Diamond copper material processing equipment based on green laser processing

Abstract

The utility model belongs to the technical field of diamond processing equipment, and particularly relates to diamond copper material processing equipment based on green laser processing, which comprises a rack, a laser system and a displacement platform are arranged on the rack, the laser system comprises a green laser, a reflecting mechanism and a light condensing mechanism, the rack comprises two layers of mounting flat plates, and the mounting flat plates are arranged on the rack. A green laser is arranged on the upper-layer mounting flat plate, a reflecting mechanism is arranged on one side of the green laser, a light hole is formed in the upper-layer mounting flat plate, and laser emitted by the green laser is reflected by the reflecting mechanism and then is emitted downwards from the light hole; and a displacement platform is arranged on the lower-layer mounting flat plate and comprises an XY moving platform and a Z-axis moving platform. According to the diamond copper material machining equipment, the green light (532 nm) laser is selected to cut the diamond copper material, and compared with a traditional infrared light source, the diamond copper material machining equipment is more suitable for ultra-precision micro-nano machining of the diamond copper material.

Description

A processing equipment for diamond-copper materials based on green laser processing Technical Field

[0001] This utility model relates to the technical field of diamond processing equipment, specifically to a diamond-copper material processing equipment based on green laser processing. Background Technology

[0002] With the rapid development of high-tech fields such as 5G communication and aerospace, diamond / copper composite materials have gained popularity due to their excellent thermal conductivity (500-1200 W / m·K) and adjustable coefficient of thermal expansion (5-10×10⁻⁻⁻⁶). 6 Diamond (K) has become a key material for heat dissipation substrates of high-power electronic devices. When the diamond volume fraction of this material is in the range of 50%-70%, it exhibits ultra-high hardness and anisotropic characteristics, with a Vickers hardness of 600-800 HV, which undoubtedly brings extremely challenging problems to precision cutting and processing.

[0003] Currently, traditional machining methods mostly employ polycrystalline diamond (PCD) tools for milling or grinding. However, this approach has many drawbacks, such as rapid tool edge chipping and the tendency for cutting force fluctuations to induce subsurface microcrack propagation. These problems become even more pronounced when machining diamond-copper materials. In particular, the high thermal conductivity of diamond-copper (5-8 times higher than traditional metals) easily leads to an imbalance in the heat dissipation mechanism in the cutting zone, further exacerbating the thermochemical wear of the tool and the thermal softening effect of the copper phase on the workpiece surface, resulting in a composite machining defect of "hard and brittle phase damage - soft and sticky phase adhesion." Therefore, traditional machining methods are not well-suited for the precision machining of diamond-copper materials. Thus, this application aims to provide a machining equipment for diamond-copper materials based on a green laser. Summary of the Invention

[0004] The purpose of this invention is to overcome the above-mentioned shortcomings of the prior art and provide a processing equipment for diamond copper materials based on green laser processing.

[0005] The technical solution of this utility model is: a processing equipment for diamond-copper materials based on green laser processing, comprising a frame, on which a laser system and a displacement platform are arranged. The laser system includes a green laser, a reflection mechanism, and a focusing mechanism. The frame includes two mounting plates arranged parallel to each other vertically. A green laser is arranged on the upper mounting plate, and a reflection mechanism is arranged on one side of the green laser. A light-transmitting hole is provided on the upper mounting plate, and the laser emitted by the green laser is reflected by the reflection mechanism and then emitted downward through the light-transmitting hole. A displacement platform is arranged on the lower mounting plate, and the displacement platform includes an XY moving platform and a Z-axis moving platform. The XY moving platform is used to carry the material to be processed, and the Z-axis moving platform is used to adjust the vertical position of the focusing mechanism.

[0006] Furthermore, the reflecting mechanism includes a base, a reflecting arm, and a reflecting lens; the reflecting arm extends obliquely upward from one side of the base, and a lens mounting hole is provided on the reflecting arm.

[0007] Furthermore, the base is a telescopic and adjustable structure used to adjust the vertical height of the reflector arm to accommodate the height of the laser beam emitted by the green laser.

[0008] Furthermore, an angle adjuster is provided in the lens mounting hole, and the reflective lens is fixed in the lens mounting hole through the angle adjuster; when the laser beam enters the reflective lens, the mounting angle of the reflective lens can be adjusted by the angle adjuster, thereby ensuring that the reflected laser beam is perpendicularly directed towards the focusing mechanism under the light-transmitting hole. The angle adjuster adopts the optical lens angle adjuster in the prior art.

[0009] Furthermore, the Z-axis moving platform includes a column and a crossbeam, with the crossbeam slidably connected to the column. Driven by the drive mechanism, the crossbeam moves vertically up and down along the axis of the column.

