Wafer polishing device

Abstract

The embodiment of the utility model provides a wafer polishing device, and relates to the technical field of wafer polishing equipment. The wafer polishing device comprises a polishing box, a fixing assembly and a polishing assembly. A first station and a second station are sequentially arranged in the polishing box in the vertical direction, the second station is relatively close to the bottom of the polishing box, the fixing assembly is installed in the polishing box, and the fixing assembly is used for fixedly installing a wafer and can drive the wafer to move in the vertical direction so that the wafer can pass through the first station or the second station. The polishing assembly is opposite to the fixing assembly, the polishing assembly can move in the vertical direction and rotate around a first preset axis, the first preset axis is parallel to the vertical direction, and the first station and the second station are polishing stations or cleaning stations. The first station and the second station are arranged in the vertical direction, so that the occupied area of the wafer polishing device in the embodiment can be effectively reduced, and the wafer machining efficiency can also be improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing equipment technology, and more specifically, to a wafer polishing device. Background Technology

[0002] Polishing is a common processing technique for wafers (such as silicon carbide wafers), and it typically includes rough polishing, fine polishing, and cleaning processes. Accordingly, existing polishing equipment usually integrates rough polishing stations, fine polishing stations, and cleaning stations to achieve wafer polishing.

[0003] However, some polishing devices in related technologies require the integration of multiple workstations, which can occupy a large area. Utility Model Content

[0004] The purpose of this invention is to provide a wafer polishing apparatus that can reduce the floor space occupied by the polishing apparatus.

[0005] The embodiments of this utility model can be implemented as follows:

[0006] In a first aspect, this utility model provides a wafer polishing apparatus, comprising:

[0007] The polishing box has a first station and a second station arranged vertically inside, with the second station being relatively close to the bottom of the polishing box.

[0008] The fixing component is installed inside the polishing box. The fixing component is used to fix the wafer and can drive the wafer to move in the vertical direction so that the wafer passes through the first station or the second station.

[0009] A polishing assembly is positioned opposite a fixed assembly. The polishing assembly is capable of moving vertically and rotating about a first preset axis. The polishing assembly is used to polish the wafer on the fixed assembly. The first preset axis is parallel to the vertical direction.

[0010] The first and second workstations are either polishing or cleaning stations.

[0011] In an optional embodiment, a first baffle is provided at the first work station. The first baffle has a first through hole for the fixing component and the polishing component to pass through. The first baffle is connected to the inner side wall of the polishing box. The first baffle and the polishing box form a first collection tank. The first collection tank is used to collect liquid.

[0012] A second baffle is provided at the second work station. The second baffle has a second through hole for the fixing component and the polishing component to pass through. The second baffle is connected to the inner wall of the polishing box. The second baffle and the polishing box form a second collection tank for collecting liquid.

[0013] In an optional embodiment, the first baffle is annular and includes a first guide section and a first collection section connected in sequence in the direction near the inner wall of the polishing box. The height of the first guide section gradually decreases in the direction near the first collection section. The first guide section is used to guide liquid to the first collection section.

[0014] In an optional embodiment, a first recovery pipe is also provided at the first station, which is used to discharge the liquid in the first collection tank out of the polishing box.

[0015] In an optional embodiment, the second baffle is annular and includes a second guide section and a second collection section connected in sequence in the direction near the inner wall of the polishing box. The second guide section is used to guide liquid to the second collection section, and the height of the second guide section gradually decreases in the direction near the second collection section.

[0016] In an optional embodiment, a second recovery pipe is also provided at the second station, which is used to discharge the liquid in the second collection tank out of the polishing box.

[0017] In an optional embodiment, the polishing box also has a third station, which is arranged vertically spaced from the second station and located below the second station. The third station is a cleaning station for the wafers on the fixed assembly.

[0018] In an optional embodiment, a water pipe and / or a chemical solution pipe are provided at the third station. The water pipe is used to spray cleaning fluid onto the wafers on the fixing assembly, and the chemical solution pipe is used to spray chemical solution onto the wafers on the fixing assembly.

