Chip mounting equipment for semiconductor chip processing

Abstract

A chip mounting device for semiconductor chip processing comprises a machine body, an XY moving table is arranged on the outer wall of the upper side of the machine body, an L-shaped mounting plate is fixedly connected to a sliding block of the XY moving table, two symmetrically-distributed air cylinders are mounted on the inner wall of the lower side of the L-shaped mounting plate, and output shafts of the air cylinders penetrate through the lower side wall of the L-shaped mounting plate and are fixedly connected with mounting connectors. A mounting groove is formed in the mounting connector. Compared with the prior art, the suction nozzle has the advantages that the suction nozzle can be replaced conveniently and quickly through the installation connector and the limiting mechanism, the suction nozzle can be replaced in a short time, the downtime is remarkably shortened, and therefore the production efficiency is improved; through the arrangement of the positioning mechanism, the position of the substrate can be accurately corrected through clamping forces in four directions, and the substrate is ensured to always keep a correct angle and a correct position in the processing process, so that the precision and the stability of chip mounting are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a chip mounting device for semiconductor chip processing. Background Technology

[0002] Chips work based on the physical properties of semiconductor materials, integrating electronic components onto a small semiconductor wafer through specific manufacturing processes. The main steps include design, manufacturing, and packaging. Chips can perform specific functions, such as data processing, signal amplification, and information storage, and are widely used in computers, communications, consumer electronics, industrial control, automotive electronics, and medical devices. Chip mounting equipment is mainly used to precisely mount chips or other components onto substrates or lead frames.

[0003] In the semiconductor chip manufacturing industry, the nozzles on surface mount equipment are key components used to hold chips or components for precise placement. However, due to the diverse sizes of chips and components, different sizes of chips and components require different sized nozzles for placement. Traditionally, changing nozzles is cumbersome and time-consuming, impacting production efficiency. Furthermore, traditional surface mount equipment generally lacks the capability for precise substrate alignment. After the substrate is placed on the equipment, it often exhibits angular misalignment or incorrect positioning, and manual correction further hinders processing efficiency. Utility Model Content

[0004] The main objective of this invention is to provide a chip mounting device for semiconductor chip processing, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a chip mounting device for semiconductor chip processing, comprising a body, an XY moving stage on the upper outer wall of the body, an L-shaped mounting plate fixedly connected to a sliding block of the XY moving stage, two symmetrically distributed cylinders mounted on the lower inner wall of the L-shaped mounting plate, the output shaft of the cylinders passing through the lower side wall of the L-shaped mounting plate and fixedly connected to a mounting joint, the mounting joint having a mounting groove, an abutment plate fixedly connected in the mounting groove, a sealing groove on the lower side wall of the abutment plate, a sealing ring provided in the sealing groove, a suction nozzle detachably connected in the mounting groove through a limiting mechanism, a mounting stage fixedly connected to the upper outer wall of the body, and a positioning mechanism provided on the mounting stage.

[0006] As a further description of the above technical solution, the limiting mechanism includes a groove, a limiting bead, a collar, and a clamping spring. The mounting groove has four grooves on its wall, and the limiting bead is provided in each groove. The collar is slidably fitted on the mounting joint, and a clamping spring is provided between the upper inner wall of the mounting joint and the collar.

[0007] As a further description of the above technical solution, the positioning mechanism includes a bidirectional screw, a knob, a moving block, a first clamping plate, a push plate, a second clamping plate, a buffer spring, an L-shaped connecting rod, and a wedge block. The bidirectional screw is rotatably mounted on one inner wall of the mounting table. The other end of the bidirectional screw passes through the other side wall of the mounting table and is fixedly connected to a knob. Two symmetrically distributed moving blocks are threaded onto the bidirectional screw. The first clamping plate is fixedly connected to the upper side wall of the moving blocks. The push plate and the second clamping plate are slidably mounted on both the front and rear sides of the upper outer wall of the mounting table. Two buffer springs are provided between the push plate and the second clamping plate. The L-shaped connecting rod is fixedly connected to both the front and rear side walls of the first clamping plate. The other end of the L-shaped connecting rod is fixedly connected to a wedge block that cooperates with the push plate.

[0008] As a further description of the above technical solution, the outer wall of the suction nozzle is provided with four slots.

[0009] As a further description of the above technical solution, four guide grooves are also provided around the wall of the mounting groove, and four insertion blocks that are adapted to the guide grooves are provided around the outer wall of the suction nozzle.

