Battery management device and energy storage equipment
By using heat sinks to connect the battery management circuit components and the charging circuit components in the energy storage device, and utilizing an air-cooling system for heat dissipation, the problem of excessively large size of the energy storage device is solved, achieving rapid heat dissipation and miniaturization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HELLO TECH ENERGY CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-04-28
AI Technical Summary
The layout of battery management circuit components and charging circuit components in energy storage devices results in excessively large device sizes, making it difficult to meet the requirements for miniaturization.
The battery management circuit assembly and the charging circuit assembly are connected by a heat sink, which shares a common heat sink for heat absorption and dissipation. The circuit components are staggered to reduce the size, and the battery management device and inverter device are cooled by an air cooling system.
This technology enables rapid heat dissipation of the battery management device, reduces overall size, lowers complexity and cost, and improves integration and miniaturization.
Smart Images

Figure CN224178492U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of energy storage technology, and in particular to a battery management device and energy storage equipment. Background Technology
[0002] With the continuous development of power generation technology and the increase in the scale of new energy power generation, energy storage devices have been increasingly widely promoted and applied. Energy storage devices typically contain battery management circuitry and charging circuitry. However, when these components are housed within the energy storage device, their layout often results in an excessively large device size, making it difficult to meet the miniaturization requirements. Summary of the Invention
[0003] This application provides a battery management device and an energy storage device.
[0004] In a first aspect, this application provides a battery management device, comprising a battery management circuit assembly, a charging circuit assembly, and a heat sink. The battery management circuit assembly includes a battery management circuit board and a first switching transistor disposed on the battery management circuit board. The charging circuit assembly is spaced apart from and electrically connected to the battery management circuit assembly, and includes a charging circuit board and a second switching transistor disposed on the charging circuit board. The heat sink includes a first heat dissipation surface and a second heat dissipation surface facing away from each other, the first heat dissipation surface being in contact with the first switching transistor, and the second heat dissipation surface being in contact with the second switching transistor, the heat sink being configured to dissipate heat from the first switching transistor and the second switching transistor.
[0005] In some embodiments, the charging circuit board includes a first surface and a second surface facing away from each other in the thickness direction. The first surface is provided with the second switching transistor and a plurality of charging elements, which are arranged at intervals from the second switching transistor. The battery management circuit board includes a first surface and a second surface facing away from each other in the thickness direction. The first surface is provided with the first switching transistor and a plurality of management elements, which are arranged at intervals from the first switching transistor. The first surface and the first surface are spaced apart and opposite each other, and the plurality of charging elements and the plurality of management elements are staggered in the direction from the first surface to the first surface.
[0006] In some embodiments, the heat sink is a harmonica tube heat sink, and the heat sink includes a plurality of through holes, each of which extends in a direction perpendicular to the direction from the first heat sink surface to the second heat sink surface.
[0007] In some embodiments, a first thermally conductive medium is provided between the first heat dissipation surface and the first switching transistor.
[0008] In some embodiments, a second thermally conductive medium is provided between the second heat dissipation surface and the second switching transistor.
[0009] Secondly, this application provides an energy storage device, which includes the battery management device and housing described in any of the above embodiments. The battery management device is housed within the housing.
[0010] In some embodiments, the energy storage device further includes a heat dissipation assembly, and the housing includes a first shell and a second shell. The first shell is provided with a first air duct, and the second shell is disposed opposite to the first shell at a distance and is provided with a second air duct opposite to the first air duct. The heat dissipation assembly is disposed on the first shell and located at the first air duct. The battery management device is located on the air outlet path of the heat dissipation assembly, and the heat dissipation assembly is used to dissipate heat from at least the battery management device through air cooling.
[0011] In some embodiments, the heat sink is a harmonica tube heat sink, which includes multiple through holes, and the airflow direction of the heat sink assembly is consistent with the extension direction of the through holes.
[0012] In some embodiments, the battery management device includes a first end and a second end opposite each other, the first end being closer to the heat dissipation component than the second end, and the heat dissipation component being closer to the first end.
[0013] In some embodiments, the enclosure further includes a third and fourth shell spaced apart from each other, the third and fourth shells being connected to both the first and second shells; the energy storage device also includes a battery unit and an inverter unit. In the direction from the third to the fourth shell, the battery unit, the battery management unit, and the inverter unit are stacked sequentially inside the enclosure. The exhaust direction of the heat dissipation assembly is perpendicular to the stacking direction and is also used to dissipate heat from the battery unit and / or the inverter unit. The battery unit and / or the inverter unit are disposed between the first and second air ducts.
[0014] In some embodiments, the inverter device includes a housing, circuit components, and a heat dissipation unit. The circuit components are housed within the housing. The heat dissipation unit is disposed on at least one side of the housing facing the first and second housings, and corresponds to the circuit components. The heat dissipation unit is used to dissipate heat from the circuit components via air cooling, and the exhaust direction of the heat dissipation unit is consistent with the air blowing direction of the heat dissipation components.
