Feeding calibration device of polishing machine

Abstract

The utility model provides a polishing machine feeding calibration device. The polishing machine feeding calibration device comprises a fixed disc, an image collector and a calibration disc. Wherein an up-down through mounting hole is formed in the center of the fixing disc, the edge of the fixing disc protrudes upwards to form a hanging and leaning part, and a locking device is arranged on the hanging and leaning part and used for being fixedly connected with the polishing head. And the image collector is fixedly arranged in the mounting hole in a vertically downward manner. The upper surface of the calibration disc is provided with a positioning point used for indicating the center position. In use, the calibration disc replaces a wafer and is placed on the material disc. According to the technical scheme, the relative position between the material disc containing the wafers and the polishing head of the polishing machine can be detected and calibrated, operation is convenient and fast, accuracy is high, errors caused by insufficient experience or non-standard operation of operators can be effectively avoided, the precision and reliability of the calibration process are improved, and the production efficiency is improved. Therefore, the calibration efficiency and effect are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing, and more specifically, to a material feeding and calibration device for a polishing machine. Background Technology

[0002] In wafer fabrication, before polishing, the wafer needs to be picked up from the material tray by a polishing head and transferred to the polishing platform. Normally, the material tray and polishing machine are in fixed positions, so the wafer's movement trajectory is also fixed and does not require real-time adjustment. However, in actual production, due to various factors such as component wear, the polishing head or material tray may shift from its original position. Therefore, misalignment may occur when the polishing head picks up the wafer from the material tray, leading to wafer pickup failure. If the positional shift of the polishing head or material tray is too large, it may even cause the wafer to fall, resulting in significant economic losses and prolonged downtime.

[0003] In existing technologies, an Allen wrench or other device is typically used to measure the radial clearance between the polishing head and the material tray by inserting it vertically between them. This allows for the determination and calibration of the relative position of the polishing head and the material tray. This measurement method is cumbersome and inconvenient, highly dependent on the accuracy of manual operation, and prone to significant measurement errors due to tool misalignment or other factors. Therefore, it is difficult to effectively determine the correctness of the relative position of the polishing head and the material tray, which can affect subsequent processes. Therefore, a specialized calibration device is needed to conveniently and accurately calibrate the relative position of the polishing head and the material tray, ensuring that the polishing head accurately places the wafer on the material tray and preventing accidents such as wafer drops. Utility Model Content

[0004] The purpose of this application is to provide a polishing machine feeding calibration device, which can detect and calibrate the relative position between the material tray holding the wafer and the polishing head of the polishing machine. It is easy to operate and highly accurate, and can effectively avoid errors caused by insufficient operator experience or non-standard operation, thereby improving the accuracy and reliability of the calibration process, and thus improving calibration efficiency and effect.

[0005] This application provides a polishing machine loading and calibration device, including a fixed plate, an image acquisition unit, and a calibration plate. The fixed plate has a through-hole at its center, and its edge protrudes upwards to form a mounting portion with a locking device for fixed connection with the polishing head. The image acquisition unit is vertically fixed within the mounting hole. The upper surface of the calibration plate has positioning points for indicating the center position. In use, the calibration plate replaces the wafer on the material tray.

[0006] In one feasible embodiment, the fixed plate includes a central plate and a plurality of connecting arms respectively connected to the central plate. The edges of each connecting arm protrude upward to form a hooking part, and a locking device is provided on each hooking part.

[0007] In one feasible embodiment, the fixed disk includes at least three connecting arms that are evenly distributed around the central disk.

[0008] In one feasible solution, the connecting arm is telescopic to accommodate polishing heads of different sizes.

[0009] In one feasible embodiment, the locking device is rotatably mounted on the mounting part. The locking device has a locked state and an unlocked state. In use, the locking device is rotated to the unlocked state, the fixing plate is placed under the polishing head, and then the locking device is rotated to the locked state, fixing the fixing plate under the polishing head.

[0010] In one feasible solution, a threaded fixing hole is provided horizontally through the inside and outside of the mounting hole. A set screw is installed in the threaded fixing hole, and the set screw abuts against the outside of the image acquisition device to fix the image acquisition device.

[0011] In one feasible solution, an internal thread is provided on the inner wall of the mounting hole, and an external thread is provided on the outer side of the image acquisition device. The image acquisition device is fixedly installed in the mounting hole by the thread.

[0012] In one feasible embodiment, the upper surface of the calibration disk is provided with a scale to indicate the radial offset angle and offset distance between the polishing head and the calibration disk.

