Incubator test positioning support
By designing a positioning bracket for the temperature chamber test and adopting a detachable positioning bracket and hanging rod structure, the problem of the single positioning method in the temperature chamber is solved, realizing wall-mounted and ceiling-mounted positioning, improving testing efficiency and accuracy. Furthermore, the transparent carrier plate provides lighting, solving the problem of inconvenient operation inside the temperature chamber.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN NETIS TECH CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-04-28
AI Technical Summary
The existing temperature chambers use a single method for positioning electronic products, which cannot simulate actual installation methods. This leads to inconsistent verification of heat dissipation solutions and inconvenient operation, especially for wall-mounted or ceiling-mounted products, which are difficult to position accurately during high and low temperature tests.
A temperature chamber test positioning bracket was designed, including a base, a middle frame bracket, a top frame structure, and a movable carrier plate. Through the detachable positioning components and hanging rod structure, wall-mounted and ceiling-mounted positioning can be achieved. Combined with the transparent carrier plate to provide lighting, the testing efficiency and accuracy can be improved.
It enables positioning based on the heat dissipation location of electronic products, improving the efficiency and accuracy of temperature chamber testing, solving the problem of a single positioning method, and addressing the inconvenience of operation inside the temperature chamber through lighting.
Smart Images

Figure CN224176575U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of temperature testing technology for electronic products, and in particular to a positioning bracket for temperature chamber testing. Background Technology
[0002] With the increasing variety of electronic products on the market, people's demands for their quality are also rising. During the R&D verification phase and mass production sampling and regression testing, electronic products require a series of performance evaluation tests, among which high and low temperature testing is particularly important. This involves placing the electronic product in an incubator and adjusting its parameters to simulate various operating states under different temperature and humidity environments. Simultaneously, multiple temperature instruments are connected to detect whether each chip or electronic component reaches its predetermined temperature limit under extreme conditions, thereby assessing the stability of the electronic product's operation.
[0003] Because existing incubators only offer desktop placement options, some wall-mounted or ceiling-mounted models cannot be tested according to their actual installation method. The location of their internal heat dissipation modules differs from the actual application scenario, making it impossible to verify the heat dissipation solution. Furthermore, the internal airflow direction is incorrect, making the air duct design unverifiable. In addition, existing incubators often lack internal lighting, leading to inconvenient operation and low work efficiency. Utility Model Content
[0004] To overcome the shortcomings of existing technologies, this utility model provides a temperature chamber testing positioning bracket, which can be detachably and fixedly installed on the base structure, middle frame support structure and top frame structure through a movable carrier plate. The positioning temperature test is performed at the corresponding position of the positioning bracket according to the heat dissipation position of the electronic product under test. This solves the problem of the single positioning method when testing the temperature of electronic products in existing temperature chambers, thereby improving the testing efficiency and accuracy.
[0005] To achieve the above-mentioned objectives, this utility model adopts the following technical solution:
[0006] A temperature chamber testing positioning bracket includes a base structure, a middle frame support structure, a top frame structure, a movable carrier plate, and a positioning component. The middle frame support structure is fixedly connected to the base structure and the top frame structure. The movable carrier plate is detachably and fixedly installed on the base structure, the middle frame support structure, and the top frame structure. One end of the positioning component is rotatably and movably fixedly installed on the movable carrier plate. By combining the movable carrier plate and the positioning component, the positioning temperature test can be performed at the corresponding position on the positioning bracket according to the heat dissipation location of the electronic product under test.
[0007] Optionally, the base structure, the middle frame support structure, and the top frame structure are all provided with corresponding threaded holes, and the middle frame support structure is fixedly connected to the base structure and the top frame structure respectively by screws.
[0008] Optionally, the middle frame support structure is fixedly connected to the base structure and the top frame structure to form a C shape.
[0009] Furthermore, the base structure is provided with a limiting groove and a threaded hole. The limiting groove is used to restrict the movement of the movable carrier plate when it is connected to the base structure, and the threaded hole is used to fix the base structure to the middle frame support structure with screws.
[0010] Furthermore, a positioning hook is provided on the back of the movable carrier plate.
