Traceless needle insertion testing device for flexible board B2B

Abstract

The utility model is suitable for the technical field of electronic testing, and provides a traceless needle insertion testing device for a flexible board B2B. The traceless needle insertion testing device for the flexible board B2B comprises a first needle mold, a second needle mold and a third needle mold, wherein the first needle mold is provided with a station for placing the flexible board; the second needle die is arranged at the bottom of the first needle die and is in floating connection with the first needle die; a support column; the third needle die is connected with the second needle die through the supporting column; the long probe is limited in the third probe die and is used for being in contact with a test point on the flexible plate; and the buffer module is arranged at the bottom of the third probe die and is used for switching over signals of the long probes and relieving probe insertion impact. According to the utility model, by arranging the buffer module, different acupuncture elastic forces can be provided for different acupuncture areas of a product, and buffer and impact elimination can be realized.

Description

Technical Field

[0001] This utility model belongs to the field of electronic testing technology, and in particular relates to a non-marking needle puncture test device for flexible board B2B. Background Technology

[0002] FPC (Flexible Printed Circuit) B2B (Board-to-Board) connectors are key components for achieving high-density interconnects in modern electronic devices, particularly suitable for space-constrained scenarios requiring flexible connections. These connectors combine the flexibility of FPCs with the compact design of B2B connectors, and are widely used in smartphones, wearable devices, automotive electronics, and other fields.

[0003] With the continuous upgrading of FPC manufacturing processes, the industry's requirements for product appearance quality after ICT testing are becoming increasingly stringent. In the traditional pin mold testing process, pin marks often become visible during customer quality inspection after ICT testing, and such appearance defects are completely unacceptable under current stringent quality standards. However, the design verification of pin mold modules has a significant lag—it can only be confirmed whether pin marks will occur after processing is completed and the product is put into actual use on the customer's production line. This retrospective problem discovery mechanism forces manufacturers to passively adjust the finalized pin molds.

[0004] Therefore, the existing testing scheme is contradictory: if the existing needle mold module is modified on a large scale, the production cost will be greatly increased; if it is not modified, it is difficult to guarantee the production yield. Summary of the Invention

[0005] The purpose of this utility model embodiment is to provide a non-marking needle puncture testing device for flexible board B2B, which aims to minimize the modification of existing needle mold modules and optimize controllable costs, so as to fundamentally prevent the occurrence of needle mark problems.

[0006] This utility model embodiment is implemented as follows: a non-marking needle puncture testing device for flexible B2B boards, the non-marking needle puncture testing device for flexible B2B boards comprising:

[0007] The first needle mold has a station for placing the flexible plate;

[0008] The second needle mold is disposed at the bottom of the first needle mold and is floatingly connected to the first needle mold;

[0009] Support column;

[0010] The third needle mold is connected to the second needle mold via the support column;

[0011] A long probe, confined within the third needle mold, is used to contact the test points on the flexible plate;

[0012] A buffer module, located at the bottom of the third needle mold, is used to transfer the signal of the long probe and reduce the impact of the needle insertion.

[0013] Furthermore, the buffer module includes:

[0014] The first adapter block is located at the bottom of the third needle mold;

[0015] The second adapter block is located at the bottom of the first adapter block;

[0016] A dual-headed probe is positioned between the first and second adapter blocks to transfer signals from the long probe and mitigate the impact of needle insertion.

[0017] Furthermore, the non-marking needle puncture testing device for flexible board B2B also includes:

[0018] The PCB board is located at the bottom of the buffer module and is in contact with the dual-headed probe.

[0019] Furthermore, the first adapter block is connected to the third pin mold via a first positioning pin, and the first adapter block is connected to the PCB board via a second positioning pin.

[0020] Furthermore, the first needle mold and the second needle mold are connected by a limiting copper sleeve, and a spring is provided between the first needle mold and the second needle mold.

[0021] Furthermore, a guide pin is provided between the first needle mold and the second needle mold.

