Photoresist spin-coating cleaning device
By designing a photoresist spin-coating cleaning device, which combines a dissolving solution and an activated carbon adsorption column with a soft brush, the problem of difficult-to-clean photoresist residue on the side of the substrate is solved, achieving efficient substrate cleaning and ensuring uniform photoresist coating and etching precision.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANGZHOU UNIV
- Filing Date
- 2025-05-28
- Publication Date
- 2026-05-01
AI Technical Summary
Existing substrate film deposition equipment leaves photoresist residue on the side of the substrate after coating, which is difficult to clean, affecting the performance and precision of the photoresist, resulting in poor etching accuracy, inability to accurately transfer the design pattern, and high requirements for environmental cleanliness, as even slight contamination can affect the performance of the photoresist.
A photoresist spin coating and cleaning device was designed, comprising a spin coating unit, a worktable, a support unit, a dissolving pool, an activated carbon adsorption column, and a circulation unit. The device dissolves residual photoresist with a dissolving solution, improves the purity of the dissolving solution using the activated carbon adsorption column, and performs secondary cleaning with a soft brush, thereby achieving efficient cleaning of the outer periphery of the substrate.
It improves the cleaning efficiency of the outer periphery of the substrate, ensures the uniformity of photoresist coating, simplifies the cleaning process, and avoids problems such as poor etching accuracy and environmental pollution caused by residual photoresist.
Smart Images
Figure CN224190391U_ABST
Abstract
Description
A photoresist spin coating cleaning device Technical Field
[0001] This application relates to the field of semiconductor microfabrication technology, specifically to a photoresist spin-coating cleaning device. Background Technology
[0002] With the continuous advancement and performance improvement of high-precision electronic devices, the precision of photoresist manufacturing processes is also increasing, gradually forming a technological barrier and a key bottleneck restricting its further development and widespread application. Photoresist is a key functional material in the photolithography process of the large-scale integrated circuit industry. In the photolithography process, after being irradiated with extreme ultraviolet light, the photoresist undergoes a series of chemical reactions, causing changes in its dissolution rate in the developer before and after exposure. Through processes such as development, hardening, etching, and stripping, specific high-precision patterns can be transferred to the surface of the substrate to be processed. Existing substrate film deposition equipment involves placing the substrate on a turntable, then dripping the photoresist onto the substrate surface using a dispensing device. The turntable rotates the substrate, and centrifugal force causes the photoresist to spin-coat the substrate surface, forming a colloidal thin film. However, existing substrate film deposition equipment still has many shortcomings, and the production process requires extremely high environmental cleanliness, temperature, and humidity conditions; even the slightest contamination can affect the performance of the photoresist. For example, the introduction of impurities or insufficient dehydration during the production process can lead to poor adhesion or uneven coating, resulting in poor etching precision and an inability to accurately transfer the designed pattern onto the substrate. In critical applications (such as aerospace and medical equipment), substandard photoresist can even cause device failure, thereby increasing production costs and extending production cycles. In early photolithography technologies, photoresist was mainly used for simple pattern transfer. With the development of semiconductor manufacturing processes, the wavelength of photoresist gradually transitioned from ultraviolet photoresist to deep ultraviolet photoresist, used for manufacturing chips with mature processes and high-end memory chips. These photoresists are mainly used in the manufacturing of chips with mature processes. To meet the demand for high-precision devices, high-power carbon dioxide lasers bombard tin droplets to generate plasma and radiate extreme ultraviolet light with a wavelength of only 13.5 nm. However, as photolithography technology develops towards higher resolution and shorter wavelengths, and the requirements for the operating environment become increasingly stringent, the limitations of ordinary coating techniques are gradually becoming apparent.
[0003] Taking spin coating technology as an example, although it can coat photoresist relatively evenly, the photoresist will remain on the side of the substrate after spin coating and is difficult to clean.
[0004] Therefore, it is necessary to provide a photoresist spin-coating and cleaning device to solve the above problems. Summary of the Invention
[0005] In view of the above-mentioned problems in the prior art, the purpose of this application is to provide a photoresist spin coating and cleaning device to solve the problems mentioned in the background art.
