Test device, test circuit and test system

Abstract

The embodiment of the utility model discloses a test device, a test circuit and a test system, and relates to the field of test equipment. The testing device comprises a plurality of module modules, a plurality of channel modules, a control circuit, a first simulation module and a second simulation module. The plurality of module modules are arranged in parallel and are correspondingly connected with the plurality of acquisition modules; the plurality of channel modules are connected with the plurality of module modules; the control circuit is used for controlling the plurality of module modules and the plurality of channel modules; the first simulation module is connected with the plurality of channel modules; and the second simulation module is connected with the plurality of module modules. And the control circuit is configured to control the tested module to be communicated with the first simulation module through the plurality of connected channel modules when the tested acquisition module is tested. The testing device can quickly and independently test a single battery module, and the testing efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of testing equipment, and more specifically, to a testing apparatus, a testing circuit, and a testing system. Background Technology

[0002] In the research, development, production, and quality inspection of electronic devices, data acquisition modules, as components for acquiring various physical quantity data, play a crucial role in ensuring their reliability and accuracy. To ensure stable operation of data acquisition modules in various practical application scenarios, they need to be tested. Existing testing equipment requires manual switching between testing devices, a complex process with low testing efficiency. Utility Model Content

[0003] This application provides a testing device, testing circuit, and testing system that can quickly and independently test a single battery module, thereby improving testing efficiency.

[0004] In a first aspect, this application provides a testing device, including multiple module modules connected in parallel, each module module being connected to a corresponding acquisition module; multiple channel modules connected to the multiple module modules; a control circuit for controlling the multiple module modules and the multiple channel modules; a first simulation module connected to the multiple channel modules; and a second simulation module connected to the multiple module modules. The control circuit is configured such that, when testing a test acquisition module among the multiple acquisition modules, the test acquisition module is connected to the first simulation module through the connected multiple channel modules, and the connection between the test acquisition module and the second simulation module remains disconnected. The connection between the test acquisition module and all other module modules among the multiple module modules, excluding the test acquisition module itself, remains disconnected. The test acquisition module is the module among the multiple module modules connected to the test acquisition module.

[0005] In this embodiment, by controlling the connection status of each module through the control circuit, independent testing of a single acquisition module under test can be achieved, avoiding interference from other untested modules, improving the accuracy and reliability of the test results, and reflecting the performance of the acquisition module under test. The setup of the first simulation module, the second simulation module, and multiple module modules and channel modules allows for simultaneous preparation of multiple acquisition modules. When different acquisition modules need to be tested, the connection status can be quickly switched through the control circuit, eliminating the need for complex rewiring or equipment adjustments, greatly improving testing efficiency and saving testing time and labor costs.

[0006] In some embodiments of the first aspect, the testing device is used to test the voltage and temperature of the acquisition module, wherein the number of multiple channel modules is greater than or equal to the sum of the number of voltage channels and temperature channels in the acquisition module.

[0007] In this embodiment, since the number of multiple channel modules is greater than or equal to the sum of the number of voltage and temperature channels in the acquisition module, the testing device can provide an independent test channel for each voltage and temperature channel regardless of how the voltage and temperature channels of the acquisition module are combined. The independent channel modules provide a signal transmission path for each voltage and temperature channel. This reduces mutual interference between signals from different channels during testing. Different models and specifications of acquisition modules have varying numbers of voltage and temperature channels. By having a number of channel modules greater than or equal to the sum of the voltage and temperature channels in the acquisition module, the testing device can flexibly handle various acquisition modules, improving its applicability and testing flexibility.

[0008] In some embodiments of the first aspect, the number of multiple channel modules is greater than or equal to the number of multiple module modules.

[0009] In this embodiment, since the number of channel modules is greater than or equal to the number of module modules, each module has its own channel module, ensuring that each acquisition module connected to the module can communicate with the first simulation module during testing. The sufficient number of channel modules provides each module with an independent signal transmission path, reducing crosstalk and interference between signals.

[0010] In some embodiments of the first aspect, each channel module includes multiple channel relays, each module module includes multiple module relays, and the j-th channel relay of each channel module is connected to multiple module relays of the same module module respectively, where 1≤j≤N, j is a positive integer, and N is the number of multiple module modules.

[0011] In this embodiment, a flexible and adjustable connection structure is constructed through the combination of channel relays and module relays. This allows for the selection of the acquisition modules to be tested and the establishment of corresponding test channels according to different testing requirements, improving the flexibility and adaptability of the testing device. Independent relay control ensures that the testing process of each acquisition module is not interfered with by other modules, enabling accurate acquisition of the acquisition module's performance data and improving the accuracy and reliability of the test results. When the number of acquisition modules needs to be increased, simply adding channel modules and module modules accordingly and configuring the relay connections appropriately easily expands the system, reducing the cost and difficulty of system upgrades.

[0012] In some embodiments of the first aspect, the i-th module relay of each module is connected to the channel relay of the i-th channel module, where 1≤i≤M, and i is a positive integer, and M is the number of multiple channel modules.

[0013] In this embodiment, by connecting the i-th module relay of each module to the channel relay of the i-th channel module, the testing device can select different channel modules and module modules to connect according to different testing requirements. Because the connection relationship is clear and orderly, when a module or channel module malfunctions, the problem can be quickly located and repaired. When it is necessary to increase the number of acquisition modules or channel modules, it is only necessary to expand according to the established connection rules, without the need for a large-scale redesign of the entire system, thus reducing the cost of system maintenance and expansion.

[0014] In some embodiments of the first aspect, the j-th channel relay of each channel module is connected to a plurality of module relays of the j-th module, respectively.

[0015] In this embodiment, by directly connecting the j-th channel relay of each channel module to multiple module relays of the j-th module, the control circuit can quickly and accurately establish the signal transmission path required for testing. Compared to traditional complex connection methods, this reduces connection and debugging time and improves testing efficiency. When testing requirements change, such as adding a new acquisition module or changing the acquisition module under test, the system can be easily expanded and adjusted by simply setting the corresponding connections for the new module and channel modules according to the established connection rules. This allows the testing device to adapt to different testing scenarios and requirements, and has a wider range of applications.

[0016] In some embodiments of the first aspect, the module relay and the channel relay include a first contact, a second contact, and a third contact. When testing a test acquisition module among multiple acquisition modules, the third contact of the multiple module relays in the test module is connected to the second contact. The third contact of the channel relay in the multiple channel modules that is connected to the multiple module relays in the test module is connected to the second contact. The third contact of the module relays in the multiple module modules other than the test module and the connected channel relays is connected to the first contact.

[0017] In this embodiment, by controlling the contact connection of the module relay and the channel relay, the module under test can be disconnected from other modules to avoid signal interference. At the same time, the test signal can be transmitted to the acquisition module under test. The testing process of each acquisition module is independent and will not be affected by other modules, thereby improving the accuracy and reliability of the test results.

[0018] In some embodiments of the first aspect, the first contact of the i-th module relay of each module module is connected to the first contact of the i-th module relay of the remaining module modules, and the first contact of the k-th channel relay in each channel module is connected to the third contact of the (k+1)-th channel relay; each channel module includes N channel relays, each module module includes M module relays, and the second contact of the j-th channel relay in the i-th channel module is connected to the second contact of the i-th module relay in the j-th module; wherein, 1≤k<N, and k is a positive integer.

[0019] In this embodiment, the interaction between channel relays and module relays makes the connection between channel modules and module modules clearer and more orderly. This allows for the establishment of a dedicated signal transmission path for each acquisition module under different testing environments, ensuring that test signals are transmitted to the acquired module under test and improving the accuracy of test results. When expanding the system, simply adding new channel modules and module modules according to the established connection rules easily supports more acquisition modules or more complex testing scenarios.

[0020] In some embodiments of the first aspect, the module relay and the channel relay further include a fourth contact and a fifth contact, the fourth contact being connected to a power supply and the fifth contact being connected to a control circuit.

[0021] In this embodiment, the fourth contact is connected to the power supply to provide stable power support for the relay, enabling it to respond to control signals. The fifth contact is connected to the control circuit, allowing the control circuit to control the contact state of the relay. The relay structure and connection method of the fifth contact allow the control circuit to flexibly control the relay's on / off state according to different testing requirements, enabling diversified testing of a single acquisition module and enhancing the flexibility and adaptability of the testing device. Power supply and control signal transmission reduce signal interference and power instability, improving the stability and reliability of the testing device.

