Testing device for split single chip of wafer

Abstract

The utility model provides a testing device for a split single chip of a wafer, which comprises a base platform, a placing platform is arranged on the base platform, and the top end of the placing platform is provided with a chip profiling groove for placing a single chip to be tested; a single-probe head is arranged on the single-probe seat, and the single-probe seat is used for being electrically connected with a to-be-tested single chip and enabling the single chip to emit light; the optical coupling test group comprises an optical fiber array which is detachably arranged, and the optical fiber array is aligned with the light outlet of the single chip to be tested; the first camera is vertically arranged at the top of the placement table, a lens of the first camera faces downwards, and the first camera is used for observing the position of the single chip to be detected; the second camera is obliquely arranged on the outer side of the placement table, a lens faces the placement table, and the second camera is used for observing the position of the single-probe head and the position of the optical fiber array. According to the utility model, by improving the structure, a function testing device for a single chip is formed, optocoupler and function testing can be flexibly carried out on the single chip to be tested by matching and assembling, the installation is convenient and fast, the automation degree is high, and the cost is low.

Description

Technical Field

[0001] This utility model relates to the field of wafer chip testing technology, specifically, it demonstrates a testing device for individual chips on a wafer. Background Technology

[0002] Chip packaging and testing is the process of cutting a manufactured wafer into individual chips and connecting the chips to external circuits through packaging technology, while providing protection and support.

[0003] Wafer dicing is the first step in chip packaging and testing, and it is also a key step in separating the chips on the wafer into independent individuals. After dicing, the wafer is divided into many tiny chips (dies), which will then enter the next packaging process. Packaging and testing is the last step in chip packaging and testing, and it is also an important step in ensuring product quality. Packaging and testing mainly includes functional testing, performance testing, and reliability testing.

[0004] Functional testing verifies whether the packaged chip can perform all the functions specified in the design specifications. During testing, specific test vectors are input to the chip, and the chip's output response is observed to see if it meets expectations. This dynamic testing simulates signal changes under real-world operating conditions to verify the chip's dynamic performance.

[0005] However, most existing chip testing equipment is designed for functional testing of the entire wafer and cannot be well used for testing individual chips after wafer dicing. Moreover, the equipment has a low degree of automation, and most testing operations need to be performed manually. Utility Model Content

[0006] The purpose of this invention is to provide a testing device for individual chips on a wafer, which has a simple and reliable structure and improves efficiency.

[0007] The technical solution is as follows:

[0008] A test apparatus for separate single chips on a wafer includes a base, on which:

[0009] The placement stage has a chip contour slot at its top for placing a single chip to be tested;

[0010] A single probe holder is located on the first outer side of the placement stage. A single probe head is provided on the single probe holder for electrical connection with the single chip under test and to make the single chip emit light.

[0011] The optical coupling test group is located on the second outer side of the placement stage. The optical coupling test group includes a detachable fiber array, which is aligned with the light output port of the single chip under test.

[0012] The first camera, which is vertically mounted on the top of the placement stage with its lens pointing downwards, is used to observe the position of the individual chip under test;

[0013] The second camera, which is tilted and positioned on the outer side of the placement stage with its lens facing the placement stage, is used to observe the position of the single probe head and the position of the fiber optic array.

[0014] Optionally, the horizontal position and angle of the placement platform on the base are adjustable; the bottom end of the placement platform is provided with a first rotating platform that can adjust its rotation angle. The first rotating platform is set on the base via a first two-dimensional adjustment platform, which is used to adjust the position of the placement platform in two-dimensional space.

[0015] Optionally, the horizontal and vertical positions of the single probe holder on the base are adjustable; the single probe holder is connected to a second two-dimensional adjustment stage, which is connected to a three-dimensional adjustment stage, and the three-dimensional adjustment stage is mounted on the base via a base. The three-dimensional adjustment stage is used to adjust the position of the single probe head relative to the single chip under test on the placement stage, and the second two-dimensional adjustment stage is used to adjust the single probe head to make it contact the single chip under test to achieve power-on.

[0016] Optionally, the optical coupling test assembly further includes a main arm and a clamping rotating arm. The middle part of the clamping rotating arm is hinged to the main arm, and a spring that is always in a compressed state is provided between the rear part of the clamping rotating arm and the main arm. The head end of the main arm is provided with a receiving slot, and a pressing body is correspondingly provided at the head end of the clamping rotating arm. In the initial state, the pressing body is always in contact with the receiving slot. The fiber array is clamped and fixed between the receiving slot and the pressing body in a certain posture, making the assembly and disassembly of the fiber array convenient.