[0006] The technical solution adopted by this application to solve its technical problem is: a photoresist spin coating and cleaning device, including a spin coating unit for coating a substrate, a worktable is arranged directly below the spin coating unit, a support unit for driving the substrate to lift and rotate is installed on the upper surface of the worktable, a baffle is formed around the support unit, the baffle is fixedly connected to the upper surface of the worktable and forms a dissolving pool with an upward opening, the dissolving pool is filled with a dissolving solution for dissolving residual adhesive on the sidewall of the substrate, the bottom of the dissolving pool is connected to an activated carbon adsorption column, one end of the activated carbon adsorption column is connected to a circulation unit, the outlet end of the circulation unit is aligned with the substrate, so that the treated dissolving solution can perform a secondary cleaning of the substrate.
[0007] Furthermore, the circulation unit includes a liquid supply unit and a discharge unit. The liquid supply unit has an intake pipe connected to the bottom of the activated carbon adsorption column, a water pump, and a discharge pipe. The water pump is fixedly connected to the upper surface of the workbench and is outside the baffle. The input end of the water pump is connected to one end of the intake pipe, and the output end is connected to one end of the discharge pipe.
[0008] Furthermore, the discharge unit includes a bracket fixed to the upper end of the baffle, a collection bottle, a control valve, and a universal bamboo tube. The collection bottle forms an upward-opening liquid storage chamber, which is located directly below the outlet of the discharge pipe. The collection bottle is mounted on the bracket, and the control valve is located between the collection bottle and the universal bamboo tube and is interconnected with them.
[0009] Furthermore, a nozzle is connected to the end of the universal bamboo tube away from the control valve, and a soft brush is fixedly connected to the front end of the nozzle.
[0010] Furthermore, the outer peripheral wall of the liquid collection bottle is provided with external threads, and the bracket is provided with internal threads that match the external threads.
[0011] Furthermore, the supporting unit includes a turntable disposed on the upper surface of the workbench and an electrostatic adsorption disk for mounting the substrate, wherein the turntable is located below the electrostatic adsorption disk and is rotatably connected to the workbench.
[0012] Furthermore, a rotating motor is fixedly connected to the bottom of the worktable, and one end of the rotating motor is connected to the turntable via a gearbox.
[0013] Furthermore, the turntable and the electrostatic adsorption disk are concentric, and the diameter of the turntable is larger than the diameter of the electrostatic adsorption disk. The electrostatic adsorption disk is slidably connected to the turntable via a telescopic rod, forming a seal.
[0014] Furthermore, the spin coating unit includes an x-axis moving module, a y-axis moving module, and a z-axis moving module mounted on a frame. The output end of the z-axis moving module is fixedly connected to a glue supply tank, and the bottom of the glue supply tank is connected to a dispensing tube. The output end of the x-axis moving module is drivenly connected to the y-axis moving module to drive the y-axis moving module, the z-axis moving module, and the glue supply tank to move back and forth along the x-axis. The output end of the y-axis moving module is drivenly connected to the z-axis moving module to drive the z-axis moving module and the glue supply tank to move left and right along the y-axis. The z-axis moving module drives the glue supply tank to move up and down along the z-axis.
[0015] The beneficial effects of this application are: the photoresist spin-coating cleaning device provided by this application can perform secondary cleaning on the outer peripheral side of the substrate by setting a circulation unit, and at the same time, the purity of the solution can be improved by the activated carbon adsorption column, thereby improving the cleaning efficiency of the outer peripheral side of the substrate.
[0016] By threading the collection bottle and the bracket together, the height of the collection bottle can be adjusted, thereby controlling the distance between the nozzle and the substrate and making the adjustment more flexible.
[0017] By installing a soft brush at the front end of the nozzle, the outer periphery of the substrate can be cleaned again to remove stubborn adhesive residue, and the whole process is extremely simple.
