Gas inlet assembly of vacuum chamber and vapor deposition equipment

Abstract

The utility model discloses a gas inlet assembly of a vacuum chamber and vapor deposition equipment, and relates to the technical field of semiconductor manufacturing. The air inlet assembly of the vacuum chamber comprises an air inlet ring and an air uniformizing ring, and the air inlet ring is provided with an air inlet flow channel extending in the radial direction. The gas uniformizing ring is coaxially arranged on the inner circle of the gas inlet ring, the gas uniformizing ring is provided with a gas inlet hole communicated with the gas inlet flow channel, gas outlet holes evenly distributed in the circumferential direction and an annular flow channel connecting the gas inlet hole and the gas outlet holes, and the annular flow channel is configured to evenly distribute gas to the gas outlet holes from the gas inlet hole. According to the air inlet assembly, the uniformity of a deposited film is ensured; and the flow channels are respectively designed on the air inlet ring and the air homogenizing ring, so that the processing difficulty is reduced. The air inlet flow channel extending in the radial direction is a straight flow channel and is short. The annular runner used for communicating the air inlet and the air outlet has few corners, so that the runner stroke is simplified, the air flow resistance is reduced, and the air flow rate is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an air intake component for a vacuum chamber and a vapor deposition apparatus. Background Technology

[0002] In semiconductor manufacturing processes, wafer deposition is achieved through vapor phase deposition. When using plasma sputtering technology to deposit thin films on semiconductor wafers, process gases are introduced into a vacuum chamber and excited to form plasma. The plasma then bombards a target material, causing the sputtered target material to deposit on the wafer surface, thereby forming the thin film required for the process.

[0003] The uniformity of gas distribution in the vacuum chamber directly affects the uniformity of the deposited film. Existing technologies achieve uniform gas intake by incorporating an intake assembly with airflow channels. However, the airflow channel design is complex, making it difficult to manufacture; furthermore, excessive length and numerous bends in the airflow channel affect the gas flow rate, especially when the gas flow rate decreases, which can severely impact the deposition rate. Utility Model Content

[0004] The purpose of this invention is to provide an air intake component for a vacuum chamber and a vapor deposition device, which not only ensures the uniformity of the deposited film, but also has a simple structure for the airflow channel, is easy to process, ensures the gas flow rate, and thus ensures the deposition rate of the vapor deposition device.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] The air intake assembly of the vacuum chamber includes:

[0007] The intake ring has radially extending intake air passages;

[0008] A gas equalization ring is coaxially disposed within the inner ring of the air intake ring. The gas equalization ring is provided with an air intake hole communicating with the air intake channel, an air outlet hole evenly distributed along the circumference, and an annular flow channel connecting the air intake hole and the air outlet hole. The annular flow channel is configured to evenly distribute gas from the air intake hole to each of the air outlet holes.

[0009] As an alternative to the air intake assembly of the vacuum chamber, the middle part of the annular flow channel is connected to the air inlet, and each air inlet is connected to at least two air outlets through the annular flow channel.

[0010] As an optional embodiment of the air intake assembly of the vacuum chamber, each end of the annular flow channel is connected to an air outlet.

[0011] As an optional embodiment of the air intake assembly of the vacuum chamber, each end of the annular flow channel is connected to a sub-annular flow channel, the middle of the sub-annular flow channel is connected to the annular flow channel, and each end of the sub-annular flow channel is connected to an air outlet.

[0012] As an optional configuration for the air intake assembly of the vacuum chamber, the number of air intake channels is two, symmetrically distributed at 180° intervals.

[0013] As an optional configuration for the air intake assembly of the vacuum chamber, the number of air intake channels is four and they are evenly distributed at 90° intervals.

[0014] As an optional embodiment of the air intake assembly of the vacuum chamber, the inner ring of the air intake ring is provided with a receiving groove, the air distribution ring is provided in the receiving groove, the air intake hole is provided on the bottom surface of the air distribution ring, and the air intake ring is also provided with a connecting channel extending along the axial direction, one end of the connecting channel is connected to the air intake channel, and the other end is connected to the air intake hole.

[0015] As an optional embodiment of the air intake assembly of the vacuum chamber, the upper surface of the air intake ring is provided with a sealing groove surrounding the receiving groove, and the lower surface is provided with a sealing surface;

[0016] And / or, the intake assembly further includes a sealing ring, which is disposed above the air distribution ring and flush with the upper surface of the intake ring.

