Detachable liquid cooling radiator with rhombic protrusions on inner wall of flow channel

Abstract

The utility model discloses a detachable liquid cooling radiator with rhombic protrusions on the inner wall of a flow channel. The detachable liquid cooling radiator comprises a liquid cooling mainboard and a bottom plate which are detachably arranged in an attached mode. The liquid cooling mainboard is provided with a liquid inlet flow channel and a liquid outlet flow channel which are communicated with each other. The liquid inlet flow channel comprises an external liquid inlet pipeline and an internal liquid inlet pipeline, and a rhombic protruding flow guide structure is arranged on the inner wall of the internal liquid inlet pipeline. The liquid outlet flow channel comprises an external liquid outlet pipeline and an internal liquid outlet pipeline, and the inner wall of the internal liquid outlet pipeline is also provided with a rhombic protruding flow guide structure. The rhombic protruding flow guide structure comprises a plurality of rhombic protruding blocks which are arranged in an array in a staggered mode. According to the radiator, a section of threaded flow guide structure is arranged in the external liquid inlet pipeline, and the rhombic convex flow guide structures are arranged on the inner walls of the internal liquid inlet pipeline and the internal liquid outlet pipeline, so that the heat exchange area of fluid and a flow channel is increased; and more importantly, the convection heat exchange efficiency is enhanced by disturbing a boundary layer generated when the fluid is in contact with the wall surface of the flow channel, so that the heat exchange effect is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling heat dissipation equipment technology, and in particular to a detachable liquid cooling heat sink with diamond-shaped protrusions on the inner wall of the flow channel. Background Technology

[0002] To achieve heat dissipation, high-power electronic devices such as air conditioner inverters on the market are equipped with liquid-cooled radiators. The flow channels of these traditional liquid-cooled radiators are embedded and expanded into the liquid cooling plate through an expansion joint process.

[0003] In actual working conditions, traditional liquid-cooled radiators have the following drawbacks:

[0004] 1) The inner wall of the cold medium flow channel is smooth, and the flow rate of the cold medium is relatively fast, resulting in an unsatisfactory heat exchange effect in which the cold medium carries away heat.

[0005] 2) The liquid cooling plate of the liquid-cooled radiator is directly connected and fixed to the control board of the heat source (high-power electronic equipment such as air conditioner inverter). The heat source needs to be frequently disassembled and repaired in the later stage. Since it is inconvenient to disassemble the liquid-cooled radiator every time it is repaired, the inspection work will inevitably damage the components on the radiator or cause poor contact between the radiator and the heat source, thus affecting the heat dissipation effect of the liquid-cooled radiator.

[0006] 3) The expansion joint process involves embedding the pipe into the liquid cooling plate. This is an embedded connection between two different objects, which results in a relatively longer heat exchange path and a less effective heat exchange effect than directly embedding the flow channel into the liquid cooling plate. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention provides a detachable liquid-cooled radiator with diamond-shaped protrusions on the inner wall of the flow channel, thereby overcoming the deficiencies in existing technologies.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A detachable liquid-cooled heat sink with diamond-shaped protrusions on the inner wall of the flow channel includes a detachable liquid-cooled main board and a base plate that are fitted together. A layer of thermally conductive silicone grease is provided on the contact surface between the liquid-cooled main board and the base plate. The liquid-cooled main board is provided with an inlet flow channel and an outlet flow channel that are interconnected.

[0010] The liquid inlet channel includes an external liquid inlet pipe connected to the liquid cooling motherboard and an internal liquid inlet pipe pre-installed in the liquid cooling motherboard; the inner wall of the internal liquid inlet pipe is provided with a diamond-shaped protruding flow guiding structure.

[0011] The liquid outlet channel includes an external liquid outlet pipe connected to the liquid cooling motherboard and an internal liquid outlet pipe pre-installed in the liquid cooling motherboard. The inner wall of the internal liquid outlet pipe is also provided with the diamond-shaped protruding flow guiding structure.

[0012] The rhomboid protrusion guide structure includes several rhomboid protrusions arranged in an array, with the long diagonal corner of each rhomboid protrusion facing the direction of fluid flow.

[0013] Furthermore, the inner wall of the external liquid inlet pipe is provided with a threaded flow guiding structure.

[0014] Preferably, the staggered arrangement in the array means that the number of rhomboid bumps in odd-numbered rows is N, and the number of rhomboid bumps in even-numbered rows is N-1.

