Wafer film recycling system

Abstract

The embodiment of the utility model provides a wafer film recycling system. The wafer film recycling system comprises a film pasting table; the wafer carrying table is arranged in the film pasting table and is used for carrying a wafer; the paired film cylinders are arranged on the two sides of the film pasting table and used for supplying the wafer films and recycling the remaining wafer films; at least two position detection sensors, the detection direction of the first position detection sensor faces the wafer film between the wafer carrying table and the supply film cylinder, and the detection direction of the second position detection sensor faces the wafer film between the wafer carrying table and the recovery film cylinder; and the control unit is coupled with the film cylinders and the position detection sensors, controls at least one film cylinder to rotate in response to the fact that the first position detection sensor detects the bonding film on the wafer film, and controls at least one film cylinder to stop in response to the fact that the second position detection sensor detects the same bonding film. By adopting the technical scheme, the utilization rate of the wafer film can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and more particularly to a wafer film recycling system. Background Technology

[0002] In chip manufacturing, before the thinning / dicing process, a protective film needs to be applied to the front and / or back of the wafer. During the film application process, a laser-guided sensor monitors the remaining amount of the wafer film. Because the beam emitted by the sensor's signal light source has a limited width, and different wafer films have varying light transmittance, to ensure effective monitoring, 5% to 10% of the wafer film is typically left unused to trigger a film replacement alarm signal. Therefore, 5% to 10% of the wafer film on each roll becomes unusable during the film application process.

[0003] Therefore, how to provide technical solutions to improve the utilization rate of wafer films has become an urgent technical problem to be solved. Utility Model Content

[0004] In view of this, embodiments of the present disclosure provide a wafer film reuse system that can improve wafer film utilization.

[0005] To address the aforementioned technical problems, this disclosure provides a wafer film recycling system, comprising: a film application stage; a wafer carrier disposed in the film application stage for supporting wafers; a pair of film tubes disposed on both sides of the film application stage for supplying the wafer film and recycling any remaining wafer film; at least two position detection sensors, wherein the detection direction of a first position detection sensor is toward the wafer film between the wafer carrier and the supply film tube, and the detection direction of a second position detection sensor is toward the wafer film between the wafer carrier and the recycling film tube; and a control unit coupled to the film tubes and the position detection sensors, wherein, in response to the first position detection sensor detecting an adhesive film on the wafer film, the control unit controls at least one film tube to rotate, and in response to the second position detection sensor detecting the same adhesive film, the control unit controls at least one film tube to stop.

[0006] Optionally, the wafer film reuse system further includes: a wafer film splicing device; the wafer film splicing device includes: a first film tube, a second film tube, and an adhesive film; the adhesive film bonds and splices one end of the wafer film of the first film tube to one end of the wafer film of the second film tube together; wherein the rotation directions of the first film tube and the second film tube are the same, so as to wind the remaining wafer film onto the second film tube.

[0007] Optionally, the transmittance of the adhesive film is more than 20 percent less than the transmittance of the wafer film, and / or the reflectance of the adhesive film is more than 10 percent greater than the reflectance of the wafer film.

[0008] Optionally, the wafer stage is composed of three circular steps that rise sequentially from the outside to the inside.

[0009] Optionally, the outermost circular step of the wafer stage has a straight-edge positioning groove for positioning the wafer on the wafer stage.

[0010] Optionally, the wafer film reuse system further includes: a wafer film cutting device; the wafer film cutting device is disposed above the wafer stage and coupled to the control unit, and cuts the wafer film in response to a cutting signal from the control unit.

[0011] Optionally, the wafer shaving device is a ring blade; wherein the cutting edge of the ring blade is perpendicular to and faces the plane where the wafer stage is located.

[0012] Optionally, the position detection sensor is a reflective photoelectric sensor.

[0013] Optionally, the position detection sensor is located on the film application stage, and its projection on the wafer film does not coincide with the projection of the wafer stage on the wafer film.

[0014] Optionally, the position detection sensor is clipped onto the film application table.