[0022] This invention provides a non-marking needle puncture testing device for flexible board B2B. During product testing, a traditional needle mold module is first used. If needle marks are found, a buffer module is installed on the original needle mold. By setting the buffer module, this invention can provide different needle elasticity for different needle puncture areas of the product, and can also achieve buffering and impact elimination. Mass production verification has shown that it can effectively eliminate needle marks generated during needle mold testing, improve test yield, enhance the applicability of different types of needle molds, and improve the compatibility of different types of B2B products. Attached Figure Description

[0023] Figure 1 An exploded view of the non-marking needle test device for flexible board B2B provided in an embodiment of this utility model;

[0024] Figure 2 A perspective view of the non-marking needle puncture test device for flexible board B2B provided in an embodiment of this utility model;

[0025] Figure 3 Here is a structural diagram of the existing testing equipment;

[0026] Figure 4 An exploded view of the buffer module provided in an embodiment of this utility model;

[0027] 1. First needle mold; 2. Second needle mold; 3. Support column; 4. Third needle mold; 5. Long probe; 6. PCB board; 7. Limiting copper sleeve; 8. Spring; 9. Guide pin; 10. First adapter block; 11. Second adapter block; 12. Double-headed probe; 13. First positioning pin; 14. Second positioning pin. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0029] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but unless otherwise stated, these elements are not limited by these terms. These terms are used only to distinguish one element from another.

[0030] like Figure 1 and 2 As shown, in one embodiment, a non-marking needle puncture testing device for flexible B2B is proposed, the non-marking needle puncture testing device for flexible B2B includes:

[0031] The first needle mold 1 is provided with a station for placing the flexible plate;

[0032] The second needle mold 2 is disposed at the bottom of the first needle mold 1 and is floatingly connected to the first needle mold 1;

[0033] Support column 3;

[0034] The third needle mold 4 is connected to the second needle mold 2 via the support column 3;

[0035] The long probe 5 is confined within the third needle mold 4 and is used to contact the test point on the flexible plate;

[0036] A buffer module, located at the bottom of the third needle mold 4, is used to transfer the signal of the long probe 5 and reduce the impact of the needle insertion.

[0037] PCB board 6 is located at the bottom of the buffer module and is connected to and in contact with the dual-headed probe 12.

[0038] In this embodiment, the top of the first needle mold 1 is provided with a recessed workstation for positioning the flexible plate. The connection between the first needle mold 1 and the second needle mold 2 is an elastic floating connection: the first needle mold 1 and the second needle mold 2 are connected by a limiting copper sleeve 7, and a spring 8 and a guide pin 9 are provided between them, allowing the first needle mold 1 to move downward and return to its original position relative to the second needle mold 2. The support column 3 provides support and fixation. The long probe 5 is installed between the third needle mold 4 and the first needle mold 1, and the third needle mold 4 limits the ball head at the tail of the long probe 5.

[0039] Because the needle-piercing areas of the B2B products have height differences and coating variations, and existing testing equipment does not include a buffer module, such as... Figure 3 As shown, the long probes of the needle molds all have a uniform protrusion height, making it difficult to accommodate product variations. Different puncture areas of the product require different puncture elasticities, and the buffer module in this embodiment can provide different puncture elasticities, which is the first function of the buffer module. Furthermore, the needle mark phenomenon is related to the impact generated by the long probe 5 during puncture in the designated B2B area. During testing, a pressure block, driven by a cylinder, presses against the first needle mold 1 at a certain speed until the first needle mold 1 and the second needle mold 2 are completely adhered. The process from the initial position to complete adhesion of the first needle mold 1 and the second needle mold 2 is the puncture process. The puncture impact transfers energy from the long probe 5 to the B2B; therefore, the second function of the buffer module is to buffer and eliminate impact.

[0040] Regarding the first function mentioned above, namely providing different elasticity levels, this embodiment provides a corresponding technical solution. Specifically, as follows... Figure 4 As shown, the buffer module includes:

[0041] The first adapter block 10 is disposed at the bottom of the third needle mold 4;

[0042] The second adapter block 11 is disposed at the bottom of the first adapter block 10;

[0043] A dual-headed probe 12 is disposed between the first adapter block 10 and the second adapter block 11, and is used to transfer the signal of the long probe 5 and reduce the impact of the needle insertion. The dual-headed probe 12 is provided with at least two different specifications.

