Multi-point temperature detection electronic equipment

Abstract

The utility model discloses a multi-point temperature detection electronic device comprising a circuit board on which a temperature detection circuit and a control circuit are integrated. The temperature detection circuit is connected with the control circuit; the temperature detection circuit detects the temperatures of the plurality of heat source devices and converts the temperatures into corresponding temperature values; and the control circuit outputs a plurality of groups of switching signals in sequence according to a preset sequence, and controls the temperature detection circuit to output each temperature value to the control circuit in sequence. The temperature of multiple heat source devices can be detected at the same time, temperature values are sequentially transmitted through switching control of multiple sets of switching signals, the functions of multi-point temperature detection and temperature control are achieved, and the problems that an existing temperature detection circuit is single in function, and multiple heat source devices cannot be detected in an expanded mode are solved.

Description

Technical Field

[0001] This utility model relates to the field of electronic technology, and in particular to an electronic device for multi-point temperature detection. Background Technology

[0002] With the continuous enhancement of 5G smartphone functions and the increasing performance of chips such as charging ICs (integrated circuits), CPUs (central processing units), GPUs (graphics processing units), and transceivers, the heat generated during use, especially in scenarios such as 100W fast charging, gaming, and video calls, is increasing significantly, leading to a rapid temperature rise. Excessive temperature not only affects the phone's performance and lifespan but also causes discomfort and affects user experience. Currently, the main methods for detecting board-side temperature (BB) and charging temperature require separate temperature detection circuits. A single temperature detection circuit can only detect one type of temperature, resulting in limited functionality and an inability to expand to detect the temperatures of other heat-generating components. This lack of comprehensive temperature data fails to meet the needs for a complete assessment of temperature rise and analysis of its causes.

[0003] Therefore, the existing technology still needs to be improved and enhanced. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an electronic device for multi-point temperature detection, so as to solve the problem that the existing temperature detection circuit has a single function and cannot be expanded to detect multiple heat source devices.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An electronic device for multi-point temperature detection includes a circuit board, wherein a temperature detection circuit and a control circuit are integrated on the circuit board; the temperature detection circuit is connected to the control circuit.

[0007] The temperature detection circuit detects the temperature of several heat source devices and converts it into corresponding temperature values; the control circuit outputs several sets of switching signals in a preset order, controlling the temperature detection circuit to output each temperature value to the control circuit in sequence.

[0008] In the aforementioned multi-point temperature detection electronic device, the temperature detection circuit includes a conversion module and a hierarchical network module, wherein the conversion module is connected to the hierarchical network module and the control circuit;

[0009] The hierarchical network module has several detection paths. Each detection path detects the temperature of a heat source device and generates a corresponding temperature voltage. The detection path is switched according to several sets of switching signals transmitted by the control circuit, and the temperature voltages are output to the conversion module in sequence.

[0010] The conversion module converts the analog temperature voltage into a digital temperature value and transmits it to the control circuit.

[0011] In the aforementioned multi-point temperature detection electronic device, the conversion module includes a pull-up resistor and a converter. The AUXADC_IN pin of the converter is connected to the output terminal of the hierarchical network module and one end of the pull-up resistor. The other end of the pull-up resistor is connected to the power supply terminal. The SPMI_M_SCL pin and SPMI_M_SDA pin of the converter are both connected to the control circuit.

[0012] In the aforementioned multi-point temperature detection electronic device, the hierarchical network module is a first-level switch network, and the hierarchical network module includes a first-level switch and several thermistors;

[0013] The common output pin of the primary switch is connected to the AUXADC_IN pin of the converter and one end of the pull-up resistor. The control pin of the primary switch is connected to the control circuit. Several input pins of the primary switch are grounded through a thermistor. The reserved input pin of the primary switch is left floating. Each thermistor is adjacent to the heat source device whose temperature is to be measured on the circuit board.

[0014] In the aforementioned multi-point temperature detection electronic device, the hierarchical network module is a two-level switch network, and the hierarchical network module further includes at least one two-level switch and several thermistors;

[0015] The common output pin of each secondary switch is connected to the reserved input pin of each primary switch. The control pin of the secondary switch is connected to the control circuit. Several input pins of the secondary switch are grounded through a thermistor. The reserved input pin of the secondary switch is left floating.