[0015] Compared with the prior art, the technical solution of the present disclosure has the following advantages:

[0016] This disclosure provides a wafer film reuse system in which surplus wafer films are bonded and spliced ​​together. A first position detection sensor is positioned between the wafer stage and the supply film tube, and a second position detection sensor is positioned between the wafer stage and the recycling film tube, facing the wafer film, to detect the adhesive film on the wafer film. Based on the position information of the adhesive film obtained from the various position detection sensors, the control unit stops the film tube, moving the adhesive film away from the wafer stage. This prevents the adhesive film from being used for wafer bonding, allowing the bonded and spliced ​​wafer film to be reused. Therefore, the utilization rate of the wafer film can be improved. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this specification, the drawings used in the description of the embodiments of this specification or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1A schematic diagram of a wafer film recycling device according to an embodiment of the present disclosure is shown;

[0019] Figure 2 A schematic diagram of another wafer film recycling device is shown in an embodiment of this disclosure;

[0020] Figure 3 A schematic diagram of a wafer splicing device according to an embodiment of the present disclosure is shown;

[0021] Figure 4 A wafer film residue detection device is shown.

[0022] Explanation of reference numerals in the attached figures:

[0023] Film application table 100, position detection sensor 110, first position detection sensor 110a, second position detection sensor 110b, laser beam sensor 111, transmitter 111a, receiver 111b;

[0024] Wafer stage 200, straight edge positioning groove 210;

[0025] Membrane tube 300, supply membrane tube 300a, recovery membrane tube 300b, first membrane tube 300c, second membrane tube 300d, wafer film 310, adhesive film 320;

[0026] The first sensor detection position is A1, the second sensor detection position is A2, the distance between the two sensors is L1, the feeding direction is F1, and the feeding direction is F2. Detailed Implementation

[0027] The technical solutions described herein will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this disclosure and are used to illustrate the concept of this disclosure; these descriptions are illustrative and exemplary and should not be construed as limiting the implementation methods or the scope of protection of this disclosure. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0028] It should be noted that the accompanying drawings in this embodiment are schematic diagrams used to illustrate the concept of this disclosure, and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of this disclosure, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0029] In a specific application, see Figure 4In chip manufacturing, before the thinning / dicing process, a protective film needs to be applied to the front and / or back of the wafer. During the film application process, a laser-guided sensor 111 monitors the remaining amount of wafer film 310. Because the beam emitted from the sensor's transmitter 111a to the receiver 111b has a limited width, and because different wafer films 310 have varying light transmittance, to ensure effective monitoring, 5% to 10% of the wafer film 310 is typically retained as a reserve to effectively trigger a film replacement alarm signal. Therefore, 5% to 10% of the wafer film 310 in each roll of film becomes unusable during the film application process.

[0030] To address the aforementioned technical problems, this disclosure provides a wafer film reuse system in which surplus wafer films are bonded and spliced ​​together. A first position detection sensor is positioned between the wafer stage and the supply film tube, and a second position detection sensor is positioned between the wafer stage and the recycling film tube, facing the wafer film, to detect the adhesive film on the wafer film. Based on the position information of the adhesive film obtained from the various position detection sensors, the control unit stops the film tube, moving the adhesive film away from the wafer stage. This prevents the adhesive film from being used for wafer bonding, allowing the bonded and spliced ​​wafer film to be reused. Therefore, the utilization rate of the wafer film can be improved.

[0031] To make the above-described objects, features and advantages of this disclosure more apparent and understandable, a clear and complete illustrative description of this disclosure is provided below in conjunction with the accompanying drawings.

[0032] See Figure 1 , Figure 1 A schematic diagram of a wafer film recycling device according to an embodiment of the present disclosure is shown. The schematic diagram is divided into two parts connected by a dashed line, with the same structure leading out from the dashed line. The lower part is a schematic diagram of the wafer film recycling device, and the upper part leading out from the dashed line is a top view of the film application stage in the wafer film recycling device.

[0033] In this embodiment, the wafer film reuse system may include: a film application stage 100, a position detection sensor 110, a wafer carrier 200, and a film tube 300.

[0034] This disclosure provides a wafer film recycling system, including a film application stage 100, which provides process space for applying films to silicon wafers.

[0035] The wafer stage 200 is disposed in the film-coating stage 100 and is used to support the wafer.