[0011] Furthermore, the other end of the positioning component is equipped with an anti-slip element.
[0012] Optionally, the positioning component can be a spring arm pressure plate, and the anti-slip component can be a silicone anti-slip sleeve. One end of the spring arm pressure plate can be rotatably and movably fixed on the movable carrier plate, and the other end of the spring arm pressure plate is provided with a silicone anti-slip sleeve.
[0013] Furthermore, the mid-frame support structure is provided with a mid-frame hanging rod component for hooking the movable carrier plate component. The mid-frame support structure is provided with a hanging rod hole for fixing the mid-frame hanging rod component. By combining the mid-frame hanging rod component with the positioning hook on the back of the movable carrier plate component, the movable carrier plate component is hooked and fixed to the mid-frame support structure, realizing wall-mounted positioning test of the electronic product under test.
[0014] Furthermore, the middle frame hanging rod component includes a first middle frame hanging rod member, which is inserted through the hanging rod hole and combined with the positioning hook on the back of the movable carrier plate member to fix the movable carrier plate member to the middle frame support structure.
[0015] Furthermore, the top frame structure is provided with a top frame hanging rod component for hooking the movable carrier plate, and the top frame support structure is provided with a hanging rod hole for fixing the top frame hanging rod component. By combining the top frame hanging rod component with the positioning hook on the back of the movable carrier plate, the movable carrier plate is hooked and fixed to the top frame structure, realizing the ceiling-mounted positioning test of the electronic product under test.
[0016] Furthermore, the top frame hanging rod component includes a first top frame hanging rod and a second top frame hanging rod. The first top frame hanging rod and the second top frame hanging rod are inserted into the hanging rod hole, and the first top frame hanging rod and the second top frame hanging rod are combined with the positioning hook on the back of the movable carrier plate to fix the movable carrier plate to the top frame structure.
[0017] Furthermore, a temperature chamber test positioning bracket also includes a transparent carrier plate for placing the lighting unit, the transparent carrier plate being fixedly connected to the top frame support structure.
[0018] Optionally, the transparent carrier plate is a rectangular groove strip, and the top frame support structure is provided with a groove that matches the width of the rectangular groove strip for fixed connection between the rectangular groove strip and the top frame support structure.
[0019] The beneficial effects of this application are: it enables the detachable and fixed installation of the movable carrier plate on the base structure, middle frame support structure and top frame structure, and the positioning temperature test is performed at the corresponding position of the positioning bracket according to the heat dissipation position of the electronic product under test, which solves the problem of the single positioning method when testing the temperature of electronic products in existing temperature chambers, thereby improving the testing efficiency and accuracy. This application is applicable to high and low temperature testing of electronic products such as routers and switches.
[0020] This invention enables users to place their mobile phones on a transparent carrier plate in the top frame support structure to place the lighting unit and turn on the lighting function, and to refer to relevant test data using their mobile phones. This avoids problems such as inconvenience in connecting test lines due to the dim interior space of the temperature chamber.
[0021] This invention enables wall-mounted positioning testing of electronic products under test by combining the mid-frame hanging rod component with the positioning hook on the back of the movable carrier plate component to fix the movable carrier plate component to the mid-frame support structure.
[0022] This invention enables the use of a top frame hanging rod component combined with a positioning hook on the back of the movable carrier plate to fix the movable carrier plate to the top frame structure, thus achieving ceiling-mounted positioning testing of the electronic product under test. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the structure of a temperature chamber testing positioning bracket according to this utility model;
[0025] Figure 2 This is a structural schematic diagram of the present invention during placement and positioning testing;
[0026] Figure 3 This is a structural schematic diagram of the present invention during wall-mounted positioning testing;
[0027] Figure 4 This is a schematic diagram of the structure of this utility model during ceiling-mounted positioning testing;
[0028] Figure 5This is a structural schematic diagram of the movable carrier plate component of this utility model.