[0019] In an optional embodiment, the wafer polishing apparatus further includes a robotic arm for removing the cleaned wafer and transferring it to a wafer storage device.

[0020] In an optional embodiment, the wafer polishing apparatus further includes a polishing slurry recovery component, which includes a filtration component, a concentration component, and a repolishing component connected in sequence. The filtration component is connected to a first collection tank or a second collection tank. The liquid in the first collection tank or the second collection tank can flow into the polishing slurry collection unit through the filtration component, the concentration component, and the repolishing component in sequence. The concentration component is used to concentrate the polishing slurry that has passed through the filtration component, and the repolishing component is used to restore the polishing performance of the polishing slurry that has passed through the concentration component.

[0021] The beneficial effects provided by this embodiment of the invention include: This embodiment of the invention provides a wafer polishing apparatus, which includes a polishing box, a fixing component, and a polishing assembly. A first station and a second station are sequentially arranged vertically inside the polishing box, with the second station relatively close to the bottom of the polishing box. The fixing component is installed inside the polishing box and is used to fix the wafer and move the wafer vertically, allowing the wafer to pass through the first station or the second station. The polishing assembly is opposite to the fixing component and can move vertically and rotate around a first preset axis, which is parallel to the vertical direction. The first station and the second station are polishing stations or cleaning stations. Arranging the first station and the second station vertically effectively reduces the floor space occupied by the wafer polishing apparatus in this embodiment and also improves the processing efficiency of the wafer. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the wafer polishing apparatus provided in this embodiment;

[0024] Figure 2 This is a schematic diagram of the flow path structure of the polishing slurry recovery component provided in this embodiment.

[0025] Icons: 1-Wafer polishing apparatus; 100-Polishing box; 101-First station; 102-Second station; 103-Third station; 110-First baffle; 111-First guide section; 112-First collection section; 1100-First collection tank; 120-Second baffle; 121-Second guide section; 122-Second collection section; 1200-Second collection tank; 130-First recovery pipe; 140-Second recovery pipe; 200-Fixing assembly; 300 - Polishing assembly; 310 - Polishing head; 320 - Polishing pad; 400 - Water pipe; 500 - Chemical solution pipe; 600 - Robotic arm; 700 - Wafer storage device; 800 - Polishing slurry recovery assembly; 810 - Filter assembly; 811 - First filter element; 812 - Second filter element; 820 - Concentration assembly; 821 - Concentration tank; 8211 - Polishing slurry chamber; 8212 - Water chamber; 822 - Semi-permeable membrane; 830 - Re-polishing assembly; 840 - Preset pipeline. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0031] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0032] The following describes in detail, with reference to the accompanying drawings, the specific structure of a wafer polishing device provided by this utility model and its corresponding technical effects.

[0033] Please refer to Figure 1 The wafer polishing device 1 provided in this embodiment of the present invention includes a polishing box 100, a fixing component 200 and a polishing component 300.

[0034] The polishing box 100 has a first station 101 and a second station 102 arranged vertically inside. The second station 102 is relatively close to the bottom of the polishing box 100. The fixing component 200 is installed inside the polishing box 100. The fixing component 200 is used to fix the wafer and can drive the wafer to move vertically so that the wafer passes through the first station 101 or the second station 102. The polishing component 300 is opposite to the fixing component 200. The polishing component 300 can move vertically and rotate around a first preset axis. The polishing component 300 is used to polish the wafer on the fixing component 200, such as rough polishing or fine polishing. The first preset axis is parallel to the vertical direction. The first station 101 and the second station 102 are polishing stations or cleaning stations.

[0035] Understandably, since the polishing box 100 in this application integrates the first station 101 and the second station 102 in the vertical direction, it can effectively reduce the floor area of ​​the wafer polishing device 1 in this embodiment, so that the polishing device can be arranged in a smaller area. Therefore, the wafer polishing device 1 in this embodiment can adapt to more environments.