[0036] The wafer stage 200 has a plurality of vacuum adsorption holes in its central region. The vacuum adsorption holes are evenly distributed and symmetrical about the center of the wafer stage 200 to fix the wafer, so that the wafer is subjected to balanced force during adsorption and avoids wafer deformation or damage due to excessive local pressure.

[0037] In some embodiments, the wafer stage 200 is composed of three circular steps that rise sequentially from the outside to the inside. The height difference between adjacent steps is 0.5–1.0 mm. The outermost step has an outer diameter of 310–330 mm, the middle step has an outer diameter of 250–270 mm, and the innermost step has an outer diameter of 100–120 mm, forming a progressive support surface. The innermost circular step has multiple evenly distributed vacuum adsorption holes, with three holes evenly distributed at 120° intervals. The holes have a diameter of 0.8–1.2 mm and are connected to a negative pressure system via internal vacuum tubing, generating an adsorption force of -80 kPa within 0.1 seconds to adsorb and fix the wafer. This design of three circular steps rising sequentially from the outside to the inside is compatible with wafers of various sizes, effectively supporting wafers with diameters ranging from 100 mm to 300 mm.

[0038] In some embodiments, the outermost circular step of the wafer stage 200 has a straight-edge positioning groove 210, which achieves high-precision angle calibration and anti-displacement of the wafer by physical limiting and precise matching with the edge features (flat edge or notch), so as to help position and adsorb the wafer onto the wafer stage 200.

[0039] In some embodiments, the wafer stage 200 is height-adjustable and can be used in conjunction with a robotic arm or other automated equipment to achieve automatic loading and unloading of wafers, thereby improving production efficiency.

[0040] The film application stage 100 has a pair of film tubes 300 symmetrically installed on both sides, namely a supply film tube 300a and a recovery film tube 300b, for supplying the wafer film 310 and recovering the remaining wafer film.

[0041] In some embodiments, the central axis distance between the supply membrane cylinder 300a and the recovery membrane cylinder 300b is adjustable from 500 to 800 mm to accommodate different wafer films 310. The supply membrane cylinder 300a and / or the recovery membrane cylinder 300b are driven by a servo motor with a membrane supply rate of 0.5-5 m / min.

[0042] See also Figure 4 The supply membrane cylinder 300a is equipped with a laser-type sensor 111 arranged perpendicular to the axis of the membrane cylinder to monitor the remaining membrane material thickness in real time.

[0043] See also Figure 1 and Figure 2The number of position detection sensors 110 is at least two, and in this embodiment, two are preferred, namely a first position detection sensor 110a and a second position detection sensor 110b.

[0044] The detection direction of the first position detection sensor 110a is towards the wafer film 310 between the wafer stage 200 and the supply film cylinder 300a, and the detection direction of the second position detection sensor 110b is towards the wafer film 310 between the wafer stage 200 and the return film cylinder 300b. Furthermore, the position detection sensor 110 is snapped into the film application stage 100 between the wafer stage 200 and the supply film cylinder 300a.

[0045] The distance L1 between the two sensors is greater than the diameter of the wafer stage 200, that is, the distance between the first sensor detection position A1 and the second sensor detection position A2 is greater than the diameter of the wafer stage 200.

[0046] Specifically, the position detection sensor 110 is disposed on the film application stage 100 between the wafer stage 200 and the film supply cylinder 300a. The connection between the position detection sensor 110 and the film application stage 100 can be a detachable connection such as screw connection, snap connection, or magnetic attraction. Here, a snap connection is preferred, that is, when the snap is in contact with the slot, the snap is elastically deformed under pressure or tension, the deformed part enters the limiting area in the slot, the elastic element (snap) returns to its original shape, generating a pre-tightening force to achieve self-locking.

[0047] In some embodiments, the detection direction of the position detection sensor 110 is perpendicular to the plane of the wafer stage 200 and toward the wafer film 310.

[0048] In some embodiments, the position detection sensor 110 is snapped onto the side of the film application stage 100, and its emitted beam is focused precisely at the lower surface of the wafer film 310 in the suspended section between the edge of the wafer stage 200 and the supply film cylinder 300a, with an effective detection distance set to 30±5mm.