[0015] In the battery management device and energy storage device of this application, the battery management circuit assembly and the charging circuit assembly are connected and electrically connected to each other via a heat sink, and can be integrated into a module. The first heat sink surface, when attached to the first switching transistor, can absorb the heat generated when the first switching transistor is operating, and the second heat sink surface, when attached to the second switching transistor, can absorb the heat generated when the second switching transistor is operating. In this way, the heat sink can remove the heat generated by the battery management circuit assembly and the charging circuit assembly, achieving rapid heat dissipation in the battery management device. Furthermore, the battery management circuit assembly and the charging circuit assembly share a single heat sink, reducing the overall size of the battery management device, lowering its complexity and cost, and improving its integration and miniaturization.
[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:
[0018] Figure 1 This is a three-dimensional assembly schematic diagram of an energy storage device according to some embodiments of this application;
[0019] Figure 2 This is a three-dimensional exploded view of an energy storage device according to some embodiments of this application;
[0020] Figure 3 This is a three-dimensional exploded view of a portion of the structure of an energy storage device according to some embodiments of this application.
[0021] Figure 4 This is an exploded perspective view of a battery management device according to some embodiments of this application;
[0022] Figure 5 This is a three-dimensional assembly schematic diagram of a battery management device according to some embodiments of this application.
[0023] Explanation of key component designations:
[0024] Energy storage device 100; inverter device 10; housing 11; circuit assembly 101; enclosure 30; inverter circuit 13; DC-DC circuit assembly 131; PFC circuit assembly 133; MPPT circuit assembly 16; heat dissipation unit 19; enclosure 30; first shell 31; first air duct 311; heat dissipation assembly 313; second shell 32; second air duct 321; third shell 33; fourth shell 34; fifth shell 35; sixth shell 36; battery device 50; battery management device 70; electricity Battery management circuit assembly 71; battery management circuit board 711; first surface 7111; second surface 7113; first switching transistor 713; charging element 715; charging circuit assembly 73; charging circuit board 731; first surface 7311; second surface 7313; second switching transistor 733; management element 735; heat sink 75; first heat dissipation surface 751; second heat dissipation surface 753; through hole 755; first thermal conductive medium 771; second thermal conductive medium 772; bracket 90. Detailed Implementation
[0025] In the description of this application, some of the disclosed content has been illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The following description with reference to the accompanying drawings is exemplary and is only used to explain this application, and should not be construed as limiting this application.
[0026] This application discloses numerous different contents or examples for implementing different structures. To simplify the disclosure of this application, the components and settings of specific examples are described below. Of course, these are merely examples and are not intended to limit this application.
[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0028] In the description of this application, it should be understood that the terms used to indicate orientation or positional relationship (such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc.) are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and understanding the corresponding embodiments, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to indicate orientation or positional relationship should not be construed as limitations on this application.
[0029] In the description of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0030] Please see Figure 1 and Figure 2 The energy storage device 100 is a device capable of storing and releasing electrical energy. When charging, the energy storage device 100 can receive and store electrical energy input from an external source. When discharging, the energy storage device 100 can output electrical energy to a load. The energy storage device 100 includes an inverter device 10, a housing 30, a battery device 50, and a battery management device 70. The inverter device 10, battery device 50, and battery management device 70 are housed inside the housing 30.
[0031] The enclosure 30 is a structure used to install and house the internal components of an energy storage device. The enclosure 30 of this application is used to install internal components such as the inverter device 10, battery device 50, and battery management device 70, and to house these internal components within the enclosure 30 for protection. The cross-sectional shape of the enclosure 30 may be, but is not limited to, circular, elliptical, rectangular, or other polygonal shapes. The material of the enclosure 30 includes, but is not limited to, metal or non-metal. Metals include aluminum, iron, steel, aluminum alloys, or iron alloys, while non-metals include, but are not limited to, plastics. When the enclosure 30 is made of plastic, it has good insulation performance, low cost, and light weight. When the enclosure 30 is made of metal, it has high strength, good wear resistance, and a long service life.
[0032] The inverter device 10 can convert between different forms of electrical energy, such as DC to DC and DC to AC, to meet the requirements of energy storage systems and loads. The inverter device 10 includes various circuit components 101, such as the inverter circuit 13 and the Maximum Power Point Tracking (MPPT) circuit component 16. The inverter device 10 converts the DC power stored in the battery device 50 into AC power for use by AC loads such as homes or businesses. Simultaneously, the inverter device 10 efficiently captures and converts electrical energy with different input voltages through the MPPT circuit component 16, ensuring that electrical energy can be stored in the battery device 50.