[0022] In some embodiments of the first aspect, the first simulation module includes a plurality of first connection channels, the i-th first connection channel of the plurality of first connection channels being connected to the third contact of the first channel relay in the i-th channel module; the second simulation module includes a plurality of second connection channels, the j-th second connection channel of the plurality of second connection channels being connected to the first contact of the j-th module relay in each module module.

[0023] In this embodiment, the connection between the first simulation module and the channel module, and between the second simulation module and the module module, enables the acquisition module to receive diverse analog signals, including voltage, temperature, and other relevant operating status signals, thereby evaluating the performance of the acquisition module in different real-world scenarios. The control circuit can flexibly control the connection status between the first and second simulation modules and each module according to different testing requirements. The reasonable connection structure and precise control logic reduce signal interference and transmission errors, improving the accuracy and reliability of the test results.

[0024] In some embodiments of the first aspect, the testing apparatus further includes a control device for controlling the first simulation module and the second simulation module to input analog voltage and analog temperature, and the control device for sending test signals to a control circuit for controlling multiple module modules and multiple channel modules according to the test signals.

[0025] In this embodiment, by controlling the first and second simulation modules through a control device, analog voltage and temperature signals that better match the actual application scenario can be provided to the acquisition module, thereby more accurately testing the performance of the acquisition module and improving test accuracy. The control device uniformly coordinates the analog signal input and test process control, enabling the control circuit to respond quickly to test requirements, reducing test preparation time and switching time during the test, and greatly improving test efficiency. The control device can adjust the parameters of the analog signals and the test process according to the characteristics of different acquisition modules and test requirements, improving the versatility and flexibility of the test device.

[0026] Secondly, this application provides a test circuit, comprising: multiple module modules connected in parallel, each module module being connected to a corresponding acquisition module; multiple channel modules connected to the multiple module modules; and a control circuit for controlling the multiple module modules and the multiple channel modules. The control circuit is configured to, when testing a test acquisition module among the multiple acquisition modules, connect the test acquisition module to the connected multiple channel modules, while keeping the connection between the test acquisition module and the other module modules among the multiple module modules disconnected. The test acquisition module is defined as the module among the multiple module modules connected to the test acquisition module.

[0027] In some embodiments of the second aspect, the number of multiple channel modules is greater than or equal to the number of multiple module modules.

[0028] In some embodiments of the second aspect, each channel module includes multiple channel relays, each module module includes multiple module relays, and the j-th channel relay of each channel module is connected to multiple module relays of the same module module respectively, where 1≤j≤N, j is a positive integer, and N is the number of multiple module modules.

[0029] In some embodiments of the second aspect, the i-th module relay of each module is connected to the channel relay of the i-th channel module, where 1≤i≤M, i is a positive integer, and M is the number of multiple channel modules.

[0030] In some embodiments of the second aspect, the j-th channel relay of each channel module is connected to a plurality of module relays of the j-th module, respectively.

[0031] In some embodiments of the second aspect, the module relay and the channel relay include a first contact, a second contact, and a third contact. When testing a test acquisition module among multiple acquisition modules, the third contact of the multiple module relays in the test module is connected to the second contact. The third contact of the channel relay in the multiple channel modules that is connected to the multiple module relays in the test module is connected to the second contact. The third contact of the module relays in the multiple module modules other than the test module and the connected channel relays is connected to the first contact.

[0032] In some embodiments of the second aspect, the first contact of the i-th module relay of each module module is connected to the first contact of the i-th module relay of the remaining module modules, and the first contact of the k-th channel relay in each channel module is connected to the third contact of the (k+1)-th channel relay; each channel module includes N channel relays, each module module includes M module relays, and the second contact of the j-th channel relay in the i-th channel module is connected to the second contact of the i-th module relay in the j-th module; where 1≤k<N, and k is a positive integer.

[0033] In some embodiments of the second aspect, the module relay and the channel relay further include a fourth contact and a fifth contact, the fourth contact being connected to a power supply and the fifth contact being connected to a control circuit.

[0034] Thirdly, this application provides a testing system, including: multiple acquisition modules; and a testing device, which includes the testing device in the first aspect, and is used to test the multiple acquisition modules. Attached Figure Description

[0035] Figure 1 This is a structural diagram of the testing device according to an embodiment of this application;

[0036] Figure 2 This is another structural diagram of the testing apparatus according to an embodiment of this application;

[0037] Figure 3 This is another structural diagram of the testing apparatus according to an embodiment of this application;

[0038] Figure 4 This is a partial structural diagram of the channel module according to an embodiment of this application;

[0039] Figure 5 This is a partial structural diagram of the module module in an embodiment of this application;

[0040] Figure 6 This is another partial structural diagram of the channel module in an embodiment of this application;

[0041] Figure 7 This is another partial structural diagram of the module module in an embodiment of this application;

[0042] Figure 8 This is another structural diagram of the test apparatus according to an embodiment of this application.

[0043] The accompanying drawings are not drawn to scale.

[0044] Figure label:

[0045] 1-First contact; 2-Second contact; 3-Third contact; 4-Fourth contact; 5-Fifth contact; 10-Testing device; 11-Module; 111-Module relay; 12-Channel module; 121-Channel relay; 13-Control circuit; 14-First simulation module; 141-First connection channel; 15-Second simulation module; 151-Second connection channel; 16-Control device; 20-Acquisition module. Detailed Implementation

[0046] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0048] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0049] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0050] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0052] In the embodiments of this application, the same reference numerals denote the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width, and other dimensions of various components in the embodiments of this application shown in the accompanying drawings, as well as the overall thickness, length, width, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this application.

[0053] In this application, "multiple" refers to two or more (including two), and similarly, "multiple groups" refers to two or more (including two), and "multiple pieces" refers to two or more (including two).

[0054] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions.

[0055] Unless otherwise specified, all technical features and optional technical features of this application may be combined to form new technical solutions.

[0056] A Battery Management System (BMS) is an electronic system used to monitor, control, and protect battery packs. It is widely used in electric vehicles, energy storage systems, portable electronic devices, and other fields.

[0057] A battery management system (BMS) can monitor parameters such as voltage, current, and temperature of the battery pack in real time, accurately acquiring the battery's state of charge (SOC) and health status, providing data support for battery management and control. Based on the battery's state and the needs of external devices, it controls the charging and discharging process to prevent overcharging, over-discharging, and overheating, extending battery life. Because individual cells in a battery pack differ in capacity, internal resistance, and other aspects, imbalances can occur after long-term use. The BMS uses active or passive balancing technology to ensure consistent charge levels in each cell, improving the overall performance and utilization rate of the battery pack.

[0058] A battery management system comprises hardware and software components. The hardware component may include a main control unit, a data acquisition unit, a drive unit, and a communication unit. The software component may include underlying driver software, algorithm programs, and a communication protocol stack.

[0059] The main control unit typically uses a microcontroller or digital signal processor to process data collected from various sensors, perform logical operations and decisions, and control the operation of other modules. The data acquisition unit, also known as a data acquisition module, consists of multiple voltage, current, and temperature sensors used to collect various parameters of the battery pack and convert these analog signals into digital signals for transmission to the main control unit. The drive unit, according to instructions from the main control unit, controls the battery's charge / discharge switches, relays, and other actuators to achieve charge / discharge control and safety protection for the battery pack. The communication unit enables communication between the BMS and external devices.

[0060] The underlying driver software is responsible for interacting with the hardware modules, acquiring and processing sensor data, and controlling the actuators, providing a unified interface for upper-layer applications. The algorithm program includes various battery management algorithms, and the communication protocol stack implements the protocol stack for communication with external devices, ensuring accurate and efficient data transmission and command exchange between the BMS and other devices.

[0061] In the research, development, production, and quality inspection of electronic devices, data acquisition modules, as components for acquiring various physical quantity data, play a crucial role in ensuring their reliability and accuracy. To ensure stable operation of data acquisition modules in various practical application scenarios, they need to be tested. Existing testing equipment requires manual switching between testing devices, a complex process with low testing efficiency.

