3D visual sensor module with temperature control function

Abstract

The utility model discloses a 3D visual sensor module group with temperature control. The 3D visual sensor module group comprises a sensor housing, a cooling fan and a 3D visual module group. The 3D visual module comprises a 3D camera and a data processing circuit board and is arranged in the shell. An independent heat dissipation channel is arranged in the shell, the two ends of the heat dissipation channel are communicated with the outside and completely isolated from the 3D vision module, the heat conduction structure of the outer wall abuts against a heat source of the data processing circuit board, heat can be conducted into the channel, and the heat dissipation fan is arranged at one end of the channel. According to the module, through the isolation type heat dissipation channel and the heat conduction structure, electronic elements are isolated from dust, dust damage is reduced, the heat conduction efficiency is improved, the heat dissipation structure is convenient to clean and maintain, stable operation of the 3D vision sensor module is guaranteed, the service life is prolonged, and the module is suitable for multiple fields such as industrial manufacturing and intelligent transportation.

Description

Technical Field

[0001] This utility model relates to the field of visual sensor technology, and in particular to a 3D visual sensor module with temperature control. Background Technology

[0002] Currently, 3D vision sensors, as core devices for acquiring three-dimensional spatial information of objects, are widely used in industrial manufacturing, intelligent transportation, medical care, and consumer electronics. They achieve high-precision 3D modeling and detection of target objects through principles such as stereo vision, structured light, time-of-flight (ToF), and laser scanning. With the continuous expansion of application scenarios and the increasing performance requirements, the number of electronic components integrated within 3D vision sensors, such as 3D cameras and data processing circuit boards, is increasing, leading to a significant increase in heat generated during operation. Therefore, an efficient heat dissipation structure has become a key component to ensure stable operation.

[0003] However, existing 3D vision sensor heat dissipation structures have many shortcomings. On the one hand, in traditional heat dissipation methods, air comes into direct contact with electronic components, and dust easily adheres to critical electronic components such as processing chips and circuit boards. This not only affects the heat dissipation effect but may also cause short circuits and other malfunctions, reducing the reliability and lifespan of the sensor. On the other hand, existing heat dissipation structures are difficult to clean and maintain, and efficient cleaning methods cannot be adopted. After long-term use, dust accumulation becomes severe, further weakening the heat dissipation performance and making it difficult to meet the requirements of stable operation of 3D vision sensors in complex environments. Utility Model Content

[0004] The main purpose of this invention is to provide a 3D vision sensor module with temperature control, which aims to isolate the internal electronic components of the 3D vision sensor module from dust, reduce the damage of dust to the electronic components, facilitate the cleaning and maintenance of the heat dissipation structure, improve the heat conduction efficiency, ensure the stable operation of the module and extend its service life.

[0005] To achieve the above objectives, this utility model proposes a 3D vision sensor module with temperature control, comprising a sensor housing, a cooling fan, and a 3D vision module. The 3D vision module is located inside the sensor housing and includes a 3D camera and a data processing circuit board. A heat dissipation channel is fixedly connected inside the sensor housing, with both ends of the heat dissipation channel communicating with the outside of the sensor housing. The heat dissipation channel is completely isolated from the 3D vision module. The outer wall of the heat dissipation channel is provided with a heat-conducting structure, which abuts against the heat source of the data processing circuit board. The heat-conducting structure is used to conduct the heat generated by the data processing circuit board into the heat dissipation channel. The cooling fan is located at one end of the heat dissipation channel.

[0006] In one possible implementation, the heat dissipation channel has a Y-shaped or T-shaped structure, and the heat dissipation channel is provided with two air inlets and one air outlet, with the cooling fan located at the air outlet.

[0007] In one possible implementation, the thermally conductive structure includes a thermally conductive sheet and thermally conductive grease. The thermally conductive grease is applied to the heat source surface of the data processing circuit board. The thermally conductive sheet abuts against the heat source surface of the data processing circuit board. The thermally conductive grease is used to increase the thermal conductivity between the data processing circuit board and the thermally conductive sheet. The side of the thermally conductive sheet facing away from the data processing circuit board is fixedly connected to a heat dissipation channel.