[0033] The battery device 50 is an assembly of one or more energy storage battery packs. This assembly can be charged and discharged by connecting and controlling the individual battery cells in the battery packs. The battery device 50 can store electrical energy from solar panels or other power sources during charging and provide stable DC power to the inverter device 10 during discharging to support the normal operation of the inverter and the power supply needs of the load.
[0034] The battery management device 70 includes a battery management circuit assembly 71 and a charging circuit assembly 73. The battery management circuit assembly, also known as the Battery Management System (BMS), monitors and manages the battery device 50. The battery management circuit assembly 71 controls the charging and discharging process of the battery device 50 by acquiring and calculating parameters such as voltage, current, and temperature. For example, the battery management circuit assembly 71 determines the charging power of the battery device 50 by acquiring and calculating its voltage. The battery management circuit assembly 71 is also electrically connected to other components such as the inverter device 10 to ensure the storage and release of electrical energy.
[0035] The charging circuit assembly 73 is used to control the input current from an external input source. This control includes, but is not limited to, controlling the on / off state of the current. The charging circuit assembly 73 is electrically connected to the battery management circuit assembly 71, which monitors the status of the charging circuit assembly 73 and controls the charging process.
[0036] The circuit components 101 within the inverter device 10 include an inverter circuit 13 and an MPPT circuit component 16. The inverter circuit 13 includes a direct current to direct current (DC-DC) circuit component 131 and a power factor correction (PFC) circuit component 133, and the circuit components 101 are electrically connected to each other.
[0037] The electrical energy used for charging the battery device 50 can come from one or more input sources. For example, the energy storage device 100 of this application can store electrical energy input from external sources. For example, external input sources include, but are not limited to, portable solar panels and home photovoltaic systems. Portable solar panels are suitable for outdoor mobile scenarios, supplementing emergency power needs; home photovoltaic systems are integrated with fixed buildings to achieve daily energy self-sufficiency. For example, portable solar panels...
[0038] MPPT circuit component 16 is used for maximum power point tracking of an external input source. MPPT circuit component 16 can monitor the output voltage and current of the external input source in real time, and adjust the operating point of the external input source through a preset control algorithm, such as synchronous Buck-Boost topology technology, to keep the external input source in a maximum power output state. The input terminal of MPPT circuit component 16 is connected to the external input source, and the output terminal is connected to DC-DC circuit component 131. During power transmission, MPPT circuit component 16 regulates the DC power output from the external input source to improve power conversion efficiency and ensure that power can be transferred to the battery device 50 for storage.
[0039] The PFC circuit component 133 is used to improve the power factor of the energy storage device 100, reduce grid harmonic pollution, and improve power quality. In the inverter device 10, the PFC circuit component 133 is electrically connected to the DC-DC circuit component 131, which can perform waveform correction and optimization on the AC power output of the inverter, making the AC power output of the inverter closer to the ideal sine wave, reducing the impact of high-order harmonics on the grid, and improving power transmission efficiency.
[0040] More specifically, the electrical energy from an external input source (such as a portable solar panel or a home photovoltaic system) first undergoes maximum power point tracking (MPPT) in the inverter device 10's MPPT circuit component 16, adjusting the input voltage and current in real time to capture maximum power. It then enters the DC-DC circuit component 131 for boost or buck conversion, adjusting the voltage to suit the charging range of the battery device 50. If the external power source is AC, the electrical energy also undergoes waveform correction and power factor optimization in the PFC circuit component 133 to reduce harmonic losses and improve power quality. The processed DC power is then transmitted to the charging circuit component 73 of the battery management device 70. The charging circuit component 73, according to instructions from the battery management circuit component 71, controls the on / off state and magnitude of the charging current, achieving precise charging during constant current or constant voltage stages. Simultaneously, the battery management circuit component 71 monitors the battery's voltage, temperature, and current parameters in real time. Thus, the electrical energy is input into the battery device 50 for storage.
[0041] When the energy storage device 100 discharges, the DC power stored in the battery device 50 opens the circuit through the battery management device 70. The current is regulated by the DC-DC circuit component 131 of the inverter device 10, and then the waveform is optimized and converted into AC power by the PFC circuit component 133 in the inverter circuit 13. Finally, the power is supplied to the household or industrial load through the inverter output. At the same time, the battery management device 70 monitors the battery status in real time (such as voltage, temperature and remaining capacity) and cuts off the discharge circuit to ensure safety in case of abnormality.
[0042] Please see Figure 2 , Figure 4 and Figure 5 This application provides a battery management device 70, which includes a battery management circuit assembly 71, a charging circuit assembly 73, and a heat sink 75. The battery management circuit assembly 71 includes a battery management circuit board 711 and a first switching transistor 713 disposed on the battery management circuit board 711. The charging circuit assembly 73 is spaced apart from and electrically connected to the battery management circuit assembly 71, and includes a charging circuit board 731 and a second switching transistor 733 disposed on the charging circuit board 731. The heat sink 75 includes a first heat dissipation surface 751 and a second heat dissipation surface 753 facing away from each other. The first heat dissipation surface 751 is attached to the first switching transistor 713, and the second heat dissipation surface 753 is attached to the second switching transistor 733. The heat sink 75 is configured to dissipate heat from the first switching transistor 713 and the second switching transistor 733.