[0062] Based on the above considerations, this application provides a testing device capable of rapidly and independently testing a single battery module, thereby improving testing efficiency. The testing device provided in this application includes multiple module modules, multiple channel modules, a control circuit, a first simulation module, and a second simulation module. The multiple module modules are connected in parallel, with each module module corresponding to a different acquisition module; multiple channel modules are connected to multiple module modules; the control circuit controls the multiple module modules and multiple channel modules; the first simulation module is connected to multiple channel modules; and the second simulation module is connected to multiple module modules. Specifically, when testing a target acquisition module among the multiple acquisition modules, the control circuit controls the target acquisition module to connect to the first simulation module through the connected multiple channel modules, while keeping the connection between the target acquisition module and the second simulation module disconnected. The connection between the target acquisition module and all other module modules among the multiple module modules, excluding the target acquisition module itself, remains disconnected. The target acquisition module is the module among the multiple module modules connected to the target acquisition module.

[0063] In this embodiment, by controlling the connection status of each module through the control circuit, independent testing of a single acquisition module under test can be achieved, avoiding interference from other untested modules, improving the accuracy and reliability of the test results, and reflecting the performance of the acquisition module under test. The setup of the first simulation module, the second simulation module, and multiple module modules and channel modules allows for simultaneous preparation of multiple acquisition modules. When different acquisition modules need to be tested, the connection status can be quickly switched through the control circuit, eliminating the need for complex rewiring or equipment adjustments, greatly improving testing efficiency and saving testing time and labor costs.

[0064] Figure 1 This is a structural diagram of the testing apparatus according to an embodiment of this application. Figure 1As shown, the testing device 10 includes multiple module modules 11, multiple channel modules 12, a control circuit 13, a first simulation module 14, and a second simulation module 15. The multiple module modules 11 are connected in parallel, and each module module 11 is connected to a corresponding acquisition module 20. The multiple channel modules 12 are connected to the multiple module modules 11. The control circuit 13 controls the multiple module modules 11 and the multiple channel modules 12. The first simulation module 14 is connected to the multiple channel modules 12. The second simulation module 15 is connected to the multiple module modules 11. In the case where the control circuit 13 is configured to test the test acquisition module 20 among the multiple acquisition modules 20, the test module is connected to the first simulation module 14 through multiple connected channel modules 12, and the connection between the test module and the second simulation module 15 is kept disconnected. The connection between the test module and the module modules 11 among the multiple module modules 11 other than the test module is kept disconnected. The test module is the module module 11 among the multiple module modules 11 that is connected to the test acquisition module 20.

[0065] In the field of new energy vehicles, the performance of the Battery Management System (BMS) directly affects the vehicle's range, safety, and lifespan. The data acquisition module 20, as a key component of the BMS, is responsible for real-time monitoring of battery parameters such as voltage and temperature. On industrial automated production lines, numerous sensors and data acquisition modules 20 are used to monitor equipment operating status and production process parameters in real time. Therefore, accurate data acquisition plays a crucial role in ensuring product quality and improving production efficiency. Smart grids achieve efficient management and optimized scheduling of the power system by collecting real-time grid operation data. The data acquisition module 20 is used in smart grids to monitor key parameters such as voltage, current, and power. The testing device 10 can be used to test the performance of the data acquisition module 20 in the BMS.

[0066] In this embodiment, the connections between multiple module modules 11, the connections between multiple channel modules 12, and the connections between multiple module modules 11 and multiple channel modules 12 can all be wire harness connections.

[0067] Multiple module modules 11 are connected in parallel, and each module module 11 is connected to a corresponding acquisition module 20. Specifically, the first module module 11 is connected to the first acquisition module 20, the second module module 11 is connected to the second acquisition module 20, that is, each module module 11 is connected to its corresponding acquisition module 20.

[0068] In some embodiments, multiple module modules 11 are connected in parallel, meaning that one end of each module module 11 is connected to a common node, which can be considered as the convergence point of signal inputs. When the parallel lines are connected, each module module 11 receives the same signal.

[0069] Multiple module modules 11 can be implemented in the form of integrated circuit boards. Each module module 11 integrates a signal processing chip, a data buffer, and interface circuits for connecting to the acquisition module 20 and other modules.

[0070] For example, module 11 and channel module 12 can be designed as a circuit structure with multiple switching elements that are turned on and off under the control of control circuit 13.

[0071] In this embodiment, the control circuit 13 can control the connection status of the module module 11 and the channel module 12 according to the test requirements. For example, when it is necessary to test the test acquisition module 20 in the multiple acquisition modules 20, the control circuit 13 receives the test signal and controls the connection between the multiple module modules 11 and the multiple channel modules 12, so that it is in a connected state or a disconnected state according to different test requirements.

[0072] In some embodiments, when testing a certain acquisition module 20 using the testing device 10, for clarity, the acquisition module 20 under test is defined as the acquisition module under test 20, and the module 11 connected to the acquisition module under test 20 is defined as the module under test module. The control circuit 13 controls the module under test module to connect to the first simulation module 14 through the connected channel module 12. In this way, the test signal generated by the first simulation module 14 can be transmitted to the module under test module through the channel module 12, and then to the acquisition module under test 20 for testing.

[0073] When testing a certain acquisition module 20, the connection between the module under test and the second simulation module 15 is disconnected, and the connection between the module under test and all other modules 11 (excluding the module under test) is also disconnected to prevent the signal from the second simulation module 15 from interfering with the module under test. For ease of description, the other modules 11 are referred to as the remaining modules 11. The connection between the second simulation module 15 and the remaining modules 11 is continuous; that is, the test signal generated by the second simulation module 15 is transmitted to the remaining modules 11, and then to the acquisition module 20 connected to the remaining modules 11. Through this connection method, the first simulation module 14 controls the module under test, and the second simulation module 15 controls the remaining acquisition modules 20.

[0074] In some embodiments, to reduce interference from other module 11 to the module under test, the test signal of the first simulation module 14 is different from the test signal of the second simulation module 15. That is, the module under test receives the first test signal from the first simulation module 14, while the other module 11 receives the second test signal from the second simulation module 15. For example, the first test signal is a voltage of 3V, and the second test signal is a voltage of 4V. This allows the acquisition module 20 under test to be tested in an independent environment, unaffected by other acquisition modules 20.

[0075] In this embodiment, by controlling the connection status of each module through the control circuit 13, independent testing of a single acquisition module 20 under test can be achieved, avoiding interference from other untested modules, improving the accuracy and reliability of the test results, and reflecting the performance of the acquisition module 20 under test. The setup of the first simulation module 14, the second simulation module 15, and multiple module modules 11 and channel modules 12 allows for simultaneous preparation of multiple acquisition modules 20. When different acquisition modules 20 need to be tested, the connection status can be quickly switched through the control circuit 13, eliminating the need for complex rewiring or equipment adjustments, greatly improving testing efficiency and saving testing time and labor costs.

[0076] In this embodiment, the testing device 10 is used to test the voltage and temperature of the acquisition module 20, and the number of multiple channel modules 12 is greater than or equal to the sum of the number of voltage channels and temperature channels in the acquisition module 20.

[0077] The data acquisition module 20 is a component of the BMS and is responsible for collecting various data from the battery system, providing basic information for the BMS to monitor, manage, and control the battery's status.

[0078] In some embodiments, the voltage channels in the acquisition module 20 are responsible for acquiring voltage values ​​at different circuit nodes. In practical applications, there are multiple locations where voltage monitoring is required. To enable independent testing of these voltage channels, ensuring that each voltage channel is not interfered with by other channels during testing, a sufficient number of module modules 11 are needed to correspond to each channel.

[0079] The temperature channels in the acquisition module 20 are used to acquire ambient temperature or the temperature of critical components of the equipment. Each part that needs to have its temperature monitored corresponds to a temperature channel. Similar to the voltage channels, a sufficient number of module 11 are required to test these temperature channels.

[0080] For example, suppose that the test device 10 has three acquisition modules 20, namely the first acquisition module, the second acquisition module, and the third acquisition module. The first acquisition module has two voltage channels and one temperature channel, the second acquisition module has three voltage channels and two temperature channels, and the third acquisition module has two voltage channels and one temperature channel. Then the sum of the number of voltage channels and temperature channels in the acquisition modules 20 is (2+1)+(3+2)+(2+1)=11, so the number of modules 11 is at least 11.

[0081] When the temperature of a certain acquisition module 20 needs to be tested, the control circuit 13 controls the module module 11 corresponding to that acquisition module 20 to connect to the first simulation module 14 through the connected channel module 12. The first simulation module 14 simulates different temperature signals, and the module module 11 transmits these signals to the acquisition module 20. The acquisition module 20 acquires and processes these signals to determine whether they match the temperature of the acquisition module 20.

