Test probe

Abstract

The utility model relates to the technical field of electronic testing, in particular to a test probe. The test probe is used for detecting a tested product, the test probe comprises a plurality of contact parts, the plurality of contact parts are located at one end of the test probe, and the plurality of contact parts can be contacted with the tested product at the same time. The contact area between the test probe and the tested product during the open and short circuit test is increased, and the good contact between the test probe and the tested product (such as an FPC extension socket) is realized, so that the high misjudgment rate of the open and short circuit test is improved, and the production efficiency of equipment is improved.

Description

Technical Field

[0001] This application relates to the field of electronic testing technology, and in particular to a test probe. Background Technology

[0002] Anisotropic conductive film (ACF) is used to connect various components in a camera module, such as fixing electronic devices like image sensors onto a circuit board to achieve electrical connections. ACF contains conductive particles that are conductive in the Z-axis direction but insulating in the X and Y axes. ACF placement is a specific process in electronic assembly, primarily used to connect electronic components with fine pitch, such as connecting FPC (Flexible Printed Circuit Connectors) to other electronic components. In ACF placement, the ACF film is first placed between the two components to be connected. Then, through processes such as hot pressing, the resin in the ACF film cures, and the conductive particles become conductive in the Z-axis direction under pressure, thus completing the electrical connection and mechanical fixation between the two components.

[0003] In ACF (Automatic Circuit Board) production, FPC (Flexible Printed Circuit) power strips serve as crucial connecting components, used to connect flexible printed circuit boards and other electronic components or devices. Their conductivity directly affects the performance of the entire product. During the production process, FPC power strips may experience problems such as poor connection, open circuit, or short circuit. Utility Model Content

[0004] This application discloses a test probe with multiple contact portions at one end, which can simultaneously contact the product under test, increasing the contact area for testing and achieving good contact between the test probe and the FPC connector. This improves the high false positive rate of open and short circuit tests and enhances equipment production efficiency.

[0005] To achieve the above objectives, in a first aspect, embodiments of this application disclose a test probe, comprising:

[0006] Multiple contact portions are located at one end of the test probe, and the multiple contact portions can simultaneously contact the product under test.

[0007] As an optional implementation, the plurality of contact portions include a first contact portion and a second contact portion, both of which extend along a first direction, and are spaced apart along a second direction, which is perpendicular to the first direction.

[0008] As an optional implementation, the first contact portion includes a first end face and a first side face. The first end face is used to contact the product under test, and the first side face has a first protrusion facing the second contact portion. The second contact portion includes a second end face and a second side face. The second end face is used to contact the product under test, and the second side face has a second protrusion facing the first contact portion.

[0009] As an optional implementation, the first protrusion and the second protrusion are offset from each other in the second direction.

[0010] As an optional implementation, the test probe further includes a buffer portion connected to the plurality of contact portions, the buffer portion being deformable along the first direction.

[0011] As an optional implementation, the buffer includes multiple straight segments and multiple arc segments. The multiple straight segments are arranged along the first direction and extend along the second direction. Adjacent straight segments are smoothly connected by the arc segments.

[0012] As an optional implementation, the buffer section has a hollow structure.

[0013] As an optional implementation, the test probe further includes a mounting portion connected to the end of the buffer portion away from the contact portion, and the mounting portion is provided with a force-reducing hole.

[0014] As an optional implementation, the mounting portion extends along the first direction, and the width of the mounting portion gradually decreases along the direction away from the buffer portion.

[0015] As an optional implementation, the plurality of contact portions are in surface contact with the product under test.

[0016] Compared with the prior art, the beneficial effects of this application are at least as follows:

[0017] The test probe provided in this application includes multiple contacts located at one end of the probe, which can simultaneously contact the product under test. When testing products such as FPC connectors, the multiple contacts can simultaneously contact one test terminal of the product under test, resulting in better contact with the surface and pins of the FPC connector, reducing the possibility of poor contact. Furthermore, the multiple contacts can cover a larger area, ensuring more comprehensive contact with the corresponding test terminals of the FPC connector, thus ensuring more stable and uniform transmission of the test signal. The increased contact area and guaranteed good contact by the multiple contacts reduce signal transmission anomalies caused by poor contact, making the test results more accurately reflect the true open / short circuit state of the FPC connector. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of an existing testing device;

[0020] Figure 2 for Figure 1 Sectional view at point AA;

[0021] Figure 3 This is a schematic diagram of the structure when an existing test probe comes into contact with the product under test.

