Substrate pretreatment device

Abstract

The utility model relates to a substrate pretreatment device, which comprises a vacuum cavity, an upper heating unit, a substrate bearing unit and a radio frequency power unit, the upper end of the vacuum cavity is in sealing fit with the upper heating unit, the lower end of the vacuum cavity is in sealing connection with the substrate bearing unit, a pretreatment cavity is formed in the vacuum cavity, and heating lamp tubes are distributed at the lower end, located in the pretreatment cavity, of the upper heating unit; the substrate bearing unit comprises an anode flange, a shielding cover fixed at the upper end of the anode flange, a temperature control anode plate arranged at the upper part of the shielding cover, a ceramic circuit breaker connected with the temperature control anode plate and the anode flange, and a high-temperature-resistant insulating plug and an insulating sleeve which are arranged in the ceramic circuit breaker up and down; the upper ends of the temperature control medium input and output pipes are communicated with the medium flow channel in the anode plate; the radio frequency protection box is fixed below the anode flange, the radio frequency matcher is installed outside the radio frequency protection box, and an output line of the radio frequency matcher is electrically connected with the temperature control medium input pipe and the temperature control medium output pipe through the power transmission clamp. The device achieves better process applicability.

Description

Technical Field

[0001] This utility model belongs to the field of thin film deposition technology, specifically relating to a substrate pretreatment device. Background Technology

[0002] Currently, magnetron sputtering is a widely used substrate coating method. Before magnetron sputtering coating on the substrate, it is necessary to remove moisture from the substrate and etch the substrate surface to increase its roughness. Existing substrate pretreatment equipment is generally suitable for pretreatment of substrates of single material and single size, which has the disadvantage of poor process applicability. Utility Model Content

[0003] This invention addresses the aforementioned technical problems by proposing a substrate pretreatment device that achieves better process applicability.

[0004] The above-mentioned objective of this utility model is achieved through the following technical solution:

[0005] A substrate preprocessing apparatus includes a vacuum chamber, an upper heating unit, a substrate support unit, and a radio frequency power unit;

[0006] The upper end of the vacuum chamber is sealed to the upper heating unit, and the lower end of the vacuum chamber is sealed to the substrate support unit, forming a pretreatment chamber inside. The lower end of the upper heating unit located in the pretreatment chamber is equipped with heating lamps. Multiple interfaces are provided on the side wall of the vacuum chamber, and vacuum pumps, vacuum measuring instruments, process gas input interfaces, and vacuum breaking components are respectively connected to the multiple interfaces.

[0007] The substrate carrier unit includes an anode flange, a shielding cover, a temperature-controlled anode plate, a ceramic circuit breaker, a high-temperature resistant insulating plug, an insulating sleeve, a temperature-controlled medium input pipe, and a temperature-controlled medium output pipe. The anode flange is located at the lower end of the vacuum chamber and is fixedly connected to the vacuum chamber. The shielding cover is a cylindrical shielding cover with a frustum at the upper end and a flange at the lower end, and the lower flange of the shielding cover is fixedly connected to the upper end of the anode flange. The ceramic circuit breaker is built into the inner hole of the shielding cover, and the lower end of the ceramic circuit breaker is fixedly connected to the upper end of the anode flange. The lower end of the temperature-controlled anode plate is fixedly connected to the upper end of the ceramic circuit breaker, and the upper part of the temperature-controlled anode plate extends from the upper frustum of the shielding cover. The end extends out, and its upper end forms a substrate tray or substrate support surface. A medium flow channel is evenly distributed in the upper part of the temperature-controlled anode plate. A high-temperature resistant insulating plug is installed in the upper part of the inner hole of the ceramic circuit breaker, and an insulating sleeve is fixed in the lower part. The temperature-controlled medium input pipe and temperature-controlled medium output pipe pass through the pipe hole of the high-temperature resistant insulating plug and the inner hole of the insulating sleeve. The upper ends of the two pipes are fixed to the temperature-controlled anode plate and communicate with the built-in medium flow channel. The lower ends of the two pipes extend to the bottom of the anode flange. The lower end of the temperature-controlled medium input pipe forms a medium inlet, and the lower end of the temperature-controlled medium output pipe forms a medium return port. The medium inlet and the medium return port are connected to the external medium supply device.

