Plug-in type shell-mounted SMD (Surface Mount Device) thermistor

Abstract

The utility model relates to the technical field of thermistors, in particular to a plug-in type shell-mounted SMD (Surface Mount Device) thermistor. The thermistor comprises a thermistor chip, the thermistor chip is a negative temperature coefficient thermistor chip, one side of the thermistor chip is welded with two pins, the surface of the thermistor chip is sleeved with a first packaging shell and a second packaging shell, one side of the first packaging shell is fixedly connected with two connecting plates, and the other side of the first packaging shell is fixedly connected with a second connecting plate. Two connecting grooves are formed in one side of the second packaging shell, and the arc surfaces of the pins are connected with the second packaging shell in a penetrating mode. The problems that when a thermistor breaks down and needs to be maintained, or internal elements need to be replaced due to equipment upgrading, performance optimization and the like, maintenance personnel often need to use professional and complex tools, a large amount of time and energy are consumed, and irreversible damage can be possibly caused to a thermistor chip or other peripheral fine components by slight carelessness are solved.

Description

A plug-in shell-mount surface mount thermistor Technical Field

[0001] This utility model relates to the field of thermistor technology, and in particular to a plug-in shell-mount surface mount thermistor. Background Technology

[0002] In today's widespread use of electronic devices, thermistors, as key temperature-sensitive components, play an important role in temperature monitoring and control in various circuit systems. Among them, the through-hole type surface mount thermistors are widely used in many electronic devices due to their ease of installation and protective characteristics. However, existing thermistors of this type have significant defects in their structural design, especially the difficulty in easily disassembling their packaging.

[0003] Currently, most mainstream through-hole type surface mount thermistors use a one-piece molding process or are tightly bonded with strong adhesive. While this design provides a certain degree of physical protection and insulation for the internal thermistor chip, the inability to easily remove the package becomes a significant drawback when the thermistor malfunctions and needs repair, or when internal components need to be replaced due to equipment upgrades or performance optimizations. Repair personnel often need to use specialized and complex tools, spending considerable time and effort carefully attempting to open the package, and even a slight mistake could cause irreversible damage to the thermistor chip or other delicate surrounding components.

[0004] Regarding the above-mentioned and existing related technologies, the inventor believes that the following defects often exist: when the thermistor malfunctions and needs repair, or when internal components need to be replaced due to equipment upgrades or performance optimizations, repair personnel often need to use professional and complex tools, which consumes a lot of time and energy. If they are not careful, they may cause irreversible damage to the thermistor chip or other delicate peripheral components. Therefore, in order to address the above problems, a plug-in shell-mount surface mount thermistor is proposed. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies where, when a thermistor malfunctions and needs repair, or when internal components need to be replaced due to equipment upgrades or performance optimizations, repair personnel often need to use specialized and complex tools, consuming a lot of time and energy. Furthermore, a slight mistake could cause irreversible damage to the thermistor chip or other delicate peripheral components. Therefore, this invention proposes a plug-in shell-mount surface mount thermistor.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a plug-in type surface mount thermistor, comprising a thermistor chip, wherein the thermistor chip is a negative temperature coefficient thermistor chip, two pins are welded to one side of the thermistor chip, a first encapsulation shell and a second encapsulation shell are fitted onto the surface of the thermistor chip, two connecting plates are fixedly connected to one side of the first encapsulation shell, two connecting slots are formed on one side of the second encapsulation shell, the arc surface of the pins is connected through the second encapsulation shell, the size of the connecting plate is adapted to the size of the connecting slot of the second encapsulation shell, two L-shaped plates are fixedly connected to both sides of the second encapsulation shell, threaded rods are inserted into the L-shaped plates, elliptical grooves are formed on the surface of the connecting plates, and an abutment block is fixedly connected to one end of the threaded rod, the abutment block abutting against the inner wall of the elliptical groove.

[0007] The aforementioned components achieve the following effects: By employing a negative temperature coefficient thermistor chip, it can be efficiently applied to various scenarios requiring precise temperature sensing and corresponding adjustments, meeting a wide range of temperature-related functional needs. The thermistor chip is housed within a protective structure composed of first and second encapsulation shells, with the connecting plate of the first encapsulation shell precisely matched to the connecting groove of the second encapsulation shell. Combined with the abutment of the L-shaped plate's internal threaded rod and the elliptical groove of the connecting plate, a stable and easily disassembled connection between the encapsulation shells is achieved, greatly improving the ease of installation and maintenance of the thermistor. Simultaneously, the pins are soldered to one side of the thermistor chip and penetrate the second encapsulation shell, ensuring the reliability of the electrical connection and guaranteeing stable signal transmission under various operating environments, thus comprehensively improving the product's practicality and stability.