[0082] When it is necessary to test the voltage of the acquisition module 20, the steps are similar to those described above, and will not be repeated here.

[0083] In this embodiment, the temperature and voltage of the acquisition module 20 can also be tested simultaneously, and the first simulation module 14 simulates different temperature and voltage signals for testing.

[0084] In this embodiment, since the number of multiple channel modules 12 is greater than or equal to the sum of the number of voltage and temperature channels in the acquisition module 20, the testing device 10 can provide an independent test channel for each voltage and temperature channel regardless of how the voltage and temperature channels of the acquisition module 20 are combined. The independent channel modules 12 provide a path for signal transmission for each voltage and temperature channel. This reduces mutual interference between signals from different channels during testing. Different models and specifications of acquisition modules 20 have different numbers of voltage and temperature channels. By having a number of channel modules 12 greater than or equal to the sum of the number of voltage and temperature channels in the acquisition module 20, the testing device 10 can flexibly handle various acquisition modules 20, improving its applicability and testing flexibility.

[0085] In some embodiments, the number of multiple channel modules 12 is greater than or equal to the number of multiple module modules 11.

[0086] In some embodiments, the number of multiple module modules 11 is greater than or equal to the sum of the number of voltage channels and temperature channels in the acquisition module 20.

[0087] In some embodiments, the number of multiple channel modules 12 is greater than or equal to the number of multiple module modules 11, such that each module module 11 is connected to a corresponding channel module 12 according to its connection relationship with the channel module 12. During the testing of the acquisition module 20 under test, each module module 11 can obtain the corresponding channel module 12 connection in a timely manner.

[0088] In this embodiment, since the number of multiple channel modules 12 is greater than or equal to the number of multiple module modules 11, each module module 11 has, thereby enabling each acquisition module 20 connected to the module module 11 to be connected to the first simulation module 14 during testing.

[0089] In this embodiment, the sufficient channel module 12 provides an independent signal transmission path for each module module 11, reducing crosstalk and interference between signals.

[0090] Figure 2 This is another structural diagram of the testing apparatus according to an embodiment of this application. Figure 2 As shown, each channel module 12 includes multiple channel relays 121, and each module module 11 includes multiple module relays 111. The j-th channel relay 121 of each channel module 12 is connected to multiple module relays 111 of the same module module 11, where 1≤j≤N, j is a positive integer, and N is the number of multiple module modules 11.

[0091] In some embodiments, each channel module 12 includes a plurality of channel relays 121, and each module module 11 includes a plurality of module relays 111. The plurality of channel relays 121 are interconnected with the plurality of module relays 111. Specifically, the j-th channel relay 121 of each channel module 12 is connected to the plurality of module relays 111 of the same module module 11, where 1≤j≤N, j is a positive integer, and N is the number of the plurality of module modules 11.

[0092] For example, the testing device 10 has three acquisition modules 20, namely a first acquisition module, a second acquisition module, and a third acquisition module, with corresponding module modules 11, namely a first module module, a second module module, and a third module module, i.e., N=3. Each module module 11 includes three module relays 111: the first module module includes a first module first relay, a first module second relay, and a first module third relay; the second module module includes a second module first relay, a second module second relay, and a second module third relay; and the third module module includes a third module first relay, a third module second relay, and a third module third relay. The three module modules are connected to the first channel module, the second channel module, and the third channel module. Each channel module 12 includes multiple channel relays 121: the first channel module includes a first channel first relay, a first channel second relay, and a first channel third relay; the second channel module includes a second channel first relay, a second channel second relay, and a second channel third relay; and the third channel module includes a third channel first relay, a third channel second relay, and a third channel third relay.

[0093] The first relay of the first channel can be connected to the first relay of the first module, the first relay of the second channel is connected to the second relay of the first module, and the first relay of the third channel is connected to the third relay of the first module. That is, the first relay of the first channel, the first relay of the second channel, and the first relay of the third channel are the first channel relays of each channel module 12, and are connected to the module relays in the first module module.

[0094] The first relay of the first channel can also be connected to the second relay of the first module, the first relay of the second channel is connected to the third relay of the first module, and the first relay of the third channel is connected to the first relay of the first module. That is, the first channel relay of each channel module 12 is connected to the module relay 111 in the first module. The specific correspondence is not limited in this application.

[0095] Similarly, the connection between the second channel relay of each channel module 12 and the module relay 111 of the second module is similar to that described above, and the connection between the third channel relay of each channel module 12 and the module relay 111 of the third module is also similar to that described above, and will not be repeated here.

[0096] The first channel relay of each channel module 12 can also be connected to the module relay 111 of the second module, the second channel relay of each channel module 12 can also be connected to the module relay 111 of the third module, and the third channel relay of each channel module 12 can also be connected to the module relay 111 of the first module. That is, the corresponding connection relationship between the channel module 12 and the module module 11 is not limited in this application.

[0097] For example, when the first acquisition module needs to be tested, the control circuit 13 closes the module relay 111 in the first module module connected to the first acquisition module, and controls the first channel first relay, the second channel first relay and the third channel first relay connected to the module relay 111 in the first module module to close, so that the first module module is connected to the first simulation module 14 through the channel module 12.

[0098] The first simulation module 14 simulates different voltage and temperature signals. These signals are transmitted to the first acquisition module through the closed first channel first relay, the second channel first relay, the third channel first relay, the first module first relay, and the module relay 111 in the first module module. The first acquisition module acquires and processes these signals to test its voltage and temperature performance. The module relay 111 connecting the first module module to the second and third module modules is disconnected, so that the testing of the first acquisition module is not affected by other acquisition modules 20.

[0099] Similarly, when it is necessary to test the second or third acquisition module, the control circuit 13 controls the corresponding channel relay 121 and module relay 111 to close or open according to the same principle, so as to realize independent testing of each acquisition module 20.

[0100] In this embodiment, a flexible and adjustable connection structure is constructed through the combination of channel relay 121 and module relay 111. This allows for the selection of the acquisition module 20 to be tested and the establishment of corresponding test channels according to different testing requirements, improving the flexibility and adaptability of the testing device 10. Independent relay control ensures that the testing process of each acquisition module 20 is not interfered with by other modules, enabling accurate acquisition of performance data of the acquisition module 20 and improving the accuracy and reliability of test results. When the number of acquisition modules 20 needs to be increased, simply adding channel module 12 and module module 11 accordingly and configuring the relay connections appropriately easily expands the system, reducing the cost and difficulty of system upgrades.

[0101] In this embodiment of the application, the i-th module relay 111 of each module module 11 is connected to the channel relay 121 of the i-th channel module 12, where 1≤i≤M, i is a positive integer, and M is the number of multiple channel modules 12.

[0102] In some embodiments, multiple channel relays 121 are interactively connected to multiple module relays 111, that is, the i-th module relay 111 of each module module 11 is connected to the channel relay 121 of the i-th channel module 12, where 1≤i≤M, and i is a positive integer, and M is the number of multiple channel modules 12.

[0103] For example, the testing device 10 has three acquisition modules 20, namely a first acquisition module, a second acquisition module, and a third acquisition module, with corresponding module modules 11, namely a first module module, a second module module, and a third module module, i.e., N=3. Each module module 11 includes multiple module relays 111. The first module module includes a first module first relay, a first module second relay, and a first module third relay; the second module module includes a second module first relay, a second module second relay, and a second module third relay; the third module module includes a third module first relay, a third module second relay, and a third module third relay. The three module modules are connected to the first channel module, the second channel module, and the third channel module. Each channel module 12 includes multiple channel relays 121. The first channel module includes a first channel first relay, a first channel second relay, and a first channel third relay; the second channel module includes a second channel first relay, a second channel second relay, and a second channel third relay; the third channel module includes a third channel first relay, a third channel second relay, and a third channel third relay.

[0104] The first module's first relay can be connected to the first channel's first relay, the second module's first relay can be connected to the first channel's second relay, and the third module's first relay can be connected to the first channel's third relay. That is, the first module's first relay, the second module's first relay, and the third module's first relay are the first module relays of each module 11, and are connected to the channel relay 121 in the first channel module.

