Flattening machine for thin film surface patch processing
By introducing a cleaning motor and a cleaning thread rod into the flattening machine, the problem of insufficient cleaning in traditional flattening machines is solved, achieving tight bonding of the film surface and improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAIBEI XINJUN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-03-26
- Publication Date
- 2026-04-28
AI Technical Summary
Traditional flattening machines lack a cleaning function, resulting in poor film adhesion, air bubbles, and other problems that affect processing quality.
A flattening machine with a cleaning motor and a cleaning thread rod was designed. The cleaning thread rod cleans the surface of electronic instruments, removing dust and impurities and ensuring that the film adheres tightly to the surface of the electronic instruments.
It effectively removes dust and impurities from the bonding area of electronic instruments, improves the bonding quality between the film and the surface of electronic instruments, avoids bubbles and voids, and enhances the flatness and smoothness of the product.
Smart Images
Figure CN224170487U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of film surface mounting technology, and in particular to a flattening machine for film surface mounting processing. Background Technology
[0002] In the field of modern electronic equipment manufacturing, film surface coatings are widely used on the surfaces of various electronic instruments as an important decorative and functional component. They not only enhance the appearance and texture of products, but also have multiple functions such as waterproofing, dustproofing, scratch resistance, and labeling. The bonding quality of film surface coatings has a crucial impact on the overall performance and service life of electronic instruments.
[0003] Traditional film lamination machines primarily focus on flattening films onto the surface of electronic instruments using pressure. However, in actual production environments, dust, debris, and other tiny particles inevitably adhere to the bonding surfaces of electronic instruments. Lacking a cleaning function, traditional lamination machines typically perform the film lamination operation directly, leaving these impurities trapped between the film and the bonding surface of the electronic instrument. This easily leads to loose film bonding, resulting in bubbles, voids, and other issues, often requiring rework and significantly reducing the overall processing quality.
[0004] Therefore, it is necessary to provide a flattening machine for film surface coating to solve the above-mentioned technical problems. Utility Model Content
[0005] This invention provides a flattening machine for film surface bonding processing, which solves the problem that the lack of a cleaning function for the bonding area of electronic instruments in traditional devices leads to a significant decrease in processing quality.
[0006] To solve the above-mentioned technical problems, this utility model provides a flattening machine for film surface coating processing, comprising: a device body, a device fixing block fixedly connected to the device body, a motor base fixedly connected to the device fixing block, a cleaning motor fixedly connected to the motor base, a cleaning threaded rod provided on the cleaning motor, a cleaning nut block threadedly connected to the cleaning threaded rod, a transverse rod fixedly connected to the cleaning nut block, a cleaning sticking rod rotatably connected to the transverse rod, a limiting block fixedly connected to the transverse rod, a detachable blocking block provided on the transverse rod, a cleaning guide block fixedly connected to the cleaning nut block, a cleaning groove provided on the device fixing block, and a controller installed on the device body.
[0007] Preferably, the main body of the device is provided with an adjustment groove, an adjustment rod is fixedly connected to the adjustment groove, an adjustment spring is provided on the adjustment rod, and an adjustment slider is slidably connected to the adjustment rod.
[0008] Preferably, a fixing frame is fixedly connected to the adjusting slider, the adjusting slider is slidably connected to the adjusting groove, one end of the adjusting spring is fixedly connected to the adjusting slider, and the other end of the adjusting spring is fixedly connected to the adjusting groove.
[0009] Preferably, a vertical fixing rod is fixedly connected to the main body of the device, a vertical sliding groove is provided on the vertical fixing rod, a vertical bearing is provided on the vertical sliding groove, and a downward threaded rod is rotatably connected to the vertical bearing.
[0010] Preferably, a pressing nut block is threadedly connected to the pressing threaded rod, a torsion block is fixedly connected to the pressing threaded rod, a pressure plate is fixedly connected to the pressing nut block, and a protective pad is fixedly connected to the pressure plate.
[0011] Preferably, a top plate is fixedly connected to the vertical fixing rod, and a limiting block is fixedly connected to the horizontal rod.
[0012] Preferably, a device support rod is fixedly connected to the main body of the device, and an anti-slip pad is fixedly connected to the device support rod.