[0016] In the aforementioned multi-point temperature detection electronic device, the hierarchical network module is a three-level switch network, and the hierarchical network module further includes at least one three-level switch and several thermistors;

[0017] The common output pin of each three-stage switch is connected to the reserved input pin of each two-stage switch. The control pin of the three-stage switch is connected to the control circuit. Several input pins of the three-stage switch are grounded through a thermistor. The reserved input pin of the three-stage switch is left floating.

[0018] In the aforementioned multi-point temperature detection electronic device, the control circuit includes a main control chip, and the SPMI_M_SCL and SPMI_M_SDA pins of the main control chip are connected one-to-one with the SPMI_M_SCL and SPMI_M_SDA pins of the converter; each control pin of the main control chip is connected to the control pin of the corresponding level switch.

[0019] Compared to existing technologies, the multi-point temperature detection electronic device provided by this utility model includes a circuit board integrating a temperature detection circuit and a control circuit. The temperature detection circuit is connected to the control circuit. The temperature detection circuit detects the temperature of several heat source devices and converts it into corresponding temperature values. The control circuit outputs several sets of switching signals in a preset order, controlling the temperature detection circuit to output each temperature value to the control circuit sequentially. This device can simultaneously detect the temperature of multiple heat source devices and transmit each temperature value sequentially through the switching control of multiple sets of switching signals, thus realizing the function of multi-point temperature detection and solving the problem that existing temperature detection circuits have limited functionality and cannot be expanded to detect multiple heat source devices. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure and circuit of the multi-point temperature detection electronic device provided by this utility model.

[0021] Figure 2 This is a schematic diagram of the structure of a multi-level switching network for a multi-point temperature detection electronic device provided by this utility model.

[0022] Figure 3 This is a schematic diagram of the structural principle of the temperature control circuit in the multi-point temperature detection electronic device provided by this utility model.

[0023] Figure 4 This is a circuit diagram of the PID controller in the multi-point temperature detection electronic device provided by this utility model. Detailed Implementation

[0024] This invention provides an electronic device for multi-point temperature detection. To make the objectives, technical solutions, and advantages of this invention clearer and more explicit, the following detailed description, with reference to the accompanying drawings and embodiments, further illustrates the invention. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of the invention.

[0025] Please also refer to Figure 1 and Figure 2 The present invention provides an electronic device for multi-point temperature detection, comprising a circuit board on which a temperature detection circuit 10 and a control circuit 20 are integrated; the temperature detection circuit 10 is connected to the control circuit 20, the temperature detection circuit 10 detects the temperature of several heat source devices and converts them into corresponding temperature values; the control circuit 20 outputs several sets of switching signals in a preset order, controlling the temperature detection circuit 10 to output each temperature value to the control circuit 20 in sequence.

[0026] The heat source devices include, for example, charging chips, 4G chips, 5G chips, baseband chips, CPUs (excluding core temperature), DDR, cameras, LCDs, large transistors, and radio frequency (RF) power amplifiers (PAs). The temperature detection circuit 10 can simultaneously detect the temperature of multiple heat source devices. By controlling the switching of multiple sets of switching signals, it sequentially transmits each temperature value, achieving multi-point temperature detection and solving the problem of existing temperature detection circuits having limited functionality and being unable to detect multiple heat source devices.

[0027] The temperature detection circuit 10 includes a conversion module 11 and a hierarchical network module 12. The conversion module 11 is connected to the hierarchical network module 12 and the control circuit 20. The hierarchical network module 12 has several detection paths. Each detection path detects the temperature of a heat source device and generates a corresponding temperature voltage. The detection path is switched according to several sets of switching signals transmitted by the control circuit 20, and the temperature voltages are output to the conversion module 11 in sequence. The conversion module 11 converts the analog temperature voltage into a digital temperature value and transmits it to the control circuit 20.

