Insulation test structure of crystal oscillator product
By designing an automated insulation testing structure for crystal oscillators, the problems of low testing efficiency and poor accuracy in existing technologies have been solved, achieving efficient and accurate insulation testing for crystal oscillators.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO JINGCHUANG TECH CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-04-28
AI Technical Summary
Existing insulation testing methods for crystal oscillators are inefficient and susceptible to human factors and temperature variations, leading to inaccurate test results.
An automated testing structure was designed, comprising a working platform, a mobile arm structure, and a heating structure. The heating controller maintains a constant temperature, and the mobile arm and pin test pieces are used to realize automated insulation testing of crystal oscillator products. The test data is automatically generated and saved.
It improves the automation and accuracy of testing, reduces the impact of temperature on test results, lowers labor costs, and increases testing efficiency.
Smart Images

Figure CN224176676U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a test structure for crystal oscillator products, and more particularly to an insulation test structure for crystal oscillator products. Background Technology
[0002] Insulation performance is a crucial indicator in the production and testing of crystal oscillators. Traditional insulation testing methods mostly rely on manual operation, which is not only inefficient but also susceptible to human error. Furthermore, it is impossible to conduct tests under constant high-temperature conditions, leading to significant errors in the test results.
[0003] Currently, the industry standard for testing the insulation of crystal oscillators involves first preparing a tray of materials, then manually aligning the probes of an insulation tester with the electrode pins of the material, manually pressing the test button on the insulation tester to test the electrode pins, and then manually recording the measured values. Each material requires testing two diagonally opposite values. Due to the small size of the chips, manual operation easily leads to misalignment of the electrode pins, resulting in inaccurate test data. Furthermore, the testing steps for each material are cumbersome, wasting significant manpower and time when there are many materials.
[0004] The insulation characteristics of crystal oscillators vary at different temperatures. It is best to conduct the test under constant temperature conditions to effectively reduce the influence of external factors. The existing test mode is to test at room temperature. Temperature fluctuations will affect the accuracy of the test results. Furthermore, the current mode cannot test the insulation characteristics at higher temperatures. Incorrect test data may lead to personnel misjudging the data, which may result in incorrect decisions in subsequent operations. Summary of the Invention
[0005] This invention provides an insulation testing structure for crystal oscillators that is highly automated, has minimal temperature impact on testing, and offers high testing accuracy. It solves the technical problems of existing technologies where insulation testing of crystal oscillators requires manual completion, resulting in low efficiency and susceptibility to temperature fluctuations, leading to inaccurate test data.
[0006] The above-mentioned technical problem of this utility model is solved by the following technical solution: an insulation testing structure for crystal oscillators, including a working platform, on which a crystal oscillator moving arm structure and a crystal oscillator placement structure are installed. The crystal oscillator placement structure includes a test tray for placing crystal oscillators, a heating structure below the test tray, an external heating controller connected to the heating structure, and a crystal oscillator shelf on one side of the test tray. A crystal oscillator gripper and a crystal oscillator pin test piece are installed on the moving arm structure. The crystal oscillator shelf holds the crystal oscillator products to be tested. When testing is required, the heating structure is first controlled to heat the crystal oscillator. When the temperature reaches the set value, the moving arm is used to move the crystal oscillator product onto the test tray. Then, the crystal oscillator product pin test piece is used to perform an insulation test on the crystal oscillator product. Qualified products are moved to the OK cup, and unqualified products are moved to the NG cup. One piece is tested. The testing process is repeated until all the pieces in the test tray are tested, which is considered a test set. Then, the next set of pieces is picked up from the tray and the previous steps are repeated. Once the material in the tray is completely absorbed, the machine stops, returns to the standby position, and triggers an alarm to alert personnel. At the same time, test data is automatically generated and saved locally.
[0007] Preferably, the test plate is fixed to the cover plate, and a heating structure is provided below the cover plate, with a heat dissipation structure below the heating structure. The heat dissipation structure allows for better control of the heating structure's temperature, resulting in good heat dissipation and ensuring the temperature stability of the heating structure.
[0008] Preferably, the heat dissipation structure includes heat dissipation fins, and a heat dissipation mounting platform is provided outside the heat dissipation fins. The heat dissipation mounting platform surrounds the heat dissipation fins in the middle, facilitating the installation and heat dissipation of the heat dissipation fins.
[0009] Preferably, a fan mounting surface is provided on the front side of the frame, and a fixing frame is provided on the top side of the frame. The fixing frame at the top secures all four sides of the frame, improving the fan's heat dissipation effect.
[0010] Preferably, the side of the frame is provided with a lead wire groove for the heating structure.
[0011] Preferably, the heating structure includes a heating semiconductor, with heat insulation plates on both sides of the heating semiconductor, and a cover plate pressed onto the heat insulation plates and the heating semiconductor, with the cover plate located within a fixed frame.
[0012] Preferably, a thermocouple is provided above the heating semiconductor for temperature monitoring.
[0013] Preferably, the test tray is equipped with slots for crystal oscillators of various sizes. This provides good versatility, enabling testing of products of various specifications.
[0014] Therefore, the insulation test structure for crystal oscillator products of this utility model has the following advantages: a heating prevention structure under the crystal oscillator product ensures constant temperature during testing, thereby improving test accuracy; and the automated operation of the crystal oscillator product test is completed using a moving arm structure, which is highly efficient and stable. Attached Figure Description
[0015] Figure 1 This is a three-dimensional diagram of the insulation test structure for a crystal oscillator product.
