LED lamp bead aging substrate

Abstract

The utility model discloses an LED lamp bead aging substrate, which relates to the technical field of LED lamp beads, and comprises a bottom sealing plate, an aging plate and a top sealing plate which are sequentially arranged from bottom to top, a plurality of groups of uniformly distributed LED welding spots are arranged in the middle of the top of the aging plate, a pair of power supply wiring welding spots are arranged on one side of the top of the aging plate, and the power supply wiring welding spots are arranged on the other side of the aging plate. The multiple sets of LED welding spots are connected in parallel through welding wires, and the ends of the welding wires are connected to the power supply wiring welding spots. According to the utility model, the plurality of aging point positions are arranged and are connected in parallel with the LED welding points through the welding wires, so that each lamp bead can be uniformly stressed and electrified, normal-temperature aging test and high-low-temperature aging test of the lamp beads can be realized in cooperation with the temperature control module, and compared with a traditional large-scale aging table, the aging substrate has the advantages of small size, high reliability and high reliability. Moreover, the number of testable lamp beads can be greatly increased, and the testing efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and in particular to an LED lamp bead aging substrate. Background Technology

[0002] In the current field of LED chip testing technology, the cost of reliability aging tests for LED chips has always been a relatively high issue. The currently popular testing methods on the market are to conduct LED chip aging tests through high-temperature aging benches and room-temperature aging benches. However, existing high-temperature aging benches and room-temperature aging benches need to be customized separately. Most companies need to customize special LED aging benches to complete this test, which not only consumes money, but also increases the complexity and time cost of the test work. Moreover, these aging test equipment can usually only age 20 to 40 chips at a time, which cannot be used for large-scale testing and limits work efficiency. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides an LED lamp bead aging substrate, which solves the technical problems mentioned in the background section.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an LED lamp bead aging substrate, comprising a bottom sealing plate, an aging plate, and a top sealing plate arranged sequentially from bottom to top. Multiple sets of evenly distributed LED solder joints are arranged at the center of the top of the aging plate. A pair of power connection solder joints are arranged on one side of the top of the aging plate. The multiple sets of LED solder joints are connected in parallel by solder wires, the ends of which are connected to the power connection solder joints. Multiple aging points aligned with the LED solder joints are installed on the top of the top sealing plate. The aging points are soldered to the LED solder joints. Multiple temperature control modules connected to the LED solder joints are inserted inside the aging plate.

[0005] Furthermore, the temperature control module is equipped with heating elements and cooling elements.

[0006] Furthermore, the bottom of the temperature control module is provided with an integrally formed abutment plate, the width of which is greater than the width of the temperature control module.

[0007] Furthermore, a baffle is provided between each pair of adjacent abutment plates, and fastening bolts are threaded onto both ends of the baffle, which are installed at the bottom of the aging plate.

[0008] Furthermore, the number of aging points is 100, and the aging points are distributed in a 10×10 square array.

[0009] Furthermore, positioning holes are provided at the three corners of the bottom sealing plate, aging plate, and top sealing plate.

[0010] Furthermore, the top sealing plate is bolted to the bottom of the aging plate.

[0011] By employing the above technical solution, this utility model provides an LED lamp bead aging substrate, which has at least the following beneficial effects:

[0012] 1. This utility model sets multiple aging points and connects them in parallel with LED solder joints to ensure that each LED bead is evenly stressed and powered. With the temperature control module, it can perform room temperature aging tests and high and low temperature aging tests on the LED beads. Compared with traditional large aging benches, this aging substrate is not only small in size, easy to carry and use, but also greatly increases the number of LED beads that can be tested, thus improving testing efficiency.

[0013] 2. This utility model separates multiple temperature control modules, allowing the removal of the baffle plate to take out the corresponding temperature control module when individual temperature control modules are aging or damaged. This enables the replacement of specific temperature control modules without affecting other modules, saving usage costs and extending service life. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the wire bonding connection of this utility model;

[0017] Figure 3 This is a schematic diagram of the temperature control module structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the baffle structure of this utility model;

[0019] Figure 5 This is a schematic diagram of the bottom structure of the aging board of this utility model;

[0020] Figure 6 This is a partial cross-sectional view of the aging board of this utility model.

[0021] In the diagram: 1. Bottom sealing plate; 2. Aging plate; 201. LED solder joint; 202. Power supply wiring solder joint; 203. Welding wire; 204. Temperature control module; 2041. Heating element; 2042. Cooling element; 205. Abutment plate; 206. Baffle plate; 207. Fastening bolt; 3. Top sealing plate; 301. Aging point; 4. Positioning hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In the current field of LED chip testing technology, existing technologies use high-temperature aging benches and room-temperature aging benches to conduct LED chip aging tests. However, existing high-temperature aging benches and room-temperature aging benches need to be customized separately. Most companies need to customize special LED aging benches to complete this test, which not only consumes money, but also increases the complexity and time cost of the test work. Moreover, these aging test equipment can usually only age 20 to 40 chips at a time, which cannot be used for large-scale testing and limits work efficiency.