[0013] In one feasible solution, a level is installed on the center plate of the fixed plate to detect the horizontal status of the fixed plate after installation, ensuring the accuracy of image acquisition by the image acquisition device.

[0014] In one feasible embodiment, the polishing machine loading and calibration device also includes a controller and a monitor. The controller is signal-connected to the polishing machine and is used to control the movement of the polishing head. The monitor is signal-connected to an image acquisition unit, enabling the operator to observe the alignment of the fixed disc and the calibration disc in real time.

[0015] Compared with the prior art, the beneficial effects of this application include at least the following:

[0016] This application provides a polishing machine loading and calibration device. By vertically fixing an image acquisition unit downwards within a mounting hole and conveniently mounting a fixed plate below the polishing head via a hanging part, it can acquire real-time images of the relative positions of the polishing head and the calibration plate. This allows operators to directly judge the alignment status and make corresponding adjustments based on the images, significantly improving calibration efficiency and reducing downtime caused by calibration. Compared to the traditional method relying on manual distance measurement by operators, this image-based detection method eliminates the need for repeated manual operations, effectively avoiding errors caused by insufficient operator experience or improper operation. This improves the accuracy and reliability of the calibration process, effectively avoiding the risk of wafer drops, improving product quality, and ensuring the safety and continuity of the production process. Furthermore, since both the fixed plate and the image acquisition unit remain relatively stationary with respect to the polishing head, the entire calibration process only requires adjusting the position of the polishing head, without interfering with the positions of the fixed plate and the image acquisition unit. Therefore, the calibration process is simpler and more efficient, reducing the complexity of manual operation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram illustrating the working state of the polishing machine feeding and calibration device according to an embodiment of this application;

[0019] Figure 2 An exploded view of the material feeding and calibration device for a polishing machine;

[0020] Figure 3 This is a top view of the fixed disk;

[0021] Figure 4 This is a schematic diagram of the locking device of the fixed plate in the unlocked state.

[0022] Figure 5 This is a schematic diagram of the locking device of the fixed plate in the locked state.

[0023] Figure 6 This is a partial schematic diagram showing the connection between the image acquisition device and the fixed disk;

[0024] Figure 7 This is a top view of the calibration disk.

[0025] In the diagram: 1. Fixed plate; 2. Image acquisition device; 3. Calibration plate; 4. Polishing head; 5. Material plate; 101. Mounting hole; 102. Hanging part; 103. Center plate; 104. Connecting arm; 105. Locking device; 111. Threaded fixing hole; 112. Set screw. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] like Figure 1 and Figure 2 As shown, this application provides a polishing machine loading and calibration device for detecting and calibrating the relative position between the wafer tray and the polishing head of the polishing machine. The device includes a fixed tray 1, an image acquisition unit 2, and a calibration tray 3. The fixed tray 1 has a through-hole 101 at its center, and an upward-protruding hook portion 102 at its edge. A locking device 105 is provided on the hook portion 102 for fixed connection with the polishing head. The image acquisition unit 2 is vertically fixed within the mounting hole 101. The upper surface of the calibration tray 3 has positioning points for indicating the center position. In use, the calibration tray 3 replaces the wafer on the wafer tray.

[0029] Preferably, the image acquisition device can employ a high-resolution camera to better identify minute offsets. In particular, the image acquisition device should have low lens distortion to avoid operators misjudging the relative offset between the polishing head and the material tray, thereby affecting the calibration process.

[0030] In use, first, the image acquisition device 2 is fixed in the mounting hole 101, and then the fixing plate 1 is installed on the polishing head through the hanging part 102 and the locking device 105. Next, the calibration plate 3 is placed on the material tray used to hold the wafers. The image acquisition device 2 can take real-time pictures of the calibration plate below it. The operator can observe the captured images and determine whether the image acquisition device 2 is aligned with the center of the calibration plate 3 based on the positioning point on the calibration plate 3, thereby determining whether the polishing head is aligned with the material tray. If misaligned, the operator can operate the polishing machine according to the deviation between the image center and the positioning point of the calibration plate 3, causing the polishing head to move accordingly in the horizontal plane until the image center is aligned with the positioning point of the calibration plate 3, at which point the calibration process ends.