[0008] In one possible implementation, heat dissipation fins are fixedly connected inside the heat dissipation channel. The heat dissipation fins are parallel to the sidewall of the heat dissipation channel and are located at the connection between the heat dissipation channel and the heat-conducting structure. The heat dissipation fins are used to increase the heat dissipation area so that the heat transferred by the heat-conducting structure can be quickly diffused.

[0009] In one possible implementation, the air inlet is equipped with a filter screen, which is detachably connected to the sensor housing, and the filter screen is used to filter impurities in the air entering the heat dissipation channel.

[0010] In one possible implementation, the filter screen has an elastic element at one end facing the outside of the sensor housing, and a fixing block is provided on the outside of the elastic element. The fixing block is embedded in the sensor housing and is used to fix the connection between the filter screen and the sensor housing. The elastic element can move towards the center of the filter screen, thereby causing the fixing block to detach from the sensor housing.

[0011] In one possible implementation, the cooling fan is detachably connected to the sensor housing, and the connection between the cooling fan and the sensor housing is secured by screws, thus achieving a detachable connection between the cooling fan and the sensor housing via screws.

[0012] The working principle and beneficial effects of this utility model are as follows:

[0013] This utility model's technical solution isolates electronic components from dust by placing the 3D vision module inside the sensor housing and completely isolating the heat dissipation channel from the 3D vision module, thus reducing dust damage to the electronic components. A heat-conducting structure is installed on the outer wall of the heat dissipation channel, and this structure comes into contact with the heat source of the data processing circuit board, efficiently transferring the heat generated by the circuit board to the heat dissipation channel. Since both ends of the heat dissipation channel are connected to the outside of the sensor housing, and a cooling fan is located at one end of the channel, the cooling fan effectively dissipates heat from the sensor housing, ensuring stable operation of the 3D vision sensor module. Complete isolation between the heat dissipation channel and the 3D vision module facilitates cleaning and maintenance of the channel, reducing the impact of dust accumulation on heat dissipation performance. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of this utility model;

[0017] Figure 3 for Figure 2 Schematic diagram of the internal structure of the heat dissipation channel;

[0018] Figure 4 This is a schematic diagram of the filter structure of this utility model.

[0019] The following are the reference numerals: 1. Sensor housing; 2. Cooling fan; 3. 3D camera; 4. Data processing circuit board; 5. Heat dissipation channel; 6. Thermal pad; 7. Thermal grease; 8. Filter; 51. Air inlet; 52. Air outlet; 53. Heat dissipation fins; 81. Elastic element; 82. Fixing block.

[0020] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] like Figures 1-4 As shown, this embodiment proposes a 3D vision sensor module with temperature control, including a sensor housing 1, a cooling fan 2, and a 3D vision module. The 3D vision module is located inside the sensor housing 1 and includes a 3D camera 3 and a data processing circuit board 4. A heat dissipation channel 5 is fixedly connected inside the sensor housing 1. Both ends of the heat dissipation channel 5 are connected to the outside of the sensor housing 1. The heat dissipation channel 5 is completely isolated from the 3D vision module. A heat-conducting structure is provided on the outer wall of the heat dissipation channel 5. The heat-conducting structure abuts against the heat source of the data processing circuit board 4. The heat-conducting structure is used to conduct the heat generated by the data processing circuit board 4 into the heat dissipation channel 5. The cooling fan 2 is located at one end of the heat dissipation channel 5.

