Clamp facilitating rapid measurement of flatness of semiconductor lead frame cooling fin

Abstract

The utility model discloses a clamp convenient for quickly measuring the flatness of a semiconductor lead frame radiating fin, which belongs to the technical field of lead frame manufacturing and comprises a base, a support table is arranged on the base, and a plurality of support contacts are arranged on the support table; a swingable pressing claw is further supported on the base, the pressing end of the pressing claw is used for pressing a chip loading area on the lead frame on the multiple supporting contacts, and a pressing spring is connected between the tail of the pressing claw and the base. According to the utility model, the slide area of the lead frame can be kept horizontal during the subsequent flatness measurement of the lead frame, so that the flatness measurement of the lead frame can be completed quickly, and the precision of the flatness measurement of the lead frame is ensured.

Description

Technical Field

[0001] This utility model belongs to the field of lead frame manufacturing technology, specifically, it relates to a fixture that facilitates rapid measurement of the flatness of semiconductor lead frame heat sinks. Background Technology

[0002] As a chip carrier for integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It acts as a bridge connecting to external wires. Most semiconductor integrated circuits require the use of lead frames, which are an important basic material in the electronics and information industry.

[0003] The main manufacturing processes for lead frames are stamping and etching. However, in the stamping process, such as... Figure 1 As shown, when the V-groove in the lamination area of ​​the lead frame is stamped, a protrusion is easily formed on the back of the lamination area. This makes it difficult for the lamination area of ​​the lead frame to remain horizontal after being supported on the platform during subsequent flatness measurement. This not only causes inconvenience to flatness measurement, but also makes it difficult to guarantee the accuracy of flatness measurement. Utility Model Content

[0004] The purpose of this invention is to provide a fixture for quickly measuring the flatness of semiconductor leadframe heat sinks, so that the leadframe's carrier area can remain horizontal during subsequent flatness measurements. This not only enables the flatness measurement of the leadframe to be completed quickly, but also ensures the accuracy of the flatness measurement.

[0005] To achieve the purpose of this utility model, the technical solution adopted is as follows: a fixture for quickly measuring the flatness of semiconductor lead frame heat sinks, including a base, a support platform on the base, and multiple support contacts on the support platform; the base also supports a swingable pressure claw, the pressing end of the pressure claw is used to press the lead frame plate area onto the multiple support contacts, and a pressure spring is connected between the tail of the pressure claw and the base.

[0006] Furthermore, both the pressure claw and the base are L-shaped, with the horizontal section of the pressure claw engaging with the vertical section of the base, and the support platform located on the highest surface of the base.

[0007] Furthermore, the clamping end of the clamping claw is U-shaped, the opening width of the clamping end of the clamping claw is greater than the width of the plate area on the lead frame, and the clamping end of the clamping claw also has two inwardly extending clamping parts.

[0008] Furthermore, the pressing surface of the pressing part has pressing teeth.

[0009] Furthermore, a U-shaped seat is also installed on the base, and the middle part of the pressure claw is hinged to the U-shaped seat.

[0010] Furthermore, the base and the pressure claw are provided with corresponding mounting holes, and the two ends of the compression spring are respectively installed in the two mounting holes.

[0011] Furthermore, the mounting holes on the base and / or the mounting holes on the pressure claws are threaded through holes, and a screw plug is installed inside the threaded through hole, with one end or both ends of the compression spring abutting against the screw plug.

[0012] Furthermore, a vertically extending stop is also installed on the support platform, and the stop is located on the side of the support platform near the compression spring.

[0013] Furthermore, the support platform and the base cooperate to form a stepped surface adapted to the lead frame.

[0014] Furthermore, the support platform and the base are an integral structure.