[0022] Figure 4 This is a schematic diagram of the structure of the test probe disclosed in the embodiments of this application;

[0023] Figure 5 This is a schematic diagram of the structure of the test probe in contact with the product under test as disclosed in the embodiments of this application;

[0024] Figure 6 This is a schematic diagram of the structure in which multiple contact parts disclosed in the embodiments of this application are in surface contact with the product under test.

[0025] Explanation of reference numerals in the attached figures:

[0026] a-Test substrate; b-Probe; c-Product loading fixture; d-Test terminal of the product under test; 100-Test probe; 1-Contact portion; 11-First contact portion; 111-First end face; 112-First side face; 1121-First protrusion; 12-Second contact portion; 121-Second end face; 122-Second side face; 1221-Second protrusion; 2-Buffer portion; 21-Straight segment; 22-Curved segment; 3-Mounting portion; 3a-Reducing hole; X-First direction; Y-Second direction. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] In this application, the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0029] Furthermore, some of the aforementioned terms, besides indicating location or positional relationships, may also have other meanings. For example, the term "above" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0030] Furthermore, the terms "installation," "setup," "equipped with," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components, and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0032] ACF (Adhesive Cordless Film) is used to connect various components in a camera module, such as fixing electronic devices like image sensors onto a circuit board to achieve electrical connection. ACF contains conductive particles that are conductive in the Z-axis direction and insulating in the X and Y-axis directions. ACF bonding is a specific process in electronic assembly, primarily used to connect electronic components with fine pitch, such as connecting FPC (Flexible Printed Circuit) to other electronic components. In ACF bonding, the ACF film is first placed between the two components to be connected. Then, through processes such as hot pressing, the resin in the ACF film cures, and the conductive particles achieve Z-axis conductivity under pressure, thus completing the electrical connection and mechanical fixation between the two components.

[0033] In ACF (Automatic Circuit Board) production, FPC (Flexible Printed Circuit) power strips serve as crucial connecting components, used to connect flexible printed circuit boards and other electronic components or devices. Their conductivity directly affects the performance of the entire product. During the production process, FPC power strips may experience problems such as poor connection, open circuit, or short circuit.

[0034] The inventor designed such as Figure 2 The probe b shown is combined with Figures 1 to 3 Probe B is mounted on test substrate A, and product loading fixture C is mounted on a turntable. After receiving the product under test, it rotates to the open / short circuit test station. During the open / short circuit test, test substrate A descends to make probe B contact the test terminal d of the product under test, and power is applied to test the product under test. The existing probe B has a needle-shaped structure with a small contact area with the product under test, making the probe prone to breakage. This leads to poor contact between the product under test and the test probe of the open / short circuit inspection section, increasing the number of open / short circuit retests, resulting in a high false positive rate and an increase in equipment alarms.

[0035] Based on this, this application discloses a test probe with multiple contact parts at one end, which can simultaneously contact the product under test, increasing the contact area of ​​the test and achieving good contact between the test probe and the FPC connector, thereby improving the high false judgment rate of open and short circuit tests and improving equipment production efficiency.

[0036] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0037] Please see Figure 1 , Figure 2 and Figure 4 , Figure 1 This is a schematic diagram of the structure of an existing testing device. Figure 2 for Figure 1 Sectional view at point AA. Figure 4 This is a schematic diagram of the structure of the test probe 100 disclosed in an embodiment of this application. This application discloses a test probe 100, which includes:

[0038] Multiple contact parts 1 are located at one end of the test probe 100, and the multiple contact parts 1 can simultaneously contact the product under test.