[0043] Specifically, the battery management circuit board 711 serves as the circuit carrier, used to mount and fix the first switching transistor 713 and other management components 735, including but not limited to capacitors, inductors, and resistors. The first switching transistor 713 is a MOSFET, which stands for Metal-Oxide-Semiconductor-Field-Effect Transistor, a semiconductor device that uses an electric field effect to control current. The first switching transistor 713 is used to control the conduction or cutoff of the current passing through it. That is, the first switching transistor 713 can control the charging and discharging of the energy storage device 100.
[0044] The first switching transistor 713 can be a single MOSFET integrated with charging and discharging control functions, or it can be divided into a separate charging MOSFET and a discharging MOSFET. This application describes the first switching transistor 713 as a single MOSFET.
[0045] When the energy storage device 100 is charging, the first switching transistor 713 can control the current to stabilize the voltage at the rated value and prevent overcharging. Simultaneously, the first switching transistor 713 can monitor the charging current and voltage in real time and quickly disconnect the charging circuit when an abnormality occurs. When the energy storage device 100 is discharging, for example when it is discharging to supply power to a load, the first switching transistor 713 can open the discharge circuit, allowing the DC energy stored in the battery device 50 to flow out. The first switching transistor 713 can adjust the discharge current according to the load demand and battery status to ensure that the battery device 50 supplies power to the load with an appropriate current, extending the service life of the battery device 50. When the voltage or temperature of the battery device 50 becomes abnormal, the first switching transistor 713 will disconnect the discharge circuit to prevent the battery device 50 from over-discharging or being damaged.
[0046] The charging circuit board 731 serves as the circuit carrier, used to mount and fix the second switching transistor 733 and other charging components 715, including but not limited to capacitors, inductors, and resistors. The charging MOSFET (i.e., the second switching transistor 733) controls the on / off state of the charging circuit according to the instructions of the battery management circuit assembly 71. When the battery device needs charging, the second switching transistor 733 is turned on, allowing charging current to flow into the battery; when charging is complete or an abnormal situation occurs, the second switching transistor 733 quickly turns off, cutting off the charging current and protecting the battery and circuitry.
[0047] When the energy storage device 100 is charging, the externally input electrical energy is first processed by the inverter device 10 (e.g., the MPPT circuit component performs maximum power point tracking, the DC-DC circuit component performs voltage conversion, etc.), and then transmitted to the charging circuit component 73. The charging circuit board 731 receives the processed electrical energy and controls the on / off state and magnitude of the charging current through the second switching transistor 733. The second switching transistor 733 adjusts the charging current according to the instructions of the battery management circuit component 71 to meet the charging requirements. When the energy storage device 100 is discharging, the charging circuit component 73 is in a non-operating state, the second switching transistor 733 is turned off, cutting off the charging circuit and preventing electrical energy from flowing back into the charging circuit. At this time, the electrical energy stored in the battery device 50 is discharged through the first switching transistor 713 in the battery management device 70 to open the discharge circuit, and is converted by the inverter device 10 into electrical energy suitable for the load to power the external load.
[0048] The heat sink 75 connects the battery management circuit assembly 71 and the charging circuit assembly 73, and dissipates heat between them. The heat sink 75 includes a first heat dissipation surface 751 and a second heat dissipation surface 753 facing away from each other in the thickness direction (i.e., the third direction X). The first heat dissipation surface 751, when attached to the first switching transistor 713, absorbs the heat generated during the operation of the first switching transistor 713 and dissipates the heat through the heat dissipation structure of the heat sink 75 itself (such as heat sink fins, heat pipes, or liquid cooling channels). The second heat dissipation surface 753, when attached to the second switching transistor 733, absorbs the heat generated during the operation of the second switching transistor 733 and dissipates the heat through the heat dissipation structure of the heat sink 75 itself.
[0049] In the battery management device 70 of this application, the battery management circuit assembly 71 and the charging circuit assembly 73 are connected and electrically connected to each other via a heat sink 75, and can be integrated into a module. The contact between the first heat dissipation surface 751 and the first switching transistor 713 can absorb the heat generated when the first switching transistor 713 is working, and the contact between the second heat dissipation surface 753 and the second switching transistor 733 can absorb the heat generated when the second switching transistor 733 is working. In this way, the heat sink 75 can remove the heat generated by the battery management circuit assembly 71 and the charging circuit assembly 73, realizing rapid heat dissipation in the battery management device 70. Furthermore, the battery management circuit assembly 71 and the charging circuit assembly 73 share a single heat sink 75, reducing the overall size of the battery management device 70, lowering the complexity and cost of the battery management device 70, and improving the integration and miniaturization of the battery management device 70.
