A sample box for testing anti-displacement memory chips

Abstract

This utility model discloses a sample box for testing anti-displacement memory chips, relating to the field of sample storage technology for chip testing. It includes a shell and a multi-layer buffer mechanism. The inner wall of the shell is fixedly connected to the multi-layer buffer mechanism, which includes a polyurethane outer protective sleeve fixedly connected to the inside of the shell. A nylon middle isolation sleeve is fixedly connected to one side of the polyurethane outer protective sleeve, and an EVA inner buffer sleeve is fixedly connected to one side of the nylon middle isolation sleeve. The EVA inner buffer sleeve is thick, tightly wrapping the chip body and absorbing minor vibrations. The nylon middle isolation sleeve has raised textures. Compared with existing ordinary test sample boxes, this anti-displacement memory chip test sample box constructs a "fixed-buffered" protection system. The shell assembly and the buffer mechanism form a three-dimensional protection, adding a "two-way fixed" system. The three components work together to adapt to different chips, preventing vibration, friction, and compression, ensuring chip integrity and the accuracy of subsequent test data.

Description

Technical Field

[0001] This utility model relates to the field of sample storage technology for chip testing, specifically a sample box for testing anti-displacement memory chips. Background Technology

[0002] Chip test samples are chip carriers used in chip research and development, production and quality inspection processes, for testing equipment to test performance, function, reliability and other indicators. They cover unpackaged bare wafers, packaged finished chips, or customized test chips that simulate actual working conditions. Chip test sample boxes are storage devices specifically designed to store and protect chip test samples, and must be adapted to the size, form (bare die, packaged chip) and testing scenario requirements of the chip.

[0003] For example, a chip storage fixing box with application number CN202120804642.2 relates to the field of chip storage technology. It aims to solve the problem that existing boxes do not provide good protection for each chip when storing chips, which can lead to chip damage and make it inconvenient for users to transport and carry. A second box is provided on one side of the first box, and the first box and the second box are rotatably connected by a pivot. A locking block is provided on the other side of the first box. A dehumidifying bag is provided on the top of both the first and second boxes, and the dehumidifying bag is connected to the first and second boxes by a slot. A storage plate is provided at the bottom of the dehumidifying bag, and storage compartments are provided on the surface of the storage plate. There are multiple storage compartments, which are arranged in an array. A storage shell is provided on the top of the storage plate, and the storage shell fits into the storage compartments. However, the test sample box is easily displaced and scratched during storage and transportation due to vibration. Static electricity or wear is generated by friction between chips. The sample box is also damaged by external impacts such as squeezing and dropping. Furthermore, the chips may be misaligned due to up-and-down shaking, resulting in poor compatibility.

[0004] Therefore, in view of this, we have studied and improved the existing structure to address its shortcomings, and proposed a sample box for testing anti-displacement memory chips. Utility Model Content

[0005] The purpose of this invention is to provide a sample box for testing anti-displacement memory chips, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a sample box for testing anti-displacement memory chips, comprising a shell and a multi-layer buffer mechanism. The multi-layer buffer mechanism is fixedly connected to the inner wall of the shell, and the multi-layer buffer mechanism includes a polyurethane outer protective sleeve fixedly connected to the inside of the shell. A nylon middle isolation sleeve is fixedly connected to one side of the polyurethane outer protective sleeve, and an EVA inner buffer sleeve is fixedly connected to one side of the nylon middle isolation sleeve.

[0007] Preferably, a cover plate is rotatably connected to the top of the outer shell, and a pressing mechanism is fixedly connected to one side of the cover plate.

[0008] Preferably, the pressing mechanism includes a nylon adjusting rod threaded to one side of the cover plate, and a pressing spring is fixedly connected to one end of the nylon adjusting rod. The pressing spring has a damping column inside, and an anti-static acrylic cover is fixedly connected to one end of the pressing spring.

[0009] Preferably, a sealing gasket is fixedly connected to one side of the cover plate, and a conductive silicone layer is fixedly connected to the inside of the outer shell.

[0010] Preferably, the conductive silicone layer has pin grooves inside, and a partition is fixedly connected to the outer surface of the polyurethane outer protective sleeve.

[0011] Preferably, the partition is internally fixedly connected with reinforcing ribs, and the outer surface of the outer shell is fixedly connected with anti-collision bars.