[0028] like Figure 2 As shown, the conversion module 11 includes a pull-up resistor Ra and a converter 110. The AUXADC_IN pin of the converter 110 is connected to the output terminal of the hierarchical network module 12 and one end of the pull-up resistor Ra. The other end of the pull-up resistor Ra is connected to the power supply terminal (providing 2.8V voltage). The SPMI_M_SCL pin and SPMI_M_SDA pin of the converter 110 are both connected to the control circuit 20 (specifically, the SPMI_M_SCL pin and SPMI_M_SDA pin of the converter 110 are connected one-to-one with the SPMI_M_SCL pin and SPMI_M_SDA pin of the main control chip U1).

[0029] The converter 110 is preferably an internal AD (analog-to-digital) converter of the MT6377 (power management chip), which supports AUXADC analog-to-digital converter function. It converts the analog temperature voltage (representing the temperature change) output by the hierarchical network module 12 into a digital temperature value and transmits it to the control circuit 20 through a 2-wire SPMI interface. The resistor Ra is a pull-up resistor with two functions: first, it is connected in series with the thermistor Rn of the current detection channel to adjust the sensitivity of the thermistor temperature acquisition by series resistor voltage division; second, when the input pin of the back-end switch network is floating (equivalent to the corresponding switch input pin or input reserved pin not being connected to any device), it pulls the voltage of the AUXADC pin to a high level to avoid inputting incorrect temperature values.

[0030] In this embodiment, the hierarchical network module 12 can be progressively expanded according to the heat source devices required for temperature detection. For example, in a scenario where the number of temperature detection points on the circuit board does not exceed the total number of ports of a single switch, the hierarchical network module 12 is a single-level switch network. In this case, the hierarchical network module 12 includes a single-level switch 121 and several thermistors Rn (n is a positive integer, such as...). Figure 1 R1, R2...Rn); the common output pin of the first-level switch 121 (i.e., the output terminal of the hierarchical network module 12, Figure 2 The single pin on the left connects to the AUXADC_IN pin of converter 110 and one end of the pull-up resistor Ra, and is the control pin of the first-stage switch 121. Figure 2 The three pins shown in the lower middle section are connected to the control circuit 20 and several input pins of the primary switch 121. Figure 2 The pins shown on the right are grounded through a thermistor, the input pin of the first-level switch 121 is left floating, and the thermistors are arranged on the circuit board adjacent to the heat source device whose temperature is to be measured.

[0031] In this embodiment, a thermistor is placed near each heat source device as a temperature detection point, thus basically covering the heat sources of the mobile phone system. For heat source devices that are relatively close together in the layout, a primary switch 121 connects each thermistor. The common output pin is connected to any input pin or input reserved pin to form a detection path, and the temperature of the corresponding heat source device can be collected through the thermistor connected in the detection path. The wiring length during connection is within a suitable range, and the wiring length will not be extended due to distance, so as not to cause interference affecting the accuracy of temperature detection. The input reserved pin of the primary switch 121 is the input pin. These input pins are not directly connected to the thermistors. They will be connected later if there is a need for expansion. For distinction, the input pins that are not directly connected to the thermistors are called input reserved pins. The primary switch network is not expanded, so it is left floating. In specific implementation, the input reserved pins can also be grounded through other thermistors.

[0032] The first set of switching signals (including signals V1, V2, and V3) output by the control circuit 20 is sent to the three control pins of the primary switch 121, controlling the connection between the common output pin of the primary switch 121 and the corresponding input pin. Taking the signals V1, V2, and V3 provided in this embodiment as an example, the primary switch 121 has eight input pins (in expanded versions, the input pins listed later can be used as reserved input pins), with eight possible level combinations: 000, 001, 010, 011, 100, 101, 110, and 111, where 0 represents a low level and 1 represents a high level. When V1, V2, and V3 are all low (i.e., the control logic level is 000), the common output pin is connected to the topmost input pin in the right row, transmitting the temperature voltage detected by the thermistor connected to the first input pin. When V1, V2, and V3 are all high (i.e., the control logic level is 111), the common output pin is connected to the bottommost input pin in the right row, transmitting the temperature voltage detected by the thermistor connected to the eighth input pin.

