Aluminum substrate solder resist ink pre-baking device

Abstract

The utility model discloses an aluminum substrate solder resist ink pre-baking device, which belongs to the technical field of aluminum substrate solder resist ink, and is characterized in that the aluminum substrate solder resist ink pre-baking device comprises a moving frame, a device body and an aluminum substrate body are arranged at the top of the moving frame, and sealing mechanisms are arranged on the front side and the rear side of the device body. Auxiliary mechanisms are arranged on the two sides of the top of the movable frame. The auxiliary mechanism comprises a heating plate, a dustproof net, an installation frame, a plurality of fixing columns, an air inlet frame and an installation sleeve, and solves the problems that most existing aluminum substrate solder resist ink pre-baking devices adopt the design that infrared heating pipes are evenly distributed at the top and the bottom, but in actual operation, aluminum substrates in the edge area still have the situation that heating is insufficient, and the heating effect is poor. The problems that a pre-baking device is poor in sealing performance, heat is prone to loss, temperature fluctuation in the device is large, stable pre-baking temperature is difficult to maintain, the ink curing effect is affected, and external dust and impurities possibly enter the device to pollute ink and an aluminum substrate are solved.

Description

A pre-baking device for solder resist ink on aluminum substrate Technical Field

[0001] This utility model relates to the field of aluminum substrate solder resist ink technology, and in particular to an aluminum substrate solder resist ink pre-baking device. Background Technology

[0002] Solder resist ink for aluminum substrates is a special ink specifically designed for use on the surface of aluminum substrates, and it plays a crucial role in the field of electronic circuit manufacturing.

[0003] Traditional pre-baking methods and pre-baking ovens use hot air circulation drying at 75±2℃ for 40-50 minutes to complete the pre-baking process. The aluminum substrate is placed statically in the pre-baking oven, and the contact with the hot air is not uniform, resulting in uneven drying and affecting the pre-baking efficiency. At the same time, the rack on which the aluminum substrate is placed will come into contact with the solder resist ink, causing the solder resist ink to fall off or stick to the rack, affecting product quality.

[0004] Existing patent document (publication number: CN217726102U) discloses a pre-baking device for solder resist ink on aluminum substrates, including a pre-baking oven and a rotating box. The advantages are as follows: This utility model uses a rotating box and clamping strips. When pre-baking the solder resist ink on the surface of an aluminum substrate, the aluminum substrate coated with solder resist ink can be placed in the pre-baking oven. By opening the clamping strips outwards, the aluminum substrate is placed between the strips, aligned with the clamping grooves, and the spring rebound pushes the clamping grooves on the surface of the clamping strips to clamp the aluminum substrate, thus starting the pre-baking process. The clamping grooves clamp the edge of the aluminum substrate, almost without contact with the solder resist ink, avoiding the solder resist ink from falling off and sticking. During pre-baking, the drive motor drives the rotating box to rotate, thereby driving the aluminum substrate to rotate. The air pump generates airflow which is injected into the distribution funnel. After being heated by the heating wire, the hot air is blown onto the rotating aluminum substrate. Because the aluminum substrate is rotating during pre-baking, the contact between each surface and the hot air is more uniform, thereby improving the uniformity and efficiency of drying and increasing work efficiency.

[0005] To address the aforementioned issues, existing patents offer solutions. However, these solutions have certain limitations in practice. Most existing aluminum substrate solder resist ink pre-baking devices employ a design with infrared heating tubes evenly distributed at the top and bottom. However, in actual operation, the aluminum substrate in the edge area still suffers from insufficient heating. The pre-baking device has poor sealing, heat is easily lost, and the internal temperature fluctuates greatly, making it difficult to maintain a stable pre-baking temperature, which affects the ink curing effect. Furthermore, external dust and impurities may enter the device, contaminating the ink and aluminum substrate.

[0006] To address this, a pre-baking device for solder resist ink on aluminum substrates is proposed. Summary of the Invention

[0007] The purpose of this invention is to provide an aluminum substrate solder resist ink pre-baking device that can solve the problems of most existing aluminum substrate solder resist ink pre-baking devices that use infrared heating tubes evenly distributed at the top and bottom, but in actual operation, the aluminum substrate in the edge area still suffers from insufficient heating, poor sealing of the pre-baking device, easy heat loss, large temperature fluctuations inside the device, difficulty in maintaining a stable pre-baking temperature, affecting the ink curing effect, and the possibility of external dust and impurities entering the device and contaminating the ink and aluminum substrate.

