Sensor semiconductor chip bending and cutting device

Abstract

The utility model discloses a sensor semiconductor chip bending and cutting device, and relates to the field of sensor chip processing, the sensor semiconductor chip bending and cutting device comprises an arc-shaped track, a straight track and a fixing plate which are fixedly mounted at the top of a base from right to left in sequence, a supporting arm is fixedly mounted at the top of the base, and a telescopic rod is fixedly mounted at the top of the supporting arm. According to the application, the circular hole formed in the surface of the semiconductor chip body is identified and monitored through the identifier, the conveying distance of the semiconductor chip body can be calculated, and the motor can be controlled to drive the driving wheel to rotate through the identification of the identifier on the circular hole; a convex nail on the outer side of a driving wheel is matched with a round hole to drive a semiconductor chip body to carry out conveying motion, a telescopic rod drives a movable block to move, so that a bending mold and a cutting mold at the bottom of the movable block can bend and cut the semiconductor chip body, and the semiconductor chip body can be accurately processed; and the processing precision and quality of the semiconductor chip body are improved.

Description

Technical Field

[0001] This application relates to the field of sensor chip processing, and in particular to a sensor semiconductor chip bending and cutting device. Background Technology

[0002] A sensor semiconductor chip is a semiconductor device that integrates sensor functions. It converts environmental parameters such as temperature, pressure, light intensity, and magnetic field into electrical signals through changes in the physical or chemical properties of semiconductor materials, thereby realizing the perception and transmission of information.

[0003] It can realize the mutual conversion between physical quantities such as electricity, light, temperature, sound, displacement, and pressure, and is easy to integrate and multi-functionalize, making it more suitable for computer requirements. Therefore, it is widely used in automated detection systems.

[0004] When processing sensor semiconductor chips, bending and cutting operations are required. The unevenness of the semiconductor chip processing position can lead to inaccuracies during the transport of the semiconductor chip, reducing the processing precision. Utility Model Content

[0005] For high-precision processing, this application provides a sensor semiconductor chip bending and cutting device.

[0006] The sensor semiconductor chip bending and cutting device provided in this application adopts the following technical solution:

[0007] The device includes, from right to left, an arc-shaped track, a straight track, and a fixing plate fixedly installed on the top of the base. A support arm is fixedly installed on the top of the base, and a telescopic rod is fixedly installed on the top of the support arm. A movable block is installed at the output end of the telescopic rod. The movable block is slidably installed with the support arm. A bending mold and a cutting mold for processing the semiconductor chip body are respectively provided at the bottom of the movable block. A circular hole is opened on the surface of the semiconductor chip body. A motor is fixedly installed on one side of the fixing plate, and an identifier for identifying the semiconductor chip body is fixedly installed on the other side of the fixing plate. A drive wheel for conveying the semiconductor chip body is installed at the output end of the motor.

[0008] By adopting the above technical solution, it is easy to identify and monitor the circular holes on the surface of the semiconductor chip body through the identifier, and to calculate the transport distance of the semiconductor chip body. By setting up bending molds and cutting molds, it is easy to control the motor to drive the drive wheel to rotate through the identification of the circular holes by the identifier. With the help of the telescopic rod to drive the movable block to move, the bending molds and cutting molds at the bottom of the movable block can be used to bend and cut the semiconductor chip body.

[0009] Preferably, the arc-shaped track is fixedly connected to the straight track, the semiconductor chip body is located above the arc-shaped track and the straight track, the straight track is located in front of the support arm, and the straight track is located below the movable block.

[0010] By adopting the above technical solution, it is convenient to transport the semiconductor chip body through the arc-shaped track and the straight track, so that the semiconductor chip body is transported to the position below the moving block, so that the bending die and the cutting die can better perform bending and cutting processing operations on the semiconductor chip body.

[0011] Preferably, the bottom right side of the arc-shaped track has a discharge port, and the top of the base has a receiving port fixedly installed, which is located at the front side of the fixed plate.

[0012] By adopting the above technical solution, it is convenient to transport the semiconductor chip body from the discharge port for processing, and collect the processed semiconductor chip body through the receiving port to complete the bending and cutting processing operation of the semiconductor chip body.

