Grinding device for preparing diffusion resistance test sample

Abstract

The utility model provides a grinding device for preparing a diffusion resistance test sample. The grinding device for preparing the diffusion resistance test sample comprises a grinding disc and a pressure adjusting mechanism, the middle area of the grinding disc is a sample grinding area. The pressure adjusting mechanism is arranged above the grinding disc, the projection of the pressure adjusting mechanism on the grinding disc is located in a sample grinding area of the grinding disc, the pressure adjusting mechanism comprises a plurality of pressure applying heads with different weights, a grinding rod and a grinding head, and the grinding rod is arranged over the sample grinding area of the grinding disc. The grinding head is arranged at the end, close to the grinding disc, of the grinding rod, and the pressing head is detachably installed at the end, away from the grinding disc, of the grinding rod. The problem that the grinding pressure of the grinding device is not accurately adjusted can be effectively solved, and the uniformity and high quality of the surface of a sample are ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing, and more specifically, to a grinding apparatus for preparing samples for diffusion resistance testing. Background Technology

[0002] Sperm resistivity (SRP) is an important analytical method for semiconductor materials. Its basic principle is to obtain information about the doping distribution within the semiconductor by measuring the diffusion resistance through a probe placed on the sample surface. Due to its high sensitivity and high resolution, SRP is widely used in the research and development and manufacturing processes of semiconductor devices. In the semiconductor industry, SRP technology can accurately detect the impurity distribution within semiconductor materials, providing crucial data support for performance optimization and quality control of semiconductor devices. In SRP testing, the smoothness and uniformity of the sample surface are key factors for test accuracy. If the sample surface has micro-scratches, dents, or uneven roughness, it will directly affect the contact state between the probe and the sample surface, leading to deviations in the measurement data. The contact quality between the probe and the sample surface directly affects the stability and accuracy of the measurement signal. When defects exist on the sample surface, the probe may make poor contact with these defects, resulting in distorted measurement signals. To ensure the reliability of SRP testing, the sample surface must be rigorously treated to guarantee its smoothness and uniformity. Therefore, polishing is an indispensable step in SRP test sample preparation.

[0003] Existing grinding devices typically rely on manual or simple mechanical pressurization, making precise pressure control difficult. This imprecise pressure control leads to uneven wear on the sample surface during grinding, affecting the sample's smoothness and uniformity. Furthermore, traditional grinding devices have limited pressure adjustment ranges, failing to adapt to the diverse pressure requirements of different materials and grinding stages. For example, grinding hard semiconductor materials may require higher pressures, while grinding soft materials requires lower pressures, which existing devices struggle to adjust flexibly. Additionally, uniform distribution of the grinding slurry is crucial for grinding efficiency. However, existing devices often have design flaws in their grinding slurry distribution systems, resulting in uneven distribution of the slurry on the sample surface. This not only affects grinding efficiency but may also lead to localized overheating or under-grinding, further impacting sample quality. Utility Model Content

[0004] In view of the problems existing in the prior art described above, this application provides a grinding device for preparing diffusion resistance test samples, which can effectively solve the problem of inaccurate grinding pressure adjustment of the grinding device and ensure the uniformity and high quality of the sample surface.

[0005] To achieve the above and other related objectives, this utility model provides a grinding apparatus for preparing samples for diffusion resistance testing, comprising:

[0006] The grinding disc has a central area for grinding the sample.

[0007] The pressure regulating mechanism is located above the grinding disc, and its projection on the grinding disc is located in the sample grinding area of ​​the grinding disc. The pressure regulating mechanism includes multiple pressure heads of different weights, a grinding rod, and a grinding head. The grinding rod is located directly above the sample grinding area of ​​the grinding disc, the grinding head is located at the end of the grinding rod near the grinding disc, and the pressure head is detachably installed at the end of the grinding rod away from the grinding disc.

[0008] Optionally, the grinding apparatus for preparing samples for diffusion resistance testing further includes: a flow direction adjustment mechanism, which includes:

[0009] The follow-up connection structure is fixedly installed at the edge of the grinding disk outside the sample grinding area;

[0010] The baffle, located above the grinding disc, includes a first end and a second end. The first end is rotatably connected to the follower connection structure, and the second end is located on one side of the sample to be ground in the sample grinding area.

[0011] Optionally, the pressure adjustment range of the pressure regulating mechanism is 0.5N to 50N.

[0012] Optionally, the follower connection structure is detachably mounted on the grinding disc.

[0013] Optionally, when grinding the sample, in the projection on the surface of the grinding disc, the geometric center of the follower connection structure and the geometric center of the grinding sample are connected by a first line, and the geometric center of the follower connection structure and the midpoint of the second end of the baffle are connected by a second line, and the angle between the first line and the second line is between 15° and 25°.