[0010] As a further description of the above technical solution, an adapter pipe that communicates with the mounting groove is fixedly connected to the upper outer wall of the mounting joint.

[0011] As a further description of the above technical solution, limit rods are fixedly connected between the inner walls of both sides of the mounting table and on the front and rear sides of the bidirectional screw, and the moving block slides with the limit rods.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. The installation connector and limiting mechanism make nozzle replacement convenient and quick, enabling nozzle replacement to be completed in a short time, significantly reducing downtime and thus improving production efficiency.

[0014] 2. Through the positioning mechanism, the clamping force in four directions can accurately correct the position of the substrate, ensuring that the substrate maintains the correct angle and position during the processing, thereby greatly improving the accuracy and stability of chip mounting. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chip processing mounting device according to the present invention;

[0016] Figure 2 This is a schematic diagram of the nozzle structure of a chip mounting device for semiconductor chip processing according to this utility model;

[0017] Figure 3This is a cross-sectional view of the mounting connector of a chip mounting device for semiconductor chip processing according to this utility model;

[0018] Figure 4 This is a schematic diagram of the internal structure of the mounting table of a semiconductor chip processing mounting equipment according to this utility model;

[0019] Figure 5 This is a schematic diagram of the positioning mechanism structure of a semiconductor chip processing chip mounting equipment according to the present invention;

[0020] In the diagram: 1. Body; 2. XY moving stage; 3. L-shaped mounting plate; 31. Cylinder; 4. Mounting connector; 41. Mounting groove; 42. Abutment plate; 43. Sealing groove; 5. Nozzle; 6. Limiting mechanism; 7. Mounting table; 8. Positioning mechanism; 61. Cavity; 62. Limiting bead; 63. Collar; 64. Pressing spring; 81. Bidirectional screw; 82. Knob; 83. Moving block; 84. First clamping plate; 85. Push plate; 86. Second clamping plate; 87. Buffer spring; 88. L-shaped connecting rod; 89. Wedge block; 51. Slot; 44. Guide groove; 52. Insertion block; 45. Adapter pipe; 71. Limiting rod. Detailed Implementation

[0021] To make the technical means, creative features, and objectives of this utility model easier to understand, the following describes this utility model in conjunction with specific embodiments.

[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] Please see Figure 1-5This utility model provides a chip mounting device for semiconductor chip processing, including a body 1. An XY moving stage 2 is located on the upper outer wall of the body 1. The XY moving stage 2 can drive an L-shaped mounting plate 3 to move along the X and Y axes. This is mature prior art, and its specific structure and principle will not be described here. An L-shaped mounting plate 3 is fixedly connected to a sliding block of the XY moving stage 2. Two symmetrically distributed cylinders 31 are mounted on the lower inner wall of the L-shaped mounting plate 3. The output shafts of the cylinders 31 pass through the lower wall of the L-shaped mounting plate 3. An installation connector 4 is fixedly connected to the mounting body 1. The mounting connector 4 has an installation groove 41. An abutment plate 42 is fixedly connected to the installation groove 41. A sealing groove 43 is provided on the lower side wall of the abutment plate 42. After the nozzle 5 is installed, it will abut against the abutment plate 42. Under the action of the sealing ring, the seal between the nozzle 5 and the installation connector 4 is ensured. A sealing ring is provided in the sealing groove 43. The nozzle 5 is detachably connected to the installation groove 41 through the limiting mechanism 6. A mounting table 7 is fixedly connected to the upper outer wall of the body 1. A positioning mechanism 8 is provided on the mounting table 7.

[0025] Specifically, such as Figure 3 As shown, a semiconductor chip processing chip mounting device includes a limiting mechanism 6 comprising a cavity 61, a limiting bead 62, a collar 63, and a clamping spring 64. The mounting groove 41 has four cavities 61 arranged around its wall, with the limiting bead 62 inside each cavity. The collar 63 is slidably fitted onto the mounting connector 4. A clamping spring 64 is positioned between the upper inner wall of the mounting connector 4 and the collar 63. When replacing the nozzle 5, the collar 63 is pulled upwards to remove pressure on the limiting bead 62. Then, the nozzle 5 is pulled downwards, causing the limiting bead 62 to disengage from the slot 51, thus completing the removal of the nozzle 5. When installing a new nozzle 5, the nozzle 5 is inserted into the mounting groove 41, and then the collar 63 is released. Under the push of the clamping spring 64, the collar 63 moves downwards, squeezing the limiting bead 62 and locking it into the slot 51, thereby fixing the nozzle 5 in place. This installation method is convenient and quick, significantly reducing downtime and improving production efficiency.