[0044] In this embodiment, the PCB board 6 is disposed at the bottom of the buffer module and is in contact with the dual-headed probe 12. The second adapter block 11 is disposed between the PCB board 6 and the first adapter block 10. The first adapter block 10 is connected to the third needle mold 4 by a first positioning pin 13, and the first adapter block 10 is connected to the PCB board 6 by a second positioning pin 14.

[0045] In this embodiment, after the traditional needle mold test is completed, if the product quality inspection finds needle marks, a buffer module is installed at the bottom of the third needle mold 4. The positioning hole of the buffer module aligns with the first positioning pin 13 of the third needle mold 4, and the first positioning pin 13 of the buffer module aligns with the positioning block of the PCB board 6, and the screws are tightened. Double-headed probes 12 with different elasticity specifications are added between the long probes 5 in different needle-piercing areas and the PCB board 6 for connection, eliminating the impact force during the needle-piercing process and ensuring different needle-piercing elasticity in different areas to suit the product.

[0046] Working principle:

[0047] During testing, the flexible board is placed in the first pin mold 1 station to position the product and B2B. The second pin mold 2 is fixed on the machine base, while the first pin mold 1 and the second pin mold 2 can float. A pressure block, driven by a cylinder, presses onto the first pin mold 1 at a certain speed until the first pin mold 1 and the second pin mold 2 are completely aligned. At this point, the long probe 5 inserts a specified number of pins into the designated pinning area of ​​the B2B. The upper end of the long probe 5 is connected to the product's pin point, and the lower end is connected to the pin point on the PCB board 6 via a double-headed probe 12. Then, the PCB board 6 is connected to the test motherboard via a ribbon cable, allowing ICT testing of the product's circuitry. After the test, the pressure block, driven by the cylinder, moves away from the first pin mold 1, and the first pin mold 1, under the action of the spring 8, moves away from the second pin mold 2, reaching the limiting surface. At this point, the test ends.

[0048] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

[0050] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A non-marking needle puncture testing device for flexible board B2B, characterized in that, The non-marking needle puncture test device for flexible board B2B includes: The first needle mold has a station for placing the flexible plate; The second needle mold is disposed at the bottom of the first needle mold and is floatingly connected to the first needle mold; Support column; The third needle mold is connected to the second needle mold via the support column; A long probe, confined within the third needle mold, is used to contact the test points on the flexible plate; A buffer module, located at the bottom of the third needle mold, is used to transfer the signal of the long probe and reduce the impact of the needle insertion.

2. The non-marking needle puncture testing device for flexible board B2B according to claim 1, characterized in that, The buffer module includes: The first adapter block is located at the bottom of the third needle mold; The second adapter block is located at the bottom of the first adapter block; A dual-headed probe is positioned between the first and second adapter blocks to transfer signals from the long probe and mitigate the impact of needle insertion.

3. The non-marking needle puncture testing device for flexible board B2B according to claim 2, characterized in that, The dual-headed probe is available in at least two different specifications.

4. The non-marking needle puncture testing device for flexible board B2B according to claim 3, characterized in that, The non-marking needle puncture test device for flexible board B2B also includes: The PCB board is located at the bottom of the buffer module and is in contact with the dual-headed probe.

5. The non-marking needle puncture testing device for flexible board B2B according to claim 4, characterized in that, The first adapter block is connected to the third pin mold via a first positioning pin, and the first adapter block is connected to the PCB board via a second positioning pin.

6. The non-marking needle puncture testing device for flexible board B2B according to claim 1, characterized in that, The first needle mold and the second needle mold are connected by a limiting copper sleeve, and a spring is provided between the first needle mold and the second needle mold.

7. The non-marking needle puncture testing device for flexible board B2B according to claim 6, characterized in that, A guide pin is also provided between the first needle mold and the second needle mold.

Images