[0014] Optionally, the pressure regulating mechanism includes three pressure heads of different weights.

[0015] Optionally, the grinding apparatus for preparing samples for diffusion resistance testing further includes:

[0016] The control module communicates with the grinding disc and the pressure regulating mechanism to control the rotation of the grinding disc and the pressure of the pressure regulating mechanism.

[0017] Optionally, the rotation speed of the grinding disc is between 200 r / min and 1000 r / min.

[0018] Optionally, the pressure regulating mechanism also includes a shock-absorbing component, which is arranged around the grinding rod.

[0019] Optionally, the top of the pressure head can be flat or curved.

[0020] As described above, the grinding apparatus for preparing diffusion resistance test samples provided by this utility model has at least the following beneficial technical effects:

[0021] This invention relates to a grinding device for preparing samples for diffusion resistance testing, comprising a grinding disc and a pressure regulating mechanism. The central area of ​​the grinding disc is the sample grinding zone. The pressure regulating mechanism is positioned above the grinding disc, and its projection onto the grinding disc is located within the sample grinding zone. The pressure regulating mechanism includes multiple pressure applying heads of varying weights, a grinding rod, and a grinding head. The grinding rod is positioned directly above the sample grinding zone on the grinding disc, and the grinding head is positioned at the end of the grinding rod closest to the grinding disc. The pressure applying head is detachably mounted at the end of the grinding rod furthest from the grinding disc. This device effectively solves the problem of inaccurate grinding pressure regulation in grinding devices, ensuring the uniformity and high quality of the sample surface.

[0022] The grinding apparatus for preparing samples for diffusion resistance testing also includes a flow direction adjustment mechanism, which comprises a follower connection structure and a baffle. The follower connection structure is located at the edge of the grinding disk surrounding the sample grinding area. The baffle is located on the grinding disk and includes a first end and a second end. The first end is rotatably connected to the follower connection structure relative to the grinding disk, so that it rotates relative to the grinding disk under the drive of the follower connection structure. The second end is located on one side of the sample to be ground in the sample grinding area. This ensures that the grinding slurry covers the entire grinding disk, avoiding unstable grinding results due to uneven distribution of the grinding slurry. Attached Figure Description

[0023] Figure 1 The diagram shows the structure of the grinding apparatus for preparing samples for diffusion resistance testing provided by this invention.

[0024] Figure 2 The diagram shows a projection of the follower connection structure, baffle, and grinding sample onto the surface of the grinding disc, as provided in an embodiment of this utility model.

[0025] Figure Labels

[0026] 1. Grinding disc; 11. Sample grinding area; 2. Pressure adjustment mechanism; 21. Pressure head; 22. Grinding rod; 221. Shock absorption assembly; 23. Grinding head; 3. Grinding sample; 4. Flow direction adjustment mechanism; 41. Follower connection structure; 42. Baffle; 421. First end; 422. Second end. Detailed Implementation

[0027] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0028] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0029] This embodiment provides a grinding apparatus for preparing samples for diffusion resistance testing, referring to... Figure 1 The grinding apparatus for preparing samples for diffusion resistance testing in this embodiment includes a grinding disc 1 and a pressure regulating mechanism 2. The central area of ​​the grinding disc 1 is the sample grinding area 11. The surface of the grinding disc 1 is precision-machined to ensure its flatness and reduce errors during the grinding process. The rotation speed of the grinding disc 1 is between 200 r / min and 1000 r / min.

