Circuit board structure compatible with DDR particles

Abstract

The utility model discloses a circuit board structure compatible with DDR particles in the field of circuit board design, which comprises a first DDR installation area and a second DDR installation area which are arranged on a circuit board, the first DDR installation area and the second DDR installation area are mutually overlapped to form a DDR compatible area, and a plurality of DDR particle bonding pads are arranged in the DDR compatible area. According to the utility model, the problems of reworking of circuit board design and greatly reduced design efficiency caused by replacement of DDR particle models in the prior art are solved, reuse of various DDR particle installation spaces can be realized in a limited circuit board space, when the DDR particle models need to be replaced, the layout of the whole circuit board does not need to be replanned, and the cost is reduced. The complexity and the area requirement of circuit board design are reduced, the material changing process becomes simpler and faster, the circuit board does not need to be redesigned with a large amount of time, the material changing time is greatly shortened, and the design efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board design technology, specifically to a circuit board structure compatible with DDR chips. Background Technology

[0002] In modern electronic devices, DDR (Double Data Rate) chips are used as key storage components in computers, servers, and various smart devices. With the continuous iteration and upgrading of DDR technology, from DDR1 to DDR5, each generation of DDR chips has seen significant improvements in performance, frequency, and power consumption.

[0003] During the design and manufacturing of circuit boards, shortages of certain DDR chips are frequently encountered during material preparation due to fluctuations in market supply and demand or production adjustments by upstream suppliers. When a particular DDR chip is discontinued, the circuit board design team has to find alternatives. Furthermore, during product debugging, replacing DDR chips with different models is a common practice to optimize performance, reduce costs, or resolve compatibility issues. However, even DDR chips from different manufacturers, even those belonging to the same technology generation, can have subtle differences in packaging. These differences may seem minor, but they can lead to incompatibility in pad layout and electrical connections on the circuit board, resulting in rework of the circuit board design. This process requires significant manpower, resources, and time, greatly reducing design efficiency and potentially delaying the entire project, increasing R&D costs and marketing time.

[0004] The above-mentioned defects urgently need to be addressed. Utility Model Content

[0005] To address the problem of rework in circuit board design caused by changing DDR chip models, which greatly reduces design efficiency, this utility model provides a DDR chip-compatible circuit board structure.

[0006] The technical solution of this utility model is as follows:

[0007] A DDR chip compatible circuit board structure includes a first DDR mounting area and a second DDR mounting area disposed on the circuit board. The first DDR mounting area and the second DDR mounting area are superimposed to form a DDR compatible area, and a plurality of DDR chip pads are disposed in the DDR compatible area.

[0008] According to the above-described scheme of this utility model, the centers of the first DDR mounting area and the second DDR mounting area coincide.

[0009] According to the present invention based on the above scheme, the width of the first DDR mounting area is greater than the width of the second DDR mounting area.

[0010] According to the present invention based on the above scheme, the length of the first DDR mounting area is less than the length of the second DDR mounting area.

[0011] According to the present invention based on the above scheme, the edge of the first DDR mounting area has a first silkscreen frame, and the edge of the second DDR mounting area has a second silkscreen frame. The first silkscreen frame and the second silkscreen frame are superimposed to form the DDR compatible area.

[0012] According to the above-described scheme of this utility model, the width of the silkscreen line of the first silkscreen frame is equal to the width of the silkscreen line of the second silkscreen frame.

[0013] According to the above-described scheme of this utility model, the screen printing line width of the first screen printing frame and the screen printing line width of the second screen printing frame are both 5mil to 7mil.

[0014] According to the above-described scheme of this utility model, multiple DDR chip pads are divided into two DDR pad matrices, and the two DDR pad matrices are symmetrically arranged within the DDR compatibility area.

[0015] According to the above-described scheme of this utility model, the spacing between two adjacent DDR chip pads located in the same DDR pad matrix is ​​30.5mil to 32.5mil.

[0016] According to the above-described scheme of this utility model, the diameter of the DDR chip pad is 15mil to 17mil.