[0017] As an optional embodiment of the air intake assembly of the vacuum chamber, the air intake ring is provided with at least two sets of air intake channels, each set of air intake channels includes a different number of air intake channels, and each set of air intake channels is adapted to the gas equalizing ring with the same number of air intake holes as the number of air intake channels.

[0018] A vapor deposition apparatus comprising an air intake assembly for a vacuum chamber as described in any of the above embodiments.

[0019] The beneficial effects of this utility model are:

[0020] The vacuum chamber inlet assembly provided by this utility model includes an inlet ring and a gas equalization ring. The gas equalization ring is coaxially disposed within the inner ring of the inlet ring. An inlet flow channel extending radially from the inlet ring introduces gas into the gas equalization ring through an inlet port and guides it to the outlet port through an annular flow channel. The outlet ports are uniformly distributed circumferentially within the vacuum chamber. The annular flow channel is configured to uniformly distribute gas from the inlet port to each outlet port, thereby achieving uniform gas entry into the vacuum chamber circumferentially. This not only ensures the uniformity of the deposited thin film but also reduces processing difficulty by designing flow channels on the inlet ring and the gas equalization ring respectively. The radially extending inlet flow channel is a straight-flow channel with a relatively short length; the annular flow channel connecting the inlet port and the outlet port has few bends, simplifying the flow path, reducing gas flow resistance, and thus increasing the gas flow velocity.

[0021] The vapor deposition equipment provided by this invention utilizes the aforementioned air intake component of the vacuum chamber, which not only ensures uniform air intake within the vacuum chamber but also reduces processing difficulty, increases gas flow rate, and guarantees vapor deposition rate. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the air intake assembly of the vacuum chamber provided in a specific embodiment of this utility model;

[0023] Figure 2 This is a front structural schematic diagram of the intake ring provided in a specific embodiment of this utility model;

[0024] Figure 3 This is a top view of the intake ring provided in a specific embodiment of this utility model;

[0025] Figure 4 yes Figure 3 Sectional view along line AA;

[0026] Figure 5 yes Figure 3 Sectional view along the BB direction;

[0027] Figure 6 This is a side view of the intake ring provided in a specific embodiment of the present utility model;

[0028] Figure 7 yes Figure 6 C-axis sectional view;

[0029] Figure 8 This is a schematic diagram of the bottom structure of the intake ring provided in a specific embodiment of the present utility model;

[0030] Figure 9 This is a front structural diagram of the first type of gas equalization ring and sealing ring cooperation provided in a specific embodiment of this utility model;

[0031] Figure 10This is a schematic diagram of the bottom structure of the first type of gas equalization ring and sealing ring provided in a specific embodiment of this utility model;

[0032] Figure 11 This is a side view of the first type of gas equalization ring and sealing ring cooperation provided in a specific embodiment of this utility model;

[0033] Figure 12 yes Figure 11 Sectional view along the DD direction;

[0034] Figure 13 This is a front view of the second type of gas equalization ring and sealing ring cooperation provided in a specific embodiment of this utility model;

[0035] Figure 14 This is a schematic diagram of the bottom structure of the second type of gas equalization ring and sealing ring provided in a specific embodiment of the present invention;

[0036] Figure 15 This is a side view of the second type of gas equalization ring and sealing ring cooperation provided in a specific embodiment of this utility model;

[0037] Figure 16 yes Figure 15 Sectional view along the EE direction.

[0038] In the picture:

[0039] 1. Intake ring; 11. Intake air passage; 111. First intake air passage; 112. Second intake air passage; 12. Connecting passage; 121. First connecting passage; 122. Second connecting passage; 13. Receiving groove; 131. Threaded hole; 14. Sealing groove; 15. Sealing surface;

[0040] 2. Uniform air ring; 21. Air inlet; 22. Air outlet; 23. Annular flow channel; 231. Sub-annular flow channel; 24. Connecting hole; 25. Radial connecting flow channel;

[0041] 3. Sealing ring; 31. Countersunk hole;

[0042] 4. Air outlet pipe;

[0043] 51. First air intake connector; 52. Second air intake connector. Detailed Implementation

[0044] To make the technical problem solved by this utility model, the technical solution adopted, and the technical effect achieved clearer, the technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0045] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0046] This embodiment provides a vapor deposition apparatus, including an upper cavity, a lower cavity, and an inlet assembly for a vacuum chamber. The inlet assembly is located between the upper and lower cavities, and the upper cavity, inlet assembly, and lower cavity together enclose the inner cavity of the vacuum chamber. Gas is introduced into the inner cavity of the vacuum chamber through the inlet assembly and excited to form plasma. The plasma then bombards a target material, causing the sputtered target material to be deposited on the wafer surface, thereby forming a wafer thin film.