[0016] Figure 2 yes Figure 1 Exploded view of the installation structure of the crystal oscillator product. Detailed Implementation
[0017] The technical solution of the utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.
[0018] Example:
[0019] like Figure 1 and 2 As shown, an insulation test structure for a crystal oscillator product includes a working platform 1, an X-axis guide rail 2 and a Y-axis guide rail 3 mounted on the working platform 1, a movable arm structure 4 mounted on the guide rails, and a crystal oscillator product gripper 5 and a crystal oscillator product pin test piece 6 mounted on the movable arm structure 4.
[0020] A quadrilateral frame 15 is installed within the space enclosed by the X-guide rail 2 and the Y-guide rail 3. Heat dissipation fins 20 are installed inside the frame 15. A fan mounting hole 14 is provided on the front side of the frame, and a fan is installed within the fan mounting hole 14 for further heat dissipation. A fixing frame 7 is arranged on the upper side of the frame 15, fixing the four sides of the frame to the fixing frame 7, thus completing the forming of the frame 15.
[0021] A heating structure consisting of four heating semiconductors 16 is laid above the heat dissipation fins 20, and heat insulation plates 13 are arranged on both sides of the heating structure. A cover plate 12 is laid above the heating semiconductors 16 and the heat insulation plates 13, and a temperature measuring thermocouple 19 is fixed to the side of the heating semiconductors 16 by bolts. The wires of the heating semiconductors 16 and the temperature measuring thermocouples 18 are led out through the lead grooves 17 located on the side of the frame and connected to an external controller to control the temperature of the heating semiconductors 16. Through holes are opened on the cover plate 12 and the heat insulation plates 13. Bolts pass through the cover plate 12 and the heat insulation plates 13 and are fixed to the heat dissipation fins. The cover plate 12 is located inside the fixing frame 7 and is flush with the fixing frame 7. The cover plate 12 completes the fixation of the heat insulation plates 13 and the heating semiconductors 16. At the same time, the temperature measuring thermocouples 19 can also be fixed to the side of the cover plate 12 by bolts. A test plate 8 is fixed to the cover plate 12 by bolts, and the test plate 8 is provided with crystal oscillator product placement slots 11 of various specifications.
[0022] On one side of the test tray 11, a crystal oscillator product shelf 10 is attached to the top by three pillars, and a material tray 9 is installed on the crystal oscillator product shelf 10.
[0023] When using the equipment, first place the crystal oscillator product into the tray 9, and then place the tray 9 onto the crystal oscillator product shelf 10. Then, in the program visualization interface, select the current test station size, the set test voltage, and the set test temperature, and then click Start Run to start the machine.
[0024] The machine's operation is as follows: After pressing the start button, the controller controls the heating semiconductor 16 to begin heating. Once the set temperature is reached, the crystal oscillator product gripper 5 in the moving arm structure picks up the crystal oscillator products from the material tray 9 and transfers them to the test tray 8. After the test tray 8 is full, the crystal oscillator product pin tester 6 on the moving arm structure moves to the electrode pin position of the product. The crystal oscillator product pin tester presses down and sends a test command to the insulation tester to test the pin position value once. The relay is then activated, and a test command is sent again to test the pin position a second time. The test data is recorded in the software. After testing one product, the corresponding product is picked up and placed into the corresponding OK and NG cups based on the test results. The test of one product is then completed. The testing process is repeated until all products on the test board are tested, which constitutes a test set. The next set of crystal oscillator products is then picked up from the material tray for testing, and the previous steps are repeated. When the material tray is empty, the machine stops, returns to the standby position, and an alarm is triggered to alert personnel. At the same time, the test data is automatically generated and saved locally.
[0025] The specific embodiments described herein are merely illustrative of the concept of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.
Claims
1. An insulation test structure for a crystal oscillator product, comprising a working platform, characterized in that: The work platform is equipped with a crystal oscillator product moving arm structure and a crystal oscillator product placement structure. The crystal oscillator product placement structure includes a test tray for placing crystal oscillator products, a heating structure below the test tray, an external heating controller connected to the heating structure, a crystal oscillator product shelf on one side of the test tray, and a crystal oscillator product gripper and a crystal oscillator product pin test piece installed on the moving arm structure.
2. The insulation test structure for a crystal oscillator product according to claim 1, characterized in that: The test plate is fixed on the cover plate, and a heating structure is provided below the cover plate, and a heat dissipation structure is provided below the heating structure.
3. The insulation test structure for a crystal oscillator product according to claim 2, characterized in that: The heat dissipation structure includes heat dissipation fins, and a heat dissipation mounting platform is provided outside the heat dissipation fins. The heat dissipation mounting platform is in the form of a frame.
4. The insulation test structure for a crystal oscillator product according to claim 3, characterized in that: A fan mounting surface is provided on the front side of the frame, and a fixing frame is provided on the upper side of the frame.
5. The insulation test structure for a crystal oscillator product according to claim 4, characterized in that: The side of the frame is provided with a lead wire groove for the heating structure.
6. The insulation test structure for a crystal oscillator product according to any one of claims 1 to 5, characterized in that: The heating structure includes a heating semiconductor, with heat insulation plates on both sides of the heating semiconductor, and a cover plate pressed onto the heat insulation plates and the heating semiconductor, with the cover plate located within a fixed frame.
7. The insulation test structure for a crystal oscillator product according to claim 6, characterized in that: A temperature-measuring thermocouple is provided above the heating semiconductor.
8. An insulation test structure for a crystal oscillator product according to any one of claims 1 to 5, characterized in that: The test disk is equipped with slots for crystal oscillators of various specifications.