[0033] The control circuit 20 sequentially outputs the above eight combined levels in the order of 000 to 111 through the first set of switching signals to sequentially obtain the temperature voltage corresponding to the first input pin to the eighth input pin. If any input pin is used as a reserved input pin and is left floating, the voltage on the common output pin of the first-level switch 121 is pulled up to a continuous high level by the pull-up resistor Ra. If the control circuit 20 detects the continuous high level, it can determine that the input pin connected after the current switch is not connected to a thermistor.

[0034] When there are many heat source devices to be detected on the circuit board, and each heat source device is arranged in a different area, with some heat source devices concentrated in one area and others concentrated in another area, the hierarchical network module is a two-level switch network. The hierarchical network module 12 also includes at least one secondary switch and several thermistors. The common output pin of each secondary switch is connected to each reserved input pin of the primary switch 121, the control pin of the secondary switch is connected to the control circuit 20, several input pins of the secondary switch are grounded through a thermistor, and the reserved input pins of the secondary switch are left floating.

[0035] The input reserved for the secondary switch can be used as an input pin to directly connect to a thermistor, or it can be used to connect to other stage switches during expansion. For example... Figure 2 As shown, this embodiment takes the first secondary switch 122_1 and the second secondary switch 122_2 as examples. Each input pin and the reserved input pin of the first secondary switch 122_1 are grounded through a thermistor. The input pins of the second secondary switch 122_2 are grounded through a thermistor. The reserved input pin of the second secondary switch 122_2 is left floating (to be connected to other switches during expansion).

[0036] The control circuit 20 outputs a set of switching signals to each secondary switch. For example, the first secondary switch 122_1 receives the second set of switching signals (including signals V4, V5, and V6), and the second secondary switch 122_2 receives the third set of switching signals (including signals V7, V8, and V9). The control method is the same as the first set of switching signals, and will not be elaborated here. By connecting the secondary switches with the primary switches to form an extended network, the control circuit 20 can control multiple switches to achieve multi-point temperature detection. The secondary switch transition also lengthens the wiring, facilitating centralized detection of heat source devices in different areas, improving the arrangement of connecting wires during layout and avoiding wiring chaos, and further expanding the number of heat source devices that need to be detected.

[0037] Please continue reading. Figure 2 When the circuit board is divided into regions, some regions are adjacent or close to each other, while others are far apart. In order to detect the temperature of each heat source device in the far region, the hierarchical network module is a three-level switch network. The hierarchical network module 12 also includes at least one three-level switch 123 and several thermistors. The common output pin of each three-level switch 123 is connected to each reserved input pin of the two-level switch 122. The control pin of the three-level switch 123 is connected to the control circuit 20. Several input pins of the three-level switch 123 are grounded through a thermistor. The reserved input pins of the three-level switch 123 are left floating.

[0038] The input reserved of the three-stage switch 123 can be used as an input pin to directly connect to a thermistor, or it can be connected to other stages of switches during subsequent expansion. For example... Figure 2 As shown, the control circuit 20 outputs a set of switching signals for each three-level switch. For example, if the three-level switch 123 receives the fourth set of switching signals (including V10, V11, and V12 signals), its control method is the same as that of the first set of switching signals, which will not be elaborated here. The number of switching signals corresponds to the number of switches; each switch is preferably an 8-channel switch, preferably of model MXD8680. An extended network is formed by the layered connection of the three-level switches, the two-level switches, and the first-level switches. The transfer of the three-level switches further extends the wiring length, so that even the temperature and voltage of various heat source devices in distant areas can be transmitted to the converter 110 through three layers of transfer (three-level switch to two-level switch, two-level switch to first-level switch, and first-level switch to converter).