[0105] The first relay of the first module can be connected to the third relay of the first channel, the first relay of the second module can be connected to the first relay of the first channel, and the first relay of the third module can be connected to the second relay of the first channel. That is, the first module relay of each module 11 is connected to the channel relay 121 in the first channel module. The specific correspondence is not limited in this application.

[0106] Similarly, the connection between the second module relay of each module 11 and the channel relay 121 of the second channel module is similar to that described above, and the connection between the third module relay of each module 11 and the channel relay 121 of the third channel module is also similar to that described above, and will not be repeated here. That is, the order of the module relays 111 in module 11 is the same as the order of the channel modules 12.

[0107] The first module relay of each module 11 can also be connected to the channel relay 121 of the second channel module, the second module relay of each module 11 can also be connected to the channel relay 121 of the third channel module, and the third module relay of each module 11 can also be connected to the channel relay 121 of the first channel module. That is, the corresponding connection relationship between the channel module 12 and the module 11 is not limited in this application.

[0108] In some embodiments, multiple channel relays 121 are interactively connected to multiple module relays 111. That is, based on the fact that the j-th channel relay 121 of each channel module 12 is connected to multiple module relays 111 of the same module module 11 respectively, the i-th module relay 111 of each module module 11 is connected to the channel relay 121 of the i-th channel module 12, where 1≤i≤M, and i is a positive integer, and M is the number of multiple channel modules 12.

[0109] In this embodiment, by connecting the i-th module relay 111 of each module 11 to the channel relay 121 of the i-th channel module 12, the testing device 10 can select different channel modules 12 to connect to the module modules 11 according to different testing requirements. Because the connection relationship is clear and orderly, when a module 11 or channel module 12 malfunctions, the problem can be quickly located and repaired. When it is necessary to increase the number of acquisition modules 20 or channel modules 12, expansion can be carried out simply according to the established connection rules, without the need for a large-scale redesign of the entire system, thus reducing the cost of system maintenance and expansion.

[0110] In this embodiment of the application, the j-th channel relay 121 of each channel module 12 is connected to a plurality of module relays 111 of the j-th module module 11 respectively.

[0111] In some embodiments, multiple channel relays 121 are interactively connected to multiple module relays 111. That is, based on the connection between the i-th module relay 111 of each module module 11 and the channel relay 121 of the i-th channel module 12, the j-th channel relay 121 of each channel module 12 is connected to multiple module relays 111 of the j-th module module 11 respectively.

[0112] For example, the testing device 10 has three acquisition modules 20, namely a first acquisition module, a second acquisition module, and a third acquisition module, with corresponding module modules 11, namely a first module module, a second module module, and a third module module, i.e., N=3. Each module module 11 includes multiple module relays 111. The first module module includes a first module first relay, a first module second relay, and a first module third relay; the second module module includes a second module first relay, a second module second relay, and a second module third relay; the third module module includes a third module first relay, a third module second relay, and a third module third relay. The three module modules are connected to the first channel module, the second channel module, and the third channel module. Each channel module 12 includes multiple channel relays 121. The first channel module includes a first channel first relay, a first channel second relay, and a first channel third relay; the second channel module includes a second channel first relay, a second channel second relay, and a second channel third relay; the third channel module includes a third channel first relay, a third channel second relay, and a third channel third relay.

[0113] The first relay of the first channel can be connected to the first relay of the first module, the first relay of the second channel is connected to the second relay of the first module, and the first relay of the third channel is connected to the third relay of the first module. That is, the first relay of the first channel, the first relay of the second channel, and the first relay of the third channel are the first channel relays of each channel module 12, and are connected to the module relays 111 in the first module.

[0114] Similarly, the connection between the second channel relay of each channel module 12 and the module relay 111 of the second module is similar to that described above, and the connection between the third channel relay of each channel module 12 and the module relay 111 of the third module is also similar to that described above, and will not be repeated here. That is, the order of the channel relays 121 is the same as the order of the connected module modules 11.

[0115] In this embodiment, by directly connecting the j-th channel relay 121 of each channel module 12 to multiple module relays 111 of the j-th module module 11, the control circuit 13 can quickly and accurately establish the signal transmission path required for testing. Compared with traditional complex connection methods, this reduces connection and debugging time and improves testing efficiency. When testing requirements change, such as adding a new acquisition module 20 or changing the acquisition module 20 under test, the system can be easily expanded and adjusted by simply setting the corresponding connections for the new module module 11 and channel module 12 according to the established connection rules. This allows the testing device 10 to adapt to different testing scenarios and requirements, and has a wider range of applications.

[0116] Figure 3 This is another structural diagram of the testing apparatus according to an embodiment of this application. Figure 4 This is a partial structural diagram of the channel module according to an embodiment of this application. Figure 5 This is a partial structural diagram of the module according to an embodiment of this application. Figures 3 to 5 As shown, the module relay 111 and the channel relay 121 include a first contact 1, a second contact 2, and a third contact 3. When testing the test acquisition module 20 in multiple acquisition modules 20, the third contact 3 of the multiple module relays 111 in the test module is connected to the second contact 2. The third contact 3 of the channel relay 121 in multiple channel modules 12 that is connected to the multiple module relays 111 in the test module is connected to the second contact 2. The third contact 3 of the module relays 111 in the multiple module modules 11 excluding the test module and the connected channel relays 121 is connected to the first contact 1.

[0117] In some embodiments, the module relay 111 and the channel relay 121 are specifically single-pole double-throw relays, whose internal structure includes a control coil and several contacts, here designated as first contact 1, second contact 2, and third contact 3. The single-pole double-throw relay can switch between different connection states in the circuit. When the control coil is not energized, the relay is in its initial state, and each contact maintains a specific connection; when the control coil is energized, a magnetic field is generated, which drives the relay contacts to actuate, thereby changing the connection relationship between the contacts.

[0118] When testing is performed on the test acquisition module 20 among multiple acquisition modules 20, the multiple module relays 111 in the test module and the channel relays 121 in the multiple channel modules 12 that are connected to the multiple module relays 111 in the test module will connect the module relays 111 and the channel relays 121 by connecting the third contact 3 and the second contact 2, thereby establishing a signal transmission path and ensuring that the test signal can be successfully transmitted to the test acquisition module 20.

[0119] Meanwhile, the module relays 111 of the other module modules 11 besides the module being tested, and the channel relays 121 connected to them, connect the third contact 3 to the first contact 1, disconnecting the module relays 111 and channel relays 121 of the other module modules 11 to avoid interference with the testing process.

[0120] In this embodiment, by controlling the contact connection of the module relay 111 and the channel relay 121, the module under test can be disconnected from the other modules 11 to avoid signal interference. At the same time, the test signal can be transmitted to the acquisition module 20 under test. The test process of each acquisition module 20 is independent of each other and will not be affected by other modules 11, thereby improving the accuracy and reliability of the test results.

[0121] In this embodiment, the first contact 1 of the i-th module relay 111 of each module module 11 is connected to the first contact 1 of the i-th module relay 111 of the remaining module modules 11, and the first contact 1 of the k-th channel relay 121 in each channel module 12 is connected to the third contact 3 of the (k+1)-th channel relay 121; each channel module 12 includes N channel relays 121, each module module 11 includes M module relays 111, and the second contact 2 of the j-th channel relay 121 in the i-th channel module 12 is connected to the second contact 2 of the i-th module relay 111 in the j-th module module 11; where 1≤k<N, and k is a positive integer.

[0122] In some embodiments, the connection methods in the test device 10 include the connection between module relays 111, the connection between channel relays 121, and the connection between module relays 111 and channel relays 121.

[0123] Each module 11 includes M module relays 111. The first contact 1 of the i-th module relay 111 of each module 11 is connected to the first contact 1 of the i-th module relay 111 of the other module 11s, that is, the module relays 111 in the same order in each module 11 are connected in parallel. Through this connection, unified control or status monitoring of multiple module 11s can be achieved.

[0124] Each channel module 12 includes N channel relays 121. The first contact 1 of the k-th channel relay 121 in each channel module 12 is connected to the third contact 3 of the (k+1)-th channel relay 121, where 1 ≤ k < N, and k is a positive integer. That is, the first contact 1 and the third contact 3 of the channel relays 121 within the same channel module 12 are connected in series, and the third contact 3 of the last channel relay 121 is not connected to any of the other channel relays 121. By properly controlling the on / off state of the channel relays 121 contacts, the signal transmission path within the channel module 12 can be adjusted.