[0008] The radio frequency power unit includes a radio frequency protection box and a radio frequency matching unit. The radio frequency protection box is fixed to the bottom of the anode flange by the outer shell flange, so that the temperature control medium input tube and the temperature control medium output tube are located inside the radio frequency protection box. The radio frequency matching unit is installed outside the radio frequency protection box, and the output line of the radio frequency matching unit is electrically connected to the temperature control medium input tube and the temperature control medium output tube through a power transmission clamp.

[0009] Furthermore, the upper heating unit also includes a top cover, a lamp holder, a viewing window, a heating lamp tube, an upper heat insulation device, a positive power supply terminal, a negative power supply terminal, a positive wire, a negative wire, a thermocouple, a terminal protective cover, and a connecting flange.

[0010] The top cover is supported on the upper end of the vacuum chamber, and the two are sealed by a sealing ring; the lamp holder is connected to the lower part of the top cover by multiple support columns A, and a viewing window is provided on the lamp holder; the viewing window is fixed below the lamp holder at a position corresponding to the viewing window; the upper heat insulation device consists of a heat insulation cover with an opening at the lower end and upper and lower multi-layer heat insulation plates set inside the heat insulation cover; the heat insulation cover is fixedly connected to the multiple support columns A and is set above the lamp cover; multiple heating lamps are supported parallel above the lamp holder by lamp tube brackets and are located below the lowest heat insulation plate inside the heat insulation cover, and the multiple heating lamps form a circular radiant heating surface, which is aligned with the viewing window located below; the positive power terminal and the negative power terminal are fixed to the heat insulation. The top of the cover is electrically connected to the positive and negative terminals of the heating lamp tube; a wire hole is provided in the center of the top cover; a connecting flange is fixed at the center of the top cover, and a positive lead hole, a negative lead hole, and a thermocouple through hole are provided on the connecting flange; a terminal protective cover is fixed on the top of the top cover around the connecting flange, and a cable general entry hole is provided at the upper end of the terminal protective cover; the positive terminal wire, the negative terminal wire, and the thermocouple respectively pass through the positive lead hole, the negative lead hole, and the thermocouple lead hole in a sealed manner, and the upper ends of the positive terminal wire, the negative terminal wire, and the thermocouple are all introduced through the cable general entry hole, and the lower ends of the positive terminal wire and the negative terminal wire are connected to the positive power terminal and the negative power terminal respectively; the lower end of the thermocouple extends to a position near the upper end of the viewing window.

[0011] Furthermore, the substrate pretreatment device also includes a lifting mechanism for raising the upper heating unit; the lifting mechanism includes a lifting rod, guide seats, a top cover connecting frame, and a lifting rod drive structure; two guide seats are fixed to the outer wall of the vacuum chamber, and linear bearings are installed in the upper and lower aligned guide holes on the two guide seats; the lifting rod passes through the upper and lower aligned linear bearings, and the upper end of the lifting rod is fixedly connected to the top cover connecting frame, which is fixed to the top cover; the lifting rod drive structure adopts a combination structure of gear transmission and screw nut driven by a handwheel.

[0012] Furthermore, the substrate pretreatment device also includes a pneumatic grid, which is disposed within the vacuum chamber between the upper heating unit and the temperature-controlled anode plate. The pneumatic grid includes a grid base plate, grid plates, a swing cylinder, and rigid connectors. The grid base plate is fixed to the lower part of the upper heating unit by multiple support columns B, and a square opening is provided in the center of the grid base plate. A fixing seat is fixed on both sides of the square opening at the upper end of the grid base plate, and a sliding seat is slidably disposed above the fixing seats on both sides. Multiple grid plates are arranged in parallel within the square opening, and the lower ends of each grid plate can rotate relative to the fixing seats on both sides through a lower rotating shaft. The system features a dynamic connection where the upper ends of each grid plate are rotatably connected to sliding seats on both sides via an upper pivot. A rigid connector is provided on the outer side of one sliding seat, with one end of the rigid connector being fixedly inserted into one end of a forked pin. The other end of the forked pin is rotatably connected to the outer side of the corresponding sliding seat, with both ends of the forked pin being parallel. The other end of the rigid connector is connected to the output end of a swing cylinder. A rigid connector outlet is provided on the side wall of the vacuum chamber, and the rigid connector forms a rotatable sealed fit with the rigid connector outlet through a mechanical seal and bearing. The swing cylinder is fixed on a cylinder bracket outside the vacuum chamber.