[0023] The sensor housing 1 serves as the external protective structure for the entire 3D vision sensor module. It houses the 3D vision module, heat dissipation channel 5, and other internal components, providing installation support and physical protection to prevent damage from external impacts and wear, thus ensuring the normal operation of electronic components. Simultaneously, it isolates the heat dissipation channel 5 from the external environment, providing space for its independent operation and helping to maintain a stable internal working environment, improving the reliability and durability of the 3D vision sensor module. The cooling fan 2 is located at one end of the heat dissipation channel 5. Its rotation generates airflow, drawing cool air into the channel and simultaneously expelling hot air from the channel to the outside of the sensor housing 1, creating an air circulation that removes heat from the channel. The 3D vision module is the core component for realizing 3D vision sensing. The 3D camera 3 collects image information of the target object, acquiring its three-dimensional spatial information through principles such as stereo vision and structured light. The data processing circuit board 4 processes, analyzes, and calculates the data collected by the 3D camera 3, converting the raw image information into usable three-dimensional data and outputting it to external devices. The heat dissipation channel 5 is connected to the outside of the sensor housing 1 and completely isolated from the 3D vision module. As an independent heat transfer path, it receives heat generated by the data processing circuit board 4 conducted by the heat-conducting structure and exhausts it to the outside of the sensor housing 1 via the cooling fan 2. The heat dissipation channel 5 forms an independent heat dissipation system, preventing direct contact between air and the electronic components in the 3D vision module during heat dissipation, preventing dust from adhering to the electronic components, ensuring the cleanliness of the electronic components, and reducing the risk of malfunctions caused by dust. At the same time, the independent heat dissipation channel 5 facilitates maintenance and cleaning, allowing for more efficient cleaning methods, maintaining good heat dissipation performance, and ensuring stable operation of the 3D vision sensor module. The heat-conducting structure is located on the outer wall of the heat dissipation channel 5 and comes into contact with the heat source of the data processing circuit board 4. Its main function is to quickly and efficiently conduct the heat generated by the data processing circuit board 4 during operation to the heat dissipation channel 5, realizing the transfer of heat from the electronic components to the heat dissipation channel 5.

[0024] In this embodiment, the heat dissipation channel 5 has a Y-shaped or T-shaped structure. The heat dissipation channel 5 is provided with two air inlets 51 and one air outlet 52. The cooling fan 2 is located at the air outlet 52.

[0025] The heat dissipation channel 5 adopts a Y-shaped or T-shaped structure, giving the channel multiple branch paths. This alters the airflow path and distribution within the channel, breaking away from the single airflow direction of traditional straight-tube channels. This allows the air entering the channel to be more evenly distributed across various areas, coming into contact with more heat conducted by the heat-conducting structures. The multiple branches formed by the Y-shaped or T-shaped structure enable heat to be carried away by air over a larger area, enhancing the channel's ability to handle heat from different locations. This further improves the heat dissipation performance of the 3D vision sensor module, ensuring temperature uniformity of the internal electronic components and reducing performance loss due to temperature differences. The two air inlets 51 increase the amount of air entering, allowing more cool air to simultaneously enter the channel, providing a sufficient cooling source. Simultaneously, the two air inlets 51 allow air to enter the channel from different directions, improving air distribution within the channel and preventing airflow dead zones. An air outlet 52 concentrates and discharges the hot air that has fully exchanged heat with the heat dissipation channel 5, forming a unified airflow path, which is convenient to cooperate with the cooling fan 2. Under the action of the cooling fan 2, the hot air is efficiently discharged to the outside of the sensor housing 1.

[0026] In this embodiment, the thermal conductive structure includes a thermal conductive sheet 6 and thermal conductive grease 7. The thermal conductive grease 7 is applied to the heat source surface of the data processing circuit board 4. The thermal conductive sheet 6 abuts against the heat source surface of the data processing circuit board 4. The thermal conductive grease 7 is used to increase the thermal conductivity between the data processing circuit board 4 and the thermal conductive sheet 6. The side of the thermal conductive sheet 6 facing away from the data processing circuit board 4 is fixedly connected to the heat dissipation channel 5.

