Electroplating shielding plate adjusting device

Abstract

The utility model discloses an electroplating shielding plate adjusting device, which belongs to the technical field of shielding plate adjustment and comprises a shielding plate body, a plurality of hole sites are arranged on the shielding plate body, and electroplating areas are formed by the hole sites. The first adjusting part comprises two first adjusting plates which move on the same straight line, and the first adjusting plates are located in the shielding plate body; and the second adjusting part comprises two second adjusting plates which move on the same straight line, and the second adjusting plates are located in the shielding plate body. According to the electroplating shielding plate adjusting device, the area of an electroplating area of the shielding plate is adjusted, the shielding plate does not need to be disassembled and assembled, the situation that the shielding plate is damaged can be effectively avoided, the area of the electroplating area of the shielding plate does not need to be adjusted through an adhesive tape, the adjusting accuracy of the area of the electroplating area can be effectively improved, and the production efficiency is improved. Therefore, the electroplating precision of the subsequent wafer is ensured.

Description

Technical Field

[0001] This utility model belongs to the field of shielding plate adjustment technology, and in particular relates to an electroplating shielding plate adjustment device. Background Technology

[0002] In the field of vertical wafer plating, a shielding plate is needed to shield the wafer to solve the problem of uniformity of wafer plating thickness. When using a shielding plate to shield the wafer, the area of ​​the plating area of ​​the shielding plate needs to be adjusted. By changing the area, the current distribution on the wafer surface is changed, thereby controlling the uniformity of wafer plating thickness.

[0003] Currently, the adjustment of the electroplating area of ​​the shielding plate is usually done by applying adhesive tape. This method has the following problems: 1. The shielding plate is frequently disassembled and reassembled, which can easily damage the shielding plate; 2. During the wafer electroplating process, the tape is easy to fall off the shielding plate, resulting in inaccurate electroplating area and affecting the wafer electroplating operation; 3. The tape is not applied precisely enough, which affects the wafer electroplating. Utility Model Content

[0004] This invention overcomes the shortcomings of the prior art by providing an electroplating shielding plate adjustment device to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: an electroplating shielding plate adjustment device, comprising...

[0006] The shielding plate body has a plurality of holes, which form an electroplating area;

[0007] The first adjustment part includes two first adjustment plates that move in the same straight line. The first adjustment plates are located inside the shielding plate body and move along a first direction of the shielding plate body to change the area of ​​the electroplating area.

[0008] The second adjustment part includes two second adjustment plates that move in the same straight line. The second adjustment plates are located inside the shielding plate body and move along the second direction of the shielding plate body to change the area of ​​the electroplating area.

[0009] In a preferred embodiment of the present invention, the shielding plate body includes a front cover and a rear cover, a cavity is formed between the front cover and the rear cover, and the front cover and the rear cover are connected by a connecting post.

[0010] In a preferred embodiment of the present invention, both the first adjustment part and the second adjustment part are located within the cavity, with the first adjustment part located on the front cover and the second adjustment part located on the rear cover.

[0011] In a preferred embodiment of this utility model, the front cover and the rear cover are both provided with the holes.

[0012] In a preferred embodiment of the present invention, the front cover is provided with a first slot and a first sliding groove, the end of the first adjusting plate is located in the first slot and moves along the length direction of the first sliding groove, and the rear cover is provided with a second slot and a second sliding groove, the end of the second adjusting plate is located in the second slot and moves along the length direction of the second sliding groove.

[0013] In a preferred embodiment of the present invention, both the first adjusting plate and the second adjusting plate are provided with protrusions, which are located in the first sliding groove or the second sliding groove to guide the first adjusting plate or the second adjusting plate.

[0014] In a preferred embodiment of the present invention, both the first adjustment plate and the second adjustment plate are provided with locking members to lock the first adjustment plate to the front cover or the second adjustment plate to the rear cover.

[0015] This utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0016] The electroplating shielding plate adjustment device of this utility model realizes the adjustment of the electroplating area of ​​the shielding plate without disassembling the shielding plate, which can effectively avoid damage to the shielding plate. It also eliminates the need to use tape to adjust the electroplating area of ​​the shielding plate, thus effectively improving the adjustment accuracy of the electroplating area and ensuring the electroplating precision of the subsequent wafers. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0018] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram showing the fit between the front cover and the first adjustment plate in a preferred embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram showing the fit between the rear cover and the second adjustment plate in a preferred embodiment of the present invention;

[0021] In the figure: 10, shielding plate body; 11, front cover; 111, first slot; 112, first slide groove; 12, rear cover; 121, second slot; 122, second slide groove; 101, hole; 20, first adjusting plate; 30, second adjusting plate; 40, connecting post; 50, protrusion; 60, locking component. Detailed Implementation

[0022] The following drawings will disclose several embodiments of this utility model. For clarity, many physical details will be described in the following description. However, it should be understood that these physical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these physical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0023] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0024] This embodiment provides an electroplating masking plate adjustment device, which realizes the adjustment of the electroplating area of ​​the masking plate without disassembling the masking plate, effectively avoiding damage to the masking plate. It also eliminates the need to use tape to adjust the electroplating area of ​​the masking plate, effectively improving the adjustment accuracy of the electroplating area and ensuring the electroplating precision of the subsequent wafer.