[0029] Attached image labels:
[0030] 1-Top frame structure, 101-Groove, 102-Top frame hanging rod component, 2-Middle frame support structure, 201-Middle frame hanging rod component, 3-Base structure, 301-Limiting groove, 4-Modible carrier plate component, 401-Positioning hook, 5-Positioning component, 501-Anti-slip component, 6-Transparent carrier plate component, 7-Threaded hole, 8-Screw, 9-Hanging rod hole, 11-Lighting unit, 12-Temperature acquisition module. Detailed Implementation
[0031] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0032] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. This utility model can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0033] Example 1
[0034] A temperature chamber testing positioning bracket includes a base structure, a middle frame support structure, a top frame structure, a movable carrier plate, and a positioning component. The middle frame support structure is fixedly connected to the base structure and the top frame structure. The movable carrier plate is detachably and fixedly installed on the base structure, the middle frame support structure, and the top frame structure. One end of the positioning component is rotatably and movably fixedly installed on the movable carrier plate. By combining the movable carrier plate and the positioning component, the positioning temperature test can be performed at the corresponding position on the positioning bracket according to the heat dissipation location of the electronic product under test.
[0035] The middle frame support structure is fixedly connected to the base structure and the top frame structure respectively. Optionally, the base structure, middle frame support structure, and top frame structure are all provided with corresponding threaded holes, and the middle frame support structure is fixedly connected to the base structure and the top frame structure respectively by screws. Optionally, the middle frame support structure is fixedly connected to the base structure and the top frame structure respectively to form a C shape.
[0036] The base structure is provided with a limiting groove and a threaded hole. The limiting groove is used to restrict the movement of the movable carrier plate when it is connected to the base structure, and the threaded hole is used to fix the base structure to the middle frame support structure with screws.
[0037] One end of the positioning component is rotatably and movably fixedly mounted on the movable carrier plate. A positioning hook is provided on the back of the movable carrier plate, and the other end of the positioning component is provided with an anti-slip component. Optionally, the positioning component can be a spring arm pressure plate, and the anti-slip component can be a silicone anti-slip sleeve. One end of the spring arm pressure plate is rotatably and movably fixedly mounted on the movable carrier plate, and the other end of the spring arm pressure plate is provided with a silicone anti-slip sleeve.
[0038] The mid-frame support structure includes a mid-frame hanging rod component for hooking a movable carrier plate. The mid-frame support structure also includes hanging rod holes for fixing the hanging rod component. The movable carrier plate is hooked and fixed to the mid-frame support structure by combining the mid-frame hanging rod component with a positioning hook on the back of the movable carrier plate, thus enabling wall-mounted positioning testing of the electronic product under test. The mid-frame hanging rod component includes a first mid-frame hanging rod component, which is inserted through the hanging rod holes. The first mid-frame hanging rod component, combined with the positioning hook on the back of the movable carrier plate, hooks and fixes the movable carrier plate to the mid-frame support structure, thereby enabling wall-mounted positioning testing of the electronic product under test.
[0039] The top frame structure is equipped with a top frame hanging rod component for hooking the movable carrier plate. The top frame support structure is equipped with hanging rod holes for fixing the top frame hanging rod component. The movable carrier plate is hooked and fixed to the top frame structure by combining the top frame hanging rod component with the positioning hook on the back of the movable carrier plate, thereby realizing ceiling-mounted positioning testing of the electronic product under test. The top frame hanging rod component includes a first top frame hanging rod component and a second top frame hanging rod component. The first and second top frame hanging rod components are inserted through the hanging rod holes and, by combining the first and second top frame hanging rod components with the positioning hook on the back of the movable carrier plate, the movable carrier plate is hooked and fixed to the top frame structure, thereby realizing ceiling-mounted positioning testing of the electronic product under test.
[0040] To address the issue of dim lighting inside a temperature chamber, a temperature chamber testing positioning bracket includes a transparent carrier plate for placing a lighting unit. The transparent carrier plate is fixedly connected to a top frame support structure. Optionally, the transparent carrier plate is a rectangular groove strip, and the top frame support structure has a groove that matches the width of the rectangular groove strip for fixed connection. For example, the lighting unit can be a mobile phone. Placing the phone on the transparent carrier plate and turning on the lighting function allows users to refer to relevant test data, avoiding operational difficulties caused by the dim lighting inside the temperature chamber when connecting test circuits.