[0012] Preferably, an aluminum alloy frame is fixedly connected to the outer surface of the anti-collision bar, and corner protectors are fixedly connected to the outer surface of the aluminum alloy frame.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. This utility model forms the core protective unit of the chip testing sample box through the setting of a multi-layer buffer mechanism. Through the three-layer collaborative design of "inner layer fixation, middle layer isolation, and outer layer damage resistance", it builds a "fixation-buffering" dual protection system for chip testing samples, solving the problem that chips are easily damaged by vibration, friction, and compression during storage and transportation. The EVA inner layer buffer sleeve tightly wraps the chip body with its excellent elasticity and fit, which can not only fix the chip to prevent displacement, but also absorb the slight vibration generated during transportation through its own deformation. Especially for unpackaged wafers, it can reduce the risk of surface scratches. The texture of the nylon middle layer isolation sleeve can form physical intervals to avoid direct contact and friction between the chip body and generate static electricity or wear. At the same time, the insulation of the nylon material can help isolate static electricity and further reduce the probability of electrostatic breakdown of the chip. The polyurethane outer protective sleeve can withstand 50-80N instantaneous extrusion force without deformation and can resist external impacts such as accidental dropping of the sample box and stacking pressure.

[0015] 2. This utility model, through the setting of aluminum alloy frame and anti-collision bar, forms a three-dimensional protection of "outer layer anti-impact + middle layer anti-friction + inner layer stable fixation" with multi-layer buffer mechanism, so that the chip is protected from damage such as vibration, friction and compression during the entire process of storage and turnover, ensuring the integrity of test samples and the accuracy of test data;

[0016] 3. This utility model, through the setting of the pressing mechanism, complements the "bottom-side protection" of the multi-layer buffer mechanism. Through the design of "adjustable pressing + flexible fixing", it constructs a "two-way fixing" protection system, which solves the problems of pin misalignment and main body collision caused by vertical shaking during chip storage. It further enhances the compatibility and protection stability of the sample box for chips of different specifications. Multiple protections ensure that the chip is "without vertical shaking, without horizontal friction, and without external pressure" during handling and turnover, providing key guarantees for the integrity of chip test samples and the accuracy of subsequent tests. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of the multi-layer buffer mechanism 2 of this utility model;

[0019] Figure 3 This is a schematic diagram of the pressing mechanism 4 of this utility model;

[0020] Figure 4 This is a schematic diagram of the external structure of the outer shell 1 of this utility model.

[0021] In the diagram: 1. Outer shell; 2. Multi-layer buffer mechanism; 201. Polyurethane outer protective sleeve; 202. Nylon middle isolation sleeve; 203. EVA inner buffer sleeve; 3. Cover plate; 4. Pressing mechanism; 401. Nylon adjusting rod; 402. Pressing spring; 403. Damping column; 404. Antistatic acrylic cover; 5. Sealing gasket; 6. Conductive silicone layer; 7. Pin groove; 8. Partition plate; 9. Reinforcing rib; 10. Anti-collision bar; 11. Aluminum alloy frame; 12. Corner pads. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figures 1-2As shown, a sample box for testing anti-displacement memory chips includes a shell 1 and a multi-layer buffer mechanism 2. The multi-layer buffer mechanism 2 is fixedly connected to the inner wall of the shell 1. The multi-layer buffer mechanism 2 includes a polyurethane outer protective sleeve 201 fixedly connected to the inside of the shell 1. A nylon middle isolation sleeve 202 is fixedly connected to one side of the polyurethane outer protective sleeve 201, and an EVA inner buffer sleeve 203 is fixedly connected to one side of the nylon middle isolation sleeve 202. The EVA inner buffer sleeve 203 is thicker and tightly wraps the chip body to absorb slight vibrations. The nylon middle isolation sleeve 202 has raised textures to isolate adjacent chip bodies to avoid friction. The polyurethane outer protective sleeve 201 is compression resistant and lightweight, forming a "fixed-buffered" double protection.

[0024] like Figure 3 As shown, a cover plate 3 is rotatably connected to the top of the outer shell 1, and a pressing mechanism 4 is fixedly connected to one side of the cover plate 3. The pressing mechanism 4 includes a nylon adjusting rod 401 threadedly connected to one side of the cover plate 3, and a pressing spring 402 is fixedly connected to one end of the nylon adjusting rod 401. A damping column 403 is provided inside the pressing spring 402, and an anti-static acrylic cover 404 is fixedly connected to one end of the pressing spring 402. The pressing spring 402 gently presses the top of the chip through the anti-static acrylic cover 404 to prevent it from shaking up and down during transportation. The nylon adjusting rod 401 can adjust the height of the anti-static acrylic cover 404 to adapt to chips of different thicknesses, forming a two-way fixation with the multi-layer buffer mechanism 2.

[0025] Furthermore, a sealing gasket 5 is fixedly connected to one side of the cover plate 3, and a conductive silicone layer 6 is fixedly connected to the inside of the outer shell 1. The conductive silicone layer 6 has a pin groove 7 inside, and a partition 8 is fixedly connected to the outer surface of the polyurethane outer protective sleeve 201. The sealing gasket 5 is made of rubber with a honeycomb sealing texture on the surface, which fits tightly with the edge of the cover plate 3 and the outer shell 1 to improve dustproof and waterproof performance. The inner wall of the pin groove 7 is provided with a buffer silicone strip to adapt to chip pins with different spacing and avoid bending. The partition 8 is made of ABS antistatic material with a wear-resistant coating on the surface, which divides the multi-layer buffer mechanism 2 into independent chambers to prevent collisions between different chip samples.