[0036] In detail, in this embodiment, both the first station 101 and the second station 102 are polishing stations, with the first station 101 being a coarse polishing station and the second station 102 being a fine polishing station. The polishing assembly 300 can rotate around a first preset axis to perform polishing operations on the wafer.

[0037] In this embodiment, the fixing component 200 is located below the polishing component 300 in the polishing chamber 100. Understandably, during polishing, the fixing component 200 can move the wafer upwards until it reaches the first station 101, while the polishing component 300 can move downwards to the first station 101 and perform rough polishing on the wafer at the first station 101. After rough polishing, the fixing component 200 and the polishing component 300 can move downwards to the second station 102, thereby achieving fine polishing of the wafer.

[0038] It should be noted that the polishing assembly 300 may include a polishing drive, a polishing head 310, and a polishing pad 320 connected in sequence. The polishing pad 320 is mounted on the polishing head 310. The polishing head 310 has multiple liquid outlet holes, and the polishing pad 320 also has multiple through holes corresponding to the multiple liquid outlet holes. The liquid outlet holes and through holes allow polishing fluid to flow out. The polishing fluid flowing out of the liquid outlet holes during coarse polishing is different from the polishing fluid flowing out of the liquid outlet holes during fine polishing. Furthermore, the polishing pad 320 used during coarse polishing is also different from the polishing pad used during fine polishing. It can be understood that the polishing fluid used during fine polishing is fine polishing fluid, and the polishing fluid used during coarse polishing is coarse polishing fluid. The polishing drive is used to drive the polishing head 310 to rotate and move vertically.

[0039] Optionally, a first baffle 110 is provided on the first station 101. The first baffle 110 has a first through hole for the fixing component 200 and the polishing component 300 to pass through. The first baffle 110 is connected to the inner side wall of the polishing box 100. The first baffle 110 and the polishing box 100 form a first collection tank 1100, which is used to collect liquid.

[0040] In this embodiment, a second baffle 120 is provided on the second station 102. The second baffle 120 has a second through hole for the fixing component 200 and the polishing component 300 to pass through. The second baffle 120 is connected to the inner side wall of the polishing box 100. The second baffle 120 and the polishing box 100 form a second collection tank 1200, which is used to collect liquid.

[0041] Understandably, by setting up the first collection tank 1100 and the second collection tank 1200, when the polishing assembly 300 rotates to radially polish the wafer, that is, during coarse polishing or fine polishing, the polishing liquid flowing out of the polishing assembly 300 can enter the first collection tank 1100 or the second collection tank 1200 under the action of centrifugal force, thereby realizing the collection of polishing liquid.

[0042] Of course, in some embodiments, the second baffle 120 can be provided only on the second station 102, and the second baffle 120 and the inner wall of the polishing box 100 together define the second collection groove 1200, or the first baffle 110 can be provided only on the first station 101, and the first baffle 110 and the inner wall of the polishing box 100 together define the first collection groove 1100.

[0043] In detail, the first baffle 110 is annular. In the direction near the inner sidewall of the polishing box 100, the first baffle 110 includes a first guide section 111 and a first collection section 112 connected in sequence. The height of the first guide section 111 gradually decreases in the direction near the first collection section 112. The first guide section 111 is used to guide the liquid to the first collection section 112 so that the polishing liquid of the polishing assembly 300 can enter the first collection section 112 and prevent the polishing liquid from flowing out from the first through hole.

[0044] In detail, in order to facilitate the discharge of polishing liquid from the first collection tank 1100 into the polishing box 100, a first recovery pipe 130 is also provided on the first station 101. The first recovery pipe 130 is used to discharge the liquid from the first collection tank 1100 into the polishing box 100. Specifically, one end of the first collection pipe is located in the first collection tank 1100, and the other end of the first collection pipe extends out of the polishing box 100.

[0045] Of course, there can be multiple first collection tubes, and these multiple first collection tubes can be arranged at circumferential intervals around the first collection groove 1100.