[0031] The polishing machine loading and calibration device of this application fixes the image acquisition device vertically downward in the mounting hole, and the fixing plate can be conveniently installed below the polishing head through the hanging part. It can acquire images of the relative position of the polishing head and the calibration plate in real time, allowing operators to directly judge the alignment and make corresponding adjustments based on the images. This greatly improves calibration efficiency and reduces downtime caused by calibration. Compared with the traditional method of relying on operators to manually measure distances, this image-based detection method eliminates the need for repeated manual operations, effectively avoiding errors caused by insufficient operator experience or non-standard operation, improving the accuracy and reliability of the calibration process, thereby effectively avoiding the risk of wafer drops, improving product quality, and ensuring the safety and continuity of the production process. In addition, since the fixing plate and the image acquisition device are both relatively stationary with respect to the polishing head, only the position of the polishing head needs to be adjusted during the entire calibration process. There is no need to interfere with the position of the fixing plate and the image acquisition device, so the calibration process is simpler and more efficient, reducing the complexity of manual operation.

[0032] In one embodiment, such as Figure 3 As shown, the fixed disk 1 may include a central disk 103 and a plurality of connecting arms 104 respectively connected to the central disk 103. Each connecting arm 104 has an upwardly protruding edge forming a hook portion 102, and each hook portion 102 is provided with a locking device 105. Preferably, the fixed disk 1 includes at least three connecting arms 104, which are evenly distributed around the central disk 103. The design of the central disk 103 and the connecting arms 104 helps to reduce the size and weight of the polishing machine's feeding device, thereby reducing the pressure on the polishing head and lowering manufacturing and maintenance costs.

[0033] In addition, the connecting arm 104 can be configured as a telescopic type to accommodate polishing heads of different sizes. In this case, it is preferable to provide a scale (not shown in the figure) on the telescopic part of the connecting arm 104 so that multiple connecting arms 104 can maintain the same length after telescopic extension, thereby ensuring that the mounting hole 101 is always located at the geometric center of the fixed plate 1 and avoiding calibration errors caused by inconsistent lengths of the connecting arms 104.

[0034] In one embodiment, such as Figure 4 and Figure 5 As shown, the locking device 105 is rotatably mounted on the hanging part 102. The locking device 105 has a locked state and an unlocked state. In use, as... Figure 4 As shown, rotate the locking device 105 to the unlocked state, place the fixing plate 1 below the polishing head, so that the hanging part 102 fits against the side of the polishing head, and then proceed as follows. Figure 5 As shown, rotate the locking device 105 to the locked state, so that the locking device 105 is engaged with the upper edge of the polishing head (e.g., Figure 1 (As shown), this secures the mounting plate 1 below the polishing head. The locking device 105 helps ensure that the mounting plate 1 and the polishing head remain relatively stationary at all times, preventing any shaking.

[0035] In one embodiment, such as Figure 6 As shown, a threaded fixing hole 111, penetrating both the inside and outside, is provided horizontally on the wall of the mounting hole 101. A set screw 112 is installed inside the threaded fixing hole 111, and the set screw 112 abuts against the outside of the image acquisition device 2 to fix the image acquisition device 2. During installation, the image acquisition device 2 is placed into the mounting hole 101, and then the set screw 112 is screwed into the threaded fixing hole 111 until the image acquisition device 2 is fixed. This method can reduce the requirements for the matching degree between the size of the image acquisition device 2 and the mounting hole 101, thereby effectively reducing the processing difficulty and manufacturing cost, and making the installation process more convenient.

[0036] In one embodiment, an internal thread is provided on the inner wall of the mounting hole 101, and an external thread is provided on the outer side of the image acquisition device 2. The image acquisition device 2 is fixedly installed in the mounting hole 101 by the thread (not shown in the figure). The threaded connection makes the installation and adjustment of the image acquisition device 2 more convenient and quick. The operator can make fine adjustments by rotating the image acquisition device 2 to ensure its accurate installation position. Furthermore, the threaded connection has a self-locking property, which can ensure that the image acquisition device 2 will not loosen during use, thus improving the stability of the device.

[0037] In one embodiment, the upper surface of the calibration disk 3 may also be provided with a scale to indicate the radial offset angle and offset distance between the polishing head and the calibration disk 3. Figure 7As shown, multiple concentric circles can be set on the upper surface of calibration disk 3, with the radii of each concentric circle forming an arithmetic sequence. For example, the difference in radius between adjacent concentric circles can be 1 mm or 2 mm, to facilitate faster and more accurate observation and judgment by operators, thereby improving calibration efficiency and effectiveness. The specific scale format can be determined as needed, and no further restrictions are imposed here.