[0015] Preferably, the angle of the rhombus apex of each of the rhombus protrusions along the fluid direction is between 10° and 90°.

[0016] Preferably, the liquid-cooled motherboard is further provided with a plug portion, which is located at the second end of the liquid-cooled motherboard, and the external liquid inlet pipe and the external liquid outlet pipe are located at the first end of the liquid-cooled motherboard; and the plug portion includes a mating end and a sealing plug, the mating end is mated to the second end of the liquid-cooled motherboard, and the sealing plug is sealed on the mating end.

[0017] Furthermore, the built-in channel at the docking end is used to connect the internal liquid inlet pipe and the internal liquid outlet pipe.

[0018] Furthermore, the liquid-cooled motherboard has limit grooves at the ends of the internal liquid inlet pipe and the internal liquid outlet pipe.

[0019] Preferably, the liquid-cooled motherboard is further provided with a docking bend, which is located at the second end of the liquid-cooled motherboard, and the external liquid inlet pipe and the external liquid outlet pipe are located at the first end of the liquid-cooled motherboard; the two ends of the docking bend are respectively sealed and connected to the internal liquid inlet pipe and the internal liquid outlet pipe at the second end of the liquid-cooled motherboard.

[0020] Preferably, the liquid-cooled motherboard is further provided with a pipe end cap; and the top and bottom surfaces of the liquid-cooled motherboard are both flat, so that the top or bottom surface of the liquid-cooled motherboard can be detachably attached to the base plate.

[0021] Preferably, the liquid-cooled motherboard is further equipped with a finned structure.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] 1) The detachable liquid cooler with diamond-shaped protrusions on the inner wall of the flow channel in this case has at least one section of threaded flow guide structure on the inner wall of the external liquid inlet pipe of the liquid cooling main board, and at least one section of diamond-shaped protrusion flow guide structure on the inner wall of the internal liquid inlet pipe and internal liquid outlet pipe of the liquid cooling main board. This not only increases the heat exchange area between the fluid and the flow channel, but more importantly, it also enhances the convective heat transfer efficiency by disturbing the boundary layer generated when the fluid contacts the flow channel wall, thus greatly improving the heat transfer effect.

[0024] 2) The detachable liquid cooler with diamond-shaped protrusions on the inner wall of the flow channel in this case has an added base plate between the liquid cooling main board and the heat source. The liquid cooling main board and the base plate are connected by a method that is easy to disassemble (such as screw connection, snap connection or mortise connection), while the base plate and the heat source are connected by a more stable method (such as screw connection, welding). This allows the heatsink to be easily disassembled when the heat source is under after-sales maintenance, avoiding damage to the components on the heatsink during frequent maintenance, and further ensuring the stable and reliable heat dissipation effect.

[0025] 3) The inner wall of the flow channel in this case has a detachable liquid cooling radiator with diamond-shaped protrusions. Its liquid cooling main board has built-in liquid inlet and liquid outlet flow channels. Compared with the traditional flow channels that are embedded by expansion joint process, the heat exchange path is relatively shorter, which is more conducive to liquid cooling heat dissipation.

[0026] To provide a clearer understanding of this invention, the preferred embodiments of this invention will be described below in conjunction with the accompanying drawings. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this utility model;

[0028] Figure 2 This is a cross-sectional structural diagram of the liquid-cooled motherboard of Embodiment 1 of this utility model;

[0029] Figure 3 , Figure 4 , Figure 5 This is a schematic diagram of the rhomboid protrusion guide structure of Embodiment 1 of this utility model;

[0030] Figure 6 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model;

[0031] Figure 7 This is an exploded view of the structure of Embodiment 2 of this utility model;

[0032] Figure 8 This is a schematic cross-sectional view of the overall structure of Embodiment 2 of this utility model;

[0033] Figure 9 This is a cross-sectional structural diagram of the liquid-cooled motherboard of Embodiment 2 of this utility model;

[0034] Figure 10 This is a schematic diagram of the overall structure of Embodiment 3 of this utility model;

[0035] Figure 11 This is a schematic diagram of the overall structure of Embodiment 4 of this utility model;

[0036] Figure 12 This is a schematic diagram of the overall structure of Embodiment 5 of this utility model.