[0008] To achieve the above objectives, the present invention provides the following technical solution: an aluminum substrate solder resist ink pre-baking device, comprising a movable frame, wherein a device body and an aluminum substrate are provided on the top of the movable frame, a sealing mechanism is provided on the front and rear sides of the device body, and an auxiliary mechanism is provided on both sides of the top of the movable frame.

[0009] The auxiliary mechanism includes a heating plate, a dustproof net, a mounting frame, several fixed columns, an air inlet frame, and a mounting sleeve. The surface of the heating plate is connected to the interior of the mounting frame, the surface of the dustproof net is connected to the interior of the mounting frame, the bottom of the fixed column passes through the mounting frame and extends into the interior of the movable frame, the surface of the fixed column is connected to the interior of the movable frame, the bottom of the air inlet frame communicates with the top of the mounting frame, the bottom of the mounting sleeve is connected to the top of the mounting frame, and the surface of the mounting sleeve contacts the interior of the air inlet frame.

[0010] Preferably, the sealing mechanism includes a fixing plate provided on both the front and rear sides of the device body, and an adjustment bracket is provided on the surface of the fixing plate.

[0011] Preferably, the adjusting frame is provided with four limiting springs, the top of the limiting springs being connected to the bottom of the fixed plate, thereby connecting the adjusting frame and the fixed plate together through the limiting springs.

[0012] Preferably, a sealing inclined plate is connected to the bottom of the adjusting frame, and a rotating column is rotatably connected to the bottom of the sealing inclined plate.

[0013] Preferably, six rollers are rotatably connected to each of the two adjusting frames on opposite sides, and the surface of the rollers is in contact with the surface of the device body.

[0014] Preferably, the top of the air inlet frame is provided with a number of bolts, the bottom of which extends into the interior of the mounting sleeve and is connected to the internal thread of the mounting sleeve.

[0015] Preferably, the bottom of the mounting bracket is provided with a plurality of guide plates, and the side of the guide plate near the heating plate is connected to the heating plate.

[0016] Preferably, ventilation frames are fixedly connected to both sides of the movable frame, a connecting frame is connected to the top of the ventilation frame, and the bottom of the connecting frame is connected to the top of the air inlet frame.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. This application allows the airflow inside the air inlet frame to be moved out through the mounting frame. Under the guidance of the guide plate, the moved airflow can be used to evenly blow the hot air on the surface of the heating plate, which is convenient for auxiliary pre-examination of both sides of the aluminum substrate.

[0019] 2. This application makes the rear side of the aluminum substrate contact the surface of the rotating column, thereby facilitating the movement of the rotating column through the sealing inclined plate to move the adjusting frame. When the aluminum substrate moves into the interior of the device body, under the limit of the limiting spring, the adjusting frame moves the sealing inclined plate downward on the surface of the fixed plate, thereby facilitating the sealing of the device body. Attached Figure Description

[0020] Figure 1 is an overall structural diagram of the aluminum substrate solder resist ink pre-baking device of this utility model;

[0021] Figure 2 is a three-dimensional structural diagram of the top of the movable frame in this utility model;

[0022] Figure 3 is a three-dimensional connection diagram of the connecting frame and the mounting frame in this utility model;

[0023] Figure 4 is a three-dimensional connection diagram of the auxiliary mechanism in this utility model;

[0024] Figure 5 is a three-dimensional connection diagram of the sealing mechanism in this utility model;

[0025] Figure 6 is a three-dimensional connection diagram of the roller and the adjusting frame in this utility model.

[0026] In the diagram, 1. Movable frame; 2. Aluminum substrate; 3. Sealing mechanism; 301. Fixing plate; 302. Limiting spring; 303. Adjusting frame; 304. Sealing inclined plate; 305. Rotating column; 4. Device body; 5. Ventilation frame; 6. Auxiliary mechanism; 601. Heating plate; 602. Dustproof net; 603. Mounting frame; 604. Fixing column; 605. Air inlet frame; 606. Mounting sleeve; 7. Connecting frame; 8. Bolt; 9. Roller; 10. Guide plate. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please refer to Figures 1-6. The technical solution provided by this utility model is as follows:

[0029] A pre-baking device for solder resist ink on aluminum substrate includes a movable frame 1, a device body 4 and an aluminum substrate body 2 are provided on the top of the movable frame 1, a sealing mechanism 3 is provided on the front and rear sides of the device body 4, and an auxiliary mechanism 6 is provided on both sides of the top of the movable frame 1.