[0125] The aforementioned M represents the number of multiple channel modules 12, and N represents the number of multiple module modules 11. That is, the number of module relays 111 is the same as the number of channel modules 12, and the number of channel relays 121 is the same as the number of module modules 11.

[0126] The second contact 2 of the j-th channel relay 121 in the i-th channel module 12 is connected to the second contact 2 of the i-th module relay 111 in the j-th module module 11, where 1 ≤ i ≤ M, i is a positive integer, 1 ≤ j ≤ N, and j is a positive integer. That is, the channel relay 121 and the module relay 111 are interconnected.

[0127] For example, assume M=5, N=3, that is, each module 11 has 5 module relays 111, and each channel module 12 has 3 channel relays 121. When i=2, j=3, the second contact 2 of the third channel relay 121 in the second channel module 12 is to be connected to the second contact 2 of the second module relay 111 in the third module 11.

[0128] For example, when it is necessary to control the signal of the test acquisition module 20 individually, assuming that the test acquisition module 20 is the first acquisition module 20, and the other modules are not individually controlled and use the same signal, then the first channel relay 121 of all channel modules 12 is driven, and the other channel relays 121 are not driven. The driving states of all channel relays 121 are 1, 0, 0...0 (1 indicates that the driving state is driven, and 0 indicates that the driving state is not driven). In the first module module 11 connected to the driven channel relay 121, all module relays 111 are driven, and the driving states of module relays 111 are 1, 1, 1...1; the driving states of module relays 111 of the other module modules 11 are 0, 0, 0...0.

[0129] For example, assuming the acquisition module 20 under test is the second acquisition module 20, the drive state of the channel relays 121 in all channel modules 12 is 0, 1, 0...0. In the module module 11, all module relays 111 except those in the second module module 11 are driven, that is, the module relays 111 switch to 1, 1, 1...1; the rest are 0, 0, 0...0.

[0130] In this embodiment, the interaction between the channel relay 121 and the module relay 111 makes the connection between the channel module 12 and the module module 11 clearer and more orderly. This allows for the establishment of a dedicated signal transmission path for each acquisition module 20 under different testing environments, ensuring that test signals can be transmitted to the acquisition module 20 under test and improving the accuracy of test results. When expanding the system, simply adding new channel modules 12 and module modules 11 according to the established connection rules easily enables support for more acquisition modules 20 or more complex testing scenarios.

[0131] Figure 6 This is another partial structural diagram of the channel module according to an embodiment of this application. Figure 7This is another partial structural diagram of the module according to an embodiment of this application. Figure 8 This is another structural diagram of the testing apparatus according to an embodiment of this application. Figures 6 to 8 As shown, the module relay 111 and the channel relay 121 also include a fourth contact 4 and a fifth contact 5. The fourth contact 4 is connected to the power supply, and the fifth contact 5 is connected to the control circuit 13.

[0132] In some embodiments, the fourth contact 4 and the fifth contact 5 are contacts of the control coil of a single-pole double-throw relay.

[0133] It should be understood that, due to the large number of connection lines between the control circuit 13, the module relay 111, and the channel relay 121, Figure 8 Only the connection between control circuit 13 and one channel relay 121 is shown.

[0134] The fourth contact 4 of both module relay 111 and channel relay 121 is connected to a power supply. The power supply provides stable power to the relays, enabling them to operate normally. The connection of the fourth contact 4 to the power supply provides energy for the relay's contact switching, allowing the relays to accurately perform on / off operations according to control signals.

[0135] The fifth contact 5 of module relay 111 and channel relay 121 is connected to control circuit 13. Control circuit 13 sends control signals to the relays through the fifth contact 5 to precisely control the contact state of the relays. Control circuit 13 can flexibly control the on / off state of the relays according to test requirements, realizing the regulation of the connection state between multiple module modules 11 and multiple channel modules 12. The signal sent by control circuit 13 to control coil through fifth contact 5 can be a digital signal, analog signal, or pulse signal, etc., depending on the design of control circuit 13 and the requirements for relay control accuracy and response speed.

[0136] In this embodiment, the fourth contact 4 is connected to the power supply to provide stable power support for the relay, enabling the relay to respond to control signals. The fifth contact 5 is connected to the control circuit 13, allowing the control circuit 13 to control the contact state of the relay. The relay structure and connection method of the fifth contact 5 allow the control circuit 13 to flexibly control the on / off state of the relay according to different test requirements, realizing diversified testing of a single acquisition module 20 and enhancing the flexibility and adaptability of the test device 10. Power supply and control signal transmission reduce signal interference and power instability, improving the stability and reliability of the test device 10.

[0137] In this embodiment, the first simulation module 14 includes a plurality of first connection channels 141, and the i-th first connection channel 141 is connected to the third contact 3 of the first channel relay 121 in the i-th channel module 12; the second simulation module 15 includes a plurality of second connection channels 151, and the j-th second connection channel 151 is connected to the first contact 1 of the j-th module relay 111 in each module module 11.

[0138] In some embodiments, the first simulation module 14 includes a plurality of first connection channels 141. Among the plurality of first connection channels 141, the i-th first connection channel 141 is connected to the third contact 3 of the first channel relay 121 in the i-th channel module 12, that is, the order of the first connection channels 141 is the same as the arrangement order of the channel modules 12.

[0139] The second simulation module 15 includes multiple second connection channels 151. Among the multiple second connection channels 151, the j-th second connection channel 151 is connected to the first contact 1 of the j-th module relay 111 in each module module 11. Since the module modules 11 are connected in parallel, the j-th module relay 111 in each module module 11 is connected to the second simulation module 15 through the same second connection channel 151; that is, the order of the second simulation channels is the same as the order of the module relays 111 in the module module 11.

[0140] In the non-test state, the third contact 3 of the first channel relay 121 in the i-th channel module 12 is connected to the first contact 1, so that multiple channel relays 121 in the same channel module 12 are connected in series, and then connected to the first simulation module 14 through the first channel relay 121. When testing the acquisition module 20 under test, in the module module 11 connected to the acquisition module 20 under test, the third contact 3 of all module relays 111 is connected to the second contact 2. At this time, the connection between the module relay 111 and the first simulation module 14 is disconnected, and the third contact 3 of the channel relay 121 connected to the module relay 111 is connected to the second contact 2, that is, the connection with the channel relay 121 after the channel relay 121 is disconnected, realizing the connection of the first simulation module 14, channel module 12, module module 11 and acquisition module 20 under test.

[0141] In this embodiment, the connection between the first simulation module 14 and the channel module 12, and the second simulation module 15 and the module module 11, allows for the provision of diverse analog signals to the acquisition module 20, including voltage, temperature, and other relevant operating status signals, thereby evaluating the performance of the acquisition module 20 in different real-world scenarios. The control circuit 13 can flexibly control the connection status between the first simulation module 14, the second simulation module 15, and each module according to different testing requirements. This reasonable connection structure and precise control logic reduce signal interference and transmission errors, improving the accuracy and reliability of the test results.

[0142] Continue to refer to Figure 8 The testing device 10 also includes a control device 16, which is used to control the first simulation module 14 and the second simulation module 15 to input simulated voltage and simulated temperature, and the control device 16 is used to send test signals to the control circuit 13. The control circuit 13 is used to control multiple module modules 11 and multiple channel modules 12 according to the test signals.

[0143] In some embodiments, the control device 16 can be connected to the first simulation module 14 and the second simulation module 15. The control device 16 is used to control the first simulation module 14 and the second simulation module 15 to input analog voltage and analog temperature. It can generate corresponding control commands according to the testing requirements of different acquisition modules 20, and adjust the analog signal parameters output by the first simulation module 14 and the second simulation module 15.

[0144] In some embodiments, the control device 16 can also be connected to the control circuit 13 to send test signals to the control circuit 13. These test signals include test information, such as the identifier of the acquisition module 20 to be tested, control parameters of the test process, etc. By sending these test signals, the control device 16 initiates the entire test process and guides the control circuit 13 to operate according to a predetermined test plan.