[0013] Preferably, the outer side of the drive wheel is provided with a protruding nail that matches the circular hole, and the receiving port is located at the lower left position of the drive wheel.

[0014] By adopting the above technical solution, it is convenient for the active wheel to rotate and drive the protruding nail and the matching round hole to carry the semiconductor chip body for conveying operation. The recognition of the round hole by the identifier can control the start and stop of the motor. In conjunction with the telescopic rod, the movable block is driven to perform bending and cutting processing of the semiconductor chip body, so as to better enable the start and operation of the motor and telescopic rod to perform bending and cutting processing of the semiconductor chip body.

[0015] Preferably, a second pressure roller and a third pressure roller are rotatably mounted on one side of the fixed plate, and the second pressure roller and the third pressure roller are respectively installed in rolling contact with the drive wheel.

[0016] By adopting the above technical solution, it is convenient for the second and third pressure rollers to pull the semiconductor chip body conveyed on the outside of the drive wheel, and to facilitate the output of the semiconductor chip body from the discharge port and its collection port.

[0017] Preferably, a first pressure roller is rotatably mounted on the top of the straight track, and the first pressure roller is configured to make rolling contact with the semiconductor chip body.

[0018] By adopting the above technical solution, it is convenient to restrict the contact of the semiconductor chip body with the rolling of the first pressure roller during the transportation process, so that the semiconductor chip body can be transported smoothly for processing.

[0019] Preferably, the top of the straight track is provided with a limiting piece for restricting the semiconductor chip body, and the surfaces of the arc track and the straight track are respectively provided with limiting pieces for restricting the semiconductor chip body.

[0020] By adopting the above technical solution, and by restricting the semiconductor chip body in conjunction with the limiting plate to restrict the edge position of the semiconductor chip body during transport, the semiconductor chip body can be transported flat, which facilitates the bending and cutting processing of the semiconductor chip body.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. By identifying and monitoring the circular holes on the surface of the semiconductor chip body through an identifier, the distance of the semiconductor chip body being transported can be calculated. The identification of the circular holes by the identifier can control the motor to drive the drive wheel to rotate. The matching of the protrusion on the outside of the drive wheel with the circular holes drives the semiconductor chip body to transport. The movement of the movable block driven by the telescopic rod enables the bending and cutting molds at the bottom of the movable block to perform bending and cutting processing on the semiconductor chip body. This allows for accurate processing of the semiconductor chip body, improving the processing precision and quality.

[0023] 2. By restricting the sliding contact of the semiconductor chip body, the semiconductor chip body can be transported smoothly. In conjunction with the limiting piece to restrict the edge position of the semiconductor chip body, it is easy to transport the semiconductor chip body stably on the surface of the arc track and the straight track. This allows the bending mold and cutting mold at the bottom of the moving block to process the semiconductor chip body, so that the semiconductor chip body is transported flat to the position below the moving block for processing. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of a sensor semiconductor chip bending and cutting device according to an embodiment of this application;

[0025] Figure 2 The schematic diagrams provided here are for illustrative purposes only and are intended to demonstrate the main usage of embodiments of this application.

[0026] Figure 3 This is a schematic diagram illustrating the front-view three-dimensional structure of the embodiments of this application;

[0027] Figure 4 This is a schematic diagram illustrating the rear-view three-dimensional structure of the embodiments of this application;

[0028] Reference numerals: 1. Base; 2. Arc-shaped track; 3. Straight track; 4. Fixing plate; 5. Discharge port; 6. Receiving port; 7. Semiconductor chip body; 701. Circular hole; 8. First pressure roller; 9. ; 10. Support arm; 11. Telescopic rod; 12. Movable block; 1201. Bending mold; 1202. Cutting mold; 13. Identifier; 14. Second pressure roller; 15. Third pressure roller; 16. Drive wheel; 17. Protruding nail; 18. Motor; 19. Limiting plate. Detailed Implementation

[0029] The following is in conjunction with the appendix Figures 1-4 This application will be described in further detail.