[0013] The advantages and positive effects of this utility model are as follows:

[0014] 1. After evacuating the vacuum chamber, this substrate pretreatment device can degas the substrate placed on the upper part of the temperature-controlled anode plate by turning on the heating lamp tube of the upper heating unit. After degassing, argon gas is introduced through the process gas input interface and stabilized. Then, the radio frequency matching device is turned on to realize the etching process on the substrate surface, which can achieve a better pretreatment effect.

[0015] 2. The anode plate of the substrate carrier unit of the present invention can be cooled or heated by an external temperature-controlled medium, thereby achieving cooling and heating of the substrate during the etching process. The design of this temperature control structure enables the substrate pretreatment device to etch the substrate at a better temperature, improving etching efficiency. On the other hand, it is applicable to the pretreatment of substrates of various materials, such as silicon, ceramic, glass, SiC, gallium arsenide, gallium nitride, sapphire, etc.

[0016] 3. This substrate pretreatment device is suitable for etching substrates placed on temperature-controlled anode plates via a substrate tray or directly on temperature-controlled anode plates. It can process substrates of various standard sizes, such as substrates with diameters of 8, 6, and 4 inches.

[0017] In summary, this substrate pretreatment device achieves good process applicability. Attached Figure Description

[0018] Figure 1 This is an overall view (first-person perspective) of the substrate preprocessing device;

[0019] Figure 2 This is an overall view of the substrate preprocessing device (second perspective);

[0020] Figure 3 This is an overall longitudinal sectional view of the substrate preprocessing apparatus;

[0021] Figure 4 This is an overall view of the upper heating unit;

[0022] Figure 5 This is a longitudinal sectional view of the upper heating unit;

[0023] Figure 6 This is a schematic diagram of the appearance of the substrate carrier unit and the radio frequency power unit;

[0024] Figure 7 This is a longitudinal sectional view of the substrate carrier unit and the radio frequency power unit;

[0025] Figure 8 These are schematic diagrams of the aerodynamic grille structure, 8a, schematic diagram of the first angle structure, and 8b, schematic diagram of the second angle structure.

[0026] In the diagram: 1. Upper heating unit; 1.1 Heating lamp; 1.2 Thermocouple; 1.3 Terminal protective cover; 1.4 Top cover; 1.5 Positive wiring; 1.6 Negative wiring; 1.7 Connecting flange; 1.8 Positive power terminal; 1.9 Negative power terminal; 1.10 Heat insulation cover; 1.11 Heat insulation board; 1.12 Lamp holder; 1.13 Viewing window; 2. Vacuum chamber; 3. Process gas input interface; 4. Vacuum breaking assembly; 5. Pneumatic grille; 5.1 Swing cylinder; 5.2 Rigid connector; 5.3 Fork pin; 5.4 Sliding seat; 5.5 Fixed seat; 5.6 Grille plate; 5.7 Grid substrate; 6. Lifting rod; 7. Guide seat; 8. Molecular pump; 9. Top cover connecting frame; 10. Capacitive vacuum gauge; 11. Pirani vacuum gauge; 12. Full-range vacuum gauge; 13. Observation window; 14. Substrate tray; 15. Substrate carrier unit; 15.1 Shielding cover; 15.2 Anode flange; 15.3 Temperature-controlled anode plate; 15.4 High-temperature resistant insulating plug; 15.5 Ceramic circuit breaker; 15.6 Housing flange; 15.7 Insulating sleeve; 15.8 Temperature-controlled medium output pipe; 15.9 Temperature-controlled medium input pipe; 16. Power transmission clamp; 17. RF protection box; 18. RF matching unit. Detailed Implementation

[0027] The structure of this utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that these embodiments are descriptive and not limiting.

[0028] A substrate preprocessing apparatus, please refer to Figures 1-8 Its invention points are: mainly including a vacuum cavity 2, an upper heating unit 1, a substrate carrier unit 15, and a radio frequency power unit.