[0145] After receiving the test signal sent by the control device 16, the control circuit 13 controls the multiple module modules 11 and multiple channel modules 12 according to the instructions in the test signal. Specifically, when it is necessary to test the under-test acquisition module 20 among the multiple acquisition modules 20, the control circuit 13 controls the under-test module module to connect to the first simulation module 14 through the connected multiple channel modules 12 according to the test signal. By controlling the on / off state of the module relays 111 in the corresponding module module 11 and the channel relays 121 in the channel module 12, a signal transmission path is established from the first simulation module 14 to the under-test acquisition module 20, so that the test signal simulated by the first simulation module 14 can be successfully transmitted to the under-test acquisition module 20. At the same time, the connection between the under-test module module and the other module modules 11 among the multiple module modules 11 is kept disconnected to prevent other untested module modules 11 from interfering with the current test process and to ensure the independence of the test.

[0146] In this embodiment, by controlling the first simulation module 14 and the second simulation module 15 through the control device 16, the acquisition module 20 can be provided with analog voltage and temperature signals that are more consistent with its actual application scenario, thereby more accurately testing the performance of the acquisition module 20 and improving test accuracy. The control device 16 coordinates the analog signal input and test process control, enabling the control circuit 13 to respond quickly to test requirements, reducing test preparation time and switching time during the test, and greatly improving test efficiency. The control device 16 can adjust the parameters of the analog signals and the test process according to the characteristics and test requirements of different acquisition modules 20, improving the versatility and flexibility of the test device 10.

[0147] Combination Figures 1 to 8 This application provides a test circuit, which includes multiple module modules 11, multiple channel modules 12, and a control circuit 13. The multiple module modules 11 are connected in parallel, and each module module 11 is connected to a corresponding multiple acquisition modules 20. The multiple channel modules 12 are connected to the multiple module modules 11. The control circuit 13 controls the multiple module modules 11 and the multiple channel modules 12. Specifically, when testing the acquisition module 20 under test among the multiple acquisition modules 20, the control circuit 13 controls the connection between the module under test and the connected multiple channel modules 12, while keeping the connection between the module under test and the other module modules 11 (excluding the module under test) disconnected. The module under test refers to the module 11 connected to the acquisition module 20 under test among the multiple module modules 11.

[0148] In some embodiments, the number of multiple channel modules 12 is greater than or equal to the number of multiple channel modules 12.

[0149] In some embodiments, each channel module 12 includes multiple channel relays 121, each module module 11 includes multiple module relays 111, and the j-th channel relay 121 of each channel module 12 is connected to multiple module relays 111 of the same module module 11 respectively, wherein 1≤j≤N, and j is a positive integer, and N is the number of multiple module modules 11.

[0150] In some embodiments, the i-th module relay 111 of each module module 11 is connected to the channel relay 121 of the i-th channel module 12, where 1≤i≤M, i is a positive integer, and M is the number of multiple channel modules 12.

[0151] In some embodiments, the j-th channel relay 121 of each channel module 12 is connected to a plurality of module relays 111 of the j-th module module 11.

[0152] In some embodiments, the module relay 111 and the channel relay 121 include a first contact 1, a second contact 2, and a third contact 3. When testing the test acquisition module 20 in a plurality of acquisition modules 20, the third contact 3 of the plurality of module relays 111 in the test module is connected to the second contact 2. The third contact 3 of the channel relay 121 in the plurality of channel modules 12 that is connected to the plurality of module relays 111 in the test module is connected to the second contact 2. The third contact 3 of the module relays 111 in the plurality of module modules 11 excluding the test module and the connected channel relays 121 is connected to the first contact 1.

[0153] In some embodiments, the first contact 1 of the i-th module relay 111 of each module module 11 is connected to the first contact 1 of the i-th module relay 111 of the remaining module modules 11, and the first contact 1 of the k-th channel relay 121 in each channel module 12 is connected to the third contact 3 of the (k+1)-th channel relay 121; each channel module 12 includes N channel relays 121, each module module 11 includes M module relays 111, and the second contact 2 of the j-th channel relay 121 in the i-th channel module 12 is connected to the second contact 2 of the i-th module relay 111 in the j-th module module 11; where 1≤k<N, and k is a positive integer.

[0154] This application embodiment also provides a testing system, including multiple acquisition modules 20 and a testing device 10. The testing device 10 includes multiple module modules 11, multiple channel modules 12, a control circuit 13, a first simulation module 14, and a second simulation module 15. The multiple module modules 11 are arranged in parallel, and each module module 11 is connected to one of the multiple acquisition modules 20 in a one-to-one correspondence; the multiple channel modules 12 are connected to the multiple module modules 11; the control circuit 13 is used to control the multiple module modules 11 and the multiple channel modules 12; the first simulation module 14 is connected to the multiple channel modules 12; and the second simulation module 15 is connected to the multiple module modules 11. In this configuration, when the control circuit 13 is configured to test the under-test acquisition module 20 among multiple acquisition modules 20, the under-test module is connected to the first simulation module 14 through multiple connected channel modules 12, while the connection between the under-test module and the second simulation module 15 remains disconnected. The connection between the under-test module and all other modules 11 among the multiple modules 11, excluding the under-test module itself, remains disconnected. The under-test module refers to the module 11 connected to the under-test acquisition module 20 among the multiple modules 11. The testing device 10 is used to test the multiple acquisition modules.

[0155] It should be understood that the test apparatus 10 may also include the test apparatus 10 in any of the above embodiments.

[0156] In some embodiments, the module relay 111 and the channel relay 121 further include a fourth contact 4 and a fifth contact 5, wherein the fourth contact 4 is connected to the power supply and the fifth contact 5 is connected to the control circuit 13.

[0157] According to some embodiments of this application, see Figures 1 to 8This application provides a testing device 10, which includes multiple module modules 11, multiple channel modules 12, a control circuit 13, a first simulation module 14, and a second simulation module 15. The multiple module modules 11 are connected in parallel, and each module module 11 is connected to a corresponding acquisition module 20. The multiple channel modules 12 are connected to the multiple module modules 11. The control circuit 13 controls the multiple module modules 11 and the multiple channel modules 12. The first simulation module 14 is connected to the multiple channel modules 12. The second simulation module 15 is connected to the multiple module modules 11. In this configuration, when the control circuit 13 is configured to test the tested acquisition module 20 among multiple acquisition modules 20, the tested module is connected to the first simulation module 14 via multiple connected channel modules 12, while the connection between the tested module and the second simulation module 15 remains disconnected. The connection between the tested module and all other modules 11 among the multiple modules 11 (excluding the tested module itself) remains disconnected. The tested module refers to the module 11 connected to the tested acquisition module 20. The testing device 10 is used to test the voltage and temperature of the acquisition module 20. The number of the multiple channel modules 12 is greater than or equal to the sum of the number of voltage channels and temperature channels in the acquisition module 20. The number of the multiple channel modules 12 is greater than or equal to the number of the multiple module modules 11.

[0158] Each channel module 12 includes multiple channel relays 121, and each module module 11 includes multiple module relays 111. The j-th channel relay 121 of each channel module 12 is connected to multiple module relays 111 of the same module module 11, where 1≤j≤N, j is a positive integer, and N is the number of multiple module modules 11.

[0159] The i-th module relay 111 of each module 11 is connected to the channel relay 121 of the i-th channel module 12, where 1≤i≤M, i is a positive integer, and M is the number of multiple channel modules 12.

[0160] The j-th channel relay 121 of each channel module 12 is connected to multiple module relays 111 of the j-th module module 11, respectively.

[0161] The module relay 111 and the channel relay 121 include a first contact 1, a second contact 2, and a third contact 3. When testing the test acquisition module 20 in multiple acquisition modules 20, the third contact 3 of the multiple module relays 111 in the test module is connected to the second contact 2. The third contact 3 of the channel relay 121 in multiple channel modules 12 that is connected to the multiple module relays 111 in the test module is connected to the second contact 2. The third contact 3 of the module relays 111 in the multiple module modules 11 excluding the test module and the connected channel relays 121 is connected to the first contact 1. The first contact 1 of the i-th module relay 111 in each module 11 is connected to the first contact 1 of the i-th module relay 111 in the remaining module 11. The first contact 1 of the k-th channel relay 121 in each channel module 12 is connected to the third contact 3 of the (k+1)-th channel relay 121. Each channel module 12 includes N channel relays 121, and each module 11 includes M module relays 111. The second contact 2 of the j-th channel relay 121 in the i-th channel module 12 is connected to the second contact 2 of the i-th module relay 111 in the j-th module 11. Wherein, 1≤k<N, and k is a positive integer. The module relays 111 and channel relays 121 also include a fourth contact 4 and a fifth contact 5. The fourth contact 4 is connected to the power supply, and the fifth contact 5 is connected to the control circuit 13.