[0025] Combination Figures 1 to 3 As shown, the electroplating shielding plate adjustment device of this embodiment includes a shielding plate body 10, a first adjustment part and a second adjustment part. The shielding plate body 10 is provided with a plurality of holes 101, which form an electroplating area. The first adjustment part can adjust the area of ​​the electroplating area in a first direction, and the second adjustment part can adjust the area of ​​the electroplating area in a second direction.

[0026] In this embodiment, the shielding plate body 10 includes a front cover 11 and a rear cover 12, with a cavity formed between the front cover 11 and the rear cover 12. The front cover 11 and the rear cover 12 are connected by a connecting post 40. The first adjustment part and the second adjustment part are both located in the cavity. The first adjustment part is located on the front cover 11, and the second adjustment part is located on the rear cover 12. The front cover 11 and the rear cover 12 are both provided with holes 101. In this embodiment, the electroplating area formed on the front cover 11 is exactly the same as the electroplating area formed on the rear cover 12. Therefore, when the first adjustment part or the second adjustment part moves, the electroplating area can be fully adjusted.

[0027] Combination Figure 1 and Figure 2 As shown, the first adjustment part of this embodiment includes two first adjustment plates 20 that move in the same straight line. The first adjustment plates 20 are located inside the shielding plate body 10 and move along the first direction of the shielding plate body 10 to change the area of ​​the electroplating area. In this embodiment, there are two first adjustment plates 20, which can move along the first direction under manual operation, thereby changing the area of ​​the electroplating area in the first direction. The first adjustment plate 20 is provided with a locking member 60. When the first adjustment plate 20 moves to a predetermined position, the first adjustment plate 20 is locked by the locking member 60, so that the first adjustment plate 20 is fixed on the front cover 11, ensuring that the area of ​​the electroplating area does not change, thereby ensuring the electroplating accuracy of the subsequent wafer.

[0028] In this embodiment, the locking component 60 is a screw, and the front cover 11 is provided with a first slot 111 and a first slide groove 112. The end of the first adjusting plate 20 is located in the first slot 111 and moves along the length direction of the first slide groove 112. The first adjusting plate 20 is provided with a protrusion 50, which is located in the first slide groove 112. Under the cooperation of the protrusion 50 and the first slide groove 112, the first adjusting plate 20 is guided to move.

[0029] Combination Figure 1 and Figure 3As shown, the second adjustment part of this embodiment includes two second adjustment plates 30 that move in the same straight line. The second adjustment plates 30 are located inside the shielding plate body 10 and move along the second direction of the shielding plate body 10 to change the area of ​​the electroplating area. The rear cover 12 is provided with a second slot 121 and a second slide groove 122. The end of the second adjustment plate 30 is located in the second slot 121 and moves along the length direction of the second slide groove 122. In this embodiment, there are two second adjustment plates 30. Under manual operation, they can move along the second direction respectively, thereby changing the area of ​​the electroplating area in the second direction. The second adjustment plate 30 is provided with a locking member 60. When the second adjustment plate 30 moves to a predetermined position, the second adjustment plate 30 is locked by the locking member 60, so that the second adjustment plate 30 is fixed on the rear cover 12, ensuring that the area of ​​the electroplating area does not change, thereby ensuring the electroplating accuracy of the subsequent wafer.

[0030] In this embodiment, the locking component 60 is a screw, and the rear cover 12 is provided with a second slot 121 and a second slide groove 122. The end of the second adjusting plate 30 is located in the second slot 121 and moves along the length direction of the second slide groove 122. The second adjusting plate 30 is provided with a protrusion 50, which is located in the second slide groove 122. Under the cooperation of the protrusion 50 and the second slide groove 122, the second adjusting plate 30 is guided to move.