[0039] Specifically, multiple contacts 1 of a test probe 100 can simultaneously contact the test terminal d of a product under test, allowing for better contact with the surface and pins of the FPC connector, reducing the possibility of poor contact. Furthermore, multiple contacts 1 can cover a larger area, ensuring more comprehensive contact with the corresponding test terminals of the FPC connector, thus guaranteeing more stable and uniform signal transmission. Multiple contacts 1 can simultaneously cover different parts of a pin, reducing signal transmission instability issues that may result from a small contact area. By increasing the contact area and ensuring good contact, multiple contacts 1 can reduce signal transmission anomalies caused by poor contact, making the test results more accurately reflect the true open / short circuit state of the FPC connector.

[0040] When multiple contact points 1 act simultaneously, they can apply contact pressure to the FPC connector at different positions, overcoming the instability that can easily occur at a single contact point. This ensures a reliable electrical connection between the test probe 100 and the FPC connector, guaranteeing accurate transmission of the test signal. This good contact is crucial for ensuring test accuracy, preventing signal loss or anomalies caused by contact problems, which could affect the interpretation of test results.

[0041] During open / short circuit testing, the signal generator applies a specific voltage or current signal to the test probe 100. After the test probe 100 contacts the pins of the FPC connector, it transmits the signal to the inside of the FPC connector. If the FPC connector is conducting normally, the signal will travel along the expected path in the circuit and be fed back to the data acquisition and analysis unit via the test probe 100. If the FPC connector has an open circuit problem, i.e., the circuit is broken and the signal cannot be transmitted, the signal received by the test probe 100 will be zero or an abnormal value; if there is a short circuit problem, i.e., there is unnatural continuity between different pins, the signal received by the test probe 100 will also be abnormal, with characteristics different from those of a normally conducting signal. The data acquisition and analysis unit compares the received signal characteristics with a preset standard signal to determine whether the FPC connector has an open / short circuit fault.

[0042] As an optional implementation method, combined with Figure 4 The plurality of contact portions 1 include a first contact portion 11 and a second contact portion 12. Both the first contact portion 11 and the second contact portion 12 extend along a first direction X. The first contact portion 11 and the second contact portion 12 are spaced apart along a second direction Y, which is perpendicular to the first direction X.

[0043] Understandably, the first direction X is the extension direction of the test probe 100. When mounted on the test substrate a, the first direction X is the direction in which the test substrate a rises and falls. When the two contact portions extend along the same first direction X, they can better align with these pins, increasing the adaptability and accuracy of the contact. In open-circuit and short-circuit testing operations, this structure allows the test probe 100 to make precise contact with the product under test, ensuring that the test signal can be effectively transmitted in this direction, improving the relevance and reliability of the test.

[0044] Because the first contact portion 11 and the second contact portion 12 are spaced apart along a direction perpendicular to their extension, the test probe 100 can simultaneously cover test points at different locations. For FPC connectors with pins of a certain area, this spaced arrangement of the first contact portion 11 and the second contact portion 12 can simultaneously probe different areas of a single pin, avoiding the omission of potential open or short circuit problems due to overly concentrated test points. The two contacts spaced apart along the second direction Y can simultaneously test pins in different rows or columns, expanding the test range and enhancing the comprehensiveness of the test.

[0045] Spacing can also prevent interference between different contact points. If the contact points are too close together, physical contact may affect the test results, while an appropriate spacing ensures that each contact point can independently transmit and receive signals to and from its corresponding test point, improving the independence and accuracy of the test.

[0046] In some alternative implementations, combined with Figure 4 and Figure 5 , Figure 5 This is a schematic diagram of the structure of the test probe 100 in contact with the product under test disclosed in the embodiments of this application. The first contact portion 11 includes a first end face 111 and a first side face 112. The first end face 111 is used to contact the product under test. The first side face 112 is provided with a first protrusion 1121 facing the second contact portion 12. The second contact portion 12 includes a second end face 121 and a second side face 122. The second end face 121 is used to contact the product under test. The second side face 122 is provided with a second protrusion 1221 facing the first contact portion 11.