[0013] Compared with related technologies, the flattening machine for film surface coating processing provided by this utility model has the following advantages:
[0014] This utility model provides a flattening machine for film surface lamination processing. When using this device, the electronic instrument to be laminated can be placed inside the fixed frame. At this time, the cleaning motor can be started by controlling the controller. The cleaning motor will drive the cleaning threaded rod to rotate, and the cleaning threaded rod will drive the cleaning nut block to move. At the same time, the cleaning nut block will drive the cleaning adhesive rod to clean the dust on the surface of the electronic instrument. This device adds the function of cleaning the surface of the electronic instrument, which can effectively remove dust, impurities, etc. at the bonding area, so that the film is tightly and evenly laminated to the surface of the electronic instrument, avoiding problems such as bubbles and voids caused by dust particles, improving the flatness and smoothness of the lamination, thereby improving the product processing quality. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of a preferred embodiment of a flattening machine for film surface coating processing provided by this utility model;
[0016] Figure 2 for Figure 1 The diagram shows a front sectional view of the main body of the device.
[0017] Figure 3 for Figure 1 The diagram shows a cross-sectional view of the main body of the device from the rear.
[0018] Figure 4for Figure 2 The enlarged schematic diagram of part A shown below;
[0019] Figure 5 for Figure 2 The enlarged schematic diagram of part B is shown.
[0020] The diagram is labeled as follows: 1. Main body of the device; 2. Controller; 3. Cleaning sticky rod; 4. Device fixing block; 5. Fixing frame; 6. Pressure plate; 7. Vertical fixing rod; 8. Torsion block; 9. Top plate; 10. Adjusting slide; 11. Cleaning nut block; 12. Cleaning guide block; 13. Cleaning slide; 14. Cleaning threaded rod; 15. Cleaning motor; 16. Motor base; 17. Anti-slip pad; 18. Device support rod; 19. Pressing nut block; 20. Pressing threaded rod; 21. Vertical slide; 22. Protective soft pad; 23. Adjusting slider; 24. Adjusting slide rod; 25. Vertical bearing; 26. Adjusting spring; 27. Removable plug; 28. Horizontal rod; 29. Limiting block. Detailed Implementation
[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0022] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 This is a schematic diagram of a preferred embodiment of a flattening machine for film surface coating processing provided by this utility model; Figure 2 for Figure 1 The diagram shows a front sectional view of the main body of the device. Figure 3 for Figure 1 The diagram shows a cross-sectional view of the main body of the device from the rear. Figure 4 for Figure 2 The enlarged schematic diagram of part A shown below; Figure 5 for Figure 2The enlarged schematic diagram of part B is shown. A flattening machine for film surface bonding processing includes: a device body 1, a device fixing block 4 fixedly connected to the device body 1, a motor base 16 fixedly connected to the device fixing block 4, a cleaning motor 15 fixedly connected to the motor base 16, a cleaning threaded rod 14 provided on the cleaning motor 15, a cleaning nut block 11 threadedly connected to the cleaning threaded rod 14, a transverse rod 28 fixedly connected to the cleaning nut block 11, a cleaning adhesive rod 3 rotatably connected to the transverse rod 28, a limiting block 28 fixedly connected to the transverse rod 28, a removable blocking block 27 provided on the transverse rod 28, a cleaning guide block 12 fixedly connected to the cleaning nut block 11, a cleaning groove 13 formed on the device fixing block 4, a controller 2 installed on the device body 1, and the cleaning adhesive rod 3 having the function of cleaning the surface of electronic instruments that need to be bonded.
[0023] The main body 1 of the device is provided with an adjustment groove 10, an adjustment rod 24 is fixedly connected to the adjustment groove 10, an adjustment spring 26 is provided on the adjustment rod 24, and an adjustment slider 23 is slidably connected to the adjustment rod 24. The adjustment groove 10 has the function of guiding the adjustment slider 23.
[0024] A fixing frame 5 is fixedly connected to the adjusting slider 23. The adjusting slider 23 is slidably connected to the adjusting slide 10. One end of the adjusting spring 26 is fixedly connected to the adjusting slider 23, and the other end of the adjusting spring 26 is fixedly connected to the adjusting slide 10. The fixing frame 5 has the function of fixing electronic instruments.
[0025] A vertical fixing rod 7 is fixedly connected to the main body 1 of the device. A vertical sliding groove 21 is provided on the vertical fixing rod 7. A vertical bearing 25 is provided on the vertical sliding groove 21. A downward threaded rod 20 is rotatably connected to the vertical bearing 25. The vertical bearing 25 has the function of stabilizing the downward threaded rod 20.
[0026] A pressing nut block 19 is threadedly connected to the pressing threaded rod 20. A torsion block 8 is fixedly connected to the pressing threaded rod 20. A pressure plate 6 is fixedly connected to the pressing nut block 19. A protective pad 22 is fixedly connected to the pressure plate 6. The protective pad 22 has the function of protecting electronic instruments.