[0050] In this application, the length direction of the battery management device 70 is taken as the first direction X, the width direction as the second direction Y, and the thickness direction as the third direction Z.
[0051] Please see Figure 2 , Figure 4 and Figure 5 In some embodiments, the charging circuit board 731 includes a first surface 7311 and a second surface 7313 facing away from each other in the thickness direction Z. The first surface 7311 is provided with a second switching transistor 733 and a plurality of charging elements 715, which are arranged at intervals from the second switching transistor 733. The battery management circuit board 711 includes a first surface 7111 and a second surface 7113 facing away from each other in the third thickness direction Z. The first surface 7111 is provided with a first switching transistor 713 and a plurality of management elements 735, which are arranged at intervals from the first switching transistor 713. The first surface 7311 and the first surface 7111 are spaced apart and opposite each other, and the plurality of charging elements 715 and the plurality of management elements 735 are staggered in the direction from the first surface 7311 to the first surface 7111.
[0052] Specifically, the second switching transistor 733 and multiple charging elements 715 are all disposed on the first surface 7311, which reduces the wiring length and complexity between components, facilitates unified management and maintenance of the second switching transistor 733 and multiple charging elements 715, and also allows the heat generated by the second switching transistor 733 and multiple charging elements 715 to be concentrated on the first surface 7311 of the charging circuit board 731 for unified heat dissipation through the heat sink 75, thereby improving heat dissipation efficiency. The multiple charging elements 715 are arranged at intervals with the second switching transistor 733, that is, there are gaps between the charging elements 715 and the second switching transistor 733, and between the charging elements 715 themselves, on the first surface 7311. This avoids electromagnetic interference between components and also helps to create heat dissipation channels (i.e., gaps) between the charging elements 715 and the second switching transistor 733, and between the charging elements 715 themselves, preventing local overheating.
[0053] The first switching transistor 713 and multiple management elements 735 are all disposed on the first surface 7111, which reduces the wiring length and complexity between components, facilitates unified management and maintenance of the first switching transistor 713 and multiple management elements 735, and also allows the heat generated by the first switching transistor 713 and multiple management elements 735 to be concentrated on the first surface 7111 of the charging and discharging circuit board for unified heat dissipation through the heat sink 75, thereby improving heat dissipation efficiency. The multiple management elements 735 are arranged at intervals with the first switching transistor 713, that is, there are gaps between the management elements 735 and the first switching transistor 713, and between the management elements 735 themselves, on the first surface 7111. This avoids electromagnetic interference between components and also helps to create heat dissipation channels (i.e., gaps) between the management elements 735 and the first switching transistor 713, and between the management elements 735 themselves, preventing local overheating.
[0054] The staggered arrangement means that the projections of the charging element 715 and the management element 735 on the projection plane perpendicular to the third direction Z do not overlap and are staggered. In this way, the spacing between the charging circuit board 731 and the battery management circuit board 711 in the third direction Z can be further reduced, and the size of the battery management device 70 can be further reduced.
[0055] Please see Figure 2 , Figure 4 and Figure 5 In some embodiments, the heat sink 75 is a harmonica tube heat sink, and the heat sink 75 includes a plurality of through holes 755, the extension direction of each through hole 755 being perpendicular to the direction from the first heat sink surface 751 to the second heat sink surface 753.
[0056] Specifically, the harmonica tube heat sink has a heat dissipation structure with multiple parallel-arranged flat through-holes 755. These through-holes 755 are parallel to each other and penetrate the heat sink 75, promoting the flow of the heat dissipation medium (such as coolant or airflow). The through-holes 755 also increase the surface area of the heat sink 75, improving heat dissipation efficiency. The extension direction of each through-hole 755 is perpendicular to the direction from the first heat dissipation surface 751 to the second heat dissipation surface 753, preventing the battery management circuit assembly 71 and the charging circuit assembly 73 from blocking the through-holes 755. The heat dissipation medium (taking airflow as an example) can pass through the heat sink 75 in a straight line, maximizing contact with the surface of the heat sink 75, reducing flow resistance and thermal resistance, and quickly removing heat from the battery management device 70.
[0057] Please see Figure 5 In some embodiments, a first thermally conductive medium 771 is provided between the first heat dissipation surface 751 and the first switching transistor 713.
[0058] Specifically, the materials of the first thermally conductive medium 771 include, but are not limited to, thermally conductive grease, thermally conductive pads, and thermally conductive adhesives. Thermally conductive grease has good thermal conductivity and flexibility, enabling it to fill the tiny gaps between the first heat dissipation surface 751 and the first switching transistor 713, ensuring a tight fit, thereby effectively reducing thermal resistance and improving heat dissipation efficiency. Thermally conductive pads possess a certain degree of flexibility and compressibility, allowing them to adapt to different surface flatness during installation, providing stable thermal conductivity and mechanical support, while also serving as electrical insulation. Thermally conductive adhesives, in addition to thermal conductivity, also have adhesive properties, enabling the first switching transistor 713 to be fixed to the heat sink 75, simplifying the assembly process.