[0037] Attached image labels:

[0038] 1-Liquid-cooled mainboard; 2-Base plate; 11-External liquid inlet pipe; 12-Internal liquid inlet pipe; 13-Internal liquid outlet pipe; 14-External liquid outlet pipe; 111-Threaded flow guide structure; 121-Rhomboid protrusion flow guide structure; 122-Rhomboid protrusion; 31-Mating end; 32-Sealing plug; 33-Limiting groove; 41-Mating bend; 51-Pipe end cap; 61-Fin structure. Detailed Implementation

[0039] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0040] Furthermore, if terms such as "first" or "second" are used for descriptive purposes only, they are mainly used to distinguish different devices, components or parts (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance or quantity of the indicated devices, components or parts, and should not be construed as indicating or implying relative importance.

[0041] Furthermore, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0042] Example 1

[0043] Please also refer to Figure 1-12 This utility model provides a detachable liquid-cooled radiator with diamond-shaped protrusions on the inner wall of the flow channel. It includes a detachably fitted liquid-cooled main board 1 and a base plate 2. The liquid-cooled main board 1 has interconnected inlet and outlet flow channels. The inlet flow channel includes an external inlet pipe 11 connected to the liquid-cooled main board 1 and an internal inlet pipe 12 pre-installed within the liquid-cooled main board 1. The inner wall of the external inlet pipe 11 has a threaded guide structure 111, and the inner wall of the internal inlet pipe 12 has a diamond-shaped protrusion guide structure 121. The liquid pipe 12 is connected; the liquid outlet channel includes an external liquid outlet pipe 14 connected to the liquid cooling motherboard 1 and an internal liquid outlet pipe 13 pre-installed in the liquid cooling motherboard 1. The inner wall of the internal liquid outlet pipe 13 is also provided with a diamond-shaped protruding flow guide structure 121. The external liquid outlet pipe 14 and the internal liquid outlet pipe 13 are connected. When heat dissipation is performed, the cold medium flows through the external liquid inlet pipe 11, the internal liquid inlet pipe 12, the internal liquid outlet pipe 13 and the external liquid outlet pipe 14 in sequence and carries away the heat conducted from the heat source to the liquid cooling motherboard 1, so as to achieve the effect of heat dissipation for the heat source through heat exchange.

[0044] The threaded flow guide structure 111, located on the inner wall of the external liquid inlet pipe 11, ensures that the cold medium fluid possesses a certain two-dimensional radial velocity before entering the internal liquid inlet pipe 12 of the liquid cooling mainboard 1. Specifically, when the cold medium enters from the external liquid inlet pipe 11, under the guidance of the threaded flow guide structure 111, the cold medium gradually transforms from a one-dimensional turbulent fluid with only axial velocity into a two-dimensional rotating fluid with both axial and radial velocities. The rotating fluid generates centrifugal force, causing secondary flow in the radial direction, promoting mixing of the fluid on the circular pipe cross-section, and thinning the boundary layer. Simultaneously, because the cold medium in the external liquid inlet pipe 11 maintains a rotating fluid state over a relatively long distance, it further enhances the influence of the subsequent rhomboid protrusion flow guide structure 121 on the fluid boundary layer. In addition, the introduction of radial velocity increases the turbulence of the cold medium fluid, making the movement of cold medium fluid molecules more intense and increasing the frequency of heat exchange between the fluid and the pipe wall. This additional turbulence effectively overcomes the viscous resistance of the fluid, strengthens the heat exchange process, and is beneficial for further improving heat exchange efficiency.

[0045] A rhomboid protrusion guide structure 121 is disposed on the inner wall of the internal liquid inlet pipe 12 and the internal liquid outlet pipe 13 of the liquid-cooled main board 1. The rhomboid protrusion guide structure 121 includes a plurality of rhomboid protrusions 122 arranged in an array in an alternating pattern. The edge of each rhomboid protrusion 122 with its long diagonal line faces the direction of fluid flow. Preferably, in this embodiment, the alternating arrangement means that if the number of rhomboid protrusions 122 in odd-numbered rows is N, then the number of rhomboid protrusions 122 in even-numbered rows is N-1. This arrangement can effectively avoid the generation of eddies in local areas when the cold medium fluid flows through, avoid generating large flow resistance and poor convective heat transfer effect, and effectively improve heat transfer efficiency.