[0015] The beneficial effects of this utility model are:

[0016] By setting multiple support contacts on the support platform, the carrier area on the lead frame is supported by these contacts, preventing the carrier area of ​​the lead frame from sticking to the support platform. At the same time, in conjunction with the clamping spring, the clamping claw and the base form a lever structure. The clamping spring pushes the clamping claw to swing through its own elasticity, so that the clamping claw presses the carrier area of ​​the lead frame against the multiple support contacts. This not only allows the carrier area of ​​the lead frame to be quickly pressed between the clamping claw and the multiple support contacts, but also ensures that the pressed carrier area of ​​the lead frame remains horizontal, thus ensuring the accuracy of the lead frame flatness measurement. Attached Figure Description

[0017] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0018] Figure 1 This is a structural diagram of an existing lead frame;

[0019] Figure 2 This is a structural diagram of a fixture for quickly measuring the flatness of semiconductor leadframe heat sinks;

[0020] Figure 3 This is a top view of the base;

[0021] Figure 4 This is a side view of the base;

[0022] Figure 5 This is a structural diagram of the U-shaped seat;

[0023] Figure 6 This is a top view of the pressure jaws;

[0024] Figure 7 This is a side view of the pressure claw.

[0025] The attached diagram shows the markings and corresponding component names:

[0026] 1. Base; 2. U-shaped seat; 3. Pressure claw; 4. Compression spring; 5. Screw plug; 6. Stop block;

[0027] 11. Mounting hole; 12. Support platform; 13. Support contact; 14. Mounting cavity; 15. Stepped surface;

[0028] 31. Pressing part; 32. Pressing teeth. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown in the accompanying drawings.

[0030] It should be noted that, where there is no conflict, the embodiments and features described in these embodiments can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] like Figures 2 to 7 As shown, the present invention provides a fixture for quickly measuring the flatness of a semiconductor leadframe heat sink, including a base 1, a support platform 12 on the base 1, and multiple support contacts 13 on the support platform 12. The support contacts 13 are rectangular blocks, frustums, hemispheres, etc. Specifically, there are four support contacts 13 arranged in a rectangular pattern. When the substrate area of ​​the leadframe is placed on the four support contacts 13, the substrate area of ​​the leadframe can be supported by the support contacts 13 in all four right-angle directions, ensuring that the substrate area of ​​the leadframe remains horizontal when placed on the four support contacts 13.

[0032] A swingable pressure claw 3 is supported on the base 1 by a pin. The pressure claw 3 and the base 1 cooperate to form a lever structure, and the length direction of the pressure claw 3 is consistent with the length direction of the base 1. The pressing end of the pressure claw 3 is located above the support platform 12, and a pressure spring 4 is connected between the tail of the pressure claw 3 and the base 1. When the tail of the pressure claw 3 is pressed, the pressure spring 4 is compressed, and the pressing end of the pressure claw 3 moves away from the support platform 12. When the tail of the pressure claw 3 loses the pressing force, the pressure spring 4 pushes the tail of the pressure claw 3 upward through its own elastic force. At this time, the pressing end of the pressure claw 3 moves downward, and the pressing end of the pressure claw 3 presses and fixes the carrier area of ​​the lead frame onto multiple support contacts 13.

[0033] On the one hand, multiple support contacts 13 support the carrier area on the lead frame, preventing the carrier area from sticking to the support platform 12. This ensures that the carrier area remains horizontal when the clamping end of the clamping claw 3 presses against it, allowing for rapid and accurate flatness measurement of the lead frame. On the other hand, by setting a clamping spring 4, when the carrier area of ​​the lead frame needs to be pressed against the multiple support contacts 13, or when the carrier area needs to be removed from the multiple support contacts 13, the tail of the clamping claw 3 can be pressed directly to quickly lift the clamping end of the clamping claw 3. Simultaneously, when the lead frame needs to be pressed against the multiple support contacts 13, the pressure on the tail of the clamping claw 3 can be released, making the operation faster and more convenient.

[0034] In this utility model, such as Figure 2 , Figure 4 , Figure 7 As shown, both the clamping claw 3 and the base 1 are L-shaped. The horizontal section of the clamping claw 3 corresponds to the vertical section of the base 1, and vice versa, so that the clamping claw 3 and the base 1 are arranged in an interlocking manner. The support platform 12 is located at the top of the vertical section of the base 1, that is, the support platform 12 is located on the highest surface of the base 1. At the same time, the distance between the horizontal section of the clamping claw 3 and the support platform 12 is smaller than the distance between the vertical section of the clamping claw 3 and the horizontal section of the base 1. This not only prevents the clamping end of the clamping claw 3 from swinging excessively downward during the swinging process, but also provides sufficient downward pressure space at the tail of the clamping claw 3. This facilitates the placement of the carrier area on the lead frame onto multiple support contacts 13, and also ensures that the clamping end of the clamping claw presses firmly against the carrier area on the lead frame.