[0049] Furthermore, the height of the position detection sensor 110 relative to the film application stage 100 is less than the height of the wafer stage 200 relative to the film application stage 100. That is, the distance between the wafer stage 200 and the wafer film 310 is greater than the distance between the position detection sensor 110 and the wafer film 310.

[0050] In other words, the installation height of the position detection sensor 110 is lower than the plane of the wafer stage 200 that supports the wafer, forming a stepped spatial layout. This structure makes the vertical distance (H1) between the wafer stage 200 and the wafer film 310 less than the distance (H2) between the detection surface of the position detection sensor 110 and the wafer film 310. By constructing the gradient difference of H1 < H2, an avoidance buffer zone is formed on the transmission path of the wafer film 310, effectively avoiding the risk of physical contact between the position detection sensor 110 and the wafer film 310, and reducing the probability of rubbing interference between the wafer film 310 and the position detection sensor 110.

[0051] The position detection sensor 110 is located on the film pasting table 100, and the projection of the position detection sensor 110 on the wafer film 310 does not coincide with the projection of the wafer stage 200 on the wafer film 310.

[0052] In other words, the projection of the position detection sensor 110 on the wafer film 310 and the projection of the wafer stage 200 on the wafer film 310 have a certain distance (from the perspective of saving the wafer film 310 and improving the utilization rate of the wafer film 310, this distance should be minimized as much as possible), that is, in the direction perpendicular to the wafer film 310, the position detection sensor 110 and the wafer stage 200 do not block each other, further defining the relative positions of the position detection sensor 110 and the wafer stage 200, thereby further reducing the probability of interference between the wafer film 310 and the position detection sensor 110 and the risk of physical contact between the position detection sensor 110 and the wafer film 310.

[0053] Combined with Figure 2 , Figure 2 FIG. shows another schematic diagram of a wafer film reuse device in an embodiment of the present disclosure. Among them, the schematic diagram is divided into upper and lower parts connected by a dotted line. The same structure is led out by a dotted line. The lower part is the schematic diagram of the wafer film reuse device, and the upper part led out by the dotted line is the top view of the film pasting table in the wafer film reuse device.

[0054] The control unit is coupled to the film cylinder 300 and the position detection sensor 110. After the first position detection sensor 110a detects the adhesive film 320 on the wafer film 310 and the second position detection sensor 110b detects the same adhesive film 320, the control unit controls at least one of the film cylinders 300 to stop.

[0055] Specifically, after the first position detection sensor 110a detects the adhesive film 320 on the wafer film 310, it sends a first signal to the control unit. Upon receiving the first signal, the control unit drives the motor coupled to the film cylinder 300, causing the film cylinder 300 to rotate continuously. After the second position detection sensor 110b detects the same adhesive film 320, it sends a second signal to the control unit. Upon receiving the second signal, the control unit controls the supply film cylinder 300a and / or the return film cylinder 300b to stop rotating via the motor, thereby preventing the adhesive film 320 from remaining on the wafer, and thus ensuring that the wafer film 310 near the adhesive film 320 is not used for wafer bonding.

[0056] In other words, the film tube rotates under the drive of the motor, feeding the wafer film 310 supplied by the film tube 300a into the laminating stage 100 along the F1 direction. When the first position detection sensor 110a detects the adhesive film 320 on the wafer film 310, that is, as Figure 1 As shown, the adhesive film 320 is located at the first sensor detection position A1. The first position detection sensor 110a sends the first signal to the control unit. In response to the first signal, the control unit drives the motor coupled to the film cylinder, causing the film cylinder to rotate continuously. When the second position detection sensor 110b detects the adhesive film 320 on the wafer film 310, that is... Figure 2 As shown, the adhesive film 320 is located at the second sensor detection position A2. The second position detection sensor 110b sends the second signal to the control unit. In response to the second signal, the control unit controls the supply film tube 300a and / or the recycling film tube 300b to stop rotating via a motor, so as to prevent the adhesive film 320 from staying on the wafer, thereby preventing the wafer film 310 near the adhesive film 320 from being used to attach the wafer.