[0024] To resolve the defects observed during the use of the aforementioned aging bench, please refer to [link / reference needed]. Figures 1-6The LED lamp bead aging substrate provided by this utility model can not only reduce the cost of aging tests, but also increase the number of lamp beads that can be tested for aging. The aging substrate is based on a bottom sealing plate 1, an aging plate 2, and a top sealing plate 3 arranged sequentially from bottom to top. The modular design of the aging substrate facilitates assembly, disassembly, and maintenance. Multiple sets of evenly distributed LED solder points 201 are located at the center of the top of the aging plate 2. A pair of power connection solder points 202 are located on one side of the top of the aging plate 2. The multiple sets of LED solder points 201 are connected in parallel via bonding wires 203, with the ends of the bonding wires 203 connected to the power connection solder points 202. This ensures that all LEDs are evenly powered, avoiding voltage and current differences affecting test consistency. The top sealing plate 3 has multiple aging points 301 aligned with the LED solder points 201. These aging points 301 are soldered to the LED solder points 201. There are 100 aging points 301 arranged in a 10×10 square array, allowing up to 100 LEDs to be simultaneously mounted in parallel on the top sealing plate 3. Compared to… Compared to traditional aging substrates, this method can significantly increase the number of LED chips that can be tested during aging. The aging board 2 has multiple temperature control modules 204 connected to LED solder points 201. The temperature control modules 204 can perform room temperature aging and high and low temperature aging on the LED chips. The aging substrate is also equipped with an adjustable power supply. 100 LED chips are attached to the aging points 301 and connected in parallel through the bonding wires 203 and LED solder points 201 to ensure that each LED chip is evenly stressed and powered. Then, by connecting an external adjustable power supply, various aging tests can be performed without being limited by the voltage and current of the LED chips. At the same time, because the aging substrate is small in size, it can be easily carried and used by one person, and the substrate can be reused multiple times, which greatly reduces the experimental cost. At the same time, it ensures experimental results similar to those of a high-temperature aging bench. Compared with traditional large aging benches, this aging substrate saves more space and labor costs and is suitable for laboratory or field testing.

[0025] To achieve the desired aging effect of the aging substrate on the LED beads at both room temperature and high and low temperatures, a heating element 2041 and a cooling element 2042 are provided on the temperature control module 204 to realize integrated high and low temperature aging, reduce customization costs, and meet diverse testing needs.

[0026] Reference Figure 1 As shown, positioning holes 4 are provided at the three corners of the bottom sealing plate 1, aging plate 2 and top sealing plate 3 to facilitate the installation and alignment of the aging substrate.

[0027] Example 2

[0028] After prolonged use, some temperature control modules 204 may age or malfunction, affecting temperature control performance. For easy replacement of temperature control modules 204, please refer to [the instructions]. Figures 4-6As shown, an integrally formed abutment plate 205 is provided at the bottom of the temperature control module 204. The width of the abutment plate 205 is greater than the width of the temperature control module 204, allowing for individual disassembly and replacement of the temperature control module 204 when it is damaged, without replacing the entire substrate, thus reducing maintenance costs. During installation, the temperature control module 204 is inserted into the aging board 2 from bottom to top until the abutment plate 205 abuts against the aging board 2. A baffle plate 206 is provided between each pair of adjacent rows of abutment plates 205, and fastening bolts 207 are threaded onto both ends of the baffle plate 206. 7 is installed at the bottom of the aging plate 2, and then the baffle 206 is installed at the bottom of the aging plate 2 with the fastening bolt 207. The baffle 206 can prevent the abutment plate 205 from falling off, thereby fixing the temperature control module 204, avoiding displacement, ensuring temperature uniformity and test reliability. When the temperature control module 204 is damaged, simply remove the baffle 206 to take out the corresponding temperature control module 204 and replace the temperature control module 204 separately without affecting other modules. This not only simplifies the maintenance process, but also saves on usage costs and extends service life.

[0029] For easy disassembly of baffle 206, refer to... Figure 1 As shown, the top sealing plate 3 is installed at the bottom of the aging plate 2 with bolts. The top sealing plate 3 can protect the temperature control module 204 inside the aging plate. The bolts also facilitate its installation and disassembly, making maintenance convenient.

[0030] The control method of this utility model is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail.

[0031] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED lamp bead aging substrate, characterized in that: The device includes a bottom sealing plate (1), an aging plate (2), and a top sealing plate (3) arranged sequentially from bottom to top. The aging plate (2) has multiple sets of evenly distributed LED solder joints (201) at the center of its top. The aging plate (2) has a pair of power connection solder joints (202) on one side of its top. The multiple sets of LED solder joints (201) are connected in parallel by a solder wire (203). The end of the solder wire (203) is connected to the power connection solder joint (202). The top of the top sealing plate (3) has multiple aging points (301) aligned with the LED solder joints (201). The aging points (301) are soldered to the LED solder joints (201). The aging plate (2) has multiple temperature control modules (204) connected to the LED solder joints (201) inserted inside its interior.

2. The LED lamp bead aging substrate according to claim 1, characterized in that: The temperature control module (204) is equipped with a heating element (2041) and a cooling element (2042).

3. The LED lamp bead aging substrate according to claim 1, characterized in that: The bottom of the temperature control module (204) is provided with an integrally formed abutment plate (205), the width of which is greater than the width of the temperature control module (204).

4. The LED lamp bead aging substrate according to claim 3, characterized in that: A baffle (206) is provided between each pair of adjacent abutment plates (205), and fastening bolts (207) are threaded onto both ends of the baffle (206). The fastening bolts (207) are installed at the bottom of the aging plate (2).

5. The LED lamp bead aging substrate according to claim 1, characterized in that: The number of aging points (301) is 100, and the aging points (301) are distributed in a 10×10 square array.

6. The LED lamp bead aging substrate according to claim 1, characterized in that: Positioning holes (4) are provided at the three corners of the bottom sealing plate (1), aging plate (2) and top sealing plate (3).

7. The LED lamp bead aging substrate according to claim 1, characterized in that: The top sealing plate (3) is bolted to the bottom of the aging plate (2).

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