[0029] The upper end of the vacuum chamber is sealed to the upper heating unit, and the lower end of the vacuum chamber is sealed to the substrate support unit, forming a pretreatment chamber inside. Multiple interfaces are provided on the side wall of the vacuum chamber, connecting to a vacuum pump, a vacuum gauge, a process gas input interface 3, and a vacuum breaking component 4, respectively. The vacuum pump may include a mechanical pump and a molecular pump 8; the mechanical pump achieves low-vacuum evacuation, and the molecular pump achieves high-vacuum evacuation. The vacuum gauge may include a Pirani vacuum gauge 11 (used to detect the primary vacuum level of the chamber), a capacitive vacuum gauge 10 (used to monitor the vacuum level of the chamber during the etching process), and a full-scale vacuum gauge 12 (used to detect the ultimate vacuum level of the chamber). The process gas input interface is used to input argon gas for etching the substrate. The vacuum breaking component is used to introduce gas into the vacuum chamber after the substrate etching is completed, releasing the vacuum state within the chamber. A substrate input / output port 2.1 is also provided on the side wall of the vacuum chamber, and a valve is installed thereon. An observation window 13 is also provided on the side wall of the vacuum chamber, which allows for observation of the situation inside the vacuum chamber from the outside.

[0030] The upper heating unit includes a top cover 1.4, a lamp holder 1.12, a viewing window 1.13, a heating lamp tube 1.1, an upper heat insulation device, a positive power supply terminal 1.8, a negative power supply terminal 1.9, a positive wire 1.5, a negative wire 1.6, a thermocouple 1.2, a terminal protective cover 1.3, and a connecting flange 1.7, etc.

[0031] The top cover is supported on the upper end of the vacuum chamber, and the two are sealed by a sealing ring. The lamp holder is connected to the lower part of the top cover by multiple support columns A, and a viewing window is provided on the lamp holder. The viewing window is fixed below the lamp holder at a position corresponding to the viewing window. The upper heat insulation device consists of a heat insulation cover 1.10 with an opening at the lower end and upper and lower heat insulation plates 1.11 arranged inside the heat insulation cover. The heat insulation cover is fixedly connected to the multiple support columns A and is arranged above the lamp cover. The heating lamp is a halogen heating lamp, and multiple heating lamps are supported parallel to each other above the lamp holder by lamp holders and located below the lowest heat insulation plate inside the heat insulation cover. The multiple heating lamps form a circular radiant heating surface, which is aligned with the viewing window located below. The positive power terminal and the negative power terminal are fixed to the top of the heat insulation cover and are electrically connected to the positive and negative terminals of the heating lamps. A wire hole is provided in the center of the top cover. A connecting flange is fixed at the center of the top cover. The connecting flange has a positive lead hole, a negative lead hole, and a thermocouple passage hole. A terminal protective cover is fixed around the connecting flange on the top cover, with a main cable inlet at its upper end. The positive lead, negative lead, and thermocouple are sealed and pass through the positive lead hole, negative lead hole, and thermocouple lead hole, respectively. The upper ends of the positive lead, negative lead, and thermocouple are all introduced through the main cable inlet. The lower ends of the positive and negative leads are connected to the positive and negative power terminals, respectively. The lower end of the thermocouple extends to a position near the upper end of the viewing window for detecting the heating temperature.

[0032] The substrate support unit mainly includes an anode flange 15.2, a shield 15.1, a temperature-controlled anode plate 15.3, a ceramic circuit breaker 15.5, a high-temperature resistant insulating plug 15.4, an insulating sleeve 15.7, a temperature-controlled medium input pipe 15.9, and a temperature-controlled medium output pipe 15.8. The anode flange is located at the lower end of the vacuum chamber and is fixedly connected to the vacuum chamber by screws. The anode support unit is a cylindrical protective cover with a frustum at the upper end and a flange at the lower end; the lower flange is fixedly connected to the upper end of the anode flange by screws. The ceramic circuit breaker is built into the inner hole, and the lower end of the ceramic circuit breaker is fixedly connected to the upper end of the anode flange by screws. The lower end of the anode plate is fixedly connected to the upper end of the ceramic circuit breaker. The upper part of the anode plate extends from the upper frustum, forming a substrate tray or substrate support surface. Evenly distributed medium flow channels are formed within the upper part of the anode plate. A high-temperature resistant insulating plug is installed in the upper part of the inner hole of the ceramic circuit breaker, and an insulating sleeve is fixed in the lower part. The temperature-controlled medium input pipe and temperature-controlled medium output pipe pass through the pipe holes of the high-temperature resistant insulating plug and the inner hole of the insulating sleeve. The upper ends of the two pipes are fixed to the anode plate and communicate with the built-in medium flow channel. The lower ends of the two pipes extend to the bottom of the anode flange. The lower end of the temperature-controlled medium input pipe forms the medium inlet, and the lower end of the temperature-controlled medium output pipe forms the medium return port. The medium inlet and medium return port are connected to an external medium supply device to realize the input and output of the medium. Depending on the specific substrate processing requirements, the temperature-controlled medium can be used for cooling or heating.