[0057] The position detection sensor 110 can be a transmissive photoelectric sensor, a reflective photoelectric sensor, a spectral confocal sensor, an ultrasonic sensor, a machine vision system, etc. In this embodiment, a reflective photoelectric sensor is preferred.

[0058] Reflective photoelectric sensors utilize the differences in the reflection and refraction properties of light on the surface of a transparent object, combined with photoelectric conversion technology, to identify target objects. If the target is a transparent object, light is refracted at its surface, with some light entering the interior of the transparent object and reflecting back to the sensor with relatively weak intensity. When the target object (such as an opaque or translucent object) is attached to the surface of a transparent object, light undergoes specular or diffuse reflection at that surface, significantly increasing the intensity of the reflected light back to the sensor. This significant increase in reflected light intensity causes the output signal to exceed a threshold, triggering the detection of the target signal.

[0059] See Figure 3 , Figure 3 A schematic diagram of a wafer splicing device according to an embodiment of the present disclosure is shown.

[0060] The wafer film reuse system also includes a wafer film splicing device.

[0061] The wafer film splicing device includes: a first film tube 300c, a second film tube 300d, and an adhesive film 320; the adhesive film 320 adhesively splices one end of the wafer film 310 of the first film tube 300c to one end of the wafer film 310 of the second film tube 300d; wherein the first film tube 300c and the second film tube 300d rotate in the same direction to wind the remaining wafer film 310 onto the second film tube 300d.

[0062] Specifically, after the adhesive film 320 adhesively joins one end of the wafer film 310 of the first film tube 300c with one end of the wafer film 310 of the second film tube 300d, the motor coupled to the first film tube 300c and / or the second film tube 300d is started, driving the first film tube 300c and the second film tube 300d to rotate in the same direction F2, so as to wind the remaining wafer film 310 onto the second film tube 300d.

[0063] Furthermore, the first membrane tube and the second membrane tube are not a limitation on the number of membrane tubes that can be spliced ​​together.

[0064] In some embodiments, the wafer films 310 of the first film tube 300c and the second film tube 300d are manually bonded together using the adhesive film 320. Therefore, the wafer film 310 within a 10-12 cm range around the splicing point of the spliced ​​wafer film 310 is defined as an unreliable wafer film, and this section of wafer film cannot be used in the wafer lamination process.

[0065] In this embodiment, the position detection sensor 110 is a reflective photoelectric sensor. Therefore, the transmittance of the adhesive film 320 is more than 20% less than the transmittance of the wafer film 310, and / or the reflectance of the adhesive film 320 is more than 10% greater than the reflectance of the wafer film 310. This enables the position detection sensor 110 to detect the adhesive film 320.

[0066] In a non-limiting specific application, the wafer film 310 may be a conventional blue film.

[0067] Specifically, the position detection sensor 110 is a reflective photoelectric sensor, whose main function is to detect the presence of the adhesive film 320 on the wafer film 310. In actual detection, to ensure the accuracy and reliability of this detection, the optical characteristics of the adhesive film 320 differ significantly from those of the wafer film 310. Specifically, the transmittance of the adhesive film 320 is more than 20% lower than that of the wafer film 310. Transmittance reflects the proportion of light passing through a material; the lower transmittance of the adhesive film 320 means that more light is lost when passing through it. Furthermore, or (either of two conditions must be met for the sensor to detect the adhesive film 320), the reflectance of the adhesive film 320 is more than 10% higher than that of the wafer film 310. Reflectance reflects the proportion of light reflected back after hitting the material surface; the higher reflectance of the adhesive film 320 indicates that more light is reflected back. It is precisely because the adhesive film 320 has such a significant difference in light transmittance and reflectance compared to the wafer film 310 that the position detection sensor 110 is able to effectively detect the adhesive film 320.

[0068] The wafer film recycling system further includes: a wafer film cutting device (not shown); the wafer film cutting device is disposed above the wafer stage 200 and coupled to the control unit, and cuts the wafer film 310 in response to the cutting signal of the control unit.

[0069] Specifically, after the wafer film 310 is attached to the wafer, the control unit sends a cutting signal to control the wafer film 310 cutting device to cut the wafer film 310 along the edge of the wafer and cut off the wafer after film attachment.