[0017] The optical coupling test group is adjustable in its horizontal, vertical, and angular positions on the base. It is connected to a third two-dimensional adjustment stage, which in turn is connected to a second rotating stage. The second rotating stage is connected to a three-axis motion platform, which is mounted on the base. The three-axis motion platform allows for significant positional adjustments of the fiber optic array in the vertical, horizontal, and forward / backward directions, bringing the fiber optic array approximately close to the chip under test. The second rotating stage adjusts the angular position of the fiber optic array's input end relative to the chip under test, and the third two-dimensional adjustment stage adjusts the fiber optic array to ensure it fully receives the light emitted by the chip under test.

[0018] Optionally, the horizontal position of the first camera on the base is adjustable; the first camera is connected to a fourth two-dimensional adjustment stage, which is mounted on the base via a gantry. The height of the first camera remains constant, and the fourth two-dimensional adjustment stage is used to adjust the relative position of the first camera lens and the single chip under test in terms of front-back and left-right directions.

[0019] Optionally, the angle of the second camera on the base is adjustable; the second camera is connected to a third rotating stage, which is mounted on the base via a side frame. The third rotating stage is used to adjust the lens of the second camera so that it can fully illuminate the single probe head, the single chip under test, and the fiber array.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model improves the structure to form a functional testing device for a single chip. By combining and assembling a single probe head, fiber array, first camera, second camera, etc., it can flexibly perform optical coupling and functional testing on the single chip under test. It is easy and quick to install, has a high degree of automation, and is low in cost. Attached Figure Description

[0021] Figure 1 This is an overall schematic diagram of a test device for a single chip on a wafer, according to an embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of the placement platform portion according to an embodiment of the present utility model;

[0023] Figure 3 This is a schematic diagram of the single probe holder portion of an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the optical coupling test group section of an embodiment of the present invention;

[0025] Figure 5 for Figure 4 A schematic diagram of the main arm section;

[0026] Figure 6 This is a schematic diagram of the first camera and the second camera in an embodiment of the present invention;

[0027] The relevant markings in the attached diagram are as follows: 1-Base, 2-Placement stage, 3-Single probe holder, 4-Optical coupling test group, 5-First camera, 6-Second camera; 21-Chip contouring slot, 22-First rotating stage, 23-First two-dimensional adjustment stage; 31-Single probe head, 32-Second two-dimensional adjustment stage, 33-Three-dimensional adjustment stage, 34-Base; 41-Main arm, 411-Receiving slot, 42-Clamping rotating arm, 421-Pressing body, 43-Spring component, 44-Third two-dimensional adjustment stage, 45-Second rotating stage, 46-Three-axis motion platform, 47-Fiber optic array; 51-Fourth two-dimensional adjustment stage, 52-Gantry, 61-Third rotating stage, 62-Side frame. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] This utility model provides a testing device for separate individual chips on a wafer, which solves the technical problems mentioned in the background art. For example... Figure 1 As shown, specifically, it includes a horizontal base 1, on which a placement stage 2, a single probe holder 3, an optical coupler and test group 4, a first camera 5, and a second camera 6 are respectively arranged. The single probe holder 3, the optical coupler and test group 4, the first camera 5, and the second camera 6 are all arranged at a height higher than the top of the placement stage 2.

[0030] See Figure 2 As shown, the top center of the placement stage 2 has an inwardly recessed chip contour slot 21 for placing the single chip under test. Specifically, in practice, the horizontal position and angle of the placement stage 2 on the base 1 can be designed to be adjustable to a small extent. Specifically, a first rotating platform 22 with adjustable rotation angle can be provided at the bottom of the placement stage 2. The first rotating platform 22 is mounted on the base via a first two-dimensional adjustment platform 23. The first two-dimensional adjustment platform 23 is used to adjust the front-back and left-right positions of the placement stage 2 in two-dimensional space. The first rotating platform 22 adjusts the horizontal angle of the placement stage 2, thereby achieving the adjustment of the horizontal position and angle of the single chip under test.