[0047] The gas introduced into the vacuum chamber can be a single gas or a mixture of two or more gases. The uniformity of the gas distribution in the chamber directly affects the uniformity of the deposited thin film; moreover, the structure and length of the gas flow channels in the gas inlet assembly affect the deposition rate.

[0048] To achieve both uniformity of the deposited film and no impact on the deposition rate, such as Figure 1 Combination Figure 7 and Figure 12 As shown, this embodiment provides an air intake assembly for a vacuum chamber, applied to the aforementioned vapor deposition apparatus. The air intake assembly includes an intake ring 1 and a gas distribution ring 2, with the gas distribution ring 2 coaxially disposed within the inner ring of the intake ring 1. The intake ring 1 has a radially extending intake channel 11. The gas distribution ring 2 has an intake port 21 communicating with the intake channel 11, outlet ports 22 evenly distributed circumferentially, and an annular flow channel 23 connecting the intake port 21 and the outlet ports 22. The annular flow channel 23 is configured to evenly distribute gas from the intake port 21 to each outlet port 22. An outlet pipe 4 is connected to each outlet port 22, extending radially to the center of the inner cavity.

[0049] Gas enters the inner ring of the intake ring 1 through the intake channel 11, and then enters the gas equalization ring 2 through the intake hole 21. The annular flow channel 23 in the gas equalization ring 2 can evenly distribute the gas entering from the intake hole 21 to each outlet hole 22, thereby achieving uniform gas intake in the inner cavity of the vacuum chamber and ensuring the uniformity of the deposited film.

[0050] Gas enters the inner cavity from the outside of the vacuum chamber, passing through the inlet ring 1 and the gas distribution ring 2. By designing separate flow channels on the inlet ring 1 and the gas distribution ring 2, the processing difficulty of each component is reduced. The radially extending inlet flow channel 11 is a straight channel with a short length; the annular flow channel 23 connecting the inlet port 21 and the outlet port 22 has few bends, simplifying the flow path, reducing gas flow resistance, and thus increasing the gas flow velocity.

[0051] In one embodiment, such as Figures 1-10 As shown, the inner ring of the intake ring 1 has a receiving groove 13, the air distribution ring 2 is located in the receiving groove 13, and the air inlet 21 is located on the bottom surface of the air distribution ring 2. The intake ring 1 also has an axially extending connecting channel 12, one end of which is connected to the intake air channel 11, and the other end is connected to the air inlet 21. The annular limit of the receiving groove 13 is precisely matched with the outer diameter of the air distribution ring 2 to ensure that the outlet center of the axially extending connecting channel 12 coincides with the central axis of the air inlet 21. Through the orthogonal design of the axially extending connecting channel 12 and the radially extending intake air channel 11, a straight air path without bends is constructed, reducing airflow resistance.

[0052] Specifically, the bottom of the receiving groove 13 is evenly distributed with multiple threaded holes 131, and the air equalization ring 2 is provided with connecting holes 24 corresponding to the multiple threaded holes 131 in the circumferential direction. The screw passes through the connecting hole 24 and is screwed into the threaded hole 131, thereby fixing the air equalization ring 2 to the receiving groove 13.

[0053] In one embodiment, the upper surface of the intake ring 1 is provided with a sealing groove 14 surrounding the receiving groove 13, and the lower surface is provided with a sealing surface 15. The function of the intake ring 1 is to allow air in and fix the uniform gas ring 2. To ensure the airtightness of the vacuum chamber, the upper and lower surfaces of the intake ring 1 are tightly fitted with the upper cavity and the lower cavity, respectively. When the upper surface of the intake ring 1 is fitted with the upper cavity, an O-ring is provided in the sealing groove 14 to ensure the airtightness between the upper cavity and the upper surface of the intake ring 1. The sealing surface 15 is a ring surface provided on the lower surface of the intake ring 1, and a sealing gasket or sealing layer is provided on this ring surface to ensure the airtightness between the lower cavity and the lower surface of the intake ring 1.

[0054] Furthermore, the intake assembly also includes a sealing ring 3, which is positioned above the air distribution ring 2 and flush with the upper surface of the intake ring 1. By providing the sealing ring 3, the sealing performance between the upper surface of the intake ring 1 and the upper cavity is further enhanced.