[0046] Similarly, to facilitate the collection of polishing liquid in the second collection tank 1200, the second baffle 120 is annular. In the direction near the inner wall of the polishing box 100, the second baffle 120 includes a second guide portion 121 and a second collection portion 122 connected in sequence. The height of the second guide portion 121 gradually decreases in the direction near the second collection portion 122. The second guide portion 121 is used to guide the liquid to the second collection portion 122 to prevent the polishing liquid from flowing out from the second through hole.

[0047] Similarly, in order to facilitate the discharge of polishing liquid from the second collection tank 1200 into the polishing box 100, a second recovery pipe 140 is also provided on the second station 102. The second recovery pipe 140 is used to discharge the liquid from the second collection tank 1200 into the polishing box 100. Specifically, one end of the second collection pipe is located in the second collection tank 1200, and the other end of the second collection pipe extends out of the polishing box 100.

[0048] Optionally, in this embodiment, the polishing box 100 also has a third station 103, which is arranged vertically at intervals from the second station 102 and located below the second station 102. The third station 103 is a cleaning station for the wafers on the fixing assembly 200.

[0049] Understandably, after the wafer on the fixing component 200 has been finely polished, the fixing component 200 can continue to move downwards and place the wafer in the third station 103 to facilitate wafer cleaning.

[0050] It is understood that in this embodiment, the first station 101, the second station 102 and the third station 103 are all arranged at intervals in the vertical direction within the polishing box 100, which can effectively reduce the floor space of the wafer polishing device 1.

[0051] The third station 103 is equipped with a water pipe 400 and a chemical solution pipe 500. The water pipe 400 is used to spray cleaning fluid onto the wafers on the fixing assembly 200, and the chemical solution pipe 500 is used to spray chemical solution onto the wafers on the fixing assembly 200. This is for cleaning the wafers on the fixing assembly 200.

[0052] Of course, in some other embodiments, the third station 103 may only be equipped with a water pipe 400 or a medicine pipe 500.

[0053] In detail, the fixing component 200 in this embodiment can also rotate, thereby driving the wafer to rotate. The rotation direction of the fixing component 200 is parallel to the vertical direction. Thus, after the wafer on the fixing component 200 has been cleaned at the third station 103, the fixing component 200 can drive the wafer to rotate at the third station 103 to spin dry the liquid on the wafer.

[0054] Understandably, in order to facilitate the discharge of cleaning fluid and chemical solution from the polishing box 100, a liquid collection tank can be set at the bottom of the polishing box 100, and the liquid collection tank has a drain port.

[0055] Optionally, the wafer polishing apparatus 1 also includes a robot 600, which is used to remove the cleaned wafer and transfer the cleaned wafer to a wafer storage device 700, which can be a wafer loading basket.

[0056] Optionally, in this embodiment, a vacuum adsorption hole may be provided above the fixing device. The vacuum adsorption hole is used to adsorb the wafer, that is, the fixing device is used to fix the wafer by vacuum adsorption, so as to facilitate the fixing and loosening of the wafer. Similarly, the fixing device is connected to a driving device, which is used to drive the fixing device to move vertically and rotate.

[0057] The workflow is as follows:

[0058] The wafer is drawn up to the first station 101 by the vacuum adsorption hole on the fixing device. After the polishing head 310 on the polishing assembly 300 is fitted with the polishing pad 320, it descends to the first station 101. Then, the polishing head 310 sprays coarse polishing fluid while rotating to achieve coarse polishing of the wafer. The polishing fluid splashes into the first collection tank 1100 under the centrifugal force of the wafer. After coarse polishing, the fixing device and the polishing head 310 descend to the second station 102. The polishing head 310 can replace the polishing pad 320 and then spray fine polishing fluid while rotating to achieve fine polishing of the wafer. The polishing fluid splashes into the second collection tank 1200 under the centrifugal force of the wafer. Finally, it descends to the third station 103. After cleaning and drying, it is taken out and stored by the robot arm 600. The first station 101, the second station 102 and the third station 103 are arranged vertically. This embodiment can also improve the processing efficiency of wafers.