[0059] The first thermally conductive medium 771 can improve the thermal conduction efficiency between the first heat dissipation surface 751 and the first switching transistor 713, ensuring that the heat generated by the first switching transistor 713 can be quickly and evenly transferred to the heat sink 75, thereby improving heat dissipation efficiency. Secondly, the first thermally conductive medium 771 can compensate for the small gaps between the first switching transistor 713 and the heat sink 75 caused by factors such as processing precision and surface roughness, reducing contact thermal resistance and enhancing heat dissipation effect. Furthermore, the first thermally conductive medium 771 also has electrical insulation properties, which can provide reliable electrical isolation without affecting heat dissipation, preventing electrical faults such as short circuits, and improving the safety and reliability of the entire battery management device 70.
[0060] Please see Figure 5 In some embodiments, a second heat dissipation medium 772 is provided between the second heat dissipation surface 753 and the second switching transistor 733.
[0061] Specifically, the properties of the second thermally conductive medium 772 are as described above for the first thermally conductive medium 771, and will not be repeated here. The second thermally conductive medium 772 can improve the heat conduction efficiency between the second heat dissipation surface 753 and the second switching transistor 733, ensuring that the heat generated by the charging and charging transistors can be quickly and evenly transferred to the heat sink 75, thereby improving heat dissipation efficiency. The second thermally conductive medium 772 and the first thermally conductive medium 771 can be used together, or either one can be used. When used together, the materials and sizes of the second thermally conductive medium 772 and the first thermally conductive medium 771 can be different.
[0062] Please see Figure 5 In some embodiments, the heat sink 75 is a harmonica tube heat sink, which includes a plurality of through holes 755, and the air blowing direction of the heat sink is consistent with the extension direction of the through holes 755.
[0063] Specifically, when the heat dissipation component (such as a fan or other air-cooling device) is operating, the airflow generated by the heat dissipation component can pass through the through-hole 755, thereby carrying away the heat from the battery management device 70, and then exhausting it to the outside of the enclosure through the second air duct. The airflow direction of the heat dissipation component is consistent with the extension direction of the through-hole 755 (both are the second direction Y), ensuring that the airflow of the heat dissipation component can maximize the coverage of the cross-sectional area of the through-hole 755, making heat transfer more efficient, and also reducing the airflow resistance inside the heat dissipation component 75, thereby improving air-cooling efficiency.
[0064] Please see Figure 2 In some embodiments, the battery management device 70 includes a first end 701 and a second end 702 opposite to each other, with the first end closer to the heat dissipation component 313 and the heat dissipation component 75 closer to the first end than the second end 702.
[0065] Specifically, the heat sink 75 is closer to the first end 701, which can shorten the distance between the heat sink 75 and the heat dissipation component 313, so that heat can be captured and carried away by the heat dissipation component 313 in a shorter distance, reducing the heat propagation time and path inside the battery management device 70 and improving heat dissipation efficiency.
[0066] Please see Figure 2 and Figure 3 In some embodiments, the energy storage device 100 further includes a heat dissipation assembly 313, and the housing 30 includes a first shell 31 and a second shell 32. The first shell 31 is provided with a first air duct 311, and the second shell 32 is disposed opposite to the first shell 31 at a distance and is provided with a second air duct 321 opposite to the first air duct 311. The heat dissipation assembly 314 is disposed on the first shell 31 and located at the first air duct 311. The battery management device 70 is located on the air outlet path of the heat dissipation assembly 313. The heat dissipation assembly 313 is used to dissipate heat from at least the battery management device 70 by air cooling.
[0067] Specifically, the enclosure 30 is provided with a first shell 31 and a second shell 32 opposite to each other, and the inverter device 10 is located between the first shell 31 and the second shell 32. The first air duct 311 and the second air duct 321 are used to allow airflow into or out of the enclosure 30. Exemplarily, both the first air duct 311 and the second duct are ventilation louvers, which also prevent some impurities from entering the enclosure 30. When the heat dissipation component 313 is working, it causes airflow to form convection within the enclosure 30, quickly carrying away heat from the enclosure 30 and dissipating it to the external environment. Exemplarily, the heat dissipation component 313 can be a fan or other air-cooling device, and the convection can be formed by the heat dissipation component 313 blowing air into the enclosure 30 to remove heat, or by drawing air to remove heat. At least a portion of the battery management device 70 is located on the air outlet path of the heat dissipation component 313. Exemplarily, on the XZ projection plane, at least a portion of the projection of the battery management device 70 coincides with at least a portion of the projection of the heat dissipation component 313. The airflow generated by the heat dissipation component 313 can dissipate heat from the battery management device 70.