[0031] See Figure 3 As shown. The single probe holder 3 is located on the upper left side of the placement stage 2. A single probe head 31 is mounted on the single probe holder 3, which can be electrically connected to the electrodes of the single chip under test, i.e., used to electrically connect to the single chip under test and enable the single chip to emit light. Specifically, in implementation, the horizontal and vertical positions of the single probe holder 3 on the base 1 can be designed to be adjustable to a small extent. Specifically, the single probe holder 3 is connected to a second two-dimensional adjustment stage 32, which in turn is connected to a three-dimensional adjustment stage 33. The three-dimensional adjustment stage 33 is then mounted on the base 1 via a base 34. The three-dimensional adjustment stage can be used to adjust the position of the single probe head relative to the single chip under test on the placement stage, mainly achieving a larger range of adjustment, while the second two-dimensional adjustment stage can be used to adjust the single probe head to make contact with the single chip under test to achieve power-on, mainly achieving a smaller range of adjustment.

[0032] See Figure 4 and Figure 5As shown. The optical coupling test group 4 is located on the right side of the placement stage 2. The optical coupling test group 4 includes a detachable fiber optic array 47, which is the FA. The fiber optic array 47 is used to align with the light output port of the single chip under test so as to fully receive the light emitted by the single chip under test after it is powered on. The optical coupling test group 4 also includes a main arm 41 and a clamping rotating arm 42. The middle part of the clamping rotating arm 42 is hinged to the main arm 41, and a spring 43 that is always in a compressed state is provided between the rear part of the clamping rotating arm 42 and the main arm 41. Under the compression of the spring 43, the main arm 41 and the clamping rotating arm 42 finally form a "clamp" structure. The head end of the main arm 41 is provided with a receiving slot 411, and a pressing body 421 is provided correspondingly at the head end of the clamping rotating arm 42. In the initial state, the pressing body 421 is always in contact with the receiving slot 411. The fiber array 47 is partially inserted into the receiving slot 411 in a certain posture and is finally clamped and fixed between the receiving slot 411 and the pressing body 421, which makes the disassembly and assembly of the fiber array 47 convenient.

[0033] In specific implementation, the horizontal, vertical, and angular positions of the optical coupling test group 4 on the base 1 can all be designed to be adjustable. Specifically, the optical coupling test group 4 is connected to a three-dimensional adjustment stage 44, with the main arm 41 fixedly mounted on the three-dimensional adjustment stage 44 in an almost horizontal position. The three-dimensional adjustment stage 44 is connected to a second rotating platform 45, which in turn is connected to a three-axis motion platform 46, which is mounted on the base 1. The three-axis motion platform is used to achieve significant positional adjustments of the fiber array in the vertical, horizontal, and front-back directions, bringing the fiber array approximately close to the chip under test. The second rotating platform is used to adjust the angular position of the fiber array's input end relative to the chip under test, and the three-dimensional adjustment stage is used to adjust the fiber array so that it can fully receive the light emitted by the chip under test.

[0034] See Figure 6 As shown. The first camera 5 is vertically mounted on top of the placement stage 2 with its lens pointing downwards, primarily used to observe the position of the individual chip under test on the placement stage 2. Specifically, in this implementation, the horizontal position of the first camera 5 on the base 1 can be designed to be slightly adjustable; specifically, the first camera 5 is connected to a four-dimensional adjustment platform 51, which is mounted on the base 1 via a gantry frame 52. The height of the first camera remains constant, and the four-dimensional adjustment platform is used to adjust the relative position of the first camera lens and the individual chip under test in terms of front-back and left-right movements.

[0035] Continue reading Figure 6The second camera 6 is tilted and positioned at the lower left side of the placement stage 2, with its lens facing the stage 2. It is used to observe the position of the single probe head and the fiber optic array relative to the chip under test. Specifically, the angle of the second camera 6 on the base 1 can be designed to be slightly adjustable. The second camera 6 is connected to a third rotating stage 61, which is mounted on the base 1 via a side bracket 62. The third rotating stage is used to adjust the lens of the second camera so that it can fully illuminate the single probe head, the chip under test, and the fiber optic array. This allows for subsequent control of the single probe head to contact and power on the chip under test, and for positioning the fiber optic array to fully receive the chip's light emission signal.