[0026] Specifically, such as Figure 4 and Figure 5As shown, a semiconductor chip fabrication placement device includes a positioning mechanism 8 comprising a bidirectional screw 81, a knob 82, a moving block 83, a first clamping plate 84, a push plate 85, a second clamping plate 86, a buffer spring 87, an L-shaped connecting rod 88, and a wedge block 89. The bidirectional screw 81 is rotatably mounted on one inner wall of the placement table 7. The other end of the bidirectional screw 81 passes through the other side wall of the placement table 7 and is fixedly connected to the knob 82. Two symmetrically distributed moving blocks 83 are threaded onto the bidirectional screw 81. The first clamping plate 84 is fixedly connected to the upper side wall of the moving block 83. The push plate 85 and the second clamping plate 86 are slidably mounted on both the front and rear sides of the upper outer wall of the placement table 7. Two buffer springs 87 are provided between the push plate 85 and the second clamping plate 86. The L-shaped connecting rod 88 is fixedly connected to both the front and rear side walls of the first clamping plate 84. 8. The other end of the L-shaped connecting rod 88 is fixedly connected to a wedge block 89 that cooperates with the push plate 85. Rotating the knob 82 can drive the bidirectional screw 81 to rotate. When the bidirectional screw 81 rotates, it can cause the two moving blocks 83 to move the first clamping plate 84. The first clamping plate 84 will move closer to the substrate. At the same time, driven by the L-shaped connecting rod 88, the wedge block 89 moves along with it. The movement of the wedge block 89 will squeeze the push plate 85 closer to the substrate, thereby causing the second clamping plate 86 to move closer to the substrate. Under the action of the buffer spring 87, the second clamping plate 86 has a certain fault tolerance space to ensure that the two first clamping plates 84 and the two second clamping plates 86 can clamp and position the substrate. Through the clamping force in four directions, the position of the substrate can be accurately corrected to ensure that the substrate always maintains the correct angle and position during the processing.

[0027] Specifically, such as Figure 2 As shown, a semiconductor chip processing mounting device has four slots 51 arranged around the outer wall of the nozzle 5.

[0028] Specifically, such as Figure 2 As shown, a chip mounting device for semiconductor chip processing has four guide grooves 44 arranged around the wall of the mounting groove 41, and four insertion blocks 52 that are adapted to the guide grooves 44 are arranged around the outer wall of the nozzle 5. When installing the nozzle 5, the insertion blocks 52 need to be inserted into the guide grooves 44 to ensure that the slots 51 on the nozzle 5 can be accurately aligned with the cavity 61.

[0029] Specifically, such as Figure 3 As shown, a semiconductor chip processing chip mounting device has an adapter pipe 45 fixedly connected to the upper outer wall of the mounting connector 4, which communicates with the mounting groove 41 and is used to connect a negative pressure pump.

[0030] Specifically, such as Figure 4As shown, a chip mounting device for semiconductor chip processing has a mounting table 7 with limit rods 71 ​​fixedly connected between the inner walls of both sides and on the front and rear sides of the bidirectional screw 81. The moving block 83 is slidably engaged with the limit rods 71. The limit rods 71 ​​can limit the moving block 83 when it moves, so that it can only move in a straight line.