[0018] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. A further detailed description of this application will be provided below with reference to the figures. Attached Figure Description
[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:
[0020] Figure 1 is an overall schematic diagram of this application;
[0021] Figure 2 is a schematic diagram of the adhesive application unit of this application;
[0022] Figure 3 is a schematic diagram of the workbench of this application;
[0023] Figure 4 is a front view of the workbench of this application;
[0024] Figure 5 is a schematic diagram of the discharge unit of this application;
[0025] Figure 6 is a schematic diagram of the flow direction of the solution in this application;
[0026] The following are the labeling elements in the figure:
[0027] 1. Spin coating unit; 101. X-axis moving module; 102. Y-axis moving module; 103. Z-axis moving module; 104. Glue supply tank; 105. Dispensing tube; 2. Worktable; 3. Baffle; 31. Dissolving tank; 4. Turntable; 5. Electrostatic adsorption plate; 6. Substrate; 7. Activated carbon adsorption column; 8. Rotary motor; 9. Water pump; 10. Suction pipe; 11. Discharge pipe; 12. Support; 121. Internal thread; 13. Collection bottle; 131. Liquid storage chamber; 132. External thread; 14. Control valve; 15. Universal bamboo joint tube; 16. Spray nozzle. Detailed Implementation
[0028] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.
[0029] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.
[0030] As shown in Figures 1-6, this application provides a technical solution: a photoresist spin coating and cleaning device, including a spin coating unit 1 for coating a substrate 6, a worktable 2 directly below the spin coating unit 1, a support unit for driving the substrate 6 to rise, fall and rotate installed on the upper surface of the worktable 2, a baffle 3 forming an enclosure around the support unit, the baffle 3 being fixedly connected to the upper surface of the worktable 2 and forming a dissolving pool 31 with an upward opening, the dissolving pool 31 being filled with a dissolving solution for dissolving residual adhesive on the sidewall of the substrate 6, an activated carbon adsorption column 7 being connected to the bottom of the dissolving pool 31, one end of the activated carbon adsorption column 7 being connected to a circulation unit, the outlet end of the circulation unit being aligned with the substrate 6, so that the treated dissolving solution can perform a secondary cleaning of the substrate 6.
[0031] The circulation unit includes a liquid supply unit and a discharge unit. The liquid supply unit has a suction pipe 10 connected to the bottom of the activated carbon adsorption column 7, a water pump 9, and a discharge pipe 11. The water pump 9 is fixedly connected to the upper surface of the workbench 2 and is outside the baffle 3. The input end of the water pump 9 is connected to one end of the suction pipe 10, and the output end is connected to one end of the discharge pipe 11.
[0032] The discharge unit includes a bracket 12 fixed to the upper end of the baffle 3, a collection bottle 13, a control valve 14, and a universal bamboo tube 15. The collection bottle 13 forms an upward-opening storage chamber 131, which is located directly below the outlet of the discharge pipe 11. The collection bottle 13 is installed on the bracket 12, and the control valve 14 is located between the collection bottle 13 and the universal bamboo tube 15 and is interconnected.
[0033] The end of the universal bamboo tube 15 away from the control valve 14 is connected to the nozzle 16, and a soft brush (not shown in the figure) is fixedly connected to the front end of the nozzle 16.
[0034] The outer peripheral wall of the collection bottle 13 is provided with an external thread 132, and the bracket 12 is provided with an internal thread 121 that matches the external thread 132.
[0035] The support unit includes a turntable 4 disposed on the upper surface of the worktable 2 and an electrostatic adsorption disk 5 for mounting the substrate 6. The turntable 4 is located below the electrostatic adsorption disk 5 and is rotatably connected to the worktable 2.
[0036] A rotating motor 8 is fixedly connected to the bottom of the worktable 2, and one end of the rotating motor 8 is connected to the turntable 4 through a gearbox.
[0037] The turntable 4 and the electrostatic adsorption disk 5 are concentric, and the diameter of the turntable 4 is larger than the diameter of the electrostatic adsorption disk 5. The electrostatic adsorption disk 5 is connected to the turntable 4 by a telescopic rod and forms a seal.