[0068] Please see Figure 2 and Figure 3 In some embodiments, the housing 30 further includes a third shell 33 and a fourth shell 34 spaced apart from each other, both of which are connected to the first shell 31 and the second shell 32; the energy storage device 100 also includes an inverter device 10 and a battery device 50. In the direction from the third shell 33 to the fourth shell 34, the battery device 50, the battery management device 70, and the inverter device 10 are stacked sequentially inside the housing 330. The exhaust direction of the heat dissipation assembly 313 is perpendicular to the stacking direction and is also used to dissipate heat from the battery device 50 and / or the inverter device 10. The battery device 50 and / or the inverter device 10 are disposed between the first air duct and the second air duct.
[0069] Specifically, in the third direction Z of the battery management device 70, the housing 30 has a third shell 33 and a fourth shell 34 arranged opposite each other. The fifth shell 35 and the sixth shell 36 are arranged opposite each other in the first direction X of the inverter device 10. The first shell 31 to the sixth shell 36 can be formed separately, partially integrally formed, or entirely integrally formed. For example, the battery device 50, the battery management device 70, and the inverter device 10 are stacked sequentially inside the housing 30. That is, the battery device 50, the battery management device 70, and the inverter device 10 are arranged at intervals along the direction from the third shell 33 to the fourth shell 34 (i.e., the third direction Z of the battery management device 70). In one installation method, the battery device 50 is mounted on the third shell 33. A bracket 90 is provided on the side of the battery device 50 facing away from the third shell 33. The first layer of the bracket 90 houses the battery management device 70, and the second layer houses the inverter device 10. Furthermore, in the third direction Z of the battery management device 70, the largest surfaces of the battery device 50, the battery management device 70, and the inverter device 10 face each other. The stacked layout can make use of the limited space inside the enclosure 30, allowing the components to be arranged compactly and reducing the overall space occupied by the energy storage device 100.
[0070] The exhaust direction of the heat dissipation component 313 is perpendicular to the stacking direction (i.e., the third direction Z of the battery management device 70). That is, the exhaust direction of the heat dissipation component 313 is the second direction Y. Thus, the airflow generated by the third heat dissipation component can pass through the stacked components, covering components at different positions on the third direction Z of the battery management device 70. In other words, the heat dissipation component 313 not only dissipates heat from the inverter device 10, but its exhaust path also covers the battery device 50 and / or the battery management device 70, thereby improving heat dissipation efficiency.
[0071] Please see Figure 2 and Figure 3 In some embodiments, the inverter device 10 includes a housing 11, a circuit assembly 101, and a heat dissipation unit 19. The circuit assembly 101 is housed within the housing 11. The heat dissipation unit 19 is disposed on at least one side of the housing 11 facing the first housing 31 and the second housing 32, and corresponds to the circuit assembly 101. The heat dissipation unit 19 dissipates heat from the circuit assembly 101 by air cooling, and the air outlet direction of the heat dissipation unit 19 is consistent with the air blowing direction of the heat dissipation assembly 313.
[0072] Specifically, the housing 11 is used to mount other components of the inverter device 10. The cross-sectional shape of the housing 11 can be, but is not limited to, circular, elliptical, rectangular, or other polygonal shapes; in this application, a portion of the cross-sectional shape of the housing 11 is rectangular. The material of the housing 11 can be plastic or metal. When the housing 11 is made of plastic, it has good insulation performance, low cost, and light weight. When the housing 11 is made of metal, it has high strength, good wear resistance, and long service life. The housing 11 houses the circuit assembly 101 (inverter circuit 13 and MPPT circuit assembly 16), and the housing 11 can protect the inverter circuit 13 and MPPT circuit assembly 16.
[0073] When the heat dissipation unit 19 is working, it causes airflow to form convection within the housing 30, quickly carrying away heat from the casing 11 and expelling it to the external environment. For example, the heat dissipation unit 19 can be a fan, and convection can be formed by the heat dissipation unit 19 blowing air into the casing 11 to remove heat, or by suction air. The heat dissipation unit 19 corresponds to the MPPT circuit assembly 16, meaning at least a portion of the MPPT circuit assembly 16 is located in the air outlet path of the heat dissipation unit 19. For example, on the XZ projection plane, at least a portion of the projection of the MPPT circuit assembly 16 coincides with at least a portion of the projection of the heat dissipation unit 19. This improves the heat dissipation efficiency of the heat dissipation unit 19 for the MPPT circuit assembly 16. Furthermore, the heat dissipation unit 19 is disposed on the surface of the casing 11 facing at least one side of the first casing 31 and the second casing 32, which reduces the distance between the heat dissipation unit 19 and the MPPT circuit assembly 16, resulting in a shorter heat dissipation path and enabling timely heat removal from the interior of the housing 30, thus improving the heat dissipation efficiency inside the casing 11. There can be one or more heat dissipation units 19. For example, there are three heat dissipation units 19 in this application to increase the airflow inside the housing 11.