[0039] The control circuit 20 includes a main control chip U1, whose SPMI_M_SCL and SPMI_M_SDA pins are connected one-to-one with those of the converter 110; each control pin of the main control chip U1 is connected to the control pin of the corresponding level switch. Figure 2Taking the three-level switch network shown as an example, pins BPI_D_BUS0, BPI_D_BUS1, and BPI_D_BUS2 of the main control chip U1 are connected one-to-one with pins VC1, VC2, and VC3 of the first-level switch 121; pins BPI_D_BUS3, BPI_D_BUS4, and BPI_D_BUS5 of the main control chip U1 are connected one-to-one with pins VC1, VC2, and VC3 of the first and second-level switches 122_1; pins BPI_D_BUS6, BPI_D_BUS7, and BPI_D_BUS8 of the main control chip U1 are connected one-to-one with pins VC1, VC2, and VC3 of the second and second-level switches 122_2; and pins BPI_D_BUS9, BPI_D_BUS10, and BPI_D_BUS11 of the main control chip U1 are connected one-to-one with pins VC1, VC2, and VC3 of the third-level switch 123.

[0040] The main control chip U1 outputs switching signals to sequentially poll and control the switching of internal paths of each level of switch. Each level of switch transmits the temperature voltage collected by the corresponding thermistor, which is converted into digital temperature values ​​by converter 110 and fed back to control circuit 20. The resistor array [R1, R2, ..., Rn] composed of each thermistor corresponds one-to-one with the temperature matrix T [y1(t), y2(t), ..., yN(t)] detected at time t, thereby realizing the temperature detection of various heat-generating components inside electronic devices such as smartphones.

[0041] In this embodiment, a temperature control circuit 30 can also be set to perform cooling. The error e(t) between the target temperature and the actual temperature value is transmitted to the temperature control circuit 30. When the temperature control circuit 30 detects that the temperature value is greater than the preset upper temperature limit, it cools down the heat source device corresponding to the temperature value.

[0042] like Figure 3 and Figure 4 As shown, the temperature control circuit 30 includes a PID (Prprtinal Integral Derivative) controller. Assume the temperature returned by the detection point (thermistor) corresponds to the actual voltage y(t), which is the input of the AD acquisition unit. The target temperature can be set manually. Based on the characteristics of the thermistor, the target temperature is converted into a voltage target g(t). According to automatic control theory, the main control chip U1 calculates the error voltage e(t) based on the difference between the manually set voltage target g(t) and the actual voltage y(t) sampled at the thermistor, using the formula: e(t) = g(t) - y(t).

[0043] Furthermore, based on the actual value of the calculated error voltage e(t), the main control chip U1 adjusts the output current of its P5 pin (GPIO pin, the GPIO pin used in this example is named ERIPHERAL pin, which is grounded through a resistor R501), and converts the output current into an output voltage (e.g., ...) through the resistor R501 (with a resistance of 100 ohms). Figure 2 This allows the error voltage e(t) to be output on the hardware circuit as the input to the PID controller (e.g., ...). Figure 3 ).like Figure 4 This describes the circuit principle of a PID controller.

[0044] For example, if the actual voltage value sampled by the thermistor is 500mV, and the target voltage corresponding to the target temperature is 400mV, then e(t) = 500mV - 400mV = 100mV; then the main control chip U1 controls its P5 pin to output a 1mA current, which can realize the hardware circuit outputting a 100mV "error voltage e(t)", which is given to the PID controller as the input voltage of the PID controller.

[0045] In practice, at time n, if e(t), u(t), and y(t) are discretized into discretized variables e(n), u(n), and y(n) that can be recognized by a computer program, then according to automatic control theory, the formula for the discrete expression u(n) of the PID controller output is as follows:

[0046]

[0047] Based on a large amount of experimental data, this invention trains and adjusts K... p K i K d The three coefficients are K p =-0.21, K i =-0.2, K d = -0.01, achieving good temperature control.

[0048] From experimental data K p K i K d The specific value is determined based on the discrete expression u(n). Figure 4 In the hardware circuit of the PID controller, the values ​​of R1_1, R2_1, C1_1, and C2_1 are as follows: R1_1 = 500KΩ, R2_1 = 100KΩ, C1_1 = 100nF, and C2_1 = 10uF. According to... Figure 4 The hardware circuit of the PID controller shown can be used to obtain the formula for the output u(t) of the PID controller. Substituting the corresponding resistance and capacitance values ​​will give the value of the output u(t).