[0027] Thermal grease 7 is applied to the heat source surface of the data processing circuit board 4, filling the tiny gaps and unevenness between the heat source surface of the data processing circuit board 4 and the heat sink 6. Since the surface of electronic components is not perfectly flat, these gaps are usually filled with air, which has poor thermal conductivity and hinders heat transfer. Thermal grease 7 fills these gaps, allowing for closer contact between the heat source of the data processing circuit board 4 and the heat sink 6. The heat sink 6 is in close contact with the heat source surface of the data processing circuit board 4, which is coated with thermal grease 7, receiving the heat conducted from the data processing circuit board 4. Simultaneously, the side of the heat sink 6 facing away from the data processing circuit board 4 is fixedly connected to the heat dissipation channel 5, further conducting the absorbed heat into the heat dissipation channel 5, acting as a bridge for heat transfer between the data processing circuit board 4 and the heat dissipation channel 5. The heat sink 6 efficiently transfers heat from the data processing circuit board 4 to the heat dissipation channel 5, achieving rapid heat transfer. The presence of the heat-conducting sheet 6 allows heat to be conducted over a larger area, avoiding local heat concentration and helping to distribute heat more evenly into the heat dissipation channel 5. Together with the heat dissipation channel 5 and the cooling fan 2, it effectively improves the heat dissipation capacity of the 3D vision sensor module, maintains the temperature balance inside the module, ensures that the electronic components in the 3D vision module are in a suitable operating temperature environment, and extends the service life of the module.

[0028] In this embodiment, a heat dissipation fin 53 is fixedly connected inside the heat dissipation channel 5. The heat dissipation fin 53 is parallel to the side wall of the heat dissipation channel 5 and is located at the connection between the heat dissipation channel 5 and the heat conduction structure. The heat dissipation fin 53 is used to increase the heat dissipation area so that the heat transferred by the heat conduction structure can be quickly diffused.

[0029] The heat sink fins 53 significantly increase the heat dissipation area inside the heat dissipation channel 5 through their sheet-like structure. When the heat-conducting structure transfers the heat generated by the data processing circuit board 4 to the heat dissipation channel 5, the heat sink fins 53 can quickly absorb this heat and diffuse it into the surrounding air. The heat sink fins 53 significantly improve heat dissipation efficiency, allowing heat to dissipate more quickly from the heat dissipation channel 5. The design parallel to the sidewall optimizes the airflow path, guiding airflow more smoothly through the gaps between the heat sink fins 53, enhancing the heat exchange effect. This structure not only accelerates the cooling speed of the data processing circuit board 4 but also evens out the temperature distribution within the heat dissipation channel 5, preventing localized overheating from damaging electronic components.

[0030] In this embodiment, an air inlet 51 is provided with a filter 8, which is detachably connected to the sensor housing 1. The filter 8 is used to filter impurities in the air entering the heat dissipation channel 5. An elastic element 81 is provided at one end of the filter 8 facing the outside of the sensor housing 1, and a fixing block 82 is provided on the outside of the elastic element 81. The fixing block 82 is embedded in the sensor housing 1 and is used to fix the connection between the filter 8 and the sensor housing 1. The elastic element 81 can move towards the center of the filter 8, thereby causing the fixing block 82 to detach from the sensor housing 1.

[0031] The filter 8 is installed at the air inlet 51, acting as a filtration barrier for air entering the heat dissipation channel 5. It intercepts dust, particulate matter, and other impurities in the air, preventing these impurities from entering the heat dissipation channel 5 with the airflow. This prevents the impurities from contacting the heat-conducting structure within the heat dissipation channel 5 and electronic components such as the data processing circuit board 4 connected to the heat-conducting structure. The filter 8 is detachably connected to the sensor housing 1, allowing users to easily remove the filter 8 from the sensor housing 1 for cleaning or replacement when it accumulates a lot of impurities and its filtration efficiency decreases, ensuring that the filter 8 always maintains good filtration performance. The elastic element 81 cooperates with the fixing block 82. When the filter 8 is inserted into the air inlet 51, the deformation of the elastic element 81 allows the fixing block 82 to smoothly insert into the corresponding groove of the sensor housing 1. After the fixing block 82 is inserted, the elastic element 81 returns to its original position. During disassembly, the deformation of the elastic element 81 separates the fixing block 82 from the sensor housing 1, allowing the filter 8 to be removed. The elastic element 81 and the fixing block 82 enable quick and convenient installation and removal of the filter 8.

[0032] In this embodiment, the cooling fan 2 is detachably connected to the sensor housing 1. The connection between the cooling fan 2 and the sensor housing 1 is fixed with screws, and the cooling fan 2 and the sensor housing 1 are detachably connected by screws.