[0017] The advantages of this utility model based on the above solution are as follows:

[0018] In the aforementioned DDR chip compatible circuit board structure, the first DDR mounting area and the second DDR mounting area are superimposed to form a DDR compatible area. This allows for the reuse of mounting space for multiple DDR chips within a limited circuit board space. When it is necessary to change the DDR chip model, there is no need to replan the layout of the entire circuit board, reducing the complexity of the circuit board design and the area requirements.

[0019] Furthermore, when encountering a shortage or discontinuation of DDR chips during material preparation, or when it is necessary to replace DDR chips of other models during debugging, due to the design of the DDR compatibility area, engineers can directly install the new DDR chips into the DDR compatibility area, making the material replacement process simpler and faster. This eliminates the need to spend a lot of time redesigning the circuit board, greatly shortening the material replacement time and improving design efficiency. Attached Figure Description

[0020] Figure 1 This is one of the structural schematic diagrams of this utility model;

[0021] Figure 2 This is the second structural schematic diagram of the present invention.

[0022] In the diagram, 1 is the circuit board; 2 is the first DDR mounting area; 3 is the second DDR mounting area; 4 is the DDR compatible area; 5 is the DDR chip pad; 6 is the first silkscreen frame; and 7 is the second silkscreen frame. Detailed Implementation

[0023] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0024] In the design and manufacturing process of circuit boards, the material preparation stage is often affected by market supply and demand fluctuations or production adjustments by upstream suppliers, leading to shortages of specific DDR chips. When a particular DDR chip is discontinued, the design team has to find alternatives. Furthermore, during the product debugging phase, replacing DDR chips with other models is a common practice to optimize performance, reduce costs, or resolve compatibility issues. However, even DDR chips from different manufacturers, even those belonging to the same technology generation, may have subtle differences in their packaging. These differences, though seemingly minor, can cause incompatibility in the pad layout and electrical connections on the circuit board, resulting in design rework. This process not only requires significant investment of manpower, resources, and time but also significantly reduces design efficiency and may even slow down the entire project, increasing R&D costs and time costs for market promotion.

[0025] like Figure 1 As shown, in order to solve the above-mentioned technical problems, this utility model provides a DDR chip compatible circuit board structure, including a first DDR mounting area 2 and a second DDR mounting area 3 disposed on the circuit board 1. The first DDR mounting area 2 and the second DDR mounting area 3 are superimposed to form a DDR compatible area 4. Multiple DDR chip pads 5 are disposed in the DDR compatible area 4, which can realize the reuse of mounting space for multiple DDR chips within the limited space of the circuit board 1. When it is necessary to change the DDR chip model, there is no need to re-plan the layout of the entire circuit board 1, reducing the complexity of the circuit board 1 design and the area requirements.

[0026] In this embodiment, when encountering a shortage or discontinuation of DDR chips during material preparation, or when needing to replace DDR chips of other models during debugging, the design of the DDR compatibility zone 4 allows engineers to directly install the new DDR chips into it. This simplifies and speeds up the replacement process, eliminating the need to spend significant time redesigning the circuit board 1, thus greatly reducing replacement time and improving design efficiency. For example, when developing an electronic product, designers can choose to install either DDR3 or DDR4 chips within the compatibility zone based on actual needs, without needing to design a separate circuit board 1 for each type of chip, significantly increasing design flexibility.

[0027] like Figure 1 As shown, in this embodiment, the centers of the first DDR mounting area 2 and the second DDR mounting area 3 coincide, which allows the circuit board 1 to arrange the mounting positions of DDR chips more efficiently in a limited space, avoiding the waste of space caused by the dispersion of mounting areas. This allows the circuit board 1 to integrate more functional modules or reserve more space for other electronic components, which is conducive to the miniaturization design of the circuit board 1.