[0010] Furthermore, the focusing mechanism is fixedly installed at the end of the crossbeam, and the focusing mechanism moves up and down synchronously with the crossbeam.

[0011] Furthermore, an accordion-style dust cover is provided between the focusing mechanism and the bottom surface of the upper mounting plate. Preferably, a dust cover is also provided on the XY moving platform.

[0012] Furthermore, the processing equipment also includes a control center, which is used to control the displacement platform and the laser system to work together.

[0013] Furthermore, the focusing mechanism is a lens group used to achieve laser focusing.

[0014] Furthermore, the green laser can be detachably mounted on the mounting plate, facilitating easy replacement of the laser at any time; by replacing different lasers, it can be adapted to the processing of different materials, improving the versatility of the processing equipment.

[0015] Furthermore, adjustable feet are provided at the bottom of the frame. Preferably, a leveling bubble is provided on the mounting plate of the frame to facilitate leveling.

[0016] The working principle of the processing equipment in this application is as follows: Under the control of the control center, the green laser emits laser light, which is reflected by the reflection mechanism and then emitted through the light-transmitting hole. The reflective lens can flexibly adjust the direction and angle of the laser emission under the action of the angle adjuster. Then, it is focused by the focusing mechanism and irradiated onto the diamond copper material to be processed on the XY moving platform. Through the precise adjustment of the XY moving platform and the Z-axis moving platform, the precise processing of different positions and depth areas on the diamond copper material is achieved.

[0017] Compared with existing technologies, the advantages of this invention are as follows: The processing equipment of this invention uses a green (532nm) laser to cut diamond-copper materials. Compared with traditional infrared light sources, the absorption rate of green light in common metals can reach 3-8 times that of red light. Furthermore, green light can achieve a heat-affected layer of <5μm in the cutting of copper materials, while red light typically achieves >30μm. Therefore, the processing equipment of this application is suitable for ultra-precision micro-nano processing of superhard materials; for example, it can also be used for slicing synthetic diamond materials. In the processing equipment of this application, the reflection mechanism is an adjustable structure, which can flexibly adjust the laser reflection angle to ensure that the reflected laser is perpendicular to the focusing mechanism. The displacement platform can precisely adjust the position of relevant components. The XY moving platform is used for horizontal adjustment, and the Z-axis moving platform is used to adjust the vertical height of the focusing mechanism to achieve focusing. The accordion-style dust cover effectively prevents dust from contaminating the laser path, ensuring processing accuracy. Attached Figure Description

[0018] Figure 1 is a front view schematic diagram of Embodiment 1 of this utility model;

[0019] Figure 2 is a perspective view of Embodiment 1 of this utility model;

[0020] Figure 3 is a schematic diagram of the reflection mechanism in Embodiment 1 of this utility model;

[0021] Figure 4 is a schematic diagram of the Z-axis moving platform in Embodiment 1 of this utility model;

[0022] In the diagram: 1. Frame; 11. Upper mounting plate; 12. Lower mounting plate; 13. Light transmission hole; 2. Green laser; 3. Reflection mechanism; 31. Base; 32. Reflection arm; 33. Lens mounting hole; 4. Focusing mechanism; 5. XY moving platform; 6. Z-axis moving platform; 61. Column; 62. Crossbeam; 7. Dust cover. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to specific embodiments. Methods or functional components not specifically described in the embodiments are all prior art; unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Embodiments

[0024] As shown in Figures 1-4, this embodiment is a processing equipment for diamond-copper materials based on a green laser. It includes a frame 1, on which a laser system and a displacement platform are mounted. The laser system includes a green laser 2, a reflection mechanism 3, and a focusing mechanism 4. The frame 1 includes two parallel mounting plates. The green laser 2 is mounted on the upper mounting plate 11, and a reflection mechanism 3 is located on one side of the green laser 2. A light-transmitting hole 13 is provided on the upper mounting plate 11, through which the laser emitted by the green laser 2 is reflected by the reflection mechanism 3 and emitted downwards. A displacement platform is mounted on the lower mounting plate 12, including an XY-axis moving platform 5 and a Z-axis moving platform 6. The XY-axis moving platform 5 carries the material to be processed, and the Z-axis moving platform 6 adjusts the vertical position of the focusing mechanism 4.

[0025] In this embodiment, the reflecting mechanism 3 includes a base 31, a reflecting arm 32, and a reflecting lens. The reflecting arm 32 extends obliquely upward from one side of the base 31, and a lens mounting hole 33 is provided on the reflecting arm 32. The base 31 is a telescopic and adjustable structure used to adjust the vertical height of the reflecting arm 32 to accommodate the height of the laser beam emitted by the green laser 2. An angle adjuster is provided in the lens mounting hole 33, and the reflecting lens is fixed in the lens mounting hole 33 through the angle adjuster. When the laser beam enters the reflecting lens, the mounting angle of the reflecting lens can be adjusted by the angle adjuster to ensure that the reflected laser beam is perpendicularly directed towards the focusing mechanism 4 under the light-transmitting hole 13. The angle adjuster adopts an optical lens angle adjuster in the prior art. The focusing mechanism 4 adopts a lens group.