[0055] Specifically, the sealing ring 3 and the air distribution ring 2 have the same inner and outer diameters. When assembling the intake assembly, the air distribution ring 2 and the sealing ring 3 are installed together on the intake ring 1. The sealing ring 3 has countersunk holes 31 spaced around its circumference. The screw passes through the countersunk holes 31 and the connecting hole 24 and is screwed into the threaded hole 131, thereby fixing the sealing ring 3 and the air distribution ring 2 together in the receiving groove 13.

[0056] In one embodiment, such as Figures 9-16 As shown, the middle part of the annular flow channel 23 is connected to the air inlet 21, and each air inlet 21 is connected to at least two air outlets 22 through the annular flow channel 23. The gas entering the gas equalization ring 2 through one air inlet 21 is split in the middle of the annular flow channel 23 and enters at least two air outlets 22 respectively, ensuring that the gas output of at least two air outlets 22 is basically the same, thereby ensuring uniform air intake.

[0057] Specifically, each end of the annular flow channel 23 is connected to an outlet 22. That is, after the gas enters from the middle of the annular flow channel 23, it splits into two paths. One path flows into an outlet 22 connected to one end of the annular flow channel 23, and the other path flows into an outlet 22 connected to the other end of the annular flow channel 23. Since the distance between the inlet 21 and the two ends of the annular flow channel 23 is the same, the gas flow rate from the outlets 22 at both ends of the annular flow channel 23 is basically the same.

[0058] Alternatively, each end of the annular flow channel 23 is connected to a sub-annular flow channel 231, the middle of which is connected to the annular flow channel 23. Each end of the sub-annular flow channel 231 is connected to an outlet 22. When one inlet 21 corresponds to two or more outlets 22, by setting a sub-annular flow channel 231 at each end of the annular flow channel 23, the gas flowing to one end of the annular flow channel 23 is evenly distributed by the sub-annular flow channel 231, thereby achieving uniform gas output from the two or more outlets 22.

[0059] In one embodiment, continue to refer to Figure 7 An even number of air intake channels 11 are evenly distributed along the circumference of the air intake ring 1. By setting an even number of air intake channels 11, not only is multi-path air intake achieved, but the symmetrical layout of the air intake channels 11 further ensures the uniformity and stability of the gas entering the vacuum chamber.

[0060] In this embodiment, each air intake channel 11 corresponds to one air intake hole 21, and one air intake hole 21 can correspond to two or four equal even numbers of air outlet holes 22. This achieves multi-path air intake and reduces the mutual interference of multiple gases in the flow channel, which can cause local low gas pressure and thus reduce the deposition rate.

[0061] Furthermore, such as Figure 12 As shown, the air inlet 21 and the annular flow channel 23 are radially offset, and the air inlet 21 and the annular flow channel 23 are connected by a radially connecting flow channel 25.

[0062] In one embodiment, such as Figure 16 As shown, there are two air intake channels 11, symmetrically distributed at 180° intervals. The two air intake channels 11 enable dual air intake, which is suitable for scenarios with large single-gas flow requirements.

[0063] In one embodiment, such as Figure 12 As shown, there are four air intake channels 11, evenly distributed at 90° intervals. The four air intake channels 11 enable four-way air intake, disperse the gas, and reduce the problem of excessively high local flow velocity or uneven flow rate, which is especially suitable for scenarios that require uniform mixing of two or four gases.

[0064] Of course, in other embodiments, a greater number of intake channels 11 can be provided depending on the flow rate and type of the intake gas. For example, the number of intake channels 11 and their distribution on the intake ring 1 can be adjusted according to actual production needs to meet different production requirements.

[0065] In one embodiment, the intake ring 1 is provided with at least two sets of intake channel groups, each set of intake channel groups including a different number of intake channels 11, and each set of intake channel groups is adapted to an air distribution ring 2 with the same number of intake holes 21 and intake channels 11. This arrangement allows the intake ring 1 to be applicable to different application scenarios. When used in different application scenarios, only the air distribution ring 2 needs to be replaced, thus improving the versatility of the intake ring 1.

[0066] In this embodiment, refer to Figure 2 and Figure 7 The intake ring 1 has two sets of intake channel groups. One set of intake channel groups has four first intake channels 111 and four first connecting channels 121, while the other set of intake channel groups has two second intake channels 112 and two second connecting channels 122. The outer periphery of the intake ring 1 is square, and the four corners of the square periphery are cut into planes. Each plane has a first intake channel 111, and a first connecting channel 121 is set at the bottom of the receiving groove 13 corresponding to the first intake channel 111. A second intake channel 112 is set on each opposite side of the square periphery, and a second connecting channel 122 is set at the bottom of the receiving groove 13 corresponding to the second intake channel 112. The inlet of the first intake channel 111 is connected to a first intake connector 51, and the first intake channel 111 is connected to a first intake pipe through the first intake connector 51. The inlet of the second intake channel 112 is connected to a second intake connector 52, and the second intake channel 112 is connected to a second intake pipe through the second intake connector 52.