[0030] like Figure 1As shown, the pressure regulating mechanism 2 is positioned above the grinding disk 1, and its projection on the grinding disk 1 is located in the sample grinding area 11 of the grinding disk 1. The pressure regulating mechanism 2 includes multiple pressure heads 21 of different weights, a grinding rod 22, and a grinding head 23. The grinding rod 22 is positioned directly above the sample grinding area 11 of the grinding disk 1, and the grinding head 23 is positioned at the end of the grinding rod 22 near the grinding disk 1. The grinding apparatus for preparing samples for diffusion resistance testing also includes a grinding sample 3, which is positioned on the grinding disk 1 and directly below the grinding head 23. The pressure head 21 is detachably mounted on the end of the grinding rod 22 away from the grinding disk 1. When grinding the sample, a suitable pressure head 21 can be detachably mounted on the end of the grinding rod 22 away from the grinding disk 1. The top of the pressure head 21 can be designed as a flat or curved surface to adapt to the shape of different grinding samples 3. For example, for grinding samples with complex surface shapes, a curved pressure head can better conform to the sample surface and achieve uniform grinding. The contact surface at the bottom of the pressure head 21 can be designed to be smooth and flat to ensure that the pressure is evenly transmitted to the surface of the grinding sample 3, avoiding pressure concentration caused by uneven contact surfaces, thereby protecting the surface of the grinding sample 3 from damage. For example, in an optional embodiment of this example, the pressure adjustment mechanism 2 includes three pressure heads 21 of different weights: a lightweight pressure head, a medium-weight pressure head, and a heavyweight pressure head. The lightweight pressure head weighs 50g to 500g and is suitable for fine grinding of thin wafers or brittle materials, such as silicon wafers or ceramic substrates. The lightweight pressure head can prevent surface cracks or damage to the grinding sample 3 due to excessive pressure. The medium-weight pressure head weighs 500g to 2000g and is suitable for grinding semiconductor materials or metal materials of conventional thickness. The medium-weight pressure head can ensure appropriate pressure and improve grinding efficiency. The heavy-duty pressure head weighs 2000g to 5000g and is suitable for grinding samples 3 with high hardness or rough surfaces, such as alloy substrate grinding samples or thick-layer grinding samples. The heavy-duty pressure head can improve the material removal rate. Pressure heads 21 of different weights can adapt to different grinding scenarios. The adjustable pressure head 21 can apply precise force to the surface of the grinding sample 3. The pressure adjustment mechanism 2 has a pressure adjustment range of 0.5N to 50N, which can adapt to different grinding samples 3 and grinding process requirements.

[0031] Reference Figure 1 and Figure 2The pressure regulating mechanism 2 also includes a vibration damping component 221, which is arranged around the grinding rod 22. The vibration damping component 221 is made of a high-performance elastic material and can effectively absorb and buffer vibrations and impacts during the grinding process. During grinding, the contact between the grinding head 23 and the grinding disc 1 generates vibrations, especially when grinding hard materials or samples with uneven surfaces. The vibration damping component 221 effectively absorbs vibrations and impacts during the grinding process, ensuring the stability of the applied pressure. This design avoids pressure fluctuations caused by vibration, further improving the uniformity and stability of the grinding effect. Furthermore, the design of the vibration damping component 221 not only considers vibration absorption but also structural stability and durability. For example, the internal structure of the vibration damping component 221 is a multi-layered composite design, containing alternating elastic and damping layers. The elastic layers provide an immediate elastic response, while the damping layers are responsible for further dissipating vibration energy. This design allows the vibration damping component 221 to maintain stable vibration damping performance during long-term grinding operations without failing due to material fatigue. By introducing a damping component 221 into the pressure regulating mechanism 2, pressure fluctuations caused by vibration can be effectively avoided. During the grinding process, even if the rotation of the grinding disc 1 or the contact of the grinding head 23 causes minor vibrations, the damping component 221 can quickly absorb them, thereby ensuring that the pressure applied to the surface of the grinding sample 3 remains stable.

[0032] Reference Figure 1 and Figure 2The grinding apparatus for preparing diffusion resistance test samples also includes a flow direction adjustment mechanism 4, which includes a follower connection structure 41 and a baffle 42. The follower connection structure 41 is fixedly disposed at the edge of the grinding disk 1 on the periphery of the sample grinding area 11. Specifically, in an optional embodiment of this example, a protrusion is first formed at the edge of the grinding disk 1 using an integrated die forging process, and the follower connection structure 41 is connected to the protrusion. The baffle 42 is located above the grinding disk 1 and includes a first end 421 and a second end 422. The first end 421 is rotatably connected to the follower connection structure 41, and the second end 422 is located on one side of the grinding sample 3 in the sample grinding area 11. The flow direction of the grinding fluid on the grinding disk 1 is adjusted by rotating the baffle 42. The grinding fluid is stored in a liquid storage tank (not shown in the figure), which is connected to the grinding apparatus for preparing diffusion resistance test samples through a pipeline. When grinding the sample 3, the grinding fluid is transported from the sample grinding tank to the sample grinding area 11 through the pipeline. Preferably, the baffle 42 is made of corrosion-resistant metal or high-strength polymer material to ensure wear resistance and corrosion resistance during long-term use, reducing wear and erosion of the baffle 42 by the grinding fluid. The design of the baffle 42 allows for adjustment of the angle to control the flow direction of the grinding fluid, preventing it from flowing to the outside of the grinding disk 1 or concentrating in a certain area, thus ensuring that the grinding fluid is evenly distributed on the surface of the grinding disk 1. When grinding the sample 3, in the projection on the surface of the grinding disk 1, the geometric center O of the follower connection structure 41 and the geometric center P of the sample 3 are connected by a first line, and the geometric center O of the follower connection structure 41 and the midpoint N of the second end of the baffle 42 are connected by a second line. The angle A between the first and second lines is between 15° and 25°. The adjustable angle of the baffle 42 ensures that the grinding fluid covers the entire grinding disk 1, avoiding unstable grinding results due to uneven distribution of the grinding fluid.