[0033] The radio frequency power unit includes a radio frequency protection box 17 and a radio frequency matching unit 18. The radio frequency protection box is fixed to the bottom of the anode flange by the outer shell flange 15.6, so that the temperature control medium input pipe and the temperature control medium output pipe are located inside the radio frequency protection box. The radio frequency matching unit is installed outside the radio frequency protection box, and the output line of the radio frequency matching unit is electrically connected to the temperature control medium input pipe and the temperature control medium output pipe through the power transmission clamp 16.

[0034] In addition to the above structure, a lifting mechanism is also provided to raise the upper heating unit. The lifting mechanism includes a lifting rod 6, guide seats 7, a top cover connecting frame 9, and a lifting rod drive structure. Two guide seats are fixed to the outer wall of the vacuum chamber. Linear bearings are installed in the vertically aligned guide holes on the two guide seats. The lifting rod passes through the vertically aligned linear bearings, and the upper end of the lifting rod is fixedly connected to the top cover connecting frame, which is fixed to the top cover. The lifting rod drive structure can be a drive cylinder, such as an electric cylinder, or a combination structure of gear transmission and lead screw nut driven by a handwheel.

[0035] In addition to the above structure, a pneumatic grille 5 is also provided in the vacuum chamber between the lower part of the upper heating unit and the upper part of the temperature-controlled anode plate. The pneumatic grille includes a grille base plate 5.7, grille plates 5.6, a swing cylinder 5.1, and a rigid connector 5.2. The grille base plate is fixed to the lower part of the upper heating unit by multiple support columns B, and a square opening is provided in the middle of the grille base plate. A fixing seat 5.5 is fixed on both sides of the square opening at the upper end of the grille base plate, and a sliding seat 5.4 is slidably provided above the fixing seats on both sides. Multiple grille plates are arranged in parallel in sequence in the square opening. The lower ends of each grille plate are rotatably connected to the fixing seats on both sides through a lower rotating shaft, and the upper ends of each grille plate are rotatably connected to the sliding seats on both sides through an upper rotating shaft. A rigid connector is provided on the outer side of the sliding seat on one side. One end of the rigid connector is fixedly connected to one end of the fork pin 5.3, and the other end of the fork pin is rotatably connected to the outer side of the corresponding sliding seat. The two ends of the fork pin are parallel (not coaxial). The other end of the rigid connector is connected to the output end of a swing cylinder. A rigid connector lead-out interface is provided on the side wall of the vacuum chamber. The rigid connector forms a rotatable sealed fit with the rigid connector lead-out interface through a mechanical seal and bearing. The swing cylinder is fixed on an electric cylinder bracket outside the vacuum chamber. This pneumatic grille drives the rigid connector to rotate through the swing cylinder. The rigid connector drives the sliding seat to slide on the fixed seat, realizing the rotation of the grille pieces around the lower pivot center. When all the grille pieces rotate to the horizontal position, the directional opening on the grille substrate is closed, which can avoid the adverse effects caused by the impact of metal particles generated during the etching process on the upper heating unit. When all the grille pieces rotate to the vertical position, the substrate placed on the temperature-controlled anode plate can be heated by the upper heating unit to remove moisture from the substrate.

