A memory chip package structure

Abstract

The utility model belongs to the technical field of storage chip, and disclose a kind of storage chip packaging structure, including storage chip with packaging shell and the protective housing of the packaging shell outside being set, the top of the packaging shell is bonded with ceramic heat-conducting plate, the top of the ceramic heat-conducting plate is evenly connected with multiple heat-conducting columns, the top of the protective housing is nested with fin, and the top of multiple heat-conducting columns is connected in the bottom of fin, the two sides outer walls of the protective housing are integrally formed with fixed sheet, the middle part of the fixed sheet is structured with fixed hole, and nylon screw is screwed in fixed hole. By the above scheme, the existing structure can provide sufficient protection for storage chip, but the overall structure is relatively closed, and the defect that the service life of storage chip is affected by overheating due to poor heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the field of memory chip technology, specifically a memory chip packaging structure. Background Technology

[0002] As an important component of integrated circuit boards, memory chips are usually packaged by soldering. The packaging structure can fix the memory chip in the corresponding position on the integrated circuit board and provide a certain degree of protection for the memory chip. In order to avoid damage to the internal memory chip, the packaging structure needs to have high structural strength.

[0003] Meanwhile, a memory chip packaging structure with application number CN202420481515.7 includes a packaging shell and a chip. The chip is disposed inside the packaging shell, and a packaging cover is disposed on the top of the packaging shell. Multiple internal pins are disposed inside the packaging shell, and external pins are disposed on one side of each of the multiple internal pins. The multiple external pins are respectively located on both sides of the outside of the packaging shell. A reinforcement layer is disposed inside the packaging shell, and multiple support strips are disposed on the top of the reinforcement layer. By setting up support strips, receiving plates, abutment strips, a waterproof layer and a noise reduction layer, the bottom of the chip is attached to one end of the multiple abutment strips. The cooperation between the receiving plate and the abutment strips can support the bottom of the chip.

[0004] However, the following problems were found in the implementation of the relevant technologies: Although the existing structure can provide sufficient protection for the memory chip, it makes the overall structure relatively closed, resulting in poor heat dissipation and overheating, which affects the lifespan of the memory chip. Utility Model Content

[0005] To address the problems mentioned in the background art, this utility model provides a memory chip packaging structure that provides sufficient protection through a protective shell and a packaging housing, while allowing heat from the memory chip surface to be dissipated through a ceramic heat-conducting plate, heat-conducting pillars, and a heat sink, thus ensuring that the lifespan of the memory chip is not affected by overheating.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a memory chip packaging structure, comprising a memory chip packaging shell and a protective shell sleeved on the outside of the packaging shell, wherein a ceramic heat-conducting plate is bonded to the top of the packaging shell, and a plurality of heat-conducting pillars are uniformly connected to the top of the ceramic heat-conducting plate; a heat sink is nested on the top of the protective shell, and the tops of the plurality of heat-conducting pillars are connected to the bottom of the heat sink; fixing plates are integrally formed on both symmetrical outer walls of the protective shell, and a fixing hole is formed in the middle of the fixing plate, and a nylon screw is screwed into the fixing hole.

[0007] Preferably, the sidewall of the nylon screw is fitted with a washer, and the washer abuts against the head of the nylon screw and the corresponding side of the fixing piece.

[0008] Preferably, a sealing ring is bonded to the edge of the heat sink, and the sealing ring is bonded to the top of the protective shell.

[0009] Preferably, a sound-insulating pad is adhered to the inner side of the protective shell, and the sound-insulating pad is flush with the bottom of the protective shell.

[0010] Preferably, the top of the sound insulation pad is provided with a plurality of holes evenly distributed, and the top of the heat-conducting pillar passes through the corresponding holes and is connected to the bottom of the heat sink.

[0011] Preferably, silicone pads are bonded to the top four corners of the encapsulation shell, and the silicone pads are supported on the corresponding sides of the bottom of the ceramic heat-conducting plate, with the silicone pads flush with the edges of the encapsulation shell.

[0012] Preferably, rubber pads are adhered to the top four corners of the protective shell, and the rubber pads are flush with the edges of the protective shell.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model absorbs heat from the surface of the memory chip through a ceramic heat-conducting plate and conducts it to the heat-conducting pillars. Then, the heat is conducted to the surface of the heat sink through multiple heat-conducting pillars and dissipated, which can provide good heat dissipation performance to avoid the memory chip overheating and affecting its service life.

[0015] 2. This utility model provides protection through the encapsulation shell and the protective shell sleeved on the outside of the encapsulation shell. The rubber pads at the four corners of the protective shell and the silicone pads at the four corners of the encapsulation shell can buffer the impact to a certain extent. The protective shell also increases the stability after installation through nylon screws. The above structure can provide sufficient protection for the memory chip. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the protective shell of this utility model cut open from one side;

[0018] Figure 3 This is a schematic diagram of the packaging shell structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the nylon screw of this utility model.