[0026] In this embodiment, the Z-axis moving platform includes a column 61 and a crossbeam 62. The crossbeam 62 is slidably connected to the column 61. Driven by the drive mechanism inside the column 61, the crossbeam 62 moves vertically up and down along the axial direction of the column 61. The drive mechanism can be a motor, lead screw, or other structure. The focusing mechanism 4 is fixedly installed at the end of the crossbeam 62 and moves up and down synchronously with the crossbeam 62. An accordion-style dust cover 7 is provided between the focusing mechanism 4 and the bottom surface of the upper mounting plate 11.

[0027] In this embodiment, adjustable feet are provided at the bottom of the frame 1 to ensure that the frame 1 is placed horizontally.

[0028] The working process of this embodiment is as follows: the diamond copper material to be processed is fixed on the XY moving platform 5, the reflection mechanism 3 and the focusing mechanism 4 are adjusted so that the laser emitted by the green laser 2 is reflected by the reflection mechanism 3 and then focused by the focusing mechanism 4 below, and then irradiates the diamond copper material on the XY moving platform 5. Under the control of the control center, the XY moving platform 5 and the Z-axis moving platform 6 move precisely to achieve precise processing of different positions and depth areas on the diamond copper material.

[0029] The above are only some embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various combinations and modifications of the aforementioned technical features. Any improvements, modifications, equivalent substitutions, or applications of the structure or method of the present utility model to other fields to achieve the same effect without departing from the spirit and scope of the present utility model shall fall within the protection scope of the present utility model.

Claims

1. A processing apparatus for processing a diamond copper material based on a green laser, comprising a rack, characterized in that: The frame is equipped with a laser system and a displacement platform. The laser system includes a green laser, a reflection mechanism, and a focusing mechanism. The frame includes two mounting plates arranged parallel to each other. The green laser is mounted on the upper mounting plate, and a reflection mechanism is located on one side of the green laser. A light-transmitting hole is provided on the upper mounting plate, and the laser emitted by the green laser is reflected by the reflection mechanism and then emitted downward through the light-transmitting hole. The displacement platform is mounted on the lower mounting plate, and the displacement platform includes an XY-axis moving platform and a Z-axis moving platform. The XY-axis moving platform is used to support the material to be processed, and the Z-axis moving platform is used to adjust the vertical position of the focusing mechanism.

2. The processing equipment for diamond-copper materials based on green laser processing according to claim 1, characterized in that: The reflection mechanism includes a base, a reflection arm, and a reflection lens; the reflection arm extends obliquely upward from one side of the base, and a lens mounting hole is provided on the reflection arm.

3. The apparatus for processing diamond-copper material based on green laser processing according to claim 2, characterized in that: The base is a telescopic and adjustable structure used to adjust the vertical height of the reflector arm to accommodate the height of the laser beam emitted by the green laser.

4. The apparatus for processing diamond copper material based on green laser processor according to claim 2, characterized in that: An angle adjuster is provided in the lens mounting hole, and the reflective lens is fixed in the lens mounting hole by the angle adjuster. When the laser beam enters the reflective lens, the mounting angle of the reflective lens is adjusted by the angle adjuster, so as to ensure that the reflected laser beam is perpendicular to the focusing mechanism under the light-transmitting hole.

5. The processing equipment for diamond-copper materials based on green laser processing according to claim 1, characterized in that: The Z-axis moving platform includes a column and a crossbeam. The crossbeam is slidably connected to the column. Driven by the drive mechanism, the crossbeam moves vertically up and down along the axis of the column.

6. The processing equipment for diamond-copper materials based on green laser processing according to claim 5, characterized in that: The focusing mechanism is fixedly installed at the end of the crossbeam, and the focusing mechanism moves up and down synchronously with the crossbeam.

7. The processing equipment for diamond-copper materials based on green laser processing according to claim 6, characterized in that: An accordion-style dust cover is provided between the light-concentrating mechanism and the upper mounting plate.

8. The processing equipment for diamond-copper materials based on green laser processing according to claim 1, characterized in that: The focusing mechanism is a lens group.

9. The processing equipment for diamond-copper materials based on green laser processing according to claim 1, characterized in that: It also includes a control center, which is used to control the coordinated operation of the displacement platform and the laser system.

10. The apparatus for processing diamond copper material based on green laser processor according to claim 1, characterized in that: The green laser can be detachably mounted on the mounting plate.

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