[0038] The spin coating unit 1 includes an x-axis moving module 101, a y-axis moving module 102, and a z-axis moving module 103 mounted on a frame. The output end of the z-axis moving module 103 is fixedly connected to a glue supply tank 104. The bottom of the glue supply tank 104 is connected to a dispensing tube 105. The output end of the x-axis moving module 101 is driven to the y-axis moving module 102 to drive the y-axis moving module 102, the z-axis moving module 103, and the glue supply tank 104 to move back and forth along the x-axis. The output end of the y-axis moving module 102 is driven to the z-axis moving module 103 to drive the z-axis moving module 103 and the glue supply tank 104 to move left and right along the y-axis. The z-axis moving module 103 drives the glue supply tank 104 to move up and down along the z-axis.
[0039] In one embodiment, the cleaning device removes adhesive from substrate 6.
[0040] Specifically, the staff pours the solution used to dissolve the photoresist into the dissolution pool 31. The height of the solution does not exceed the top surface of the electrostatic adsorption disk 5. The substrate 6 is fixed on the upper surface of the electrostatic adsorption disk 5. The rotating motor 8 is started to drive the turntable 4, the electrostatic adsorption disk 5 and the substrate 6 to rotate. Then, the glue supply box 104 is positioned directly above the substrate 6 by the x-axis moving module 101, the y-axis moving module 102 and the z-axis moving module 103. At this time, the glue dispensing tube 105 is controlled to be aligned with the substrate 6 to perform the glue application operation.
[0041] After the adhesive is applied, the adhesive supply box 104 is moved away from the top of the substrate 6 by each moving module. The electrostatic adsorption plate 5 is lowered by the telescopic rod until the side of the substrate 6 contacts the dissolving liquid in the dissolving pool 31. At the same time, it is ensured that the top surface of the substrate 6 is always kept above the liquid surface of the dissolving liquid. At this time, the rotation motor 8 is adjusted to reduce the speed of the substrate 6, so that the side of the substrate 6 can fully contact the dissolving liquid.
[0042] After immersion for a period of time, the electrostatic adsorption plate 5 rises so that the substrate 6 is no longer in contact with the dissolving liquid. The external thread 132 of the collection bottle 13 is threadedly connected to the internal thread 121 on the bracket 12. The height of the collection bottle 13 is adjusted, and the position of the nozzle 16 is adjusted to align with the outer periphery of the substrate 6 through the universal bamboo tube 15. At this time, the water pump 9 is started. After the impurities are absorbed by the activated carbon adsorption column 7, the dissolving liquid is pumped into the storage chamber 131 from the outlet of the discharge pipe 11. The control valve 14 is opened so that the dissolving liquid in the storage chamber 131 flows out of the nozzle 16 through the universal bamboo tube 15 under the influence of gravity. The impact force of the flowing dissolving liquid performs a secondary cleaning on the outer periphery of the substrate 6.
[0043] After the secondary cleaning is completed, turn off the water pump 9 and control valve 14 to stop the discharge of the dissolving liquid in the nozzle 16. Pull the universal bamboo tube 15 to make the soft brush at the front end of the nozzle 16 contact the outer periphery of the rotating substrate 6, thereby cleaning the outer periphery of the substrate 6 once again.
[0044] In summary, this device, through its circulation unit, enables secondary cleaning of the outer periphery of the substrate 6. Simultaneously, the activated carbon adsorption column 7 enhances the purity of the solution, improving the efficiency of cleaning the outer periphery of the substrate 6. Furthermore, the soft brush at the front end of the nozzle 16 provides a second cleaning of the outer periphery of the substrate 6, removing stubborn photoresist residue. The entire process is extremely simple. This solves the technical problem in the prior art where, although the photoresist can be coated relatively evenly, residue remains on the substrate side after spin coating, making it difficult to clean.