[0030] This application discloses a sensor semiconductor chip bending and cutting device, including an arc-shaped track 2, a straight track 3, and a fixing plate 4 fixedly installed on the top of a base 1 from right to left. A support arm 10 is fixedly installed on the top of the base 1, and a telescopic rod 11 is fixedly installed on the top of the support arm 10. A movable block 12 is installed at the output end of the telescopic rod 11. The movable block 12 is slidably installed with the support arm 10. A bending mold 1201 and a cutting mold 1202 for processing the semiconductor chip body 7 are respectively provided at the bottom of the movable block 12. A circular hole 701 is opened on the surface of the semiconductor chip body 7. A motor 18 is fixedly installed on one side of the fixing plate 4, and an identifier 13 for identifying the semiconductor chip body 7 is fixedly installed on the other side of the fixing plate 4. An active wheel 16 for conveying the semiconductor chip body 7 is installed at the output end of the motor 18.

[0031] By setting up the movable block 12, the identifier 13, and the circular hole 701, it is convenient to identify and monitor the circular hole 701 on the surface of the semiconductor chip body 7 through the identifier 13, and to calculate the conveying distance of the semiconductor chip body 7. By setting up the bending mold 1201 and the cutting mold 1202, it is convenient to control the motor 18 to drive the drive wheel 16 to rotate through the identification of the circular hole 701 by the identifier 13. The drive wheel 16 drives the semiconductor chip body 7 to carry out conveying movement. The movable block 12 is driven by the telescopic rod 11, which enables the bending mold 1201 and the cutting mold 1202 at the bottom of the movable block 12 to perform bending and cutting processing on the semiconductor chip body 7.

[0032] Reference Figure 1 , Figure 2 The arc-shaped track 2 and the straight track 3 are fixedly connected. The semiconductor chip body 7 is located above the arc-shaped track 2 and the straight track 3. The straight track 3 is located in front of the support arm 10 and below the movable block 12.

[0033] By setting up the arc-shaped track 2 and the straight track 3, it is convenient to transport the semiconductor chip body 7 through the arc-shaped track 2 and the straight track 3, so that the semiconductor chip body 7 is transported to the position below the movable block 12, so that the bending mold 1201 and the cutting mold 1202 can better perform bending and cutting processing operations on the semiconductor chip body 7.

[0034] Reference Figure 1 , Figure 2 The bottom right side of the arc track 2 has a discharge port 5, and the top of the base 1 has a receiving port 6 fixedly installed. The receiving port 6 is located in front of the fixed plate 4.

[0035] By setting up the discharge port 5 and the receiving port 6, it is convenient to transport the semiconductor chip body 7 from the discharge port 5 for processing, and collect the processed semiconductor chip body 7 through the receiving port 6 to complete the bending and cutting processing operation of the semiconductor chip body 7.

[0036] Reference Figure 1 , Figure 2 The outer side of the drive wheel 16 is provided with a protruding nail 17 that matches the round hole 701, and the receiving port 6 is located at the lower left of the drive wheel 16.

[0037] By setting a circular hole 701, the drive wheel 16 can rotate to drive the protruding nail 17 to drive the semiconductor chip body 7 to carry out the conveying operation through the matching circular hole 701. The recognition of the circular hole 701 by the identifier 13 can control the start and stop of the motor 18. In conjunction with the telescopic rod 11, the movable block 12 is driven to perform bending and cutting processing of the semiconductor chip body 7, so that the start and operation of the motor 18 and the telescopic rod 11 can better perform bending and cutting processing of the semiconductor chip body 7.

[0038] Reference Figure 1 , Figure 2 A second pressure roller 14 and a third pressure roller 15 are rotatably mounted on one side of the fixed plate 4, and the second pressure roller 14 and the third pressure roller 15 are respectively installed in rolling contact with the drive wheel 16.

[0039] By setting the second pressure roller 14 and the third pressure roller 15, it is convenient for the second pressure roller 14 and the third pressure roller 15 to pull the semiconductor chip body 7 conveyed on the outside of the drive wheel 16, so that the semiconductor chip body 7 can be output from the discharge port 5 and collected through the receiving port 6.

[0040] Reference Figure 1 , Figure 2 The top of the straight track 3 is rotatably mounted with a first pressure roller 8, which is in rolling contact with the semiconductor chip body 7; the top of the straight track 3 is provided with a 9 to restrict the semiconductor chip body 7, and the surfaces of the arc track 2 and the straight track 3 are respectively provided with limiting pieces 19 to restrict the semiconductor chip body 7.