[0041] In use, the temperature acquisition module of the multi-channel temperature instrument is fixedly mounted on the movable carrier board. By combining the movable carrier board and the positioning component, the temperature is positioned at the corresponding location on the positioning bracket according to the heat dissipation location of the electronic product under test. Application scenarios include... Figure 2 As shown, the electronic product under test (DUT) is a desktop-mounted device. A movable carrier board can be placed on the base structure, and the DUT on the movable carrier board can be used for placement and positioning testing. Application scenarios include... Figure 3 As shown, the electronic product under test is wall-mounted. The spring-loaded pressure plate on the movable carrier plate needs to be rotated simultaneously to the side of the electronic product under test. The rebound force of the spring-loaded pressure plate and the frictional force of the silicone anti-slip sleeve are used to position the electronic product. Next, the movable carrier plate, along with the positioned electronic product, is rotated 90° and erected. It is then hooked onto the hanging rod via the positioning hook. Simultaneously, the movable carrier plate is inserted into the limiting groove of the base structure, thus achieving the wall-mounted positioning test of the product. Application scenarios include... Figure 4 As shown, the electronic product under test is a ceiling-mounted type. The positioning method of the product under test in Scenario 2 needs to be repeated. The movable carrier board and the positioned electronic product under test are rotated 180° and hung on the hanging rod through the positioning hook, thereby realizing the ceiling-mounted positioning test of the product.
[0042] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process of the system and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.
[0043] The terms "first," "second," and "third," etc., used in this application's specification and the foregoing drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0044] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A temperature chamber testing positioning bracket, characterized in that, The positioning bracket includes a base structure, a middle frame support structure, a top frame structure, a movable carrier plate, and a positioning component. The middle frame support structure is fixedly connected to the base structure and the top frame structure, respectively. The movable carrier plate is detachably and fixedly installed on the base structure, the middle frame support structure, and the top frame structure. One end of the positioning component is rotatably and movably fixedly installed on the movable carrier plate. By combining the movable carrier plate and the positioning component, the positioning temperature test can be performed at the corresponding position on the positioning bracket according to the heat dissipation location of the electronic product under test.
2. The temperature chamber testing positioning bracket according to claim 1, characterized in that, The middle frame support structure is fixedly connected to the base structure and the top frame structure to form a C shape.
3. The temperature chamber testing positioning bracket according to claim 1, characterized in that, The base structure is provided with a limiting groove and a threaded hole. The limiting groove is used to restrict the movement of the movable carrier plate when it is connected to the base structure, and the threaded hole is used to fix the base structure to the middle frame support structure with screws.
4. The temperature chamber testing positioning bracket according to claim 1, characterized in that, The movable carrier plate is provided with a positioning hook on its back.
5. The temperature chamber testing positioning bracket according to claim 1, characterized in that, The other end of the positioning component is provided with an anti-slip element.
6. The temperature chamber testing positioning bracket according to claim 1, characterized in that, The positioning component is a spring arm pressure plate.
7. The temperature chamber testing positioning bracket according to claim 1, characterized in that, The middle frame support structure is provided with a middle frame hanging rod component for hooking the movable carrier plate component. The middle frame support structure is provided with a hanging rod hole for fixing the middle frame hanging rod component. The movable carrier plate component is hooked and fixed to the middle frame support structure by combining the middle frame hanging rod component with the positioning hook on the back of the movable carrier plate component.
8. The temperature chamber testing positioning bracket according to claim 1, characterized in that, The top frame structure is provided with a top frame hanging rod component for hooking the movable carrier plate component, and the top frame support structure is provided with a hanging rod hole for fixing the top frame hanging rod component. The movable carrier plate component is hooked and fixed to the top frame structure by combining the top frame hanging rod component with the positioning hook on the back of the movable carrier plate component.
9. The temperature chamber test positioning bracket according to any one of claims 1-8, characterized in that, It also includes a transparent carrier plate for placing the lighting unit, which is fixedly connected to the top frame support structure.
10. The temperature chamber test positioning bracket according to claim 9, characterized in that, The transparent carrier plate is a rectangular groove strip, and the top frame support structure has a groove that matches the width of the rectangular groove strip for fixed connection between the rectangular groove strip and the top frame support structure.