[0074] It is understood that the air outlet paths of the heat dissipation unit 19 and the heat dissipation assembly 313 are consistent. The air outlet path is from the first air duct 311 to the second air duct 321, or from the second air duct 321 to the first air duct 311. For example, this application describes the air outlet paths of the heat dissipation unit 19 and the heat dissipation assembly 313 as the first air duct 311 to the second air duct 321. One or more of the heat dissipation unit 19 and the heat dissipation assembly 313 are configured to allow airflow to enter the interior of the housing 30 from the first air duct 311, pass through the interior of the housing 30 and the components inside the housing 30 (inverter device 10, battery device 50 and battery management device 70), and then exit from the second air duct 321. It is noted that the air outlet paths of the heat dissipation unit 19 and the heat dissipation assembly 313 indicate that the airflow directions are approximately the same, but do not mean that the resulting airflow is completely identical.
[0075] In the description of this specification, the references to terms such as "some embodiments," "in one example," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0076] Any process or method description in the flowchart or otherwise herein can be understood as representing a component, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order according to the functions involved, as should be understood by those skilled in the art to which embodiments of this application pertain.
[0077] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A battery management device, characterized in that, include: A battery management circuit assembly includes a battery management circuit board and a first switching transistor disposed on the battery management circuit board; A charging circuit assembly is spaced apart from and electrically connected to the battery management circuit assembly. The charging circuit assembly includes a charging circuit board and a second switching transistor disposed on the charging circuit board. and The heat sink includes a first heat sink surface and a second heat sink surface facing away from each other. The first heat sink surface is attached to the first switching transistor, and the second heat sink surface is attached to the second switching transistor. The heat sink is configured to dissipate heat from the first switching transistor and the second switching transistor.
2. The battery management device according to claim 1, characterized in that, The charging circuit board includes a first surface and a second surface opposite to each other in the thickness direction. The first surface is provided with the second switching transistor and a plurality of charging elements, and the plurality of charging elements are arranged at intervals with the second switching transistor. The battery management circuit board includes a first surface and a second surface opposite to each other in the thickness direction. The first surface is provided with the first switching transistor and a plurality of management elements, and the plurality of management elements are arranged at intervals with the first switching transistor. The first surface and the first surface are spaced apart and opposite each other, and the plurality of charging elements and the plurality of management elements are staggered in the direction from the first surface to the first surface.
3. The battery management device according to claim 1, characterized in that, The heat sink is a harmonica tube heat sink, and the heat sink includes multiple through holes, the extension direction of each through hole being perpendicular to the direction from the first heat sink surface to the second heat sink surface.
4. The battery management device according to claim 1, characterized in that, A first thermally conductive medium is provided between the first heat dissipation surface and the first switching transistor; and / or, A second heat-conducting medium is provided between the second heat dissipation surface and the second switching transistor.
5. An energy storage device, characterized in that, include: The battery management device according to any one of claims 1-4; and The battery management device is housed within the housing.
6. The energy storage device according to claim 5, characterized in that, The energy storage device also includes a heat dissipation component, and the housing includes: The first shell is equipped with a first air duct; and The second housing is disposed opposite to the first housing at a distance and has a second air duct opposite to the first air duct. The heat dissipation component is disposed on the first housing and located at the first air duct. The battery management device is located on the air outlet path of the heat dissipation component. The heat dissipation component is used to dissipate heat from at least the battery management device by air cooling.
7. The energy storage device according to claim 6, characterized in that, The heat sink is a harmonica tube heat sink, which includes multiple through holes, and the airflow direction of the heat sink is consistent with the extension direction of the through holes.
8. The energy storage device according to claim 6, characterized in that, The battery management device includes a first end and a second end opposite to each other, the first end being closer to the heat dissipation component than the second end, and the heat dissipation component being closer to the first end.
9. The energy storage device according to claim 6, characterized in that, The enclosure further includes a third shell and a fourth shell spaced apart from each other, the third shell and the fourth shell being connected to both the first shell and the second shell; the energy storage device further includes: Battery device; and In the direction from the third housing to the fourth housing, the battery device, the battery management device, and the inverter device are stacked sequentially inside the housing. The air outlet direction of the heat dissipation component is perpendicular to the stacking direction and is also used to dissipate heat from the battery device and / or the inverter device. The battery device and / or the inverter device are disposed between the first air duct and the second air duct.
10. The energy storage device according to claim 9, characterized in that, The inverter device includes: case; Circuit components, circuit components housed within the housing; and A heat dissipation unit is disposed on at least one side of the housing facing the first housing and the second housing, and corresponds to the circuit assembly. The heat dissipation unit is used to dissipate heat from the circuit assembly by air cooling, and the air outlet direction of the heat dissipation unit is consistent with the air blowing direction of the heat dissipation assembly.