[0008] Preferably, both the first and second encapsulation shells are made of ceramic.

[0009] The effect achieved by the above components is that both the first and second encapsulation shells are made of ceramic, which has good insulation and stability.

[0010] Preferably, the pin includes an anti-oxidation metal plating layer, a metal support layer, and a highly conductive metal core, which are arranged sequentially from the outside to the inside.

[0011] The effects achieved by the above components are as follows: the pins adopt a structure consisting of an anti-oxidation metal plating layer, a metal support layer, and a highly conductive metal core, from the outside to the inside. The anti-oxidation metal plating layer can effectively prevent the pins from being oxidized and corroded, extending their service life. The metal support layer ensures the structural strength of the pins, making them less prone to deformation. The highly conductive metal core ensures good conductivity, guaranteeing stable transmission of electrical signals in various environments, thus comprehensively improving the practicality, stability, and durability of the product.

[0012] Preferably, two L-shaped brackets are fixedly connected to the lower surface of the second packaging shell, and a straightening sleeve is fixedly connected to one side of the L-shaped bracket. The inner wall of the straightening sleeve is slidably connected to the pin, and the straightening sleeve is conical.

[0013] The effect achieved by the above-mentioned components is that, by setting a straightening sleeve, the pins are straightened through the reciprocating sliding motion between the first and second packages, thus improving the practicality of the device.

[0014] Preferably, both the first and second encapsulation shells have a plurality of anti-slip textures fixedly connected to their surfaces.

[0015] The effect achieved by the above components is to increase the friction between the thermistor and the external circuit board by setting anti-slip texture, thereby preventing the thermistor from becoming loose after insertion.

[0016] Preferably, a buffer pad is fixedly connected to the inner wall of the first encapsulation shell, and the buffer pad is an insulating rubber pad.

[0017] The effect achieved by the above components is that by setting a buffer pad, the impact of external mechanical stress on the thermistor chip can be effectively buffered, reducing the risk of chip damage due to vibration and impact, and improving the practicality of the device.

[0018] Preferably, a heat sink is fixedly connected to the inner wall of the first encapsulation shell, and a plurality of heat dissipation fins are fixedly connected to the surface of the heat sink.

[0019] The effect achieved by the above components is that, through the cooperation of heat sink and heat dissipation fins, the heat generated by the thermistor chip can be quickly and evenly conducted to the package shell, thereby improving the overall heat dissipation efficiency.

[0020] Preferably, both the first and second packaging shells are coated with a moisture-proof coating.

[0021] The effect achieved by the above components is that by setting a moisture-proof coating, moisture can be effectively prevented from penetrating the inside of the package, ensuring the normal operation performance of the thermistor in a humid environment.

[0022] In this invention, by employing a negative temperature coefficient thermistor chip, it can be efficiently applied to various scenarios requiring precise temperature sensing and corresponding adjustments, meeting a wide range of temperature-related functional needs. The thermistor chip is housed in a protective structure composed of a first and a second encapsulation shell. The connecting plate of the first encapsulation shell and the connecting groove of the second encapsulation shell are precisely matched. Combined with the abutment of the L-shaped plate's internal threaded rod and the elliptical groove of the connecting plate, a stable and easy-to-disassemble connection between the encapsulation shells is achieved, greatly improving the ease of installation and maintenance of the thermistor. At the same time, the pins are soldered to one side of the thermistor chip and penetrate through the second encapsulation shell, ensuring the reliability of the electrical connection and ensuring stable transmission of electrical signals under various operating environments, thus comprehensively improving the practicality and stability of the product. Attached Figure Description

[0023] Figure 1 is a three-dimensional structural diagram of this utility model;

[0024] Figure 2 is a side view of Figure 1 in this utility model;

[0025] Figure 3 is a schematic diagram of the pin structure in this utility model;

[0026] Figure 4 is a schematic diagram of the structure of the first encapsulation shell in this utility model;

[0027] Figure 5 is an enlarged view of section A in Figure 2 of this utility model.