[0031] It should be noted that this utility model is a chip mounting device for semiconductor chip processing. In use, the substrate is placed on the mounting table 7, and then the knob 82 is rotated to drive the bidirectional screw 81. When the bidirectional screw 81 rotates, the two moving blocks 83 move the first clamping plate 84, causing it to move closer to the substrate. Simultaneously, driven by the L-shaped connecting rod 88, the wedge block 89 moves along with it. The movement of the wedge block 89 compresses the pushing plate 85, causing it to move closer to the substrate, which in turn causes the second clamping plate 86 to move closer to the substrate. Under the action of the buffer spring 87, the second clamping plate 86 has a certain tolerance space, ensuring that the two first clamping plates 84 and the two second clamping plates 86 can clamp and position the substrate. Through clamping forces in four directions, the position of the substrate can be accurately corrected, ensuring that the substrate is properly positioned during processing. By maintaining the correct angle and position, when it is necessary to replace the nozzle 5, drag the collar 63 upward so that the collar 63 no longer squeezes the limiting bead 62, and then pull the nozzle 5 downward. The limiting bead 62 will disengage from the slot 51, thus completing the disassembly of the nozzle 5. When installing a new nozzle 5, insert the nozzle 5 into the mounting slot 41 so that the nozzle 5 abuts against the abutment plate 42 in the mounting slot 41. When inserting, the insertion block 52 on the nozzle 5 must be inserted into the guide groove 44 to ensure that the slot 51 on the nozzle 5 can be accurately aligned with the cavity 61. Then release the collar 63. Under the push of the clamping spring 64, the collar 63 moves downward and squeezes the limiting bead 62 into the slot 51, thereby fixing the nozzle 5 in place. The replacement method is convenient and quick, significantly reducing downtime and thus improving production efficiency.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A chip mounting apparatus for semiconductor chip processing, comprising a body (1), wherein an XY moving stage (2) is provided on the upper outer wall of the body (1), an L-shaped mounting plate (3) is fixedly connected to a sliding block of the XY moving stage (2), and two symmetrically distributed cylinders (31) are mounted on the lower inner wall of the L-shaped mounting plate (3), characterized in that: The output shaft of the cylinder (31) passes through the lower side wall of the L-shaped mounting plate (3) and is fixedly connected to the mounting joint (4). The mounting joint (4) has a mounting groove (41). An abutment plate (42) is fixedly connected in the mounting groove (41). A sealing groove (43) is provided on the lower side wall of the abutment plate (42). A sealing ring is provided in the sealing groove (43). A suction nozzle (5) is detachably connected in the mounting groove (41) through a limiting mechanism (6). A mounting table (7) is fixedly connected on the upper outer wall of the machine body (1). A positioning mechanism (8) is provided on the mounting table (7).

2. The semiconductor chip fabrication placement equipment according to claim 1, characterized in that: The limiting mechanism (6) includes a groove (61), a limiting bead (62), a collar (63), and a clamping spring (64). The mounting groove (41) has four grooves (61) arranged around its wall. The grooves (61) contain limiting beads (62). The mounting joint (4) is slidably fitted with a collar (63). The upper inner wall of the mounting joint (4) is fitted with a clamping spring (64) between it and the collar (63).

3. The semiconductor chip fabrication placement equipment according to claim 1, characterized in that: The positioning mechanism (8) includes a bidirectional screw (81), a knob (82), a moving block (83), a first clamping plate (84), a push plate (85), a second clamping plate (86), a buffer spring (87), an L-shaped connecting rod (88), and a wedge block (89). The bidirectional screw (81) is rotatably mounted on one side inner wall of the mounting table (7). The other end of the bidirectional screw (81) passes through the other side wall of the mounting table (7) and is fixedly connected to the knob (82). Two symmetrically distributed moving blocks are threaded on the bidirectional screw (81). The moving block (83) has a first clamping plate (84) fixedly connected to its upper side wall. The mounting table (7) has a push plate (85) and a second clamping plate (86) slidably provided on both the front and rear sides of its upper outer wall. Two buffer springs (87) are provided between the push plate (85) and the second clamping plate (86). The first clamping plate (84) has an L-shaped connecting rod (88) fixedly connected to both the front and rear side walls. The other end of the L-shaped connecting rod (88) is fixedly connected to a wedge block (89) that cooperates with the push plate (85).

4. The semiconductor chip fabrication mounting equipment according to claim 2, characterized in that: The outer wall of the suction nozzle (5) is provided with four slots (51).

5. A chip mounting device for semiconductor chip processing according to claim 2, characterized in that: The mounting groove (41) is also provided with four guide grooves (44) on its groove wall, and the suction nozzle (5) is provided with four inserts (52) that are compatible with the guide grooves (44) on its outer wall.

6. The semiconductor chip fabrication placement equipment according to claim 1, characterized in that: The upper outer wall of the mounting joint (4) is fixedly connected to the adapter pipe (45) which communicates with the mounting groove (41).

7. A chip mounting apparatus for semiconductor chip processing according to claim 3, characterized in that: Limiting rods (71) are fixedly connected between the inner walls of the two sides of the mounting table (7) and on the front and rear sides of the bidirectional screw (81), respectively. The moving block (83) slides with the limiting rods (71).

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