[0033] The detachable connection design allows the cooling fan 2 to be easily detached from or reinstalled on the sensor housing 1. This facilitates the maintenance, cleaning, and replacement of the cooling fan 2. Screws serve as the medium connecting the cooling fan 2 to the sensor housing 1; tightening the screws securely fixes the cooling fan 2 to the sensor housing 1. This screw fixing method provides stable connection force, ensuring that the cooling fan 2 will not loosen or fall off during operation due to vibration, airflow impact, or other reasons. It also ensures that the relative position between the cooling fan 2 and the heat dissipation channel 5 remains unchanged, allowing the cooling fan 2 to effectively expel hot air from the heat dissipation channel 5.

[0034] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0035] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A 3D vision sensor module with temperature control, comprising a sensor housing (1), a cooling fan (2), and a 3D vision module, wherein the 3D vision module is located inside the sensor housing (1), and the 3D vision module includes a 3D camera (3) and a data processing circuit board (4), characterized in that, A heat dissipation channel (5) is fixedly connected inside the sensor housing (1). Both ends of the heat dissipation channel (5) are connected to the outside of the sensor housing (1). The heat dissipation channel (5) is completely isolated from the 3D vision module. The outer wall of the heat dissipation channel (5) is provided with a heat-conducting structure. The heat-conducting structure is in contact with the heat source of the data processing circuit board (4). The heat-conducting structure is used to conduct the heat generated by the data processing circuit board (4) to the heat dissipation channel (5). The cooling fan (2) is located at one end of the heat dissipation channel (5).

2. The 3D vision sensor module with temperature control according to claim 1, characterized in that, The heat dissipation channel (5) has a Y-shaped or T-shaped structure. The heat dissipation channel (5) is provided with two air inlets (51) and one air outlet (52). The cooling fan (2) is located at the air outlet (52).

3. A 3D vision sensor module with temperature control according to claim 1, characterized in that, The thermal conductive structure includes a thermal conductive sheet (6) and thermal conductive grease (7). The thermal conductive grease (7) is applied to the heat source surface of the data processing circuit board (4). The thermal conductive sheet (6) abuts against the heat source surface of the data processing circuit board (4). The thermal conductive grease (7) is used to increase the thermal conductivity between the data processing circuit board (4) and the thermal conductive sheet (6). The side of the thermal conductive sheet (6) facing away from the data processing circuit board (4) is fixedly connected to the heat dissipation channel (5).

4. A 3D vision sensor module with temperature control according to claim 1 or 3, characterized in that, A heat dissipation fin (53) is fixedly connected inside the heat dissipation channel (5). The heat dissipation fin (53) is parallel to the side wall of the heat dissipation channel (5). The heat dissipation fin (53) is located at the connection between the heat dissipation channel (5) and the heat-conducting structure. The heat dissipation fin (53) is used to increase the heat dissipation area so that the heat transferred by the heat-conducting structure can be quickly diffused.

5. A 3D vision sensor module with temperature control according to claim 2, characterized in that, The air inlet (51) is equipped with a filter (8), which is detachably connected to the sensor housing (1). The filter (8) is used to filter impurities in the air entering the heat dissipation channel (5).

6. A 3D vision sensor module with temperature control according to claim 5, characterized in that, The filter screen (8) has an elastic element (81) at one end facing the outside of the sensor housing (1). A fixing block (82) is provided on the outside of the elastic element (81). The fixing block (82) is embedded in the sensor housing (1). The fixing block (82) is used to fix the connection between the filter screen (8) and the sensor housing (1). The elastic element (81) can move towards the center of the filter screen (8), thereby causing the fixing block (82) to detach from the sensor housing (1).

7. A 3D vision sensor module with temperature control according to claim 1 or 2, characterized in that, The cooling fan (2) is detachably connected to the sensor housing (1). The connection between the cooling fan (2) and the sensor housing (1) is fixed with screws. The cooling fan (2) and the sensor housing (1) are detachably connected by screws.

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