[0047] The presence of the first protrusion 1121 and the second protrusion 1221 enhances the rigidity of the first contact portion 11 and the second contact portion 12. During testing, the test probe 100 needs to contact the product under test and apply a certain pressure, and may be subjected to forces from different directions, such as vibrations and impacts generated when the test equipment moves. Higher rigidity allows the contact portion 1 to maintain the stability of its shape and position when subjected to these external forces, avoiding poor contact or test position displacement due to deformation. This is crucial for ensuring the accuracy and reliability of the test, as deformation may lead to changes in the contact area and uneven contact pressure, thereby affecting the transmission of test signals and the determination of test results.

[0048] In a testing system, multiple test probes 100 are typically used simultaneously, and the spacing between them may be small. If the protrusion is located on the outer side, it is easy for the test probe 100 to come into contact with adjacent test probes 100 during movement or operation. This could damage the contact portion 1 of the test probe 100 or adjacent probes, affecting its normal testing function, shortening the lifespan of the test probe 100, and increasing maintenance costs. Furthermore, contact between test probes 100 may cause short circuits or signal interference, leading to inaccurate test results. When the protrusion is located between two contact portions, it effectively avoids this situation, ensuring the independence of each test probe 100 and allowing each test probe 100 to operate normally without misjudgment or abnormal test signals due to interference from adjacent probes.

[0049] This design improves the overall reliability and stability of the testing system, allowing multiple test probes 100 to work collaboratively in a relatively compact space without interfering with each other. This ensures that each test point of the product under test is tested independently and accurately, thereby improving the overall testing efficiency and accuracy of the testing system.

[0050] In some embodiments, combined with Figure 4 The first protrusion 1121 and the second protrusion 1221 are offset in the second direction Y.

[0051] Thus, a gap exists between the first protrusion 1121 and the second protrusion 1221, preventing them from being in the same position or overlapping in space. During testing, this staggered layout helps avoid mutual interference between the protrusions. If two protrusions were in the same position or aligned, they might collide, rub against each other, or make unnecessary physical contact, thus affecting the normal function of the test probe 100. Each protrusion can function independently, ensuring the structural integrity and normal operation of the test probe 100.

[0052] The staggered protrusions enhance the overall stability of the test probe 100. When subjected to external force or pressure, the more reasonable distribution of the protrusions results in a more uniform stress distribution on the test probe 100. This prevents excessive local stress caused by protrusions being in the same position, thereby improving the overall strength and durability of the test probe 100. This ensures that the test probe 100 will not be damaged or deformed due to uneven stress during long-term use and repeated testing, thus extending the service life of the test probe 100.

[0053] As an optional implementation method, combined with Figure 4 The test probe 100 also includes a buffer section 2, which is connected to a plurality of contact sections 1, and the buffer section 2 is capable of deforming along a first direction X.

[0054] When the test probe 100 contacts the product under test, a certain amount of impact or pressure may be generated due to manufacturing tolerances, surface unevenness, or other factors. The presence of the buffer 2 can reduce these impacts and pressures, preventing excessive impact force from acting directly on the contact part 1 or other components, thereby protecting the structural integrity of the contact part 1 and the entire test probe 100. For example, when the test probe 100 contacts the pins of the FPC connector, without the buffer 2, the contact part 1 may wear, deform, or even be damaged due to rigid contact. The buffering effect of the buffer 2 can reduce the occurrence of this situation, ensuring that the contact part 1 can work stably for a long time.

[0055] For FPC connectors of different batches or models, the height of their pins or test sections may vary slightly. The deformable nature of the buffer 2 allows the test probe 100 to adapt to these height differences within a certain range, enabling the test probe 100 to make better contact with different height sections of the product under test. Even if the height of the product under test varies within a certain range, the buffer 2 can adjust the position of the contact 1 through its own deformation, ensuring good contact between the contact 1 and the product under test, avoiding poor contact caused by height differences, and thus improving the adaptability and accuracy of the test.

[0056] Optionally, combined Figure 4 The buffer section 2 includes multiple straight segments 21 and multiple arc segments 22. The multiple straight segments 21 are arranged along the first direction X and extend along the second direction Y. Adjacent straight segments 21 are smoothly connected by arc segments 22.