[0041] By setting the first pressure roller 8, the contact restriction of the semiconductor chip body 7 during the conveying process is facilitated by the rolling of the first pressure roller 8, so that the semiconductor chip body 7 can be conveyed smoothly for processing. The restriction of the semiconductor chip body 7 by 9 and the restriction of the edge position of the semiconductor chip body 7 by the limiting piece 19 can make the semiconductor chip body 7 conveyed flat, which is convenient for bending and cutting processing of the semiconductor chip body 7.

[0042] The implementation principle of the sensor semiconductor chip bending and cutting device in this application embodiment is as follows: First, the semiconductor chip body 7 is extracted from the discharge port 5 and then conveyed sequentially along the top positions of the arc track 2 and the straight track 3. The semiconductor chip body 7 passes under the first pressure rollers 8 and 9, and then passes under the identifier 13. The semiconductor chip body 7 is conveyed through the position between the drive wheel 16 and the second pressure roller 14 and the third pressure roller 15. Then, the identifier 13 can control the start or stop of the motor 18 by recognizing the circular hole 701. With the help of the telescopic rod 11, the movable block 12 slides along the support arm 10, so that the bending mold 1201 and the cutting mold 1202 at the bottom of the movable block 12 perform bending and cutting processing on the semiconductor chip body 7. The motor 18 rotates and drives the drive wheel 16 to drive the semiconductor chip body 7 to be conveyed, so that the semiconductor chip body 7 can be smoothly conveyed to the bottom of the movable block 12. The movable block 12 performs processing on the semiconductor chip body 7. Finally, the processed semiconductor chip body 7 is collected through the receiving port 6.

[0043] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A sensor semiconductor chip bending and cutting device, characterized in that: The system includes an arc-shaped track (2), a straight track (3), and a fixing plate (4) fixedly installed on the top of the base (1) from right to left. A support arm (10) is fixedly installed on the top of the base (1). A telescopic rod (11) is fixedly installed on the top of the support arm (10). A movable block (12) is installed at the output end of the telescopic rod (11). The movable block (12) is slidably installed with the support arm (10). A bending mold (1201) and a cutting mold (1202) for processing the semiconductor chip body (7) are respectively provided at the bottom of the movable block (12). A round hole (701) is opened on the surface of the semiconductor chip body (7). A motor (18) is fixedly installed on one side of the fixing plate (4). An identifier (13) for identifying the semiconductor chip body (7) is fixedly installed on the other side of the fixing plate (4). An active wheel (16) for conveying the semiconductor chip body (7) is installed at the output end of the motor (18).

2. The sensor semiconductor chip bending and cutting device according to claim 1, characterized in that: The arc-shaped track (2) is fixedly connected to the straight track (3). The semiconductor chip body (7) is located above the arc-shaped track (2) and the straight track (3). The straight track (3) is located in front of the support arm (10) and below the movable block (12).

3. The sensor semiconductor chip bending and cutting device according to claim 2, characterized in that: The bottom right side of the arc track (2) is provided with a discharge port (5), and the top of the base (1) is fixedly installed with a receiving port (6), which is located in front of the fixed plate (4).

4. The sensor semiconductor chip bending and cutting device according to claim 3, characterized in that: The outer side of the drive wheel (16) is provided with a protruding nail (17) that matches the round hole (701), and the receiving port (6) is located at the lower left of the drive wheel (16).

5. The sensor semiconductor chip bending and cutting device according to claim 4, characterized in that: A second pressure roller (14) and a third pressure roller (15) are rotatably mounted on one side of the fixed plate (4), and the second pressure roller (14) and the third pressure roller (15) are respectively installed in rolling contact with the drive wheel (16).

6. The sensor semiconductor chip bending and cutting device according to claim 5, characterized in that: A first pressure roller (8) is rotatably mounted on the top of the straight track (3), and the first pressure roller (8) is in rolling contact with the semiconductor chip body (7).

7. The sensor semiconductor chip bending and cutting device according to claim 6, characterized in that: The top of the straight track (3) is provided with a (9) that restricts the semiconductor chip body (7), and the surfaces of the arc track (2) and the straight track (3) are respectively provided with limiting pieces (19) that restrict the semiconductor chip body (7).

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