[0045] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A photoresist spin-coating cleaning device, characterized in that: The system includes a spin coating unit (1) for applying adhesive to a substrate (6). A workbench (2) is located directly below the spin coating unit (1). A support unit that drives the substrate (6) to rise, fall, and rotate is installed on the upper surface of the workbench (2). A baffle (3) is formed around the support unit. The baffle (3) is fixedly connected to the upper surface of the workbench (2) and forms a dissolving pool (31) with an upward opening. The dissolving pool (31) is filled with a dissolving solution to dissolve the residual adhesive on the sidewall of the substrate (6). An activated carbon adsorption column (7) is connected to the bottom of the dissolving pool (31). A circulation unit is connected to one end of the activated carbon adsorption column (7). The outlet end of the circulation unit is aligned with the substrate (6) so that the treated dissolving solution can perform a secondary cleaning of the substrate (6).
2. The photoresist spin-coating cleaning device according to claim 1, characterized in that: The circulation unit includes a liquid supply unit and a discharge unit. The liquid supply unit has an intake pipe (10) connected to the bottom of the activated carbon adsorption column (7), a water pump (9) and a discharge pipe (11). The water pump (9) is fixedly connected to the upper surface of the workbench (2) and is outside the baffle (3). The input end of the water pump (9) is connected to one end of the intake pipe (10) and the output end is connected to one end of the discharge pipe (11).
3. The photoresist spin-coating cleaning device according to claim 2, characterized in that: The discharge unit includes a bracket (12) fixed to the upper end of the baffle (3), a collection bottle (13), a control valve (14), and a universal bamboo tube (15). The collection bottle (13) forms an upward-opening storage chamber (131), which is located directly below the outlet of the discharge pipe (11). The collection bottle (13) is installed on the bracket (12), and the control valve (14) is located between the collection bottle (13) and the universal bamboo tube (15) and is interconnected.
4. The photoresist spin-coating cleaning device according to claim 3, characterized in that: The end of the universal bamboo tube (15) away from the control valve (14) is connected to a nozzle (16), and a soft brush is fixedly connected to the front end of the nozzle (16).
5. The photoresist spin-coating cleaning apparatus according to claim 3, characterized in that: The outer peripheral wall of the collection bottle (13) is provided with an external thread (132), and the bracket (12) is provided with an internal thread (121) that matches the external thread (132).
6. The photoresist spin-coating cleaning apparatus according to claim 1, characterized in that: The support unit includes a turntable (4) disposed on the upper surface of the workbench (2) and an electrostatic adsorption disk (5) for mounting the substrate (6). The turntable (4) is located below the electrostatic adsorption disk (5) and is rotatably connected to the workbench (2).
7. The photoresist spin-coating cleaning apparatus according to claim 6, characterized in that: A rotating motor (8) is fixedly connected to the bottom of the workbench (2), and one end of the rotating motor (8) is connected to the turntable (4) through a gearbox.
8. The photoresist spin-coating cleaning apparatus according to claim 7, characterized in that: The turntable (4) and the electrostatic adsorption disk (5) are concentric and the diameter of the turntable (4) is larger than the diameter of the electrostatic adsorption disk (5). The electrostatic adsorption disk (5) is connected to the turntable (4) by a telescopic rod and forms a seal.
9. The photoresist spin-coating cleaning device according to claim 1, characterized in that: The spin coating unit (1) includes an x-axis moving module (101), a y-axis moving module (102), and a z-axis moving module (103) mounted on a frame. The output end of the z-axis moving module (103) is fixedly connected to a glue supply box (104). The bottom of the glue supply box (104) is connected to a glue dispensing tube (105). The output end of the x-axis moving module (101) is driven to the y-axis moving module (102) to drive the y-axis moving module (102), the z-axis moving module (103), and the glue supply box (104) to move back and forth along the x-axis direction. The output end of the y-axis moving module (102) is driven to the z-axis moving module (103) to drive the z-axis moving module (103) and the glue supply box (104) to move left and right along the y-axis direction. The z-axis moving module (103) drives the glue supply box (104) to move up and down along the z-axis direction.