite foam material itself, the thickness of the fins should not be too thin, while too thick fins will affect heat dissipation. A thickness of 4 to 6 mm is most suitable.

[0029] The graphite foam material selected has a porosity of 65% to 80% and a thermal conductivity of 150-240 W / (m·K). In one embodiment, the graphite foam material is mesophase pitch-based foamed carbon, whose larger porosity provides a larger heat exchange area and improves heat dissipation efficiency.

[0030] The metal material used to impregnate the graphite foam is copper.

[0031] Phase change materials include any one of paraffin wax, polyethylene glycol (PEG 2000-6000), and erythritol. Paraffin wax No. 45-65, fully refined, is preferred.

[0032] The thickness of the high thermal conductivity layer is 1–3 mm, and the thickness of the heat storage layer is 1–5 cm, both of which can be adjusted as needed.

[0033] Based on the above embodiments, the method for processing graphite foam materials includes the following steps:

[0034] S1.1 Cut the graphite foam material into the required size;

[0035] S1.2 Place the cut graphite foam material into anhydrous ethanol and ultrasonically clean it for 1-2 hours. Then place it in an oven at 90-110℃ and dry it for 1-3 hours.

[0036] Based on the above embodiments, the method for processing a high thermal conductivity layer includes the following steps:

[0037] S2.1 Prepare an ammonium molybdate solution with a concentration of 0.5 mol / L to 1.5 mol / L in an 80℃ water bath;

[0038] S2.2. Place the graphite foam material treated in step S1.2 into a 100°C oven for preheating, apply ammonium molybdate solution to the surface of the graphite foam material, and then place it in the oven to dry for 5-10 minutes. Repeat the above operation 10-20 times until the surface of the graphite foam material is uniformly coated with a layer of ammonium molybdate.

[0039] S2.3. Perform high-temperature heat treatment in an argon or nitrogen atmosphere. The high-temperature heat treatment temperature is 1150-1200℃ and the time is 30-60min. After high-temperature treatment, a molybdenum carbide coating is formed on the surface of the graphite foam material and on the pore walls, between 1-4mm.

[0040] S2.4 Place the above materials into a graphite crucible, and then place a copper plate, copper strip, or copper powder (in this embodiment, a copper plate of 0.5-3mm is selected) on the surface of the graphite foam material with a molybdenum carbide coating. The thickness of the copper plate can be selected according to the heat dissipation requirements. Then place it in a vacuum carbonization furnace and heat it to 1150-1200℃ at a heating rate of 10℃ / min. Hold it at this temperature for 15-60 minutes. After cooling, take it out and use a milling machine to mill the uneven copper surface.

[0041] Based on the above embodiments, when using paraffin as a phase change material, the method for treating the heat storage layer includes the following steps:

[0042] S3.1 Heat the paraffin wax in a water bath at 80-100℃ until it is completely melted into a liquid state;

[0043] S3.2 Place the graphite foam material processed in step S2.4 into a glass container with the copper-coated side facing down, and preheat it in a vacuum oven at 80-100℃. After the temperature rises, pour the melted paraffin wax into the glass container. Control the amount of paraffin wax poured in to control the height of the paraffin wax phase change layer. Turn on the vacuum pump of the vacuum oven to keep the vacuum degree at -0.09MPa. After keeping the vacuum oven at 80-100℃ for 30 minutes, stop heating and finally cool it to room temperature. Use a knife to scrape off the excess paraffin wax on the surface.

[0044] In another embodiment, when polyethylene glycol is used as the phase change material, the method for treating the heat storage layer includes the following steps:

[0045] S4.1 Place polyethylene glycol (PEG 2000~6000) into a beaker and heat it in a water bath at 70~100℃ until the polyethylene glycol is completely melted into a liquid state;

[0046] S4.2. Place the graphite foam material processed in step S2.4 into a glass container, with the copper-coated side facing down. Preheat the container in a vacuum oven at 80-100°C. After the temperature rises, pour the molten polyethylene glycol into the glass container while pouring. Observe the height of the polyethylene glycol layer while pouring. Control the amount of polyethylene glycol poured to control the height of the polyethylene glycol phase change layer. Turn on the vacuum pump of the vacuum oven to keep the vacuum level at -0.09MPa. Keep the vacuum oven at 80-100°C for 30 minutes, then stop heating. Finally, cool to room temperature. After the polyethylene glycol has completely solidified, remove any excess polyethylene glycol from the surface.

[0047] In yet another embodiment, when erythritol is used as the phase change material, the method for treating the heat storage layer includes the following steps:

[0048] S5.1 Place erythritol in a beaker and heat in an oil bath at 150-200°C until the erythritol is completely melted into a liquid state;

[0049] S5.2 Place the graphite foam material processed in step S2.4 into a glass container with the copper-coated side facing down. Preheat the container in a vacuum oven at 150-200°C. After the temperature rises, pour the melted erythritol into the glass container while pouring. Observe the height of the erythritol layer while pouring. Control the height of the erythritol phase transition layer by controlling the amount of erythritol poured in. Turn on the vacuum pump of the vacuum oven to keep the vacuum degree at -0.09MPa. After keeping the vacuum oven at 150-200°C for 30 minutes, stop heating. Finally, cool to room temperature. After the erythritol has completely solidified, remove the excess erythritol from the surface.

[0050] In summary, the upper heat dissipation layer of the integrated heat sink in this application has a finned structure. Cutting the graphite foam material into fins increases the surface area, allowing convection with the air and achieving rapid heat dissipation. The middle heat storage layer is a phase change composite material composed of graphite foam material and phase change material. The high thermal conductivity graphite foam material not only improves the heat transfer efficiency, but its porous structure can also effectively encapsulate the phase change material, enabling the phase change material to quickly store heat. The lower high thermal conductivity layer is a composite material base plate formed by impregnating graphite foam material with metal material, which can achieve rapid and uniform heat distribution at the heat source.

[0051] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. An integrated radiator with high thermal conductivity for heat storage and dissipation, characterized in that, It includes a high thermal conductivity layer, a heat storage layer, and a heat dissipation layer arranged sequentially with graphite foam material as the skeleton, wherein the high thermal conductivity layer, the heat storage layer, and the heat dissipation layer are an integrated structure; The high thermal conductivity layer is a composite material formed by impregnating the graphite foam material with a metal material; The heat storage layer is formed by filling the graphite foam material with a phase change material; The heat dissipation layer has a finned structure.

2. The integrated radiator for high thermal conductivity heat storage and heat dissipation according to claim 1, characterized in that: The graphite foam material is mesophase pitch-based foam carbon.

3. The integrated radiator for high thermal conductivity heat storage and heat dissipation according to claim 1, characterized in that: The metallic material is copper.

4. The integrated radiator for high thermal conductivity heat storage and heat dissipation according to claim 1, characterized in that: The phase change material includes any one of paraffin, polyethylene glycol, and erythritol.

5. The integrated radiator for high thermal conductivity heat storage and heat dissipation according to claim 1, characterized in that: The porosity of the graphite foam material is 65%–80%.

6. The integrated radiator for high thermal conductivity heat storage and heat dissipation according to claim 1, characterized in that: The thickness of the high thermal conductivity layer is 1–3 mm.

7. The integrated radiator for high thermal conductivity heat storage and heat dissipation according to claim 1, characterized in that: The thickness of the heat storage layer is 1 to 5 cm.

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