[0028] like Figure 1 As shown, in this embodiment, the width D1 of the first DDR mounting area 2 is greater than the width D2 of the second DDR mounting area 3, and the length D3 of the first DDR mounting area 2 is less than the length D4 of the second DDR mounting area 3. DDR chips produced by different manufacturers, or DDR chips of different generations and capacities, often have different dimensions in length and width. The design of the first DDR mounting area 2 and the second DDR mounting area 3, one wide and one long, can accommodate more types and specifications of DDR chips. For example, some DDR chips are wider but shorter, so they can be installed in the first DDR mounting area 2; while some chips are longer but narrower, so they are suitable for installation in the second DDR mounting area 3. This greatly improves the compatibility of the circuit board 1 with different DDR chips, making the circuit board 1 more flexible in design and use. In addition, the design of the first DDR mounting area 2 and the second DDR mounting area 3, one wide and one long, can reduce the number of times the circuit board 1 needs to be redesigned to accommodate different specifications of DDR chips. The same circuit board 1 design can be used to accommodate multiple DDR chips, thereby reducing R&D and production costs. At the same time, due to the improved space utilization, the size of the circuit board 1 can also be reduced, lowering raw material costs.

[0029] like Figure 1As shown, in this embodiment, the edge of the first DDR mounting area 2 has a first silkscreen frame 6, and the edge of the second DDR mounting area 3 has a second silkscreen frame 7. The first silkscreen frame 6 and the second silkscreen frame 7 overlap to form a DDR compatible area 4. The first silkscreen frame 6 and the second silkscreen frame 7 clearly define the boundaries of the first DDR mounting area 2 and the second DDR mounting area 3. When installing DDR chips, operators can accurately place the DDR chips into the corresponding mounting areas according to the silkscreen frames, greatly improving the accuracy and efficiency of installation. For example, on a large-scale production line, workers can quickly and accurately install DDR chips according to the position of the silkscreen frames, reducing the product defect rate caused by installation position deviations. In addition, during the quality inspection stage of the production process, inspectors can quickly determine whether the installation is correct by observing whether the DDR chips are installed within the area defined by the silkscreen frames. For cases where the installation position deviates from the silkscreen frames, adjustments or rework can be made in a timely manner, improving the efficiency and accuracy of quality inspection.

[0030] like Figure 1 As shown, in this embodiment, the width of the silkscreen line of the first silkscreen frame 6 is equal to the width of the silkscreen line of the second silkscreen frame 7. This simplifies the production process, reduces adjustment and switching steps during production, lowers the probability of production errors, and improves production efficiency and product yield. For example, in the mass production of circuit board 1, it is not necessary to adjust the pressure, speed, and other parameters of the printing equipment for silkscreen lines of different widths, making the production process smoother.

[0031] like Figure 1 As shown, in this embodiment, the silkscreen line width of the first silkscreen frame 6 and the silkscreen line width of the second silkscreen frame 7 are both 5mil to 7mil. The silkscreen line width of the first silkscreen frame 6 and the silkscreen line width of the second silkscreen frame 7 can be designed to be any value in the range of 5mil, 5.2mil, 5.4mil, 5.6mil, 5.8mil, 6mil, 6.2mil, 5.4mil, 6.6mil, 6.8mil, 7mil, etc. In actual design, the silkscreen line width of the first silkscreen frame 6 and the silkscreen line width of the second silkscreen frame 7 can be designed according to actual needs.

[0032] like Figure 1As shown, in this embodiment, the multiple DDR chip pads 5 are divided into two DDR pad matrices, which are symmetrically arranged within the DDR compatibility area 4, helping to achieve balanced signal transmission. DDR chips require a large amount of data transmission during operation, making signal stability and balance crucial. The symmetrical layout ensures more consistent electrical parameters such as signal line length and impedance connected to the DDR chips, reducing delay differences and interference during signal transmission. Furthermore, the symmetrical DDR pad matrix layout results in a more uniform and symmetrical electromagnetic field distribution, which helps reduce electromagnetic radiation and mutual interference. Through reasonable wiring and grounding design, the distribution of the electromagnetic field can be better controlled, improving the electromagnetic compatibility of circuit board 1, reducing the impact of electromagnetic interference on DDR chips and other circuit modules, and ensuring the stable operation of the entire circuit board 1.