[0162] The first simulation module 14 includes multiple first connection channels 141, and the i-th first connection channel 141 is connected to the third contact 3 of the first channel relay 121 in the i-th channel module 12; the second simulation module 15 includes multiple second connection channels 151, and the j-th second connection channel 151 is connected to the first contact 1 of the j-th module relay 111 in each module module 11.

[0163] The testing device 10 also includes a control device 16, which is used to control the first simulation module 14 and the second simulation module 15 to input simulated voltage and simulated temperature, and the control device 16 is used to send test signals to the control circuit 13. The control circuit 13 is used to control multiple module modules 11 and multiple channel modules 12 according to the test signals.

[0164] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A testing device, characterized in that, include: Multiple module modules (11) are connected in parallel, and each of the multiple module modules (11) is connected to a multiple acquisition module (20) in a one-to-one correspondence. Multiple channel modules (12), the multiple channel modules (12) are connected to the multiple module modules (11); A control circuit (13) is used to control the plurality of the module modules (11) and the plurality of the channel modules (12); The first simulation module (14) is connected to the plurality of channel modules (12); The second simulation module (15) is connected to the plurality of said module modules (11); Wherein, the control circuit (13) is configured to, when testing the test acquisition module (20) among the multiple acquisition modules (20), control the test module module to be connected to the first simulation module (14) through the multiple connected channel modules (12), and keep the connection between the test module module and the second simulation module (15) disconnected, and keep the connection between the test module module and the module modules (11) among the multiple module modules (11) other than the test module module, wherein the test module module is the module module (11) among the multiple module modules (11) connected to the test acquisition module (20).

2. The testing apparatus according to claim 1, characterized in that, The testing device is used to test the voltage and temperature of the acquisition module (20), and the number of the multiple channel modules (12) is greater than or equal to the sum of the number of voltage channels and temperature channels in the acquisition module (20).

3. The testing apparatus according to claim 1, characterized in that, The number of the multiple channel modules (12) is greater than or equal to the number of the multiple module modules (11).

4. The testing apparatus according to claim 1, characterized in that, Each channel module (12) includes multiple channel relays (121), and each module module (11) includes multiple module relays (111). The j-th channel relay (121) of each channel module (12) is connected to multiple module relays (111) of the same module module (11), where 1≤j≤N, j is a positive integer, and N is the number of multiple module modules (11).

5. The test device of claim 4, wherein, The i-th module relay (111) of each module (11) is connected to the channel relay (121) of the i-th channel module (12), where 1≤i≤M, i is a positive integer, and M is the number of the multiple channel modules (12).

6. The test device of claim 5, wherein, The j-th channel relay (121) of each channel module (12) is connected to a plurality of module relays (111) of the j-th module module (11).

7. The test device of claim 6, wherein, The module relay (111) and the channel relay (121) include a first contact (1), a second contact (2), and a third contact (3). When testing the test acquisition module (20) in the plurality of acquisition modules (20), the third contact (3) of the plurality of module relays (111) in the test module is connected to the second contact (2). The third contact (3) of the channel relay (121) in the plurality of channel modules (12) connected to the plurality of module relays (111) in the test module is connected to the second contact (2). The third contact (3) of the module relay (111) in the plurality of module modules (11) except the test module and the connected channel relay (121) is connected to the first contact (1).

8. The test device of claim 7, wherein, The first contact (1) of the i-th module relay (111) of each module module (11) is connected to the first contact (1) of the i-th module relay (111) of the remaining module modules (11), and the first contact (1) of the k-th channel relay (121) of each channel module (12) is connected to the third contact (3) of the (k+1)-th channel relay (121). Each channel module (12) includes N channel relays (121), and each module module (11) includes M module relays (111). The second contact (2) of the j-th channel relay (121) in the i-th channel module (12) is connected to the second contact (2) of the i-th module relay (111) in the j-th module module (11). Where 1 ≤ k < N, and k is a positive integer.

9. The testing apparatus according to claim 7, characterized in that, The module relay (111) and the channel relay (121) further include a fourth contact (4) and a fifth contact (5), the fourth contact (4) being connected to the power supply and the fifth contact (5) being connected to the control circuit (13).

10. The testing apparatus according to claim 7, characterized in that, The first simulation module (14) includes a plurality of first connection channels (141), and the i-th first connection channel (141) of the plurality of first connection channels (141) is connected to the third contact (3) of the first channel relay (121) in the i-th channel module (12); The second simulation module (15) includes a plurality of second connection channels (151), and the j-th second connection channel (151) of the plurality of second connection channels (151) is connected to the first contact (1) of the j-th module relay (111) in each of the module modules (11).

11. The testing apparatus according to any one of claims 1 to 10, characterized in that, The testing device further includes a control device (16), which is used to control the first simulation module (14) and the second simulation module (15) to input simulated voltage and simulated temperature, and the control device (16) is used to send a test signal to the control circuit (13), and the control circuit (13) is used to control multiple module modules (11) and multiple channel modules (12) according to the test signal.

12. A test circuit, characterized by include: Multiple module modules (11) are connected in parallel, and each of the multiple module modules (11) is connected to a multiple acquisition module (20) in a one-to-one correspondence. Multiple channel modules (12), the multiple channel modules (12) are connected to the multiple module modules (11); A control circuit (13) is used to control the plurality of the module modules (11) and the plurality of the channel modules (12); In this configuration, the control circuit (13) is configured to control the tested module module to connect with the connected channel modules (12) when testing the tested acquisition module (20) among the multiple acquisition modules (20), and the tested module module is kept disconnected from the module modules (11) among the multiple module modules (11) except the tested module module. The tested module module is the module module (11) among the multiple module modules (11) that is connected to the tested acquisition module (20).

13. The test circuit of claim 12, wherein, The number of the multiple channel modules (12) is greater than or equal to the number of the multiple module modules (11).

14. The test circuit of claim 13, wherein, Each channel module (12) includes multiple channel relays (121), and each module module (11) includes multiple module relays (111). The j-th channel relay (121) of each channel module (12) is connected to multiple module relays (111) of the same module module (11), where 1≤j≤N, j is a positive integer, and N is the number of multiple module modules (11).

15. The test circuit according to claim 13, characterized in that, The i-th module relay (111) of each module (11) is connected to the channel relay (121) of the i-th channel module (12), where 1≤i≤M, i is a positive integer, and M is the number of the multiple channel modules (12).

16. The test circuit of claim 15, wherein, The j-th channel relay (121) of each channel module (12) is connected to a plurality of module relays (111) of the j-th module module (11).

17. The test circuit of claim 16, wherein, The module relay (111) and the channel relay (121) include a first contact (1), a second contact (2), and a third contact (3). When testing the test acquisition module (20) in the plurality of acquisition modules (20), the third contact (3) of the plurality of module relays (111) in the test module is connected to the second contact (2). The third contact (3) of the channel relay (121) in the plurality of channel modules (12) connected to the plurality of module relays (111) in the test module is connected to the second contact (2). The third contact (3) of the module relay (111) in the plurality of module modules (11) except the test module and the connected channel relay (121) is connected to the first contact (1).

18. The test circuit of claim 17, wherein, The first contact (1) of the i-th module relay (111) of each module module (11) is connected to the first contact (1) of the i-th module relay (111) of the remaining module modules (11), and the first contact (1) of the k-th channel relay (121) of each channel module (12) is connected to the third contact (3) of the (k+1)-th channel relay (121). Each channel module (12) includes N channel relays (121), and each module module (11) includes M module relays (111). The second contact (2) of the j-th channel relay (121) in the i-th channel module (12) is connected to the second contact (2) of the i-th module relay (111) in the j-th module module (11). Where 1 ≤ k < N, and k is a positive integer.

19. The test circuit of claim 17, wherein, The module relay (111) and the channel relay (121) further include a fourth contact (4) and a fifth contact (5), the fourth contact (4) being connected to the power supply and the fifth contact (5) being connected to the control circuit (13).

20. A test system, comprising: include: Multiple acquisition modules (20); The testing device includes the testing device as described in any one of claims 1 to 11, and the testing device is used to test the plurality of acquisition modules (20).

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