[0036] The working principle of this substrate pretreatment device is as follows:

[0037] The substrate is fed into the vacuum chamber through the substrate input / output port on the vacuum chamber body. The substrate can be fed directly or through the substrate tray 14 and placed on the upper part of the temperature-controlled anode plate. Then, the substrate input / output port is closed by the valve. After the substrate input / output port is closed, the mechanical pump is turned on to evacuate the vacuum. When the vacuum degree in the vacuum chamber reaches the set low vacuum value, the high vacuum pump is turned on to continue evacuating the vacuum. When the vacuum degree in the vacuum chamber reaches the set high vacuum value, the upper heating unit is turned on to degas the substrate. After degassing is completed within the set time, the upper heating device is turned off. Then, argon gas is introduced into the vacuum chamber through the process gas input interface. When the pressure in the vacuum chamber reaches the set stable state, the radio frequency adapter is turned on to generate a potential difference in the vacuum chamber. Under the action of the potential difference, argon ions are generated. The argon ions bombard the surface of the substrate to achieve the etching effect. During the etching process, depending on the specific process requirements, a cooling or heating medium (such as water) can be introduced through a temperature-controlled medium inlet pipe to regulate the temperature of the substrate, and the heat-exchanged medium can be output through a temperature-controlled medium outlet pipe. Alternatively, the substrate can be heated using an upper heating device. During this heating process, the pneumatic grid needs to be activated and the argon gas input needs to be paused.

[0038] Although embodiments and drawings of the present invention have been disclosed for illustrative purposes, those skilled in the art will understand that various substitutions, variations and modifications are possible without departing from the spirit and scope of the present invention and the appended claims. Therefore, the scope of the present invention is not limited to the contents disclosed in the embodiments and drawings.

Claims

1. A substrate pre-treatment apparatus, characterized by: Includes a vacuum chamber, an upper heating unit, a substrate carrier unit, and an RF power unit; The upper end of the vacuum chamber is sealed to the upper heating unit, and the lower end of the vacuum chamber is sealed to the substrate support unit, forming a pretreatment chamber inside. The lower end of the upper heating unit located in the pretreatment chamber is equipped with heating lamps. Multiple interfaces are provided on the side wall of the vacuum chamber, and vacuum pumps, vacuum measuring instruments, process gas input interfaces, and vacuum breaking components are respectively connected to the multiple interfaces. The substrate carrier unit includes an anode flange, a shielding cover, a temperature-controlled anode plate, a ceramic circuit breaker, a high-temperature resistant insulating plug, an insulating sleeve, a temperature-controlled medium input pipe, and a temperature-controlled medium output pipe. The anode flange is located at the lower end of the vacuum chamber and is fixedly connected to the vacuum chamber. The shielding cover is a cylindrical shielding cover with a frustum at the upper end and a flange at the lower end, and the lower flange of the shielding cover is fixedly connected to the upper end of the anode flange. The ceramic circuit breaker is built into the inner hole of the shielding cover, and the lower end of the ceramic circuit breaker is fixedly connected to the upper end of the anode flange. The lower end of the temperature-controlled anode plate is fixedly connected to the upper end of the ceramic circuit breaker, and the upper part of the temperature-controlled anode plate extends from the upper frustum of the shielding cover. The end extends out, and its upper end forms a substrate tray or substrate support surface. A medium flow channel is evenly distributed in the upper part of the temperature-controlled anode plate. A high-temperature resistant insulating plug is installed in the upper part of the inner hole of the ceramic circuit breaker, and an insulating sleeve is fixed in the lower part. The temperature-controlled medium input pipe and temperature-controlled medium output pipe pass through the pipe hole of the high-temperature resistant insulating plug and the inner hole of the insulating sleeve. The upper ends of the two pipes are fixed to the temperature-controlled anode plate and communicate with the built-in medium flow channel. The lower ends of the two pipes extend to the bottom of the anode flange. The lower end of the temperature-controlled medium input pipe forms a medium inlet, and the lower end of the temperature-controlled medium output pipe forms a medium return port. The medium inlet and the medium return port are connected to the external medium supply device. The radio frequency power unit includes a radio frequency protection box and a radio frequency matching unit. The radio frequency protection box is fixed to the bottom of the anode flange by the outer shell flange, so that the temperature control medium input tube and the temperature control medium output tube are located inside the radio frequency protection box. The radio frequency matching unit is installed outside the radio frequency protection box, and the output line of the radio frequency matching unit is electrically connected to the temperature control medium input tube and the temperature control medium output tube through a power transmission clamp.