[0028] Legend: 1. Thermistor chip; 2. First package shell; 3. Connecting board; 4. Second package shell; 5. Pin; 51. Anti-oxidation metal plating; 52. Metal support layer; 53. High conductivity metal core; 6. L-shaped plate; 7. Threaded rod; 8. Elliptical groove; 9. Abutment block; 10. Anti-slip texture; 11. L-shaped frame; 12. Buffer pad; 13. Heat sink; 14. Heat dissipation fin; 15. Straightening sleeve. Detailed Implementation

[0029] Referring to Figures 1-5, this utility model provides a technical solution: a plug-in type surface mount thermistor, including a thermistor chip 1, which is a negative temperature coefficient thermistor chip 1. Two pins 5 are soldered to one side of the thermistor chip 1. A first encapsulation shell 2 and a second encapsulation shell 4 are fitted onto the surface of the thermistor chip 1. Two connecting plates 3 are fixedly connected to one side of the first encapsulation shell 2. Two connecting slots are opened on one side of the second encapsulation shell 4. The arc surface of the pins 5 is connected through the second encapsulation shell 4. The size of the connecting plate 3 is adapted to the size of the connecting slot of the second encapsulation shell 4. Two L-shaped plates 6 are fixedly connected to both sides of the second encapsulation shell 4. Threaded rods 7 are inserted into the internal threads of the L-shaped plates 6. Elliptical grooves 8 are opened on the surface of the connecting plates 3. An abutment block 9 is fixedly connected to one end of the threaded rod 7 and abuts against the inner wall of the elliptical groove 8. By employing a negative temperature coefficient thermistor chip 1, it can be efficiently applied to various scenarios requiring precise temperature sensing and corresponding adjustments, meeting a wide range of temperature-related functional needs. The thermistor chip 1 is housed in a protective structure composed of first and second encapsulation shells 4. The connecting plate 3 of the first encapsulation shell 2 and the connecting groove of the second encapsulation shell 4 are precisely matched. Combined with the contact between the L-shaped plate's internal threaded rod 7 and the elliptical groove 8 of the connecting plate 3, a stable and easily disassembled connection between the encapsulation shells is achieved, greatly improving the ease of installation and maintenance of the thermistor. Simultaneously, the pin 5 is soldered to one side of the thermistor chip 1 and penetrates through the second encapsulation shell 4, ensuring the reliability of the electrical connection and guaranteeing stable signal transmission under various operating environments. This comprehensively improves the product's practicality and stability. Both the first and second encapsulation shells 2 and 4 are made of ceramic, possessing excellent insulation and stability. The pin 5 includes an anti-oxidation metal plating layer 51, a metal support layer 52, and a highly conductive metal core 53, arranged sequentially from the outside to the inside. Pin 5 adopts a structure consisting of an anti-oxidation metal plating layer 51, a metal support layer 52, and a high-conductivity metal core 53, arranged from the outside to the inside. The anti-oxidation metal plating layer 51 effectively prevents pin 5 from being oxidized and corroded, extending its service life. The metal support layer 52 ensures the structural strength of pin 5, making it less prone to deformation. The high-conductivity metal core 53 ensures good conductivity, guaranteeing stable transmission of electrical signals in various environments, comprehensively improving the product's practicality, stability, and durability. Two L-shaped brackets 11 are fixedly connected to the lower surface of the second package shell 4. A straightening sleeve 15 is fixedly connected to one side of the L-shaped bracket 11. The inner wall of the straightening sleeve 15 is slidably connected to pin 5. The straightening sleeve 15 is conical. By setting the straightening sleeve 15, the pin 5 is straightened through the reciprocating sliding motion of the first package shell 2 and the second package shell 4, improving the practicality of the device. Several anti-slip textures 10 are fixedly connected to the surfaces of both the first package shell 2 and the second package shell 4.Anti-slip texture 10 is provided to increase the friction between the thermistor and the external circuit board, preventing the thermistor from loosening after insertion. A buffer pad 12, which is an insulating rubber pad, is fixedly connected to the inner wall of the first package shell 2. The buffer pad 12 effectively buffers the impact of external mechanical stress on the thermistor chip 1, reducing the risk of chip damage due to vibration and impact, and improving the practicality of the device. A heat sink 13 is fixedly connected to the inner wall of the first package shell 2, and several heat dissipation fins 14 are fixedly connected to the surface of the heat sink 13. Through the cooperation of the heat sink 13 and the heat dissipation fins 14, the heat generated by the thermistor chip 1 can be quickly and evenly conducted to the package shell, improving the overall heat dissipation efficiency. Both the first package shell 2 and the second package shell 4 are coated with a moisture-proof coating. This moisture-proof coating effectively prevents moisture from penetrating the package shell, ensuring the normal operation of the thermistor in humid environments.

[0030] The working principle of this plug-in type surface mount thermistor is as follows: The thermistor chip 1 adopts a negative temperature coefficient thermistor chip 1, which can accurately sense changes in the external temperature. When the temperature rises, the chip resistance decreases, and when the temperature falls, the resistance increases, thereby achieving efficient temperature monitoring and meeting the needs of various scenarios for accurate temperature sensing and adjustment.