[0036] It should be noted that, in this embodiment, the first and second rotary stages mentioned above both adopt existing precision rotary slides, which can achieve precise adjustment of the rotation angle; the first, second, third, and fourth two-dimensional adjustment stages can all adopt existing XY dual-axis precision slides, which can achieve precise adjustment of translation; the three-dimensional adjustment stage adopts existing XYZ three-axis precision slides, which can achieve precise adjustment of translation and lifting; and the three-axis motion platform is a conventional three-axis linear motion module.

[0037] This invention, through the aforementioned improved structure, forms a functional testing device for a single chip. By assembling a single probe head, fiber optic array, first camera, second camera, etc., it can flexibly perform optical coupling and functional testing on the single chip under test. The first camera positions the single chip under test on the stage, while the second camera observes the positions of the single probe head and fiber optic array relative to the single chip under test. The external image system performs various calculations on the image signals acquired by the first and second cameras, and then controls the movement of the single probe head and fiber optic array based on the judgment results. This achieves precise control, ensuring that the single probe head can contact the single chip under test and complete the power-on, and ensuring that the position of the fiber optic array can receive the power-on and light-emitting signal of the single chip under test.

[0038] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A test apparatus for separate single chips on a wafer, comprising a base (1), characterized in that, The base (1) is provided with: The placement platform (2) has a chip contouring groove (21) at its top for placing a single chip to be tested; A single probe holder (3) is located on the first outer side of the placement stage (2). A single probe head (31) is provided on the single probe holder (3) for electrically connecting with the single chip to be tested and making the single chip emit light. Optical coupling test group (4) is located on the second outer side of the placement stage (2). The optical coupling test group (4) includes a detachable fiber array (47) which is aligned with the light output port of the single chip under test. The first camera (5) is vertically mounted on the top of the placement stage (2) with its lens pointing downwards, and is used to observe the position of the single chip to be tested; The second camera (6) is tilted on the third outer side of the placement stage (2) with its lens facing the placement stage (2) and is used to observe the position of the single probe head and the position of the fiber array.

2. The testing device for separate individual chips on a wafer according to claim 1, characterized in that, The horizontal position and angle of the placement platform (2) on the base (1) are adjustable; the bottom end of the placement platform (2) is provided with a first rotating platform (22) that can adjust its rotation angle. The first rotating platform (22) is set on the base (1) through a first two-dimensional adjustment platform (23). The first two-dimensional adjustment platform (23) is used to adjust the position of the placement platform (2) in two-dimensional space.

3. The testing device for separate individual chips on a wafer according to claim 1, characterized in that, The single probe base (3) can be adjusted in both horizontal and vertical positions on the base (1); the single probe base (3) is connected to the second two-dimensional adjustment stage (32), the second two-dimensional adjustment stage (32) is connected to the three-dimensional adjustment stage (33), and the three-dimensional adjustment stage (33) is set on the base (1) through the base (34).

4. The testing device for separate individual chips on a wafer according to claim 1, characterized in that, The optical coupling test group (4) also includes a main arm (41) and a clamping rotating arm (42). The middle part of the clamping rotating arm (42) is hinged to the main arm (41), and a spring (43) that is always in a compressed state is provided between the rear part of the clamping rotating arm (42) and the main arm (41). The head end of the main arm (41) is provided with a receiving slot (411), and a pressing body (421) is provided correspondingly at the head end of the clamping rotating arm (42). In the initial state, the pressing body (421) is always in contact with the receiving slot (411).

5. The testing apparatus for separate individual chips on a wafer according to claim 4, characterized in that, The optical coupling test group (4) can be adjusted in horizontal position, vertical position and angle on the base (1); the optical coupling test group (4) is connected to the third two-dimensional adjustment stage (44), the third two-dimensional adjustment stage (44) is connected to the second rotating stage (45), the second rotating stage (45) is connected to the three-axis motion platform (46), and the three-axis motion platform (46) is set on the base (1).

6. The testing apparatus for separate individual chips on a wafer according to claim 1, characterized in that, The horizontal position of the first camera (5) on the base (1) is adjustable; the first camera (5) is connected to the fourth two-dimensional adjustment platform (51), which is set on the base (1) through the gantry (52).

7. The testing apparatus for separate individual chips on a wafer according to claim 1, characterized in that, The angle of the second camera (6) on the base (1) is adjustable; the second camera (6) is connected to the third rotating platform (61), which is mounted on the base (1) via a side frame (62).

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