[0020] In the diagram: 1. Encapsulation shell; 2. Ceramic heat-conducting plate; 3. Heat-conducting pillar; 4. Protective shell; 5. Heat sink; 6. Fixing plate; 7. Nylon screw; 8. Gasket; 9. Sound insulation pad; 10. Sealing ring; 11. Rubber pad; 12. Silicone pad. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1 to 4 As shown, this utility model provides a memory chip packaging structure, including a memory chip packaging shell 1 and a protective shell 4 sleeved on the outside of the packaging shell 1. A ceramic heat-conducting plate 2 is bonded to the top of the packaging shell 1. The ceramic heat-conducting plate 2 has excellent thermal conductivity. Its bottom is in contact with the surface of the memory chip, which can conduct the heat from the surface of the memory chip to the heat-conducting pillars 3. Moreover, the ceramic material is insulating, which can prevent short circuits caused by electrical conductivity. Multiple heat-conducting pillars 3 are uniformly bonded to the top of the ceramic heat-conducting plate 2. The multiple heat-conducting pillars 3 can quickly conduct the heat from the surface of the ceramic heat-conducting plate 2 to the heat sink 5. On the surface, a heat sink 5 is nested on the top of the protective shell 4, and the tops of multiple heat-conducting pillars 3 are welded to the bottom of the heat sink 5. Welding provides better heat conduction. The outer walls of the protective shell 4 are symmetrically injection molded with fixing plates 6. The injection molded structure has high structural strength and is not easily damaged. The fixing plate 6 has a fixing hole in the middle, and a nylon screw 7 is screwed into the fixing hole. The nylon screw 7 is self-insulating, which can prevent short circuits of the integrated circuit board and reinforce the connection between the protective shell 4 and the integrated circuit board, preventing the connection of the protective shell 4 from loosening due to external impact.

[0023] Specifically, a washer 8 is fitted on the side wall of the nylon screw 7, and the washer 8 abuts against the head of the nylon screw 7 and the corresponding side of the fixing plate 6. The washer 8 can prevent the nylon screw 7 from being tightened too much, making it difficult to unscrew.

[0024] Furthermore, a sealing ring 10 is bonded to the edge of the heat sink 5, and the sealing ring 10 is bonded to the top of the protective shell 4 to ensure the sealing of the connection between the heat sink 5 and the protective shell 4 and prevent moisture from entering.

[0025] Furthermore, a sound-insulating pad 9 is adhered to the inside of the protective shell 4, and the sound-insulating pad 9 is flush with the bottom of the protective shell 4. The sound-insulating pad 9 can absorb noise and achieve a noise reduction effect.

[0026] It is worth noting that the top of the sound insulation pad 9 is evenly provided with multiple insertion holes, and the top of the heat conduction pillar 3 passes through the corresponding insertion holes and is welded to the bottom of the heat sink 5, so as to maximize the coverage of the sound insulation pad 9 to improve the noise reduction effect.

[0027] It is worth noting that silicone pads 12 are bonded to the top four corners of the package housing 1, and the silicone pads 12 are supported on the corresponding side of the bottom of the ceramic heat-conducting plate 2, which can absorb a certain impact force and prevent the memory chip inside the package housing 1 from being damaged. The silicone pads 12 are flush with the edge of the package housing 1.

[0028] It is worth mentioning that rubber pads 11 are glued to the top four corners of the protective shell 4, which can absorb a certain impact force and prevent the protective shell 4 from being damaged. The rubber pads 11 are flush with the edge of the protective shell 4.

[0029] Among them, the ceramic heat-conducting plate 2 is existing technology and will not be described in detail; the "front, back, left, and right" perspectives of this device are as follows: Figure 1 The direction shown in the diagram is the reference.

[0030] Working principle: The encapsulation housing 1 is soldered to the corresponding side of the integrated circuit board, and the protective shell 4 is reinforced by nylon screws 7. The encapsulation housing 1 and the protective shell 4 sleeved on the outside of the encapsulation housing 1 can provide a certain protective function. The rubber pad 11 and the silicone pad 12 can also buffer the impact to a certain extent. The whole has sufficient protective performance.

[0031] During the operation of the integrated circuit board, the memory chip generates heat. The heat on the surface of the memory chip is conducted to the heat conduction pillars 3 through the ceramic heat conduction plate 2. Multiple heat conduction pillars 3 can quickly conduct heat to the surface of the heat sink 5 and dissipate it efficiently, ensuring that the memory chip will not have its service life affected by overheating.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A memory chip package structure comprising a package case (1) for a memory chip and a protective case (4) which is fitted outside the package case (1), characterized in that: The top of the packaging shell (1) is bonded with a ceramic heat-conducting plate (2), the top of the ceramic heat-conducting plate (2) is uniformly connected with a plurality of heat-conducting columns (3), the top of the protective shell (4) is nested with a heat sink (5), and the top of the plurality of heat-conducting columns (3) is connected to the bottom of the heat sink (5), the symmetrical two side walls of the protective shell (4) are integrally formed with a fixing sheet (6), the middle part of the fixing sheet (6) is configured with a fixing hole, and the fixing hole is screwed with a nylon screw (7).

2. The memory chip package structure of claim 1, wherein: The side wall of the nylon screw (7) is sleeved with a gasket (8), and the gasket (8) is in contact between the head of the nylon screw (7) and the corresponding side of the fixing sheet (6).

3. The memory chip package structure of claim 1, wherein: The edge of the heat sink (5) is bonded with a sealing ring (10), and the sealing ring (10) is bonded to the top of the protective shell (4).

4. The memory chip package structure of claim 1, wherein: The inner side of the protective shell (4) is bonded with a soundproof pad (9), and the soundproof pad (9) is flush with the bottom of the protective shell (4).

5. The memory chip package structure of claim 4, wherein: The top of the soundproof pad (9) is uniformly provided with a plurality of insertion holes, and the top of the heat-conducting column (3) penetrates through the corresponding insertion hole and is connected to the bottom of the heat sink (5).

6. The memory chip package structure of claim 1, wherein: The top of the packaging shell (1) is bonded with a silica gel pad (12) at the four corners, and the silica gel pad (12) is supported on the corresponding side of the bottom of the ceramic heat-conducting plate (2), and the silica gel pad (12) is flush with the edge of the packaging shell (1).

7. The memory chip package structure of claim 1, wherein: The top of the protective shell (4) is bonded with a rubber pad (11) at the four corners, and the rubber pad (11) is flush with the edge of the protective shell (4).

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