[0057] Multiple straight segments 21 are arranged along the first direction X, providing space for the deformation of the buffer section 2 in the first direction X. This helps to provide a clear deformation direction and guidance for the buffer section 2 when it is under pressure. When the test probe 100 contacts the product under test, the pressure is usually applied along the first direction X. The straight segments 21 convert the force in the first direction X into a force along the second direction Y, causing the straight segments 21 to deform along the second direction Y. The straight segments 21 can make the buffer section 2 deform in an orderly manner in this direction, avoiding disordered deformation or twisting. This orderly deformation helps the buffer section 2 better absorb and disperse the impact force, ensuring the effective realization of the buffering function. For example, when the test probe 100 presses down to contact the FPC connector, the straight segments 21 can guide the buffer section 2 to expand and contract along the first direction X, making the buffering action more stable and predictable, thereby ensuring the stable operation of the test probe 100.

[0058] The arc segment 22 can deform when the buffer part 2 is subjected to pressure along the first direction X, so as to reduce the gap between the straight segments 21, thereby enabling the buffer part 2 to deform along the first direction X.

[0059] The presence of the arc segment 22 ensures a smooth transition between adjacent straight segments 21. During the deformation of the buffer section 2, the smooth connection avoids structural damage caused by stress concentration at the connection point. If a rigid connection is used between the straight segments 21, these connections may bear large stresses when the buffer section 2 deforms, making them prone to breakage or damage; however, the arc segment 22 can disperse the stress, making the buffer section 2 more durable during repeated deformation and extending its service life. In addition, the smoothness of the arc segment 22 can make the deformation of the buffer section 2 more fluid, helping to better adapt to different contact pressures and the surface conditions of the tested product, thereby ensuring the uniformity of the contact pressure between the test probe 100 and the tested product, further improving the accuracy and reliability of the test.

[0060] In some alternative implementations, combined with Figure 4 The buffer section 2 is a hollow structure.

[0061] The buffer section 2 adopts a hollow structure, which allows it to better perform its elastic buffering function under pressure. Compared with a solid structure, the hollow structure can change the elastic properties of the material to a certain extent, making it easier to deform. When the test probe 100 comes into contact with the product under test, the pressure will cause the buffer section 2 to deform. The hollow structure allows the internal space of the buffer section 2 to act as a buffer space when under pressure, allowing the buffer section 2 to more effectively reduce and disperse external forces, thereby providing a better buffering effect for the contact section 1. This helps prevent excessive impact force from damaging the contact section 1 and the product under test, ensures uniform pressure distribution during the test, and avoids poor contact or product damage caused by excessive instantaneous impact force.

[0062] The central control structure enhances the flexibility of the buffer section 2. In different testing environments, the surface height or shape of the product under test may vary, requiring the buffer section 2 to flexibly adjust its length to adapt to these changes. This enhanced flexibility allows the test probe 100 to extend or retract more freely when contacting products of varying heights, ensuring that the contact section 1 maintains good contact with the product under test at all times. This flexibility also allows the test probe 100 to better adapt to repeated tests, reducing performance degradation caused by insufficient flexibility of the buffer section 2 and extending the service life of the test probe 100.

[0063] In some embodiments, combined with Figure 4 The test probe 100 also includes a mounting part 3, which is connected to the end of the buffer part 2 away from the contact part 1, and the mounting part 3 is provided with a force reduction hole 3a.

[0064] The stress-reducing hole 3a provided on the mounting part 3 serves as a process hole, its main purpose being to reduce bending forces. During the operation of the test probe 100, bending forces may be generated due to various external forces, such as when the test probe 100 contacts or detaches from the product under test, the mounting part 3 will bear a certain bending moment. The presence of the stress-reducing hole 3a can change the structural performance of the mounting part 3, allowing it to better disperse stress when subjected to bending moments. When a bending moment acts on the mounting part 3, the material distribution around the stress-reducing hole 3a affects the force transmission path, alleviating stress concentration and thus reducing the impact of bending forces on the mounting part 3. This helps prevent the mounting part 3 from deforming or being damaged due to excessive bending, ensuring the structural integrity of the test probe 100.