2. The substrate pretreatment apparatus according to claim 1, characterized in that: The upper heating unit also includes a top cover, lamp holder, viewing window, heating lamp tube, upper heat insulation device, positive power supply terminal, negative power supply terminal, positive wire, negative wire, thermocouple, terminal protective cover, and connecting flange. The top cover is supported on the upper end of the vacuum chamber, and the two are sealed by a sealing ring; the lamp holder is connected to the lower part of the top cover by multiple support columns A, and a viewing window is provided on the lamp holder; the viewing window is fixed below the lamp holder at a position corresponding to the viewing window; the upper heat insulation device consists of a heat insulation cover with an opening at the lower end and upper and lower multi-layer heat insulation plates set inside the heat insulation cover; the heat insulation cover is fixedly connected to the multiple support columns A and is set above the lamp cover; multiple heating lamps are supported parallel above the lamp holder by lamp tube brackets and are located below the lowest heat insulation plate inside the heat insulation cover, and the multiple heating lamps form a circular radiant heating surface, which is aligned with the viewing window located below; the positive power terminal and the negative power terminal are fixed to the heat insulation. The top of the cover is electrically connected to the positive and negative terminals of the heating lamp tube; a wire hole is provided in the center of the top cover; a connecting flange is fixed at the center of the top cover, and a positive lead hole, a negative lead hole, and a thermocouple through hole are provided on the connecting flange; a terminal protective cover is fixed on the top of the top cover around the connecting flange, and a cable general entry hole is provided at the upper end of the terminal protective cover; the positive terminal wire, the negative terminal wire, and the thermocouple respectively pass through the positive lead hole, the negative lead hole, and the thermocouple lead hole in a sealed manner, and the upper ends of the positive terminal wire, the negative terminal wire, and the thermocouple are all introduced through the cable general entry hole, and the lower ends of the positive terminal wire and the negative terminal wire are connected to the positive power terminal and the negative power terminal respectively; the lower end of the thermocouple extends to a position near the upper end of the viewing window.

3. The substrate preprocessing apparatus according to claim 1, characterized in that: The substrate pretreatment device also includes a lifting mechanism for raising the upper heating unit; the lifting mechanism includes a lifting rod, guide seats, a top cover connecting frame, and a lifting rod drive structure; two guide seats are fixed to the outer wall of the vacuum chamber, and linear bearings are installed in the upper and lower aligned guide holes on the two guide seats; the lifting rod is inserted into the upper and lower aligned linear bearings, and the upper end of the lifting rod is fixedly connected to the top cover connecting frame, which is fixed to the top cover; the lifting rod drive structure adopts a combination structure of gear transmission and lead screw nut driven by a handwheel.

4. The substrate pretreatment apparatus according to claim 1, characterized in that: The substrate pretreatment device also includes a pneumatic grid, which is disposed within the vacuum chamber between the upper heating unit and the temperature-controlled anode plate. The pneumatic grid includes a grid base plate, grid plates, a swing cylinder, and rigid connectors. The grid base plate is fixed to the lower part of the upper heating unit by multiple support columns B, and a square opening is provided in the center of the grid base plate. A fixing seat is fixed on each side of the square opening at the upper end of the grid base plate, and a sliding seat is slidably disposed above each of the two fixing seats. Multiple grid plates are arranged parallel to each other within the square opening, and the lower ends of each grid plate are rotatable relative to the two fixing seats via a lower rotating shaft. The connection is as follows: the upper ends of each grid plate are rotatably connected to the sliding seats on both sides via an upper rotating shaft; a rigid connector is provided on the outer side of one side of the sliding seat, one end of the rigid connector is fixedly connected to one end of a forked pin, and the other end of the forked pin is rotatably connected to the outer side of the corresponding sliding seat, with the two ends of the forked pin being parallel; the other end of the rigid connector is connected to the output end of a swing cylinder; a rigid connector lead-out interface is provided on the side wall of the vacuum chamber, and the rigid connector forms a rotatable sealed fit with the rigid connector lead-out interface through a mechanical seal and bearing; the swing cylinder is fixed on a cylinder bracket outside the vacuum chamber.

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