[0067] There are two types of uniform air ring 2, such as... Figures 9-12 As shown, the first type of air distribution ring 2 is provided with four air inlets 21, eight air outlets 22, and four annular flow channels 23. One air inlet 21 is connected to two air outlets 22 through one annular flow channel 23. Figures 13-16 As shown, the second type of air distribution ring 2 is provided with two air inlets 21, eight air outlets 22, two annular channels 23 and four sub-annular channels 231. One air inlet 21 is connected to two sub-annular channels 231 through one annular channel 23, and each sub-annular channel 231 is connected to two air outlets 22.

[0068] The vacuum chamber air intake assembly provided in this embodiment reduces the processing difficulty by setting an air intake ring 1 and a gas equalization ring 2. The air intake ring 1 has a separately machined air intake channel 11, and the gas equalization ring 2 has a separately machined annular flow channel 23. Furthermore, the structural design of the air intake channel 11 and the annular flow channel 23 reduces the gas flow resistance and increases the gas flow rate, thereby ensuring the deposition rate of the vapor deposition equipment. At the same time, it achieves uniform air intake and ensures the uniformity of the deposited film.

[0069] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. An air intake assembly for a vacuum chamber, characterized in that, include: The intake ring (1) is provided with a radially extending intake air passage (11); A gas equalization ring (2) is coaxially disposed in the inner ring of the air intake ring (1). The gas equalization ring (2) is provided with an air intake hole (21) communicating with the air intake channel (11), an air outlet hole (22) evenly distributed along the circumference, and an annular flow channel (23) connecting the air intake hole (21) and the air outlet hole (22). The annular flow channel (23) is configured to evenly distribute gas from the air intake hole (21) to each of the air outlet holes (22).

2. The air intake assembly for the vacuum chamber according to claim 1, characterized in that, The middle part of the annular flow channel (23) is connected to the air inlet (21), and each air inlet (21) is connected to at least two air outlets (22) through the annular flow channel (23).

3. The air intake assembly for the vacuum chamber according to claim 2, characterized in that, Each end of the annular flow channel (23) is connected to an air outlet (22).

4. The air intake assembly for the vacuum chamber according to claim 2, characterized in that, The annular flow channel (23) is connected to a sub-annular flow channel (231) at each end. The middle part of the sub-annular flow channel (231) is connected to the annular flow channel (23). The air outlet (22) is connected to each end of the sub-annular flow channel (231).

5. The air intake assembly for the vacuum chamber according to claim 1, characterized in that, The number of air intake channels (11) is two, and they are symmetrically distributed with a 180° interval.

6. The air intake assembly for the vacuum chamber according to claim 1, characterized in that, The number of air intake channels (11) is four, and they are evenly distributed at 90° intervals.

7. The air intake assembly for the vacuum chamber according to any one of claims 1-6, characterized in that, The inner ring of the air intake ring (1) is provided with a receiving groove (13), the air distribution ring (2) is provided in the receiving groove (13), the air intake hole (21) is provided on the bottom surface of the air distribution ring (2), and the air intake ring (1) is also provided with a connecting channel (12) extending along the axial direction. One end of the connecting channel (12) is connected to the air intake channel (11), and the other end is connected to the air intake hole (21).

8. The air intake assembly for the vacuum chamber according to claim 7, characterized in that, The upper surface of the intake ring (1) is provided with a sealing groove (14) surrounding the receiving groove (13), and the lower surface is provided with a sealing surface (15). And / or, the air intake assembly further includes a sealing ring (3), which is disposed above the air distribution ring (2) and flush with the upper surface of the air intake ring (1).

9. The air intake assembly for the vacuum chamber according to any one of claims 1-6, characterized in that, The air intake ring (1) is provided with at least two sets of air intake channels. Each set of air intake channels includes a different number of air intake channels (11). The number of air intake holes (21) in each set of air intake channels is the same as the number of air intake channels (11) in the uniform air ring (2).

10. A vapor deposition apparatus, characterized in that, Includes the air intake assembly of the vacuum chamber as described in any one of claims 1-9.

Images