[0033] like Figure 1 As shown, in this embodiment, the spacing D5 between two adjacent DDR chip pads 5 within the same DDR pad matrix is ​​30.5mil to 32.5mil. The spacing D6 between two adjacent DDR chip pads 5 within the same DDR pad matrix can be designed to be any value within the range of 30.5mil, 30.7mil, 30.9mil, 31mil, 31.2mil, 31.4mil, 31.6mil, 31.8mil, 32mil, 32.2mil, 32.4mil, and 32.5mil. Of course, in actual design, the spacing between two adjacent DDR chip pads 5 within the same DDR pad matrix can be designed according to actual needs.

[0034] In this embodiment, the diameter of the DDR chip pad 5 is 15mil to 17mil. The diameter of the DDR chip pad 5 can be designed to be any value in the range of 15mil, 15.2mil, 15.4mil, 15.6mil, 15.8mil, 16mil, 16.2mil, 16.4mil, 16.6mil, 16.8mil, and 17mil. In actual design, the diameter of the DDR chip pad 5 can be designed according to actual needs.

[0035] like Figure 2As shown, in this embodiment, the lateral spacing W1 between the outermost DDR chip pad 5 and the first silkscreen frame 6 within the DDR pad matrix is ​​42.15 mil, and the vertical spacing W2 between the outermost DDR chip pad 5 and the first silkscreen frame 6 within the DDR pad matrix is ​​10.65 mil; the lateral spacing W3 between the outermost DDR chip pad 5 and the second silkscreen frame 7 within the DDR pad matrix is ​​12.63 mil, and the vertical spacing W4 between the outermost DDR chip pad 5 and the second silkscreen frame 7 within the DDR pad matrix is... 20.5mil. Of course, in actual design, the horizontal spacing W1 between the outermost DDR chip pad 5 and the first silkscreen frame 6, the vertical spacing W2 between the outermost DDR chip pad 5 and the first silkscreen frame 6, the horizontal spacing W3 between the outermost DDR chip pad 5 and the second silkscreen frame 7, and the vertical spacing W4 between the outermost DDR chip pad 5 and the second silkscreen frame 7 can be designed according to actual needs.

[0036] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0037] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A DDR chip-compatible circuit board structure, characterized in that, It includes a first DDR mounting area and a second DDR mounting area disposed on the circuit board. The first DDR mounting area and the second DDR mounting area are superimposed to form a DDR compatible area. The DDR compatible area is provided with multiple DDR chip pads.

2. The DDR chip-compatible circuit board structure according to claim 1, characterized in that, The centers of the first DDR mounting area and the second DDR mounting area coincide.

3. The DDR chip-compatible circuit board structure according to claim 1, characterized in that, The width of the first DDR mounting area is greater than the width of the second DDR mounting area.

4. The DDR chip-compatible circuit board structure according to claim 1, characterized in that, The length of the first DDR mounting area is less than the length of the second DDR mounting area.

5. The DDR chip-compatible circuit board structure according to claim 1, characterized in that, The first DDR mounting area has a first silkscreen frame at its edge, and the second DDR mounting area has a second silkscreen frame at its edge. The first silkscreen frame and the second silkscreen frame overlap to form the DDR compatible area.

6. The DDR chip-compatible circuit board structure according to claim 5, characterized in that, The width of the silkscreen line of the first silkscreen frame is equal to the width of the silkscreen line of the second silkscreen frame.

7. The DDR chip-compatible circuit board structure according to claim 6, characterized in that, The screen printing line width of the first screen printing frame and the screen printing line width of the second screen printing frame are both 5mil to 7mil.

8. The DDR chip-compatible circuit board structure according to claim 1, characterized in that, Multiple DDR chip pads are divided into two DDR pad matrices, and the two DDR pad matrices are symmetrically arranged within the DDR compatibility area.

9. The DDR chip-compatible circuit board structure according to claim 8, characterized in that, The spacing between two adjacent DDR chip pads located within the same DDR pad matrix is ​​30.5mil to 32.5mil.

10. The DDR chip-compatible circuit board structure according to claim 1, characterized in that, The diameter of the DDR chip pad is 15mil~17mil.

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