[0038] In one embodiment, a level (not shown in the figure) can be installed on the center plate 103 of the fixed plate 1 to detect the horizontal state of the fixed plate 1 after installation, ensuring the accuracy of the image acquisition by the image acquisition device 2. Since the image acquisition device 2 is fixedly installed in the mounting hole 101, the horizontal state of the fixed plate 1 determines whether the image acquisition device 2 can strictly follow the vertical downward direction to take pictures. If the fixed plate 1 is not installed horizontally, the shooting direction of the image acquisition device 2 may be tilted, and the center of the image no longer represents the center of the polishing head, so the calibration process cannot be carried out normally. The introduction of the level reduces the error caused by the non-horizontal installation of the fixed plate 1, improves the reliability and repeatability of the entire polishing machine loading calibration device, and this design ensures that each calibration operation can be performed in the same horizontal state, improving the consistency of the calibration results. In addition, if an electronic level is used, an alarm can be set and the level can be connected to the alarm signal. If the level of the fixed plate 1 does not meet the preset requirements after installation, the alarm will sound an alarm to the operator to avoid affecting the subsequent calibration process.

[0039] In one embodiment, the polishing machine loading and calibration device further includes a controller and a monitor (not shown in the figure). The controller is signal-connected to the polishing machine and can control the movement of the polishing head. Through the controller, the operator can precisely adjust the position of the polishing head to ensure its alignment with the calibration plate 3. The monitor is signal-connected to the image acquisition device 2 (it can be a wired connection or a wireless connection, such as Bluetooth), and can display the images captured by the image acquisition device 2 in real time. The operator can observe the alignment of the fixed plate 1 and the calibration plate 3 through the monitor and continuously adjust the position of the polishing head through the controller. In addition, image analysis can be performed on the images captured by the image acquisition device 2 using specialized analysis software or artificial intelligence technology, and the position of the polishing head can be automatically adjusted through the controller to achieve automatic calibration.

[0040] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A polishing machine loading and calibration device, used to detect and calibrate the relative position between the material tray holding wafers and the polishing head of the polishing machine, characterized in that, include: The fixed plate (1) has a through mounting hole (101) at its center. The edge of the fixed plate (1) protrudes upward to form a hanging part (102). The hanging part (102) is provided with a locking device (105) for fixed connection with the polishing head. The image acquisition device (2) is fixedly installed vertically downward in the mounting hole (101); The calibration disk (3) has a positioning point on its upper surface for indicating the center position; in use, the calibration disk (3) is placed on the material tray instead of the wafer.

2. The polishing machine feeding and calibration device according to claim 1, characterized in that, The fixed plate (1) includes a central plate (103) and a plurality of connecting arms (104) respectively connected to the central plate (103). The edges of each connecting arm (104) protrude upward to form a hook part (102), and a locking device (105) is provided on each hook part (102).

3. The polishing machine feeding and calibration device according to claim 2, characterized in that, The fixed disk (1) includes at least three connecting arms (104) which are evenly distributed around the central disk (103).

4. The polishing machine feeding and calibration device according to claim 2, characterized in that, The connecting arm (104) is telescopic to accommodate polishing heads of different sizes.

5. The polishing machine feeding and calibration device according to claim 1, characterized in that, The locking device (105) is rotatably mounted on the abutment (102); The locking device (105) has a locked state and an unlocked state. When in use, the locking device (105) is rotated to the unlocked state, the fixing plate (1) is placed below the polishing head, and then the locking device (105) is rotated to the locked state to fix the fixing plate (1) below the polishing head.

6. The polishing machine feeding and calibration device according to claim 1, characterized in that, The mounting hole (101) has a threaded fixing hole (111) that runs through the inside and outside in the horizontal direction on the wall surface. A set screw (112) is provided in the threaded fixing hole (111). The set screw (112) abuts against the outside of the image acquisition device (2) to fix the image acquisition device (2).

7. The polishing machine feeding and calibration device according to claim 1, characterized in that, The inner wall of the mounting hole (101) is provided with an internal thread, and the outer side of the image acquisition device (2) is provided with an external thread. The image acquisition device (2) is fixedly installed in the mounting hole (101) by the thread.

8. The polishing machine feeding and calibration device according to claim 1, characterized in that, The upper surface of the calibration disk (3) is provided with a scale to indicate the radial offset angle and offset distance between the polishing head and the calibration disk (3).

9. The polishing machine feeding and calibration device according to claim 1, characterized in that, A level is provided on the central plate (103) of the fixed plate (1) to detect the horizontal state of the fixed plate (1) after installation, so as to ensure the accuracy of the image acquisition device (2) in acquiring images.

10. The polishing machine feeding calibration device according to claim 1 further includes a controller and a monitor; the controller is signal-connected to the polishing machine and is used to control the movement of the polishing head; the monitor is signal-connected to the image acquisition device (2) and is used to enable the operator to observe the alignment of the fixed plate (1) and the calibration plate (3) in real time.

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