[0031] In terms of electrical connection, pin 5 is soldered to one side of the thermistor chip 1. Its unique structure consists of an anti-oxidation metal plating layer 51, a metal support layer 52, and a high-conductivity metal core 53, arranged from the outside to the inside. The anti-oxidation metal plating layer 51 resists oxidation and corrosion, extending the life of pin 5. The metal support layer 52 maintains structural strength and prevents deformation. The high-conductivity metal core 53 ensures good conductivity and ensures stable transmission of electrical signals to external circuits.

[0032] In terms of encapsulation and protection, the first encapsulation shell 2 and the second encapsulation shell 4, made of ceramic, form a protective structure. The excellent insulation and stability of ceramic provide reliable protection for the thermistor chip 1. The connecting plate 3 of the first encapsulation shell 2 is adapted to the connecting groove of the second encapsulation shell 4. The connection is stable and easy to disassemble through the abutment of the internal thread rod 7 of the L-shaped plate 6 and the elliptical groove 8 of the connecting plate 3, which facilitates installation and maintenance. The buffer pad 12 on the inner wall of the first encapsulation shell 2 is made of insulating rubber, which can effectively buffer external mechanical stress and reduce the risk of chip damage due to vibration and impact. The moisture-proof coating on the surface prevents moisture from entering and ensures normal operation in humid environments.

[0033] Furthermore, the straightening sleeve 15 below the second package housing, when it is necessary to straighten the pin 5, rotates the threaded rod 7 within the L-shaped plate 6. The threaded rod 7 causes the abutment plate to disengage from the elliptical groove 8. If the abutment plate does not disengage from the elliptical groove 8, the second package housing 4 is pulled to perform reciprocating motion. The straightening plate on the L-shaped frame 11 can straighten the pin 5. The anti-slip texture 10 on the surfaces of the first package housing 2 and the second package housing 4 increases the friction with the circuit board to prevent loosening after insertion. The heat sink 13 and heat dissipation fins 14 on the inner wall of the first package housing 2 can quickly conduct the heat generated by the thermistor chip 1 to the package housing, improving the overall heat dissipation efficiency and ensuring the thermistor operates stably and efficiently in various environments, thus improving the practicality and stability of the product.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A plug-in type surface mount thermistor, comprising a thermistor chip (1), characterized in that: The thermistor chip (1) is a negative temperature coefficient thermistor chip (1). Two pins (5) are welded on one side of the thermistor chip (1). The surface of the thermistor chip (1) is covered with a first encapsulation shell (2) and a second encapsulation shell (4). Two connecting plates (3) are fixedly connected to one side of the first encapsulation shell (2). Two connecting slots are opened on one side of the second encapsulation shell (4). The arc surface of the pin (5) is connected through the second encapsulation shell (4). The size of the connecting plate (3) is adapted to the size of the connecting slot of the second encapsulation shell (4). Two L-shaped plates (6) are fixedly connected to both sides of the second encapsulation shell (4). A threaded rod (7) is inserted into the L-shaped plate (6). An elliptical groove (8) is opened on the surface of the connecting plate (3). An abutment block (9) is fixedly connected to one end of the threaded rod (7). The abutment block (9) abuts against the inner wall of the elliptical groove (8).

2. The plug-in type surface mount thermistor according to claim 1, characterized in that: Both the first encapsulation shell (2) and the second encapsulation shell (4) are made of ceramic.

3. A plug-in type shell-mount surface mount thermistor according to claim 1, characterized in that: The pin (5) includes an anti-oxidation metal plating layer (51), a metal support layer (52), and a highly conductive metal core (53), which are arranged sequentially from the outside to the inside.

4. A plug-in type shell-mount surface mount thermistor according to claim 1, characterized in that: Two L-shaped brackets (11) are fixedly connected to the lower surface of the second encapsulation shell (4). A straightening sleeve (15) is fixedly connected to one side of the L-shaped bracket (11). The inner wall of the straightening sleeve (15) is slidably connected to the pin (5). The straightening sleeve (15) is conical.

5. A plug-in type shell-mount surface mount thermistor according to claim 1, characterized in that: The surfaces of the first encapsulation shell (2) and the second encapsulation shell (4) are both fixedly connected with a number of anti-slip textures (10).

6. A plug-in type shell-mount surface mount thermistor according to claim 1, characterized in that: The inner wall of the first encapsulation shell (2) is fixedly connected with a buffer pad (12), which is an insulating rubber pad.

7. A plug-in type surface mount thermistor according to claim 1, characterized in that: A heat sink (13) is fixedly connected to the inner wall of the first encapsulation shell (2), and a plurality of heat dissipation fins (14) are fixedly connected to the surface of the heat sink (13).

8. A plug-in type shell-mount surface mount thermistor according to claim 1, characterized in that: Both the first encapsulation shell (2) and the second encapsulation shell (4) are coated with a moisture-proof coating.

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