[0059] Please refer to Figure 2 Optionally, the wafer polishing apparatus 1 further includes a polishing slurry recovery component 800, which includes a filter component 810, a concentration component 820, and a repolishing component 830 connected in sequence. The filter component 810 is connected to a first collection tank 1100 or a second collection tank 1200. Specifically, the filter component 810 can be connected to a first recovery pipe 130 or a second recovery pipe 140.

[0060] In detail, the filter assembly 810, the concentration assembly 820, and the repolishing assembly 830 can be connected sequentially through a preset pipeline 840. The inlet of the preset pipeline 840 is connected to the first recovery pipe 130 or the second recovery pipe 140, and the outlet of the preset pipeline 840 can be connected to the polishing liquid collection device. The polishing liquid discharged from the first recovery pipe 130 or the second recovery pipe 140 can pass through the preset pipeline 840 sequentially through the filter assembly 810, the concentration assembly 820, and the repolishing assembly 830, and the polishing liquid with restored polishing performance flows into the polishing liquid collection device for collection.

[0061] The liquid in the first collection tank 1100 or the second collection tank 1200 can flow into the polishing liquid collection unit through the filter assembly 810, the concentration assembly 820 and the repolishing assembly 830 in sequence. The concentration assembly 820 is used to concentrate the polishing liquid that has passed through the filter assembly 810, and the repolishing assembly 830 is used to restore the polishing performance of the polishing liquid that has passed through the concentration assembly 820.

[0062] In detail, in this embodiment, the filter assembly 810 may include a first filter element 811 and a second filter element 812 connected in sequence. The first filter element 811 is disposed downstream of the second filter element 812, and the first filter element 811 is used for the first coarse filtration, while the second filter element 812 is used for fine filtration. It can be understood that the filter particle size of the filter element in the second filter element 812 is smaller than the filter particle size traveling in the second filter element 812.

[0063] Optionally, the concentration component 820 includes a concentration tank 821, which is equipped with a semi-permeable membrane 822. The semi-permeable membrane 822 divides the concentration tank 821 into a polishing liquid chamber 8211 and a water chamber 8212. By pressurizing, water molecules can be transferred from the high-concentration polishing liquid chamber 8211 to the low-concentration water chamber 8212, achieving low-concentration permeation and concentrating the polishing liquid. The second filter component 810 is connected to the polishing liquid chamber 8211, and the polishing liquid chamber 8211 is connected to the repolishing component 830. Since the concentration component 820 is a conventional device, it will not be described in detail here.

[0064] Optionally, the repolishing assembly 830 includes a preset housing, which is connected to a polishing liquid chamber 8211. Liquid from the polishing liquid chamber 8211 can enter the preset housing through a preset pipe 840. Within the preset housing, additives, such as oxidants and dispersants, can be added, and the preset housing can be vibrated using ultrasound to ensure relatively uniform suspension of particles, thereby restoring the polishing performance of the polishing liquid. The preset housing can be connected to a polishing liquid collection device via the preset pipe 840 for storing the polishing liquid with restored polishing performance.

[0065] In summary, the wafer polishing apparatus 1 provided in this embodiment includes a polishing box 100, a fixing component 200, and a polishing component 300. A first station 101 and a second station 102 are sequentially arranged vertically inside the polishing box 100, with the second station 102 relatively close to the bottom of the polishing box 100. The fixing component 200 is installed inside the polishing box 100 and is used to fix the wafer and move the wafer vertically, allowing the wafer to pass through either the first station 101 or the second station 102. The polishing component 300 is opposite to the fixing component 200 and can move vertically and rotate around a first preset axis, which is parallel to the vertical direction. The first station 101 and the second station 102 are polishing stations or cleaning stations. Arranging the first station 101 and the second station 102 vertically effectively reduces the floor space occupied by the wafer polishing apparatus 1 in this embodiment and also improves the wafer processing efficiency.