[0046] Preferably, in this embodiment, the angle θ of the rhombus apex angle of each rhombus protrusion 122 along the fluid direction is between 10° and 90°.

[0047] It is important to understand that when machining the rhomboid protrusion guide structure 121 in actual working conditions, it is only necessary to machine two spiral grooves with opposite rotation directions and the same pitch and number of spiral turns on the inner walls of the internal liquid inlet pipe 12 and internal liquid outlet pipe 13 of the liquid-cooled mainboard 1. This will produce the distribution pattern of the rhomboid protrusions 122 on the inner walls of the internal liquid inlet pipe 12 and internal liquid outlet pipe 13. If it is necessary to change the angle of the long diagonal of the rhombus, it can be achieved simply by adjusting the appropriate relative feed rate, pitch, and number of spiral turns of the cutting tool during the finishing of the spiral grooves, which is simple and easy to operate. The forming method of the rhomboid protrusion guide structure 121 is not limited to tool turning; it can also be achieved by chemical etching, laser engraving, 3D printing, etc.

[0048] It is important to understand that the diamond-shaped protruding flow guiding structure 121 set in the inlet and outlet flow channels of the liquid-cooled mainboard 1 in this case is different from the heat exchange flow channels on the traditional liquid-cooled mainboard 1. The heat exchange flow channels of the traditional liquid-cooled mainboard 1 are set with ordinary parallel grooves. The parallel grooves only increase the disturbance of the fluid and increase the contact area between the fluid and the flow channel, thereby producing a better convective heat transfer effect. However, the parallel groove flow channel does not affect the boundary layer generated by the viscous force when the viscous fluid contacts the solid inner wall surface. In fact, the boundary layer is prone to separation when the viscous fluid flows over the curved surface. After the boundary layer separation point, a strong vortex, i.e. a tail vortex, will appear. There is a significant pressure difference between the fluid before and after the tail vortex region. The pressure difference resistance generated by this pressure difference will lead to a decrease in heat transfer efficiency. In this case, the corners of the staggered rhomboid protrusions guiding structure 121 face the direction of fluid flow. In this way, the corners of the rhomboid protrusions continuously divide the fluid. At the same time, the staggered arrangement of the rhomboids ensures that the fluids divided by each rhomboid corner impact and destroy each other's boundary layers, thereby greatly reducing the probability of wake vortices at the tail of the boundary layer and effectively improving heat exchange efficiency.

[0049] Furthermore, it's important to understand that the liquid-cooled motherboard 1 and base plate 2 in this case are detachably connected. This detachable connection includes, but is not limited to, screw connections, snap-fit ​​connections, or mortise and tenon connections, allowing for multiple disassembly and reassembly of the liquid-cooled motherboard 1 and base plate 2. The base plate 2 is fixed to the heat source control board via screw connections, welding, or other methods. Once the base plate 2 is fixed to the heat source control board, frequent disassembly is generally unnecessary. This design effectively avoids frequent disassembly that could lead to poor connection between the heat sink and the heat source, thus affecting heat dissipation efficiency and reducing the risk of damage to heat dissipation components during disassembly.

[0050] Preferably, in this embodiment, a layer of thermally conductive grease is also provided on the contact surface between the liquid-cooled motherboard 1 and the base plate 2 to reduce contact thermal resistance.

[0051] Preferably, in this embodiment, the liquid-cooled motherboard 1 is a single piece, which is integrally formed by means of, but not limited to, die casting, casting, extrusion, brazing, CNC machining, etc. The liquid inlet channel and liquid outlet channel built into the liquid-cooled motherboard 1 are interconnected.

[0052] It should be understood that the cooling medium can be pure water, deionized water, propylene glycol aqueous solution, or other phase change working fluids with high thermal conductivity; this application does not specifically limit this. A phase change working fluid is a material that absorbs or releases latent heat by changing its state of matter at a constant temperature; it can be an organic phase change material, an inorganic phase change material, or a composite phase change material; this application does not specifically limit this.

[0053] It should be understood that the liquid-cooled motherboard 1, base plate 2 and related components are made of easily formable metal materials such as aluminum, copper, and stainless steel.

[0054] It should be understood that the cross-section of the liquid inlet or outlet channel on the liquid-cooled motherboard 1 is not limited to a circle, but can also be a triangle, quadrilateral, polygon, or other irregular shape.