[0031] In practical use, when it is necessary to adjust the area of ​​the electroplating area, the front cover 11 and the rear cover 12 are separated. By changing the position of the first adjustment plate 20 on the front cover 11 or the position of the second adjustment plate 30 on the rear cover 12, the area of ​​the electroplating area is changed to meet the electroplating requirements of the wafer. After the first adjustment plate 20 and the second adjustment plate 30 are adjusted, the first adjustment plate 20 and the second adjustment plate 30 are locked together using the locking member 60, and then the front cover 11 and the rear cover 12 are closed.

[0032] In summary, the electroplating shield adjustment device of this embodiment realizes the adjustment of the electroplating area of ​​the shield without disassembling the shield, which can effectively avoid damage to the shield. It also eliminates the need to use tape to adjust the electroplating area of ​​the shield, thus effectively improving the accuracy of the electroplating area adjustment and ensuring the electroplating precision of the subsequent wafer.

[0033] While the present invention has been described above with reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the present invention. That is, the methods, systems, or devices discussed above are merely examples. Various configurations can be appropriately omitted, substituted, or added to various processes or components. For example, in alternative configurations, methods can be performed in a different order than described, and / or various stages can be added, omitted, and / or combined. Moreover, features described with respect to certain configurations can be combined in various other configurations. Different aspects and elements of the configuration can be combined in a similar manner. Furthermore, as technology develops, many elements are merely examples and do not limit the scope of this disclosure or the claims.

[0034] Specific details are provided in the specification to offer a thorough understanding of exemplary configurations, including implementations. However, configurations can be practiced without these specific details; for example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail to avoid obscuring the configuration. This description provides only exemplary configurations and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes can be made to the function and arrangement of the elements without departing from the spirit or scope of this disclosure.

[0035] Furthermore, although each operation can be described as a sequential process, many operations can be executed in parallel or simultaneously. Additionally, the order of operations can be rearranged. A process may have additional steps. Moreover, examples of methods can be implemented using hardware, software, firmware, middleware, code, hardware description languages, or any combination thereof. When implemented in software, firmware, middleware, or code, the program code or code segments used to perform the necessary tasks can be stored in a non-transitory computer-readable medium such as a storage medium and executed by a processor.

[0036] In summary, the above detailed description is intended to be exemplary rather than limiting, and it should be understood that the claims (including all equivalents) are intended to define the spirit and scope of this invention. These embodiments should be understood as illustrative only and not as limiting the scope of protection of this invention. After reading the description of this invention, those skilled in the art can make various alterations or modifications to it, and these equivalent changes and modifications also fall within the scope defined by the claims of this invention.

Claims

1. An electroplating shielding plate adjustment device, characterized in that, include A shielding plate body (10) is provided with a plurality of holes (101), the holes (101) forming an electroplating area; The first adjustment part includes two first adjustment plates (20) that move in the same straight line. The first adjustment plates (20) are located inside the shielding plate body (10) and move in a first direction along the shielding plate body (10) to change the area of ​​the electroplating area. The second adjustment part includes two second adjustment plates (30) that move in the same straight line. The second adjustment plates (30) are located inside the shielding plate body (10) and move in a second direction along the shielding plate body (10) to change the area of ​​the electroplating area.

2. The electroplating shielding plate adjustment device according to claim 1, characterized in that, The shielding plate body (10) includes a front cover (11) and a rear cover (12), a cavity is formed between the front cover (11) and the rear cover (12), and the front cover (11) and the rear cover (12) are connected by a connecting post (40).

3. The electroplating shielding plate adjustment device according to claim 2, characterized in that, Both the first adjustment part and the second adjustment part are located inside the cavity. The first adjustment part is located on the front cover (11), and the second adjustment part is located on the rear cover (12).

4. The electroplating shielding plate adjustment device according to claim 2, characterized in that, The front cover (11) and the rear cover (12) are both provided with the hole (101).

5. The electroplating shielding plate adjustment device according to claim 2, characterized in that, The front cover (11) is provided with a first slot (111) and a first slide groove (112). The end of the first adjusting plate (20) is located in the first slot (111) and moves along the length direction of the first slide groove (112). The rear cover (12) is provided with a second slot (121) and a second slide groove (122). The end of the second adjusting plate (30) is located in the second slot (121) and moves along the length direction of the second slide groove (122).

6. The electroplating shielding plate adjustment device according to claim 5, characterized in that, Both the first adjustment plate (20) and the second adjustment plate (30) are provided with protrusions (50), which are located in the first slide groove (112) or the second slide groove (122) to guide the first adjustment plate (20) or the second adjustment plate (30).

7. The electroplating shielding plate adjustment device according to claim 5, characterized in that, Both the first adjustment plate (20) and the second adjustment plate (30) are provided with locking members (60) to lock the first adjustment plate (20) to the front cover (11) or to lock the second adjustment plate (30) to the rear cover (12).

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