[0066] The above description is only a specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer polishing apparatus, characterized in that, include: A polishing box (100) has a first station (101) and a second station (102) arranged in sequence along the vertical direction inside the polishing box (100), with the second station (102) being relatively close to the bottom of the polishing box (100); A fixing component (200) is installed inside the polishing box (100). The fixing component (200) is used to fix the wafer and can drive the wafer to move along the vertical direction so that the wafer passes through the first station (101) or the second station (102). A polishing assembly (300) is opposite to the fixing assembly (200). The polishing assembly (300) is movable in the vertical direction and rotates about a first preset axis. The polishing assembly (300) is used to polish the wafer on the fixing assembly (200). The first preset axis is parallel to the vertical direction. The first station (101) and the second station (102) are polishing stations or cleaning stations.

2. The wafer polishing apparatus according to claim 1, characterized in that: The first workstation (101) is provided with a first baffle (110), the first baffle (110) has a first through hole for the fixing component (200) and the polishing component (300) to pass through, the first baffle (110) is connected to the inner side wall of the polishing box (100), the first baffle (110) and the polishing box (100) form a first collection groove (1100), the first collection groove (1100) is used to collect liquid; A second baffle (120) is provided on the second work station (102). The second baffle (120) has a second through hole for the fixing component (200) and the polishing component (300) to pass through. The second baffle (120) is connected to the inner side wall of the polishing box (100). The second baffle (120) and the polishing box (100) form a second collection tank (1200). The second collection tank (1200) is used to collect liquid.

3. The wafer polishing apparatus according to claim 2, characterized in that: The first baffle (110) is annular. In the direction near the inner wall of the polishing box (100), the first baffle (110) includes a first guide section (111) and a first collection section (112) connected in sequence. The height of the first guide section (111) gradually decreases in the direction near the first collection section (112). The first guide section (111) is used to guide liquid to the first collection section (112).

4. The wafer polishing apparatus according to claim 2, characterized in that: The first station (101) is also provided with a first recovery pipe (130), which is used to discharge the liquid in the first collection tank (1100) out of the polishing box (100).

5. The wafer polishing apparatus according to claim 2, characterized in that: The second baffle (120) is annular. In the direction near the inner wall of the polishing box (100), the second baffle (120) includes a second guide section (121) and a second collection section (122) connected in sequence. The second guide section (121) is used to guide liquid to the second collection section (122). The height of the second guide section (121) gradually decreases in the direction near the second collection section (122).

6. The wafer polishing apparatus according to claim 5, characterized in that: The second station (102) is also provided with a second recovery pipe (140), which is used to discharge the liquid in the second collection tank (1200) out of the polishing box (100).

7. The wafer polishing apparatus according to claim 1, characterized in that: The polishing box (100) also has a third station (103), which is spaced apart from the second station (102) along the vertical direction and located below the second station (102). The third station (103) is the cleaning station for the wafers on the fixing assembly (200).

8. The wafer polishing apparatus according to claim 7, characterized in that: The third workstation (103) is equipped with a water pipe (400) and / or a chemical solution pipe (500). The water pipe (400) is used to spray cleaning fluid onto the wafers on the fixed assembly (200), and the chemical solution pipe (500) is used to spray chemical solution onto the wafers on the fixed assembly (200).

9. The wafer polishing apparatus according to claim 7, characterized in that: The wafer polishing apparatus also includes a robotic arm (600) for removing the cleaned wafer and transferring it to a wafer storage device (700).

10. The wafer polishing apparatus according to claim 2, characterized in that: The wafer polishing apparatus further includes a polishing slurry recovery component (800), which includes a filter component (810), a concentration component (820), and a repolishing component (830) connected in sequence. The filter component (810) is connected to the first collection tank (1100) or the second collection tank (1200). The liquid in the first collection tank (1100) or the second collection tank (1200) can flow into the polishing slurry collection unit through the filter component (810), the concentration component (820), and the repolishing component (830) in sequence. The concentration component (820) is used to concentrate the polishing slurry that has passed through the filter component (810), and the repolishing component (830) is used to restore the polishing performance of the polishing slurry that has passed through the concentration component (820).

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