[0035] In the design of the clamping claw 3, to minimize the risk of scratches caused by the clamping end of the clamping claw 3 to the lead frame's carrier area, such as... Figure 6As shown, the clamping end of the clamping claw 3 can be U-shaped, and the opening width of the clamping end of the clamping claw 3 is greater than the width of the plate area on the lead frame. Two opposing clamping portions 31 are provided at the clamping end of the clamping claw 3, with the extension direction of the clamping portions 31 consistent with the width direction of the clamping claw 3. When it is necessary to clamp the plate area of ​​the lead frame onto the support contact 13, the clamping spring 4 pushes the tail of the clamping claw 3 upward, and the clamping end of the clamping claw 3 moves downward. At this time, the two clamping portions 31 respectively clamp the two sides of the plate area on the lead frame, thereby achieving the clamping of the plate area on the lead frame. Furthermore, by setting the clamping end of the clamping claw 3 in a U-shape, when the plate area on the lead frame is clamped, the plate area on the lead frame can be exposed through the opening of the clamping end of the clamping claw 3, thus facilitating the detection of the flatness of the plate area on the lead frame.

[0036] In order to ensure the clamping effect on the lead frame loading area, the clamping surface of the clamping part 31 is also provided with clamping teeth 32, which are evenly distributed on the clamping surface of the clamping part 31; at the same time, in order to avoid the clamping teeth 32 from scratching the lead frame loading area, the clamping teeth 32 can be made of rubber.

[0037] To facilitate the installation of the pressure claw 3, a U-shaped seat 2 can also be provided, such as... Figure 2 , Figure 5 As shown, corresponding threaded holes are made on the horizontal section of the U-shaped seat 2 and the horizontal section of the base 1. The U-shaped seat 2 is fixedly installed on the horizontal section of the base 1 with screws. At the same time, corresponding through holes are made on the two vertical sections of the U-shaped seat 2 and the middle of the clamping claw 3. A rotating pin passes through the through hole of the clamping claw 3, and the two ends of the rotating pin are respectively installed in the two through holes of the U-shaped seat 2. This not only realizes the installation of the clamping claw, but also ensures the swing of the clamping claw.

[0038] To prevent the two ends of the compression spring 4 from detaching from the base 1 and the pressure claw 3 respectively, corresponding mounting holes 11 can be made in the horizontal section of the base 1 and the vertical section of the pressure claw 3, such as... Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 7 As shown, the two ends of the compression spring 4 are respectively installed in the two mounting holes 11, so that the two ends of the compression spring 4 are restricted, making the installation of the compression spring 4 more stable. In order to adjust the spring force of the compression spring 4, the mounting hole 11 on the gripper or / or base 1 can be set as a threaded through hole, and a screw plug 5 is screwed into the threaded through hole, so that one or both ends of the compression spring 4 abut against the screw plug 5; when it is necessary to adjust the spring force of the compression spring 4, the screw plug 5 is turned, the position of the screw plug 5 in the mounting hole 11 is adjusted, the space length used for installing the compression spring 4 changes, thereby adjusting the spring force of the compression spring 4.

[0039] To limit the depth of the lead frame's loading area above the support contact 13, such as Figure 2 As shown, a stop block 6 is also installed on the side of the support platform 12 near the compression spring 4. The stop block 6 extends vertically upward. When the upper plate area of ​​the lead frame is placed on the support contact 13, the upper plate area of ​​the lead frame abuts against the stop block 6, thereby limiting the insertion depth of the upper plate area of ​​the lead frame towards the compression spring 4, and ensuring that the support contact 13 on the support platform 12 supports the upper plate area of ​​the lead frame.

[0040] In this utility model, such as Figure 2 As shown, the stop block 6 can be a protruding strip directly welded to the support platform 12, or a vertically extending mounting cavity 14 can be formed on the vertical section of the base 1, in which the stop block 6 is installed and the top of the stop block 6 protrudes slightly from the support platform 12. Of course, the mounting cavity 14 here can also be a through groove penetrating the base 1, in which case the stop block 6 can be embedded in the mounting cavity 14.