[0033] Reference Figure 1The grinding apparatus for preparing samples for diffusion resistance testing also includes a control module (not shown in the attached diagram). The control module is communicatively connected to the grinding disc 1 and the pressure regulating mechanism 2 to achieve fully automated control of the grinding process. Specifically, the control module employs an advanced embedded system that integrates multiple functions such as grinding disc 1 speed adjustment, pressure control, grinding time setting, and real-time monitoring of the grinding process. Through this integrated design, the operator can easily and precisely control and adjust the grinding process through a unified control interface. At the core of the control module is a high-performance microprocessor, which can automatically adjust the speed of the grinding disc 1 and the pressure of the pressure regulating mechanism 2 based on preset grinding process parameters and real-time feedback data. The speed of the grinding disc 1 can be precisely adjusted between 200 r / min and 1000 r / min according to the material of the sample 3 and the grinding requirements, while the pressure of the pressure regulating mechanism 2 can be finely adjusted within the range of 0.5 N to 50 N. Furthermore, the control module also has a grinding time setting function, allowing the operator to set the grinding time according to the sample thickness and grinding requirements, ensuring the accuracy and consistency of the grinding process. The system monitors the grinding pressure and rotation speed in real time, acquiring real-time data through high-precision pressure and rotation speed sensors, and feeding this data back to the control module. The control module automatically adjusts the grinding parameters based on the feedback data to ensure the stability and efficiency of the grinding process. The grinding apparatus for preparing diffusion resistance test samples also includes a grinding base (not shown in the figure), which is used to fix the grinding disc 1 and ensures overall stability during the grinding process. The grinding base is made of a high-rigidity material, which can effectively absorb grinding vibrations and prevent unnecessary mechanical damage to the grinding sample 3. The grinding apparatus for preparing diffusion resistance test samples of this application can solve the problems of inaccurate pressure control and uneven distribution of grinding fluid in the prior art. Through the technical solution of this application, precise pressure control and uniform distribution of grinding fluid can be achieved, thereby improving the stability of the grinding process and the sample quality.

[0034] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A grinding apparatus for preparing samples for diffusion resistance testing, characterized in that, include: A grinding disc, wherein the central area of ​​the grinding disc is the sample grinding area; A pressure regulating mechanism is disposed above the grinding disk, and the projection of the pressure regulating mechanism on the grinding disk is located in the sample grinding area of ​​the grinding disk. The pressure regulating mechanism includes multiple pressure heads of different weights, a grinding rod, and a grinding head. The grinding rod is disposed directly above the sample grinding area of ​​the grinding disk, the grinding head is disposed at the end of the grinding rod close to the grinding disk, and the pressure head is detachably mounted at the end of the grinding rod away from the grinding disk.

2. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 1, characterized in that, It also includes: a flow direction adjustment mechanism, the flow direction adjustment mechanism comprising: A follower connection structure is fixedly installed at the edge of the grinding disk outside the sample grinding area; A baffle, located above the grinding disc, includes a first end and a second end. The first end is rotatably connected to the follower connection structure, and the second end is located on one side of the sample to be ground in the sample grinding area.

3. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 1, characterized in that, The pressure adjustment range of the pressure regulating mechanism is 0.5N to 50N.

4. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 2, characterized in that, The follower connection structure is detachably mounted on the grinding disc.

5. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 2, characterized in that, When the grinding sample is ground, in the projection on the surface of the grinding disc, the geometric center of the follower connection structure and the geometric center of the grinding sample are connected by a first line, and the geometric center of the follower connection structure and the midpoint of the second end of the baffle are connected by a second line, and the angle between the first line and the second line is between 15° and 25°.

6. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 1, characterized in that, The pressure regulating mechanism includes three pressure heads of different weights.

7. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 1, characterized in that, Also includes: The control module is communicatively connected to the grinding disc and the pressure regulating mechanism to control the rotation of the grinding disc and the pressure of the pressure regulating mechanism.

8. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 1, characterized in that, The rotation speed of the grinding disc is between 200 r / min and 1000 r / min.

9. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 1, characterized in that, The pressure regulating mechanism further includes a shock-absorbing component, which is arranged around the grinding rod.

10. The grinding apparatus for preparing samples for diffusion resistance testing according to claim 1, characterized in that, The top of the pressure head is either flat or curved.

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