[0065] From the perspective of testing accuracy, reducing bending force can make the overall structure of the test probe 100 more stable. If the mounting part 3 deforms due to bending force, it may affect the position of the test probe 100 and the contact state of the contact part 1, thereby affecting the transmission of test signals and the accuracy of test results. The force-reducing hole 3a ensures the stability of the test probe 100 during the testing process by reducing bending force, which helps to improve the accuracy and reliability of the test and avoids test errors caused by deformation of the mounting part 3.

[0066] As an optional implementation method, combined with Figure 4 The mounting part 3 extends along the first direction X, and the width of the mounting part 3 gradually decreases along the direction away from the buffer part 2.

[0067] Because the test substrate a pad is relatively small, the design of the mounting part 3, whose width gradually decreases in the direction away from the buffer part 2, allows it to better match the pad. When the mounting part 3 is connected to the pad, the gradually decreasing width allows for more precise alignment and fit with the smaller pad. This design avoids connection difficulties or incomplete contact with the pad caused by an excessively large mounting part 3, thus improving the accuracy and reliability of the connection.

[0068] This adaptability helps ensure the stability of the electrical connection. The gradually decreasing width of the mounting portion 3 allows for a tight fit with the pad, forming a low-resistance connection path, thereby ensuring effective transmission of the test signal between the test probe 100 and the test substrate a. This reduces problems such as signal attenuation, noise interference, or increased contact resistance caused by poor contact, enabling the test signal to be accurately transmitted between the test probe 100 and the test substrate a, thus improving test accuracy.

[0069] In some possible implementations, combined Figure 6 , Figure 6 This is a schematic diagram of the structure in which multiple contact parts 1 disclosed in the embodiments of this application are in surface contact with the product under test. The multiple contact parts 1 and the product under test can be in surface contact.

[0070] Multiple contact points 1 make surface contact with the product under test (DUT). Compared to point or line contact, surface contact provides a larger contact area. During testing, a larger contact area means more contact points are involved in the electrical connection, which helps improve contact stability. For DUTs such as FPC connectors, the surfaces of their pins or test areas may not be perfectly flat; surface contact ensures a reliable connection between the test probe 100 and the DUT. Even with minor surface undulations, surface contact allows contact points 1 to fit tightly against the DUT, preventing signal transmission instability due to poor contact.

[0071] Furthermore, surface contact disperses pressure over a relatively large area, reducing localized pressure on the product under test compared to pressure concentrated at a point or along a line. During testing, lower localized pressure reduces the likelihood of damage to the pins or surfaces of products such as FPC connectors, protecting the physical structure and electrical performance of the product under test. Especially for fragile electronic components or products with delicate structures, surface contact test probes 100 can prevent damage caused by excessive localized pressure, improving test safety and product yield.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A test probe for detecting a product under test, characterized in that, The test probe includes: Multiple contact portions are located at one end of the test probe, and the multiple contact portions can simultaneously contact the product under test; The plurality of contact portions include a first contact portion and a second contact portion, both the first contact portion and the second contact portion extending along a first direction, the first contact portion and the second contact portion being spaced apart along a second direction, the second direction being perpendicular to the first direction; The first contact portion includes a first end face and a first side face. The first end face is used to contact the product under test. The first side face has a first protrusion facing the second contact portion. The second contact portion includes a second end face and a second side face. The second end face is used to contact the product under test. The second side face has a second protrusion facing the first contact portion. The first protrusion and the second protrusion are offset from each other in the second direction.

2. The test probe according to claim 1, characterized in that, The test probe further includes a buffer portion connected to the plurality of contact portions, and the buffer portion is capable of deforming along the first direction.

3. The test probe according to claim 2, characterized in that, The buffer section includes multiple straight segments and multiple arc segments. The multiple straight segments are arranged along the first direction and extend along the second direction. Adjacent straight segments are smoothly connected by the arc segments.

4. The test probe according to claim 3, characterized in that, The buffer section has a hollow structure.

5. The test probe according to claim 3, characterized in that, The test probe also includes a mounting part, which is connected to the end of the buffer part away from the contact part, and the mounting part is provided with a force-reducing hole.

6. The test probe according to claim 5, characterized in that, The mounting portion extends along the first direction, and its width gradually decreases along the direction away from the buffer portion.

7. The test probe according to claim 1, characterized in that, The multiple contact parts are in surface contact with the product under test.

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