[0049]

[0050] The output u(t) of the PID controller is fed to the heat source device to adjust the heating power and achieve target temperature control. The cooling method varies depending on the type of heat source device. For example, if the CPU temperature is detected to be high, the CPU's operating frequency is controlled, reducing power consumption by decreasing the frequency and core count, thus achieving cooling. If the screen temperature is detected to be too high, measures such as reducing screen brightness and overall power consumption can be taken to achieve cooling. If the charging circuit temperature is detected to be too high, the charging current is limited, reducing charging power to achieve cooling. Further discussion of cooling methods is not provided here.

[0051] This embodiment uses a PID controller to adjust the thermal power of the heat source device to achieve a cooling effect and precisely control the actual temperature of the target. For systems with less stringent temperature control requirements, the PID controller can be simplified to a P controller, PI controller, or PD controller, all of which fall under the category of PID controllers. For complex systems with multiple heat source devices controlled by multiple input cycles, a MIMO type PID controller can also be used.

[0052] In summary, the multi-point temperature detection electronic device of this invention adopts a multi-level switching network and a thermistor matrix. By switching the detection path, it can output the temperature value of each heat source device in sequence. One temperature detection circuit can be extended to detect the temperature of multiple heat source devices. It is not limited by the number of AD converter pins, so the heat source devices that can be detected are not limited.

[0053] It should be understood that the application of this utility model is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An electronic device for multi-point temperature detection, comprising a circuit board, characterized in that, The circuit board integrates a temperature detection circuit and a control circuit; the temperature detection circuit is connected to the control circuit. The temperature detection circuit detects the temperature of several heat source devices and converts them into corresponding temperature values; the control circuit outputs several sets of switching signals in a preset order, and controls the temperature detection circuit to output each temperature value to the control circuit in sequence. The temperature detection circuit includes a conversion module and a hierarchical network module, wherein the conversion module is connected to the hierarchical network module and the control circuit. The hierarchical network module has several detection paths. Each detection path detects the temperature of a heat source device and generates a corresponding temperature voltage. The detection path is switched according to several sets of switching signals transmitted by the control circuit, and the temperature voltages are output to the conversion module in sequence. The conversion module converts the analog temperature voltage into a digital temperature value and transmits it to the control circuit.

2. The electronic device for multi-point temperature detection according to claim 1, characterized in that, The conversion module includes a pull-up resistor and a converter. The AUXADC_IN pin of the converter is connected to the output terminal of the hierarchical network module and one end of the pull-up resistor. The other end of the pull-up resistor is connected to the power supply terminal. The SPMI_M_SCL pin and SPMI_M_SDA pin of the converter are both connected to the control circuit.

3. The electronic device for multi-point temperature detection according to claim 2, characterized in that, The hierarchical network module is a single-level switch network, which includes a single-level switch and several thermistors. The common output pin of the primary switch is connected to the AUXADC_IN pin of the converter and one end of the pull-up resistor. The control pin of the primary switch is connected to the control circuit. Several input pins of the primary switch are grounded through a thermistor. The reserved input pin of the primary switch is left floating. Each thermistor is adjacent to the heat source device whose temperature is to be measured on the circuit board.

4. The electronic device of claim 3, wherein, The hierarchical network module is a two-level switch network, and the hierarchical network module also includes at least one two-level switch and several thermistors; The common output pin of each secondary switch is connected to the reserved input pin of each primary switch. The control pin of the secondary switch is connected to the control circuit. Several input pins of the secondary switch are grounded through a thermistor. The reserved input pin of the secondary switch is left floating.

5. The electronic device for multi-point temperature detection according to claim 4, characterized in that, The hierarchical network module is a three-level switch network, and the hierarchical network module also includes at least one three-level switch and several thermistors; The common output pin of each three-stage switch is connected to the reserved input pin of each two-stage switch. The control pin of the three-stage switch is connected to the control circuit. Several input pins of the three-stage switch are grounded through a thermistor. The reserved input pin of the three-stage switch is left floating.

6. The electronic device of claim 5, wherein, The control circuit includes a main control chip, and the SPMI_M_SCL and SPMI_M_SDA pins of the main control chip are connected one-to-one with the SPMI_M_SCL and SPMI_M_SDA pins of the converter; each control pin of the main control chip is connected to the control pin of the corresponding level switch.

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