[0055] It should be understood that the threaded flow guiding structure 111 set on the inner wall of the external liquid inlet pipe 11 is not limited to the structure described in the drawings of this patent specification, but may be other structures or devices that can increase the radial velocity of the fluid. This application does not make specific limitations on this.

[0056] Example 2

[0057] The difference between Embodiment 2 and Embodiment 1 is that the liquid-cooled motherboard 1 is a split assembly type. In Embodiment 2, the liquid-cooled motherboard 1 is provided with a plug part, which is located at the second end of the liquid-cooled motherboard 1. The external liquid inlet pipe 11 and the external liquid outlet pipe 14 are located at the first end of the liquid-cooled motherboard 1.

[0058] The plug includes a mating end 31 and a sealing plug 32. The mating end 31 is mated to the second end of the liquid cooling motherboard 1, and the sealing plug 32 is sealed on the mating end 31. The mating end 31 has a built-in channel for connecting the internal liquid inlet pipe 12 and the internal liquid outlet pipe 13. After the mating end 31 and the sealing plug 32 are installed, the internal liquid inlet pipe 12 and the internal liquid outlet pipe 13 of the liquid cooling motherboard 1 are sealed and connected.

[0059] Preferably, in this embodiment, the liquid-cooled mainboard 1 is provided with limiting grooves 33 at the pipe openings at both ends of the internal liquid inlet pipe 12 and the internal liquid outlet pipe 13. The limiting grooves 33 are used to connect and position the external liquid inlet pipe 11 and the external liquid outlet pipe 14 at the first end of the liquid-cooled mainboard 1, and the limiting grooves 33 are also used to position and connect the plug at the second end of the liquid-cooled mainboard 1.

[0060] Preferably, in this embodiment, the mating end 31 and the sealing plug 32 are fixed by welding. The mating end 31 is welded and sealed to the internal liquid inlet pipe 12 and internal liquid outlet pipe 13 at the second end of the liquid-cooled main board 1 after being positioned and embedded by the limiting groove 33. The internal liquid inlet pipe 12 and internal liquid outlet pipe 13 at the first end of the liquid-cooled main board 1 are welded and sealed to the external liquid inlet pipe 11 and external liquid outlet pipe 14 after being positioned and embedded by the limiting groove 33. This forms the complete liquid-cooled main board 1 structure of this radiator. Then, the liquid-cooled main board 1 and the base plate 2 are connected and fixed by means of screwing, snap-fitting, or mortise and tenoning.

[0061] Example 3

[0062] The difference between Embodiment 3 and Embodiment 1 is that the liquid-cooled mainboard 1 is a split assembly type. The liquid-cooled mainboard 1 in Embodiment 3 is also provided with a docking bend 41, which is located at the second end of the liquid-cooled mainboard 1. The external liquid inlet pipe 11 and the external liquid outlet pipe 14 are located at the first end of the liquid-cooled mainboard 1. The two ends of the docking bend 41 are respectively sealed and connected to the internal liquid inlet pipe 12 and the internal liquid outlet pipe 13 at the second end of the liquid-cooled mainboard 1.

[0063] Example 4

[0064] The difference between Embodiment 4 and Embodiment 1 is that the liquid-cooled mainboard 1 is a modular assembly. The liquid-cooled mainboard 1 in Embodiment 4 is also equipped with a pipe end cap 51, which is used to seal and block the internal inlet pipe 12 and internal outlet pipe 13 at the second end of the liquid-cooled mainboard 1. Specifically, the liquid-cooled mainboard 1 is formed by precision machining of a rectangular metal plate to create the internal inlet pipe 12 and internal outlet pipe 13. Grooves are cut at the second end of the internal inlet pipe 12 and internal outlet pipe 13 to achieve communication. Then, the pipe end cap 51 is welded to the second end of the liquid-cooled mainboard 1 to complete the sealing while ensuring the communication between the internal inlet pipe 12 and internal outlet pipe 13.

[0065] Meanwhile, in this embodiment, the top and bottom surfaces of the liquid-cooled motherboard 1 are both planar, so that the top or bottom surface of the liquid-cooled motherboard 1 can be detachably attached to the base plate 2.

[0066] Example 5

[0067] The difference between Example 5 and Example 1 is that a finned structure 61 is also added to the liquid-cooled motherboard 1. The excellent heat dissipation effect of the finned structure 61 is used to further enhance the heat dissipation effect of the liquid-cooled motherboard 1 in this case. The finned structure 61 is not limited to common flat structures, corrugated structures, or structures with protrusions.