[0026] Furthermore, the partition 8 is internally fixedly connected with reinforcing ribs 9, and the outer surface of the outer shell 1 is fixedly connected with anti-collision bars 10. The outer surface of the anti-collision bars 10 is fixedly connected with an aluminum alloy frame 11, and the outer surface of the aluminum alloy frame 11 is fixedly connected with corner protectors 12. The reinforcing ribs 9 are made of ABS anti-static material and are integrally injection molded. They are distributed at the cross intersection of the partition 8 to enhance the load-bearing capacity of the partition 8 and prevent the cavity from deforming and squeezing the chip. The anti-collision bars 10 are made of TPU elastic material and are evenly distributed along the four sides of the outer shell 1. The aluminum alloy frame 11 is made of aluminum alloy and wraps around the edge of the outer shell 1. The corner protectors 12 are made of silicone material and cover the four corners of the aluminum alloy frame 11 to buffer the impact of collision and protect the chip inside the box.

[0027] Working principle: When using this anti-displacement storage chip test sample box, firstly, the pins of the chip test sample to be stored are aligned with the pin grooves 7 of the conductive silicone layer 6 and inserted to ensure that the pins are not bent. The reinforcing ribs 9 inside the partition 8 support the chamber to prevent the chip from being squeezed. At the same time, the polyurethane outer protective sleeve 201, the nylon middle isolation sleeve 202, and the EVA inner buffer sleeve 203 of the multi-layer buffer mechanism 2 form a protective layer to isolate external impacts. Then, the cover 3 is closed. The sealing gasket 5 on one side of the cover 3 fits against the edge of the outer shell 1 to achieve a seal and prevent dust. Rotating the nylon adjusting knob 401 compresses the spring 402. The anti-static acrylic cover 404 is pushed to press the chip firmly, and the damping column 403 maintains stable pressure to prevent chip displacement. The anti-collision bar 10, aluminum alloy frame 11 and corner pads 12 on the outer surface of the outer shell 1 form external protection to avoid collision damage during handling. Finally, the status of each component is checked: confirm that the sealing gasket 5 is not misaligned, the conductive silicone layer 6 is tightly attached to the chip, and the pressure of the pressing mechanism 4 is moderate, thus completing the storage of the chip test sample. When the chip is retrieved, the operation is reversed. The whole process ensures that the chip is protected from static electricity, impact and dust during storage. This is the working principle of the sample box for anti-displacement storage chip testing.

Claims

1. A sample box for testing anti-displacement memory chips, comprising a shell (1) and a multi-layer buffer mechanism (2), characterized in that, The inner wall of the outer shell (1) is fixedly connected to a multi-layer buffer mechanism (2), and the multi-layer buffer mechanism (2) includes a polyurethane outer protective sleeve (201) fixedly connected to the inner position of the outer shell (1). A nylon middle layer isolation sleeve (202) is fixedly connected to one side of the polyurethane outer protective sleeve (201), and an EVA inner buffer sleeve (203) is fixedly connected to one side of the nylon middle layer isolation sleeve (202).

2. The sample box for testing anti-displacement memory chips according to claim 1, characterized in that, The top of the outer shell (1) is rotatably connected to a cover plate (3), and a pressing mechanism (4) is fixedly connected to one side of the cover plate (3).

3. The sample box for testing anti-displacement memory chips according to claim 2, characterized in that, The pressing mechanism (4) includes a nylon adjusting rod (401) threaded to one side of the cover plate (3), and a pressing spring (402) is fixedly connected to one end of the nylon adjusting rod (401). A damping column (403) is provided inside the pressing spring (402), and an anti-static acrylic cover (404) is fixedly connected to one end of the pressing spring (402).

4. A sample box for testing anti-displacement memory chips according to claim 2, characterized in that, A sealing gasket (5) is fixedly connected to one side of the cover plate (3), and a conductive silicone layer (6) is fixedly connected inside the outer shell (1).

5. A sample box for testing anti-displacement memory chips according to claim 4, characterized in that, The conductive silicone layer (6) has a pin groove (7) inside, and a partition (8) is fixedly connected to the outer surface of the polyurethane outer protective sleeve (201).

6. A sample box for testing anti-displacement memory chips according to claim 5, characterized in that, The partition (8) is internally fixedly connected with reinforcing ribs (9), and the outer surface of the outer shell (1) is fixedly connected with anti-collision bars (10).

7. A sample box for testing anti-displacement memory chips according to claim 6, characterized in that, An aluminum alloy frame (11) is fixedly connected to the outer surface of the anti-collision bar (10), and corner protectors (12) are fixedly connected to the outer surface of the aluminum alloy frame (11).

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