[0070] The wafer slitting device is shaped like a ring blade. The cutting edge of the ring blade is perpendicular to and faces the plane of the wafer stage 200.

[0071] The ring blades come in different sizes to accommodate wafers of different sizes.

[0072] In some embodiments, the size of the annular blade is larger than the size of the wafer, i.e., the cutting position is 1-3 cm away from the wafer.

[0073] Specifically, when the wafer film cutting device receives the cutting signal, it drives the annular blade of the corresponding size to descend directly above the wafer to cut the wafer film 310, and the plane of the annular blade is parallel to the plane of the wafer stage 200.

[0074] In some embodiments, the cutting edge of the annular blade is serrated to concentrate stress and quickly cut the wafer film 310.

[0075] In some embodiments, the wafer film cutting device uses a single blade for cutting. That is, the blade descends to a preset position and moves along a fixed track in the wafer film cutting device to cut the wafer film 310.

[0076] It is understood that the above describes multiple embodiments of the wafer film recycling system. The optional methods described in each embodiment can be combined and cross-referenced without conflict, thereby extending to a variety of possible embodiments. These can all be considered as disclosed or publicly available embodiments of this utility model.

[0077] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0078] In the embodiments of this application, "multiple" refers to two or more.

[0079] The descriptions of "first," "second," etc., appearing in the embodiments of this application are for illustrative purposes and to distinguish the objects being described. They have no order and do not indicate any special limitation on the number of devices in the embodiments of this application, nor do they constitute any limitation on the embodiments of this application.

[0080] It should be noted that the sequence number of each step in this embodiment does not represent a limitation on the execution order of each step.

[0081] While the embodiments disclosed herein are as described above, this disclosure is not limited thereto. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A wafer film recycling system, characterized in that, include: Film application station; A wafer carrier, disposed in the film-coating stage, is used to support the wafer; Pairs of film tubes are arranged on both sides of the film application stage for supplying the wafer film and recycling any remaining wafer film. At least two position detection sensors are provided. The detection direction of the first position detection sensor is toward the wafer film between the wafer stage and the supply film barrel, and the detection direction of the second position detection sensor is toward the wafer film between the wafer stage and the recovery film barrel. The control unit is coupled to the film tube and the position detection sensor. In response to the first position detection sensor detecting the adhesive film on the wafer film, it controls at least one film tube to rotate. In response to the second position detection sensor detecting the same adhesive film, it controls at least one film tube to stop.

2. The wafer film recycling system according to claim 1, characterized in that, Also includes: Wafer splicing device; The wafer splicing device includes: a first film tube, a second film tube, and an adhesive film; The adhesive film bonds and splices one end of the wafer film of the first film tube to one end of the wafer film of the second film tube together; The first film tube and the second film tube rotate in the same direction to wind the remaining wafer film onto the second film tube.

3. The wafer film recycling system according to claim 2, characterized in that, The transmittance of the adhesive film is more than 20 percent less than that of the wafer film, and / or the reflectance of the adhesive film is more than 10 percent greater than that of the wafer film.

4. The wafer film recycling system according to claim 1, characterized in that, The wafer stage is composed of three circular steps that rise sequentially from the outside to the inside.

5. The wafer film recycling system according to claim 4, characterized in that, The outermost circular step of the wafer stage has a straight-edge positioning groove for positioning the wafer on the wafer stage.

6. The wafer film recycling system according to claim 5, characterized in that, Also includes: Wafer film cutting device; The wafer film cutting device is disposed above the wafer stage and coupled to the control unit, and cuts the wafer film in response to the cutting signal of the control unit.

7. The wafer film recycling system according to claim 6, characterized in that, The wafer film cutting device is a ring-shaped blade; The cutting edge of the annular blade is perpendicular to and faces the plane of the wafer stage.

8. The wafer film recycling system according to claim 1, characterized in that, The position detection sensor is a reflective photoelectric sensor.

9. The wafer film recycling system according to claim 1 or 8, characterized in that, The position detection sensor is located on the film application stage, and its projection on the wafer film does not coincide with the projection of the wafer stage on the wafer film.

10. The wafer film recycling system according to claim 9, characterized in that, The position detection sensor is attached to the film application platform.

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