[0027] A top plate 9 is fixedly connected to the vertical fixing rod 7, and a limiting block 29 is fixedly connected to the horizontal rod 28. The vertical fixing rod 7 has the function of supporting the top plate 9.
[0028] A device support rod 18 is fixedly connected to the main body 1 of the device, and an anti-slip pad 17 is fixedly connected to the device support rod 18. The anti-slip pad 17 has the function of preventing the device from sliding when it is running.
[0029] The working principle of the flattening machine for film surface coating processing provided by this utility model is as follows:
[0030] When using this device, the electronic instrument to be bonded can be placed inside the mounting bracket 5. At this time, the cleaning motor 15 can be started by the controller 2. The cleaning motor 15 will drive the cleaning threaded rod 14 to rotate, and the cleaning threaded rod 14 will drive the cleaning nut block 11 to move. At the same time, the cleaning nut block 11 will drive the cleaning guide block 12 to slide along the cleaning groove 13 to guide the cleaning nut block 11. As the cleaning nut block 11 moves, it will drive the horizontal rod 28 to move. The horizontal rod 28 will drive the cleaning sticking rod 3 to clean the dust from the surface bonding area of the electronic instrument.
[0031] Compared with related technologies, the flattening machine for film surface coating processing provided by this utility model has the following advantages:
[0032] When using this device, the electronic instrument to be bonded can be placed inside the mounting bracket 5. At this time, the cleaning motor 15 can be started by the controller 2. The cleaning motor 15 will drive the cleaning threaded rod 14 to rotate, and the cleaning threaded rod 14 will drive the cleaning nut block 11 to move. At the same time, the cleaning nut block 11 will drive the cleaning adhesive rod 3 to clean the dust from the bonding area of the electronic instrument. This device adds the function of cleaning the bonding area of the electronic instrument, which can effectively remove dust, impurities, etc. from the bonding area of the electronic instrument, so that the film is tightly and evenly bonded to the surface of the electronic instrument, avoiding problems such as bubbles and voids caused by dust particles, improving the flatness and smoothness of the bonding, thereby improving the product processing quality.
[0033] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A flattening machine for film surface lamination processing, characterized in that, include: The device body includes a device fixing block fixedly connected to it, a motor base fixedly connected to the device fixing block, a cleaning motor fixedly connected to the motor base, a cleaning threaded rod on the cleaning motor, a cleaning nut block threadedly connected to the cleaning threaded rod, a transverse rod fixedly connected to the cleaning nut block, a cleaning sticking rod rotatably connected to the transverse rod, a limiting block fixedly connected to the transverse rod, a removable blocking block on the transverse rod, a cleaning guide block fixedly connected to the cleaning nut block, a cleaning groove formed on the device fixing block, and a controller mounted on the device body.
2. The flattening machine for film surface lamination processing according to claim 1, characterized in that, The main body of the device is provided with an adjustment groove, an adjustment rod is fixedly connected to the adjustment groove, an adjustment spring is provided on the adjustment rod, and an adjustment slider is slidably connected to the adjustment rod.
3. A flattening machine for film surface lamination processing according to claim 2, characterized in that, A fixed frame is fixedly connected to the adjusting slider, the adjusting slider is slidably connected to the adjusting groove, one end of the adjusting spring is fixedly connected to the adjusting slider, and the other end of the adjusting spring is fixedly connected to the adjusting groove.
4. A flattening machine for film surface lamination processing according to claim 1, characterized in that, A vertical fixing rod is fixedly connected to the main body of the device. A vertical sliding groove is provided on the vertical fixing rod. A vertical bearing is provided on the vertical sliding groove. A downward threaded rod is rotatably connected to the vertical bearing.
5. A flattening machine for film surface lamination processing according to claim 4, characterized in that, A pressing nut block is threadedly connected to the pressing threaded rod, a torsion block is fixedly connected to the pressing threaded rod, a pressure plate is fixedly connected to the pressing nut block, and a protective pad is fixedly connected to the pressure plate.
6. A flattening machine for film surface lamination processing according to claim 4, characterized in that, A top plate is fixedly connected to the vertical fixing rod, and a limiting block is fixedly connected to the horizontal rod.
7. A flattening machine for film surface lamination processing according to claim 1, characterized in that, A device support rod is fixedly connected to the main body of the device, and an anti-slip pad is fixedly connected to the device support rod.