[0030] The auxiliary mechanism 6 includes a heating plate 601, a dustproof net 602, a mounting frame 603, several fixed posts 604, an air inlet frame 605, and a mounting sleeve 606. The surface of the heating plate 601 is fixedly connected to the interior of the mounting frame 603. The surface of the dustproof net 602 is fixedly connected to the interior of the mounting frame 603. The bottom of the fixed post 604 passes through the mounting frame 603 and extends into the interior of the movable frame 1. The surface of the fixed post 604 is fixedly connected to the interior of the movable frame 1. The bottom of the air inlet frame 605 communicates with the top of the mounting frame 603. The bottom of the mounting sleeve 606 is fixedly connected to the top of the mounting frame 603. The surface of the mounting sleeve 606 is in contact with the interior of the air inlet frame 605.

[0031] In this embodiment: by fixing the bottom of the mounting sleeve 606 to the top of the mounting bracket 603, the mounting bracket 603 can be conveniently positioned to limit the air inlet bracket 605 through the mounting sleeve 606, so that the bottom of the air inlet bracket 605 is connected to the top of the mounting bracket 603. This allows the airflow inside the air inlet bracket 605 to move out through the mounting bracket 603, and the dustproof net 602 to protect the inside of the mounting bracket 603 from dust. This also allows the outflowing airflow to evenly blow the hot air on the surface of the heating plate 601, and facilitates auxiliary pre-heating of both sides of the aluminum substrate 2.

[0032] Specifically, as shown in Figures 1 and 5, the sealing mechanism 3 includes a fixed plate 301 and an adjusting frame 303. The lower part of the fixed plate 301 is connected to the adjusting frame 303 via a connector. It should be noted that the fixed plates of the two sealing mechanisms are respectively located on the front and rear sides of the device body 4.

[0033] Specifically, as shown in Figure 5, four limiting springs 302 are fixedly connected to the adjusting frame 303. The top of the limiting springs 302 is detachably connected to or fixedly connected to the bottom of the fixing plate 301. The connection method between the limiting springs and the fixing plate is existing technology and will not be described in detail.

[0034] Specifically, as shown in Figure 5, a sealing inclined plate 304 is connected to the bottom of the adjusting frame 303, and a rotating column 305 is rotatably connected to the bottom of the sealing inclined plate 304.

[0035] In this embodiment: by connecting the top of the limiting spring 302 to the bottom of the fixing plate 301, the fixing plate 301 can be conveniently limited by the limiting spring 302 to the adjusting frame 303, and the bottom of the sealing inclined plate 304 is rotatably connected to the rotating column 305, thereby facilitating the sealing inclined plate 304 to seal the inside of the device body 4 through the rotating column 305, achieving the effect of sealing the device body 4.

[0036] Specifically, as shown in Figures 1, 5, and 6, six rollers 9 are rotatably connected to the opposite side of each of the two adjusting frames 303, and the surface of the rollers 9 is in contact with the surface of the device body 4.

[0037] Specifically, as shown in Figure 4, the top of the air inlet frame 605 is provided with several bolts 8, the bottom of the bolts 8 extends into the interior of the mounting sleeve 606 and is threadedly connected to the interior of the mounting sleeve 606.

[0038] In this embodiment: by making the surface of the roller 9 contact the surface of the device body 4, the adjusting frame 303 can be easily moved by the roller 9, and the surface of the bolt 8 can be connected to the internal thread of the mounting sleeve 606, thereby making it easy for the mounting sleeve 606 to fix the air inlet frame 605 by the bolt 8, thus achieving the effect of fixing the air inlet frame 605.

[0039] Specifically, as shown in Figure 4, the bottom of the mounting bracket 603 is provided with several guide plates 10, and the side of the guide plate 10 near the heating plate 601 is fixedly connected to the heating plate 601.

[0040] Specifically, as shown in Figures 2, 3, and 4, ventilation frames 5 are fixedly connected to both sides of the movable frame 1, and a connecting frame 7 is fixedly connected to the top of the ventilation frame 5. The bottom of the connecting frame 7 is fixedly connected to the top of the air inlet frame 605.