[0041] Because there is a height difference between the substrate area of ​​the lead frame and the pins of the lead frame, a stepped surface 15 is formed on the top surface of the vertical section of the support platform 12 to accommodate this height difference. Figure 3 , Figure 4 As shown, when the lead frame's carrier area is placed on the support contact 13, the pins on the lead frame can be supported by the stepped surface 15, avoiding the pins being supported on the support platform 12 and affecting the flatness of the lead frame placement, making the lead frame installation more stable and improving the accuracy of lead frame flatness measurement.

[0042] To simplify the fixture structure, the support platform 12 and the base 1 are integrated into one piece. That is, the vertical section of the base 1 has a raised boss, which is the support platform 12. In addition, to prevent the base 1 from scratching the wafer area of ​​the lead frame, the width of the support platform 12 can be smaller than the width of the base 1.

[0043] In this invention, when it is necessary to measure the flatness of the lead frame loading area, the tail of the pressure claw 3 is pressed, the compression spring 4 is compressed, the tail of the pressure claw 3 swings downward, and the clamping end of the pressure claw 3 is lifted upward. The lead frame loading area to be measured is placed on the support contact 13 and abuts against the stop block 6. Then, the pressure on the tail of the pressure claw 3 is released, and the compression spring 4 pushes the tail of the pressure claw 3 to swing upward through its own elasticity. The clamping end of the pressure claw 3 swings downward, and the clamping part 31 on the clamping end of the pressure claw 3 clamps the lead frame loading area, thereby clamping the lead frame loading area. The operator uses measuring tools to measure the flatness of the lead frame loading area.

[0044] After the flatness measurement of the lead frame loading area is completed, press the tail of the pressure claw 3, compress the spring 4, the tail of the pressure claw 3 swings downward, and the clamping end of the pressure claw 3 lifts upward, removing the measured lead frame loading area from the support contact 13. Then, release the pressure on the tail of the pressure claw 3, and the spring 4 pushes the tail of the pressure claw 3 to swing upward through its own elasticity, the clamping end of the pressure claw 3 swings downward, and the clamping part 31 on the clamping end of the pressure claw 3 presses against the support platform 12.

[0045] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A fixture for quickly measuring the flatness of semiconductor lead frame heat sinks, characterized in that, Includes a base (1), on which a support platform (12) is provided, and on which a plurality of support contacts (13) are provided; the base (1) is also supported by a swingable pressure claw (3), the pressing end of the pressure claw (3) is used to press the upper plate area of ​​the lead frame onto the plurality of support contacts (13), and a pressure spring (4) is connected between the tail of the pressure claw (3) and the base (1).

2. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to claim 1, characterized in that, Both the pressure claw (3) and the base (1) are L-shaped. The horizontal section of the pressure claw (3) matches the vertical section of the base (1), and the support platform (12) is located on the highest surface of the base (1).

3. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to claim 2, characterized in that, The clamping end of the clamping claw (3) is U-shaped, and the opening width of the clamping end of the clamping claw (3) is greater than the width of the plate area on the lead frame. The clamping end of the clamping claw (3) also has two inwardly extending clamping parts (31).

4. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to claim 3, characterized in that, The pressing surface of the pressing part (31) has pressing teeth (32).

5. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to claim 1, characterized in that, A U-shaped seat (2) is also installed on the base (1), and the middle part of the pressure claw (3) is hinged to the U-shaped seat (2).

6. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to claim 1, characterized in that, The base (1) and the pressure claw (3) are provided with corresponding mounting holes (11), and the two ends of the compression spring (4) are respectively installed in the two mounting holes (11).

7. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to claim 6, characterized in that, The mounting hole (11) on the base (1) and / or the mounting hole (11) on the pressure claw (3) are threaded through holes, and a screw plug (5) is installed in the threaded through hole. One end of the compression spring (4) or both ends of the compression spring (4) abut against the screw plug (5).

8. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to any one of claims 1 to 7, characterized in that, A vertically extending stop (6) is also installed on the support platform (12), and the stop (6) is located on the side of the support platform (12) near the compression spring (4).

9. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to any one of claims 1 to 7, characterized in that, The support platform (12) and the base (1) cooperate to form a stepped surface (15) that is compatible with the lead frame.

10. The fixture for quickly measuring the flatness of semiconductor lead frame heat sinks according to claim 9, characterized in that, The support platform (12) and the base (1) are an integral structure.

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