[0068] Compared to existing technologies, the present invention features a detachable liquid-cooled radiator with diamond-shaped protrusions on the inner wall of the flow channel. At least one section of threaded flow guide structure 111 is provided on the inner wall of the external liquid inlet pipe 11 of the liquid-cooled main board 1, and at least one section of diamond-shaped protruding flow guide structure 121 is provided on the inner wall of the internal liquid inlet pipe 12 and the internal liquid outlet pipe 13 of the liquid-cooled main board 1. This not only increases the heat exchange area between the fluid and the flow channel, but more importantly, it also enhances the convective heat transfer efficiency by disturbing the boundary layer generated when the fluid contacts the flow channel wall, thereby greatly improving the heat transfer effect.

[0069] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A detachable liquid-cooled heat sink with diamond-shaped protrusions on the inner wall of the flow channel, characterized in that: It includes a detachable and fitted liquid-cooled main board (1) and a base plate (2), and a layer of thermally conductive silicone grease is provided on the contact surface between the liquid-cooled main board (1) and the base plate (2); the liquid-cooled main board (1) is provided with interconnected liquid inlet channels and liquid outlet channels; The liquid inlet channel includes an external liquid inlet pipe (11) connected to the liquid cooling motherboard (1) and an internal liquid inlet pipe (12) pre-installed in the liquid cooling motherboard (1); the inner wall of the internal liquid inlet pipe (12) is provided with a diamond-shaped protruding flow guiding structure (121); The liquid outlet channel includes an external liquid outlet pipe (14) connected to the liquid cooling main board (1) and an internal liquid outlet pipe (13) pre-installed in the liquid cooling main board (1). The internal liquid outlet pipe (13) is also provided with the diamond-shaped protruding flow guiding structure (121) on its inner wall. The rhomboid protrusion guide structure (121) includes a plurality of rhomboid protrusions (122) arranged in an array, with each rhomboid protrusion (122) having a long diagonal corner facing the direction of fluid flow.

2. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 1, characterized in that: The inner wall of the external liquid inlet pipe (11) is provided with a threaded flow guiding structure (111).

3. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 1, characterized in that: The staggered arrangement in the array means that the number of rhomboid bumps (122) in odd-numbered rows is N, and the number of rhomboid bumps (122) in even-numbered rows is N-1.

4. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 1, characterized in that: The angle of the rhomboid apex of each of the rhomboid bumps (122) along the fluid direction is between 10° and 90°.

5. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 1, characterized in that: The liquid cooling motherboard (1) is also provided with a plug, which is located at the second end of the liquid cooling motherboard (1), and the external liquid inlet pipe (11) and the external liquid outlet pipe (14) are located at the first end of the liquid cooling motherboard (1); and the plug includes a docking end (31) and a sealing plug (32), the docking end (31) docks with the second end of the liquid cooling motherboard (1), and the sealing plug (32) seals the docking end (31).

6. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 5, characterized in that: The built-in channel of the docking end (31) is used to connect the internal liquid inlet pipe (12) and the internal liquid outlet pipe (13).

7. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 5, characterized in that: On the liquid-cooled main board (1), limit grooves (33) are respectively provided at the pipe openings at both ends of the internal liquid inlet pipe (12) and the internal liquid outlet pipe (13).

8. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 1, characterized in that: The liquid cooling main board (1) is also provided with a docking bend (41), which is located at the second end of the liquid cooling main board (1), and the external liquid inlet pipe (11) and the external liquid outlet pipe (14) are located at the first end of the liquid cooling main board (1); the two ends of the docking bend (41) are respectively sealed and connected to the internal liquid inlet pipe (12) and the internal liquid outlet pipe (13) at the second end of the liquid cooling main board (1).

9. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 1, characterized in that: The liquid cooling motherboard (1) is also provided with a pipe end cap (51); and the top and bottom surfaces of the liquid cooling motherboard (1) are both flat, so that the top or bottom surface of the liquid cooling motherboard (1) can be detachably attached to the base plate (2).

10. The detachable liquid cooling radiator with rhombic protrusions on the inner wall of the flow channel according to claim 1, characterized in that: The liquid-cooled mainboard (1) is also equipped with a fin structure (61).

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