[0041] In this embodiment: by fixing the side of the guide plate 10 close to the heating plate 601 to the heating plate 601, the heating plate 601 can easily guide the airflow through the guide plate 10, and the bottom of the connecting frame 7 can be fixedly connected to the top of the air inlet frame 605, thereby facilitating the airflow to move through the ventilation frame 5 to the interior of the connecting frame 7, which achieves the effect of facilitating the pre-testing of the aluminum substrate 2 and facilitating the auxiliary pre-testing of the aluminum substrate 2.

[0042] Working principle: During the pre-testing of the aluminum substrate 2, the moving frame 1 moves the aluminum substrate 2 into the interior of the device body 4, so that the rear side of the aluminum substrate 2 contacts the surface of the rotating column 305. This facilitates the rotating column 305 to drive the adjusting frame 303 to move via the sealing inclined plate 304. When the aluminum substrate 2 moves into the interior of the device body 4, under the limit of the limiting spring 302, the adjusting frame 303 drives the sealing inclined plate 304 to move downward on the surface of the fixed plate 301, thereby facilitating the sealing of the device body 4 and the pre-testing of the aluminum substrate 2 by the device body 4. Then, the airflow generated by the ventilation frame 5 moves into the interior of the mounting frame 603, thereby facilitating the... The airflow inside the air inlet frame 605 is moved out through the mounting frame 603. Under the guidance of the guide plate 10, the airflow is able to evenly blow the hot air on the surface of the heating plate 601, which facilitates auxiliary pre-baking of both sides of the aluminum substrate 2. This solves the problem that most existing aluminum substrate solder resist ink pre-baking devices use a design with infrared heating tubes evenly distributed at the top and bottom, but in actual operation, the aluminum substrate in the edge area still suffers from insufficient heating. The pre-baking device has poor sealing, heat is easily lost, and the temperature inside the device fluctuates greatly, making it difficult to maintain a stable pre-baking temperature, which affects the ink curing effect. In addition, external dust and impurities may also enter the device, contaminating the ink and aluminum substrate.

[0043] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A pre-baking device for solder resist ink on aluminum substrates, comprising a movable frame, characterized in that: The top of the mobile frame is provided with a device body and an aluminum base plate. Sealing mechanisms are provided on the front and rear sides of the device body. Auxiliary mechanisms are provided on both sides of the top of the mobile frame. The auxiliary mechanisms include a heating plate, a dustproof net, a mounting frame with several fixed columns, an air inlet frame, and a mounting sleeve. The surface of the heating plate is fixedly connected to the interior of the mounting frame. The surface of the dustproof net is connected to the interior of the mounting frame. The bottom of the fixed column passes through the mounting frame and extends into the interior of the mobile frame. The surface of the fixed column is connected to the interior of the mobile frame. The bottom of the air inlet frame communicates with the top of the mounting frame. The bottom of the mounting sleeve is connected to the top of the mounting frame. The surface of the mounting sleeve is in contact with the interior of the air inlet frame.

2. The aluminum substrate solder resist ink pre-baking apparatus according to claim 1, characterized in that: The sealing mechanism includes a fixed plate and an adjusting frame, with the fixed plate positioned above the adjusting frame.

3. The aluminum substrate solder resist ink pre-baking apparatus according to claim 2, characterized in that: Four limiting springs are provided between the adjusting frame and the fixed plate.

4. The aluminum substrate solder resist ink pre-baking apparatus according to claim 2, characterized in that: The bottom of the adjustment frame is provided with a sealing inclined plate, and a rotating column is rotatably connected to the bottom of the sealing inclined plate.

5. The aluminum substrate solder resist ink pre-baking apparatus according to claim 2, characterized in that: Six rollers are rotatably connected to each of the two adjusting frames on opposite sides, and the surface of the rollers is in contact with the surface of the device body.

6. The aluminum substrate solder resist ink pre-baking apparatus according to claim 1, characterized in that: The top of the air inlet frame is provided with several bolts, the bottom of which extends into the interior of the mounting sleeve and is connected to the internal thread of the mounting sleeve.

7. The aluminum substrate solder resist ink pre-baking apparatus according to claim 1, characterized in that: The bottom of the mounting bracket is provided with several guide plates, and the side of the guide plate near the heating plate is connected to the heating plate.

8. The aluminum substrate solder resist ink pre-baking apparatus according to claim 1, characterized in that: Ventilation frames are fixedly connected to both sides of the movable frame, and a connecting frame is fixedly connected to the top of the ventilation frame. The bottom of the connecting frame is fixedly connected to the top of the air inlet frame.

Images